High speed laser machining using polygon scanner technology

Ronny De LoorCEO, Next Scan Technology

Overview

Company introduction

Polygon scanner system

Applications

Future developments

Mission statement

Next Scan Technology delivers novel scanning solutions

to enable highest processing speed

Value proposition

Introduced fast (polygon) scanner technology to laser processing market

Today this solution delivers 10-50 times more throughput in dedicated applications

Technology is similar to desktop laser printers

but tailored for: � Very high laser pulse power handling

� Very high resolution and accuracy

� High quality spot size

� Sophisticated laser/scanner synchronisation

Team knowhow NST

Gemini PCB resist writer

High throughput OEM systems

Drum scanners offset print, flexo, PCB

Scan area : up to 1600 x 2400 mmResolution : 2.500-25.000 DPI Multi-beam : 12-72

Flatbed laser printers offset print, PCB

Scan area : up to 1350 x 2000 mm Repetition acc. : < 3 µmSpeed @ 10µm : > 200 m/s Pixel speed : up to 150 Mpxl/sec

Installed base > 1.000 units

UV, 355 nm, 457 x 610 mm

Company Fact Sheet

Next Scan Technology B.V.The Netherlands

Founded 2010 byLars Penning & Ronny De Loor

Next Scan Technology bvba Belgium, Ghent (2013)*

Activities (8 FTE, Belgium):� R&D� Production� Demo & test services

* New build facilities 700m² 1 hour drive to IMEC, 1.5 hour Eindhoven

Technology

� Custom patent pending 2 mirror diffraction limited design

– Scan line always perpendicular on the substrate

– Spot is round and constant along scanned path

– Line straightness within ± 5 um*– Handling both IR and GR in one

design

� Proprietary modulation and laser/scanner synchronization for high repeatibility

� Multiplier in throughput by:– polygon (speed)– scan optics (size)–

* Line distortion mirror optics

First product LSE170 delivers a

full telecentric scan line of 170 mm

Concept launch at PW2014Two additional scan formats: LSE050 & LSE300

GateMaster™ ModulationTrueRaster™ Positioning

Technology trade-off

Vacuum

chuck

d

Y-

stageSlow Y movement

by stage or web

Laser beam

Speed : max 10-15 m/s Speed : 10 - 100 m/s (constant) >>100 m/s possible Scan field* : limited up to 100 mm Scan field : up to 300 mm without stitching Spot size : down to 7 um (355 nm)

Fast X movement

by polygon

* Full telecentric processing f-Theta lens > 100 mm deliver less scan efficiency and limit small spot size processing

Next Scan Technology controller synchronises laser, scanner, stage and pattern data transfer.

How to operate

� A rectangular region (bitmap) is formedby equally spaced parallel lines (line spacing)

Higher rep rate or less scan speed gives:

� spot overlap (lines) or� spot spacing (holes)

(multi pass) line scanning enables high speed processing for applications like:

� Laser patterning� Surface texturing� High density Hole Drilling � Grooving & Dicing � 2.5D Micromachining

HOWEVER ...

Timing jitter & SuperSync™

SuperSync™ is a electronic solution to reduce timing jitter of pulsed lasers*

SuperSync™ enables < 3 µm spot positioning error or repetition accuracy

* certified laser interface needed

No SuperSync™Multi-pass operation at

100 m/s

SuperSync™Multi-pass operation at

100 m/s

Bitmap pattern

1 Mhz Pulse Repetition Rate at 100 m/s gives a spot positioning error of 100 um

SuperSync™ Interface

� Proprietary synchronization method for pulsed lasers

� Required for 'synchronised skywriting'

� Specific daughterboard

� Available for– Time Bandwidth PicoBlade– TRUMPF TruMicro– AMPHOS– Amplitude Systemes– Lumera HyperRapid – IPG

In validation Ekspla, OneFive, EdgeWave, Eolite Spectra Physics, Coherent, Menlo SystemsPolarOnyx, Attodyne

Processing quality

Courtesy Bern University Applied Sciences: Research by B. Neuenschwander/B. Jäggi/M. Zimmerman

Uncontrolled processing quality at

ramp up/down

Improved quality at constant speed

with existingtiming jitter

Highest quality at constant speed through eliminated

timing jitter

Applications

Customers are system integrators and high tech production companies in:

� Display: patterning, texturing

� Semicon: microdrilling, grooving & dicing

� Security: perforation, micromachining

� Automotive: patterning, micromachining

� Medical: microdrilling, micromachining

Technology validation in all domains

Demo & Application Lab

� Next Scan Technology (B)

Lumera HyperRapid 50W 2 MHz PRR External Multi MHz in development

� Time Bandwidth (CH)

Time Bandwidth PicoBlade 50W~ 4 MHz PRR (8 MHz)

� Bern University (CH)

Time Bandwidth Fuego 50W~ 4 MHz PRR (8 MHz)

Amplitude Satsuma 20W 3 MHz PRR

� USA & ASIA

Work in Progress

On site testing

Process Development Kit

� Compact lab-ready set up

� Easy commissioning

� Installation & operator training

� Bitmap raster scan training course

� Evaluation and suggestions for future improvements on performance

� Rental and buy solution

Surface processing

Apply any texture

� 100 meters/sec is 400 lines/sec

� Linear speed stage is 1 cm/s at 25 um

� Surface speed is 17 cm²/sec at 4 MHz

� Multi-pass for 'deeper' structures

Applications

� Thin film patterning

� High throughput marking

� Volume ablation (holes/slots)

� Additive printing (LIFT, STL)

� Annealing, LLO

Wafer processing

Scribing, grooving and dicing

� Speed set by PRR and spot spacing

� Linear stage in stepping mode or moves at constant speed with TrueRaster™ Technology*

� Application example

- 2 MHz PRR - 25 um spot spacing- 50 meters/sec (200 lines/sec)- 40 passes/kerf- 3 kerfs/second

* Release Q3 2014

High Density Hole Drilling

Low PRR with high pulse energy

� Percussion drilling by SuperSync™

� Scan speed to separate the holes

� Stage in stepping mode

� Application example

- 400 Khz PRR

- 250 um spot spacing through 100 meters/sec is 400 lines/sec

- 100 passes per hole is 4 lines/sec

- 6 inch board is 600 holes per line at 4 lines/sec is > 2.000 holes per second

2.5 D Micromachining

•Each layer is processed by different bitmap

� Spot overlap and PRR set the scan speed

� Stage in constant speed mode

� Application example

- dimensions 108 x 65 mm- 4.1 MHz PRR* - scan speed 59,45 m/s- 14.5 um spot spacing (1.750 dpi)- 24 seconds per layer- 2233 different layers- Maximum depth about 100 um

* TimeBandwidth FUEGO 50 W

This work was supported by the FP7 project APPOLO and executed by B. Neuenschwander/B. Jäggi/M. Zimmerman

Outlook 2014

� LSE050 and LSE300

� UV mirror optics

� Higher NA for smaller spot sizes

� GateMaster™ Modulation for CW and ns pulsed fiber lasers

� TrueRaster™ Positioning for absolute accuracy*

� Multi-beam scanning technology for unparalleled precision and highest throughput

* Line straightness ± 1 um No more pyramidical error