hp xp 12000

HP StorageWorks

XP12000 Disk Array Site Preparation Guide

Part number: AE002-96040Eleventh edition: March 2008

Legal and notice information

© Copyright 2005, 2008 Hewlett-Packard Development Company, L.P., all rights reserved.

Confidential computer software. Valid license from HP required for possession, use or copying. Consistent with FAR 12.211and 12.212, Commercial Computer Software, Computer Software Documentation, and Technical Data for Commercial Itemsare licensed to the U.S. Government under vendor's standard commercial license.

The information contained herein is subject to change without notice. The only warranties for HP products and services are setforth in the express warranty statements accompanying such products and services. Nothing herein should be construed asconstituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

UNIX is a registered trademark of The Open Group.

Contents

About this guide ................................................................................... 9Intended audience ...................................................................................................................... 9Related documentation ................................................................................................................ 9Document conventions and symbols ............................................................................................... 9Conventions for storage capacity values ...................................................................................... 10Rack stability ............................................................................................................................ 11HP technical support ................................................................................................................. 11Customer self repair .................................................................................................................. 11Product warranties .................................................................................................................... 12Subscription service .................................................................................................................. 12HP websites ............................................................................................................................. 12Documentation feedback ........................................................................................................... 12

1 Site preparation team and tasks ......................................................... 13The site preparation team .......................................................................................................... 13

HP representative responsibilities .......................................................................................... 13Customer responsibilities ..................................................................................................... 13

Site preparation tasks ................................................................................................................ 13Site preparation checklist .................................................................................................... 14Site preparation time allowances .......................................................................................... 16

2 Site requirements for the HP XP12000 Disk Array ................................ 19Disk array physical specifications ................................................................................................ 19

Dimensions ........................................................................................................................ 20Weights ............................................................................................................................ 20Calculating the weight of your disk array configuration ........................................................... 23Weight calculation example ................................................................................................ 24

General computer room requirements .......................................................................................... 25Preventing electrostatic discharge ......................................................................................... 25

Safety requirements ................................................................................................................... 26Fire safety requirements ....................................................................................................... 26Preventing equipment servicing hazards ................................................................................ 26Preventing electrical hazards ................................................................................................ 26

Floor requirements .................................................................................................................... 26Raised floor requirements .................................................................................................... 27

Raised floor cutout specifications .................................................................................... 27Estimating required floor load rating ..................................................................................... 28Floor covering requirements ................................................................................................. 29

Space planning requirements ..................................................................................................... 29The space planning process ................................................................................................ 29Floor clearance requirements ............................................................................................... 30

Floor clearances, DKC only .......................................................................................... 32Floor clearances, DKC and one DKU ............................................................................. 33Floor clearances, DKC and two DKUs ............................................................................ 34

XP12000 Disk Array Site Preparation Guide 3

Floor clearances, DKC and three DKUs .......................................................................... 35Floor clearances, DKC and four DKUs ............................................................................ 36

Environmental requirements ........................................................................................................ 36Altitude requirements .......................................................................................................... 37Air conditioning requirements .............................................................................................. 37Temperature specifications ................................................................................................... 37Humidity specifications ....................................................................................................... 37Mechanical vibration specifications ...................................................................................... 38Shock specifications ........................................................................................................... 38Acoustic specifications ........................................................................................................ 39Heat dissipation, power consumption, and air flow ................................................................. 39Controlling dust and pollution .............................................................................................. 41Preventing metallic particulate contamination ......................................................................... 41

Data communication requirements ............................................................................................... 42HP StorageWorks XP Continuous Track (C-Track) ........................................................................... 42Electrical requirements ............................................................................................................... 42

Line voltage ....................................................................................................................... 43Branch circuit breakers ........................................................................................................ 43

Three-phase branch circuit breakers ................................................................................ 43Single-phase branch circuit breakers .............................................................................. 43

Frequency ......................................................................................................................... 43Safety and dedicated ground .............................................................................................. 43Grounding requirements ...................................................................................................... 43Receptacles ....................................................................................................................... 44Power line transients ........................................................................................................... 45Maximum peak inrush specifications ..................................................................................... 45Crest factor specifications .................................................................................................... 45Uninterruptible power supply (UPS) ....................................................................................... 46Sources of electrical interference .......................................................................................... 46

Delivery space requirements ....................................................................................................... 47

3 Electrical specifications ..................................................................... 49AC line voltage requirements ...................................................................................................... 49Receptacle part numbers and ordering information ........................................................................ 51Three-phase AC cabling for the USA (60 Hz) ............................................................................... 52

Connecting the external power supply cords .......................................................................... 5230-amp, three-phase power cords .................................................................................. 52

Three-phase AC USA branch circuit requirements .................................................................... 53Three-phase AC cabling for Europe (50 Hz) ................................................................................. 53

Connecting the power supply cords ...................................................................................... 53Three-phase AC European branch circuit requirements ............................................................. 54

Single-phase AC cabling for the USA .......................................................................................... 54Connecting the power supply cords ...................................................................................... 54

50-amp, single-phase power cords ................................................................................ 5530-amp, single-phase power cords ................................................................................ 55

Single-phase AC USA branch circuit requirements ................................................................... 56Single-phase AC cabling for Europe ............................................................................................ 56

Connecting the power supply cords ...................................................................................... 5650-amp single-phase power cords for Europe .................................................................. 5630-amp single phase power cords for Europe .................................................................. 57

Single-phase AC European branch circuit requirements ........................................................... 57

4 Delivery and unpacking .................................................................... 59Checking for shipping shortage and damage ............................................................................... 59

4

Unpacking the equipment .......................................................................................................... 59Packaging configurations .................................................................................................... 59Required personnel ............................................................................................................. 60Required tools .................................................................................................................... 60Unpacking process ............................................................................................................. 60

Safety precautions ....................................................................................................... 60Removing packaging materials ...................................................................................... 61

Glossary ............................................................................................ 65

Index ................................................................................................. 71


Figures

Fully configured disk array ....................................................................................... 191

Disk controller floor cutouts ....................................................................................... 282

Disk unit floor cutout ................................................................................................ 283

Floor clearances, DKC only ...................................................................................... 324

Floor clearances, DKC and one DKU ......................................................................... 335

Floor clearances, DKC and two DKUs ........................................................................ 346

Floor clearances, DKC and three DKUs ...................................................................... 357

Floor clearances, DKC and four DKUs ........................................................................ 368

Fault-tolerant AC power example .............................................................................. 449

Fault-tolerant wiring with 30-amp, three-phase power cords .......................................... 5210

Connecting European three-phase power cords ........................................................... 5411

Fault-tolerant wiring with 50-amp, single-phase power cords ......................................... 5512

Fault-tolerant wiring with 30-amp, single-phase power cords ......................................... 5513

Connecting European single-phase power cords ......................................................... 5714

Removing the outer carton ........................................................................................ 6215

Unpacking the inner wrapping ................................................................................. 6316

6

Tables

Document Conventions .............................................................................................. 91

Disk controller dimensions ........................................................................................ 202

Disk unit dimensions ................................................................................................ 203

Rack weights .......................................................................................................... 204

Component weights ................................................................................................ 215

Overall floor clearance per floor load rating for a DKC only ......................................... 326

Overall floor clearance by floor load rating for a DKC and one DKU ............................. 337

Overall floor clearance by floor load rating for a DKC and two DKUs ............................ 348

Overall floor clearance by floor load rating for a DKC and three DKUs .......................... 359

Overall floor clearance by floor load rating for a DKC and four DKUs ........................... 3610

Temperature specifications ....................................................................................... 3711

Humidity specifications ............................................................................................ 3812

Mechanical vibration specifications ........................................................................... 3813

Shock specifications ................................................................................................ 3814

Maximum heat dissipation and power consumption specifications ................................. 3915

Air flow specifications .............................................................................................. 3916

Component heat dissipation and power consumption specifications ............................... 3917

Data communication requirements ............................................................................. 4218

Maximum peak inrush specifications ......................................................................... 4519

Crest factor specifications ......................................................................................... 4520

UPS requirements .................................................................................................... 4621

Protecting against electrical interference ..................................................................... 4622

50-amp, 50 or 60 Hz, single-phase DKC power specifications ...................................... 4923

30-amp, 50 or 60 Hz, single-phase DKC power specifications ...................................... 4924

30-amp, 50 or 60 Hz, three-phase DKC power specifications ....................................... 5025

50-amp, 50 or 60 Hz, single-phase DKU power specifications ...................................... 5026

30-amp, 50 or 60 Hz, single-phase DKU power specifications ...................................... 5027

30-amp, 50 or 60 Hz, three-phase DKU power specifications ....................................... 5128

Plug and receptacle part numbers ............................................................................. 5129


About this guide

This guide provides information about preparing a site to install the HP StorageWorks XP12000 DiskArray. Unless otherwise noted, the term disk array in this guide refers to the HP StorageWorks XP12000Disk Array.

Intended audienceThis guide is intended for system administrators and equipment installers with knowledge of:

• Local site physical characteristics• AC electrical systems for computers• Computer system installation

Related documentationThe following documents provide related information:

• HP StorageWorks XP12000 Disk Array Owner's Guide• HP StorageWorks XP Remote Web Console user guide for XP12000/XP10000 Disk Arrays and

SVS 200• HP StorageWorks XP disk array configuration guides for host operating systems

You can find these documents from the Manuals page of the HP Business Support Center website:

http://www.hp.com/support/manuals

In the Storage section, click Disk Storage Systems and then select the XP12000 disk array productunder XP Disk Arrays.

For details about the Internet-based remote support option for the XP12000 disk array, ask your HPrepresentative.

Document conventions and symbolsTable 1 Document Conventions

ElementConvention

Cross-reference links and e-mail addressesBlue text: Document conventions andsymbols

Website addressesBlue, underlined text: http://www.hp.com

• Keys that are pressed• Text typed into a GUI element, such as a box• GUI elements that are clicked or selected, such as menu and

list items, buttons, tabs, and check boxes

Bold text



http://www.hp.com

ElementConvention

Text emphasisItalic text

• File and directory names• System output• Code• Commands, their arguments, and argument values

Monospace text

• Code variables• Command variablesMonospace, italic text

Monospace, bold textMonospace, bold text

WARNING!Indicates that failure to follow directions could result in bodily harm or death.

CAUTION:Indicates that failure to follow directions could result in damage to equipment or data.

IMPORTANT:Provides clarifying information or specific instructions.

NOTE:Provides additional information.

TIP:Provides helpful hints and shortcuts.

Conventions for storage capacity valuesUse the following values to calculate physical storage capacity (hard disk drives) for HP XP storagesystems:

• 1 KB (kilobyte) = 1,000 bytes• 1 MB (megabyte) = 1,0002 bytes• 1 GB (gigabyte) = 1,0003 bytes• 1 TB (terabyte) = 1,0004 bytes

About this guide10

Use the following values to calculate logical storage capacity (logical devices) for HP XP storagesystems:

• 1 KB (kilobyte) = 1,024 bytes• 1 MB (megabyte) = 1,0242 bytes• 1 GB (gigabyte) = 1,0243 bytes• 1 TB (terabyte) = 1,0244 bytes• 1 block = 512 bytes

Rack stabilityRack stability protects personnel and equipment.

WARNING!To reduce the risk of personal injury or damage to equipment:• Extend leveling jacks to the floor.• Ensure that the full weight of the rack rests on the leveling jacks.• Install stabilizing feet on the rack.• In multiple-rack installations, fasten racks together securely.• Extend only one rack component at a time. Racks can become unstable if more than one component

is extended.

HP technical supportTelephone numbers for worldwide technical support are listed on the HP support website:

http://www.hp.com/support/

Collect the following information before calling:

• Technical support registration number (if applicable)• Product serial numbers• Product model names and numbers• Error messages• Operating system type and revision level• Detailed questions

For continuous quality improvement, calls may be recorded or monitored.

Customer self repairHP customer self repair (CSR) programs allow you to repair your StorageWorks product. If a CSRpart needs replacing, HP ships the part directly to you so that you can install it at your convenience.Some parts do not qualify for CSR. Your HP-authorized service provider will determine whether arepair can be accomplished by CSR.

For more information about CSR, contact your local service provider. For North America, see the CSRwebsite:


http://www.hp.com/support/

http://www.hp.com/go/selfrepair

This product has no customer replaceable components.

Product warrantiesFor information about HP StorageWorks product warranties, see the warranty information website:

http://www.hp.com/go/storagewarranty

Subscription serviceHP strongly recommends that customers register online using the Subscriber's Choice website:

http://www.hp.com/go/e-updates

Subscribing to this service provides you with e-mail updates on the latest product enhancements,newest driver versions, and firmware documentation updates as well as instant access to numerousother product resources.

After subscribing, locate your products by selecting Business support and then Storage under ProductCategory.

HP websitesFor additional information, see the following HP websites:

• http://www.hp.com• http://www.hp.com/go/storage• http://www.hp.com/service_locator• http://www.hp.com/support/manuals• http://www.hp.com/support/downloads

Documentation feedbackHP welcomes your feedback.

To make comments and suggestions about product documentation, please send a message [email protected]. All submissions become the property of HP.

About this guide12

http://www.hp.com/go/selfrepair

http://www.hp.com/go/storagewarranty

http://www.hp.com/go/e-updates

http://www.hp.com

http://www.hp.com/go/storage

http://www.hp.com/service_locator


http://www.hp.com/support/downloads

1 Site preparation team and tasks

The objective of a site preparation is to prepare your site for the successful and timely installation ofthe HP StorageWorks XP12000 Disk Array. Proper site preparation is vital for the reliability of thedisk array.

Site preparation involves a careful balance of equipment design criteria, site environmental variables,your business needs, and your budget constraints.

In addition to this guide, other site preparation resources may be available to you. The HP serviceorganization is committed to making sure you receive maximum benefit from your disk array. HPrepresentatives will guide and assist you throughout the site preparation.

The site preparation teamThe site preparation team plans, schedules, and completes all tasks necessary to prepare your sitefor successful system installation.

The team consists of HP representatives and you, the customer.

HP representative responsibilitiesThe HP team includes various HP representatives who have the training, knowledge, experience,tools, and parts required to install and maintain XP disk arrays.

This team is responsible for:

• Helping you to determine and implement the site requirements for your specific site and arrayconfiguration

• Coordinating all HP resources to ensure successful delivery and installation of the disk array

The HP Service Representative is your primary point of contact with HP during site preparation. OtherHP representatives include the HP Customer Engineer who assists with disk array installation andmaintenance, and the HP Application Software Engineer who assists with disk array software installationand configuration.

Customer responsibilitiesAs part of the site preparation team, your responsibilities include planning and preparing a suitableenvironment for the disk array, and scheduling equipment delivery and installation. HP representativescan help. Your internal team may include specialists in the site computer facilities, a storageadministrator, and a site electrician.

Site preparation tasksContact your HP Service Representative for assistance at any time during site preparation.


1. If you have not printed a copy of this guide, you may want to print the “Site preparation checklist”and chapter 2. The aids are easier to use when printed, and printed copies provide a record foryour files.

2. Carefully review chapter 2 to understand the site requirements. If you plan to connect externalstorage to the disk array, be sure to consider the requirements of that storage. See thedocumentation for the external system.

3. Use the information, instructions, and tools in chapter 2 to determine site requirements for thespecific disk array components you ordered.

4. On the site preparation checklist, answer each item Yes or No as it relates to your site. Thechecklist refers to the pages in this guide where you can find more information on each item.

5. Checklist items that require a Yes answer are marked with asterisks (*). If you answer No to anyof these items, your site does not meet site requirements for the disk array. Using the informationin chapter 2, correct the site environment so that you can answer Yes for each item.

6. When the site meets all requirements, contact your HP Service Representative to coordinatedelivery of the disk array equipment.

7. If you choose to unpack the equipment cartons without HP supervision, follow the instructions inchapter 4.

8. Contact the HP Service Representative to schedule disk array installation and configuration.

Site preparation checklistVerify availability of each item in the site preparation checklist. Items that require a Yes answer aremarked with asterisks (*). Provide the customer summary for the benefit of HP representatives, whowill help you complete the checklist.

Site preparation team information

Customer summary

Date:Customer:

Address:

Phone:Contact:

HP summary

Phone:HP Service Rep:

Phone:HP representative:

Site preparation checklist

ReferenceNoYesCheck items*

Fire safety requirements, page 26Is there a fire protection system in thecomputer room?

Site preparation team and tasks14


Preventing equipment servicinghazards, page 26

Is the computer room free of anyequipment servicing hazards (forexample, electrical or data cables thatobstruct access)?

*

The space planning process, page 29Is the existing floor plan documented?

The space planning process, page 29Has a new floor plan been developedto include the new array?

The space planning process, page 29Does the new floor plan includeadequate space for airflow andservicing needs?

*

Floor clearance requirements, page30

Does the new floor plan include theclearance required for the floor's loadrating?

*

General computer roomrequirements, page 25

Is the computer room structurallycomplete (walls, floor, air conditioningsystem, and so on)?

*

Floor requirements, page 26Is the floor adequate for the equipmentload?

*

Floor covering requirements, page 29Is antistatic flooring or mats installed?

Raised floor cutoutspecifications, page 27

Are there cutouts or channels for cablerouting?

Data communicationrequirements, page 42

Is there a dedicated analog telephoneline for the optional modem-basedremote support solution (if chosen)?


Is the infrastructure available for theoptional Internet-based remote supportsolution (if chosen)?


Is a telephone line available for HPrepresentative use?

Data communicationrequirements, page 42Is a private LAN available?

Temperature specifications, page 37Can the temperature be maintainedbetween 16 and 32 degrees C?

*

Temperature specifications, page 37Can temperature changes be held toless than 10 degrees C per hour?

*

Humidity specifications, page 37Can the humidity level be maintainedbetween 20% and 80%?

*

Controlling dust and pollution, page41

Is the computer room protected againstdust, pollution, and metallic particulatecontamination?

*



Mechanical vibrationspecifications, page 38Acoustic specifications, page 39

Does the computer room support otherenvironmental considerations (such asvibration and acoustics)?

*

Electrical requirements, page 42Are two AC outlets, on different lines,available for the equipment?

*

Line voltage, page 43AC line voltage requirements, page49

Does the input voltage correspond tothe DKC and DKU equipmentspecifications?

*

Branch circuit breakers, page 43Are the input circuit breakers adequatefor equipment loads?

*

Frequency, page 43Does the input frequency correspond toequipment specifications?

*

Uninterruptible power supply(UPS), page 46

Is an appropriate uninterruptible powersupply (UPS) strategy in place?

Sources of electricalinterference, page 46

If lightning arresters are recommended,are they installed?

Sources of electricalinterference, page 46

Have all sources of electricalinterferences been corrected?

*

NADoes the customer site have accesscontrol (for example, will HPrepresentatives need an escort)?

NADoes the computer room have accesscontrol (for example, will HPrepresentatives need a security code)?

Delivery space requirements, page 47

Are all floors, stairs, elevators,stairwalkers, lifts, ramps, or laddersneeded to move the equipmentadequate to support its weight and size?

*

Delivery space requirements, page 47Will the equipment fit through all doorsand corridors and in lifts?

*

NADoes the building have a loading dock?Maximum access height is _____m.

*

NA

For any additional equipment required(for example, connectors, receptacles,cables, and any equipment not suppliedby HP), is the equipment on site andready for use?

Site preparation time allowancesThe following site preparation tasks may require several weeks:

• Acquiring required power connectors


• Arranging for an electrician• Adding or modifying air conditioning systems• Making building alterations• Placing an order for data communication equipment, including equipment to support the

Internet-based remote support option

The time between placing an equipment order and actual delivery can vary. Contact your HPrepresentative to determine the best estimated delivery dates.


2 Site requirements for the HP XP12000Disk Array

Your site must meet the following requirements before HP can deliver and install the system. Thischapter discusses these requirements in detail:

• General computer room requirements• Safety requirements• Raised floor requirements• Space planning requirements• Environmental requirements• Data communication requirements• Electrical requirements• Delivery space requirements

Disk array physical specificationsUse the information in this section to determine the total dimensions and weight for your specific arrayconfiguration. You will need these values to complete other procedures in this chapter.

The disk array includes one disk controller frame (DKC), and zero to four disk array frames (DKUs).The DKC contains the controller electronics for the disk array and some hard disk drives. The DKUscontain additional hard disk drives. Figure 1 shows a disk array with four DKUs.

Figure 1 Fully configured disk array

Supported configurations are:

• One DKC (minimum configuration)


• One DKC and one DKU (R1)• One DKC and two DKUs (R1 and R2 or R1 and L1)• One DKC and three DKUs (R1, R2, and L1 or R1, L1, and L2)• One DKC and four DKUs (maximum configuration)

DimensionsDimensions for the DKC and DKU are shown in Table 2 and Table 3, respectively. Use the packagedvalues when determining delivery space requirements and unpackaged values during space planning.

Table 2 Disk controller dimensions

DKC PackagedDKC UnpackagedDimension

incmincm

35.048930.878.2Width

44.3112.536.4292.5Depth

79.5220273.23186Height

The DKC unpackaged width in Table 2 includes two side panels each 1.6 cm (0.63 in.) wide.

Table 3 Disk unit dimensions

DKU PackagedDKU UnpackagedDimension

incmincm

31.27925.665Width

44.3112.536.4292.5Depth

79.5220273.23186Height

WeightsUse the approximate packaged weights when determining delivery space requirements, andunpackaged weights to calculate the total weight of your configuration.

Table 4 provides the approximate weights for:

• Minimum configuration consisting of a base rack without additional components• Maximum configuration consisting of base rack fully populated with components

Table 4 Rack weights

Maximum configurationMinimum configurationCabinet

lbkglbkg

19308751300590UnpackagedDKC

21809891518689Packaged

1630739945429UnpackagedDKU

Site requirements for the HP XP12000 Disk Array20

Maximum configurationMinimum configurationCabinet

lbkglbkg

18808531100499Packaged

For each DKC or DKU shipment from the USA to locations outside the USA, add 59 kg (130 lb) foran international shipping crate. Within the USA, most shipments use a special carrier process in whichframes are shipped without pallets, ramps, and cartons. In these cases, the packaged weight is theunpackaged weight plus 23 kg (50 lb).

For upgrade DKU packaging (includes a ramp), add 29 kg (65 lb).

The main factor that increases total weight is the number of disk drives. The actual weight is the baserack weight plus the weight of all additional components installed.

Table 5 provides the approximate weights of additional disk array components when integrated intoa DKC or DKU rack.

Table 5 Component weights

lbkgDescriptionProduct

5022.6Three-phase 30A/60Hz for HP XP12000 DKCAE002A #001

4420Three-phase 30A/50Hz for HP XP12000 DKCAE002A #002

4721.3Single-phase 50A/60Hz for HP XP12000 DKCAE002A #003

3817.2Single-phase 50A/50Hz for HP XP12000 DKCAE002A #004

4420Single-phase 30A/60Hz for standard HP XP12000 DKCAE002A #005

4118.6Single-phase 30A/50Hz for standard HP XP12000 DKCAE002A #006

3515.9Single-phase 30A/60Hz for minimum HP XP12000 DKCAE002A #007

3315Single-phase 30A/50Hz for minimum HP XP12000 DKCAE002A #008

198.6HP XP12000 SVP High Reliability Support KitAE003A

10.5HP XP12000 Power Control Interface Kit for MainframeAE004A

115HP XP12000/10000 16-port 2-Gbps FC CHIPAE006A

135.9HP XP12000/10000 32-port 2-Gbps FC CHIPAE007A

0.040.02HP XP12000 2-Gbps FC SFP Transceiver LWAE008A

135.9HP XP12000/10000 32-port 4-Gbps FC CHIPAE010A

0.040.02HP XP12000/10000 32-port 4-Gbps FC CHIPAE011A

135.9HP XP12000/10000 8-port FICON SW CHIPAE013A

135.9HP XP12000/10000 8-port FICON LW CHIPAE014A

135.9HP XP12000/10000 16-port FICON SW CHIPAE015A

135.9HP XP12000/10000 16-port FICON LW CHIPAE016A



125.4HP XP12000/10000 16-port EXSA CHIPAE017A

14.36.5HP XP12000/10000 8-Port 1-Gbps NAS SW CHIPAE018A

9.24.2HP XP12000/10000 8-Port 1-Gbps iSCSI CHIPAE019A





5123.1HP XP12000 DKC Power SupplyAE024A

0.50.2HP XP12000/10000 4-GB Cache MemoryAE025A


146.4HP XP12000 256 Cache Platform BoardAE027B

3013.7HP XP12000 DKC-DKU BatteryAE028A

0.10.05HP XP1200/100000 1-GB Shared MemoryAE030A

52.3HP XP12000 V2 Shared Memory Platform BoardAE032B

83.6HP XP12000 Cache SwitchAE033A

115HP XP12000 Standard Performance ACP pairAE034A

73.2HP XP12000 Cable Set for DKU R1, basicAE040A

94.1HP XP12000 Cable Set for DKU R1, high performanceAE041A

94.1HP XP12000 Cable Set for DKU L1, basicAE042A

104.5HP XP12000 Cable Set for DKU L1, high performanceAE043A

52.3HP XP12000 Cable Set for DKU R2 or L2AE044A

5022.6Three-phase 30A/60Hz for HP XP12000 DKUAE045A #001

4420Three-phase 30A/50Hz for HP XP12000 DKUAE045A #002

4721.3Single-phase 50A/60Hz for HP XP12000 DKUAE045A #003


4420Single-phase 30A/60Hz for HP XP12000 DKUAE045A #005


156.8HP XP12000 High Performance FC-AL Disk PathAE046A

104.5HP XP12000 73-GB 15k-rpm Array Group, four disksAE050A

31.4HP XP12000 73-GB 15k-rpm Spare DiskAE050AS







94HP XP12000 300-GB 10k-rpm Array GroupAE053A

21HP XP12000 300-GB 10k-rpm Spare DiskAE053AS

8.84HP XP12000 300GB 15k-rpm Array Group, four disksAE058A

2.21HP XP12000 300GB 15k-rpm Spare DiskAE058AS

130.57HP XP12000/10000 4-Gbps FICON SW CHIPAE062A

130.57HP XP12000/10000 4-Gbps FICON LW CHIPAE063A

8.84.0HP XP12000 400GB 10k rpm Array Group-4 disksAE055A

2.21.0HP XP12000 400GB 10k rpm Spare DiskAE055AS

Calculating the weight of your disk array configurationThe total weight of your array configuration includes not just the DKC and DKU(s), but also the numberof disk drives in each rack and any optional components. Your site must have adequate floor strengthto support the total weight of the array, from the delivery area to the computer room.

Use the following worksheet to calculate the total weight of your unpackaged array configuration, inkilograms or pounds. A completed worksheet is illustrated on the following page.

Later you will use the calculated total weight to estimate the required floor load rating for the computerroom (see “Estimating required floor load rating” on page 28).

Total weightQuantityUnit WeightDescriptionPart Number

=x

=x

=x

=x

=x

=x

=x

=x

=x

=x


Total weightQuantityUnit WeightDescriptionPart Number

=x

=x

=x

=x

=x

=x

=x

Total weight of your configuration

Weight calculation example

Totalweight

(lbs)Qty

UnitWeight

(lbs)DescriptionPart Number

13001 =1300 xHP XP12000 Disk Control Frame (DKC)AE002A

501 =50 xThree-phase 30A/60Hz for HP XP12000 DKCAE002A #001

262 =13 xHP XP12000/10000 32-port 2-Gbps FC CHIPAE007A

131 =13 xHP XP12000/10000 8-port FICON SW CHIPAE013A

511 =51 xHP XP12000 DKC Power SupplyAE024A

48 =0.5 xHP XP12000/10000 4-GB Cache MemoryAE025A

1204 =30 xHP XP12000 DKC-DKU BatteryAE028A

0.33 =0.1 xHP XP12000/10000 1-GB Shared MemoryAE030A

81 =8 xHP XP12000 Cache SwitchAE033A

222 =11 xHP XP12000 Standard Performance ACP pairAE034A

71 =7 xHP XP12000 Cable Set for DKU R1, basicAE040A

91 =9 xHP XP12000 Cable Set for DKU R1, highperformanceAE041A

9451 =945 xHP XP12000 Disk Array Frame (DKU)AE045A

501 =50 xThree-phase 30A/60Hz for HP XP12000 DKUAE045A #001

151 =15 xHP XP12000 High Performance FC-AL Disk PathAE046A

63070 =9 xHP XP12000 146-GB 10k-rpm Array Group, fourdisksAE051A


Totalweight

(lbs)Qty

UnitWeight

(lbs)DescriptionPart Number

84 =2 xHP XP12000 146-GB 10k-rpm Spare DiskAE051AS

3258.3Total unpackaged weight of your configuration

General computer room requirementsThe goal of a computer room is to maintain an ideal environment for computer equipment, includingthis system.

Make sure your computer room adheres to all national and local building codes for a datacenter/computer room environment.

HP recommends that you follow these general guidelines:

• Locate the computer room away from exterior walls of the building to avoid the heat gain fromwindows and exterior wall surfaces.

• When exterior windows are unavoidable, use windows that are double or tripled glazed andshaded to prevent direct sunlight from entering the computer room.

• Maintain the computer room at a positive pressure relative to the surrounding spaces to reduceintroduction of contaminants.

• Install a vapor barrier around the entire computer room envelope (floors/walls/ceiling) to helpkeep moisture out of the room. This is especially important if your computer room is locatedunderground.

• Caulk and vapor-seal all pipes and cables that penetrate the computer room envelope.

Preventing electrostatic dischargeElectrostatic discharge (ESD) can cause component damage, especially during servicing operations.

Static charges occur when objects are separated or rubbed together. The voltage level of a staticcharge is determined by the following factors:

• Types of materials• Relative humidity — low humidity increases ESD voltage.• Rate of change — a standard air conditioner cools the air and lowers humidity. The faster the air

is cooled and dried, the greater the likelihood of ESD.• Separation — refers to the static discharge that can be generated when two objects are separated.

For example, printer paper is often stored in cool dry conditions. If opened and used immediately,the act of removing the paper from its box generates static. To allow the static to dischargegradually over time, leave the box open in the computer room for several hours before use.

Follow these precautions to minimize possible ESD-induced failures in your computer room:

• Install conductive flooring (conductive adhesive must be used when laying tiles).• Use conductive wax if waxed floors are installed.• Ensure that all equipment and flooring are properly grounded and are at the same ground potential.• Use conductive tables and chairs.• Store spare electric parts in antistatic containers.• Maintain recommended humidity level and airflow rates.


Safety requirementsWhen making decisions concerning site safety, your first concern should be the safety of your personneland then the safety of your equipment.

Fundamental safeguards for disk arrays should include a site well away from any sources of potentialdamage.

If you have any questions on site safety, consult your HP representative, your insurance carrier, andlocal building inspectors for safety recommendations.

Fire safety requirements

WARNING!Do not install or operate the disk array in an environment where there is a risk of fire or explosion due tothe presence of highly flammable gases, volatile liquids, or combustible dust.

Consult your insurance carrier and local fire department for fire safety suggestions. They can analyzeyour existing fire control systems and advise you on any required changes. If you are building a newsite or making structural changes to an existing site, consult your local building codes for fire preventionand protection guidelines.

Preventing equipment servicing hazardsYour staff and HP service personnel require safe access to the system. Running electrical and datacommunication cables underneath your computer room's raised floor is the best way to ensure thatthey do not create a safety hazard.

Preventing electrical hazardsThe system equipment racks contain dangerous voltages. To prevent injury or death from electricshock, refer all electrical installation and service to qualified personnel.

Floor requirementsXP disk arrays can be installed on solid surface (concrete) or raised floors.

All computer room floors must meet the following requirements:

• The floor must be able to support the total weight of the equipment as well as localized weight ateach caster or foot of the equipment cabinets. For more information, see“Estimating required floor load rating” on page 28.

• The surface of the floor must be covered or treated with conductive material. For more information,see “Floor covering requirements” on page 29.


WARNING!If metal is used in the construction of the computer room floor, ensure that there is a common groundconnection between it and the ground or floor that it is built on to avoid possible build up of differentvoltage potentials. Noncompliance can result in serious injury to personnel and damage to equipment.

Raised floor requirementsA common method of preparing an adequate floor for a computer room is to construct a raised floorover the building floor.

A raised floor has these advantages:

• Allows weight to be spread evenly across the floor• Allows cables to be run conveniently and unobtrusively under the floor• Allows optimum distribution of conditioned air

Raised floors have the following additional requirements:

• Raised floor access ramps must not exceed a 10 degree slope.• Use a 25 to 31 cm (10 to 12 inch) raised floor system for the most favorable room air distribution

system.• Grid panels must be at least 45 x 45 cm (17.72 x 17.72 in).• The floor must have a load rating between 300 and 500 kg per square meter (553 to 921.7 lb

per square yard, or 61.4 to 102.4 lb per square foot). The maximum point floor loading is 500kg (1102.3 lb).

Raised floor cutout specificationsFigure 2 and Figure 3 show the locations of floor cutouts under the DKC and DKU, respectively.Basically, position floor cutouts toward the center of the rack. The position may be off-center as longas the cutout is within the allowable range and allows smooth entrance of an external cable (checkthe relationship between the position of the cutout and the opening on the bottom of the rack).


Figure 2 Disk controller floor cutouts

Figure 3 Disk unit floor cutout

Estimating required floor load ratingTo estimate the load rating you need for your floor, consider the total weight of all of these items:


• The disk array (see “Weights” on page 20)• Other equipment• Furniture such as desks, chairs, and storage cabinets• Computer room personnel• Moving equipment, such as forklifts, dollies, and similar items

The lower the floor load rating, the more clearance is required around the array to distribute theequipment weight correctly. If your computer room is too small to allow for minimum required clearancearound the array, you may need to increase the floor load rating. For more on required clearance,see “Floor clearance requirements” on page 30.

Floor covering requirementsHP recommends a tiled floor.

CAUTION:HP strongly discourages the use of carpeting, including antistatic varieties, within 6.0 m (20 ft.) of the diskarray. Over time, carpeting may shed dust that can cause problems with the disk array.

CAUTION:If your computer room has carpeting, place static discharge mats so that personnel must walk across thembefore touching any part of the array. Failure to comply with this precaution can result in equipmentdamage through static discharge.

Space planning requirementsSpace planning involves making sure that your computer room:

• Is large enough to hold the new array and other equipment and furniture• Provides minimum clearance around the array for service access and to ensure proper weight

distribution on the computer room's floor• Includes correctly positioned floor cutouts for the array's power and data cables

The space planning process1. Document your computer room's existing floor plan, including the locations of:

a. Immovable objects, such as structural support columns

b. Walls

c. All equipment, furniture, cabinets, racks, data communication equipment, and systems

d. Floor cutouts

e. Electrical outlets

f. Interconnecting cables and power cords, including lengths

g. Floor vents


2. Develop a new floor plan that includes the locations of:

a. Immovable objects from your existing floorplan

b. Walls

c. The array with required clearance (see “Floor clearance requirements” on page 30)

d. All other equipment, furniture, cabinets, racks, data communication equipment, and systems

e. Floor cutouts (see “Raised floor cutout specifications” on page 27)

f. Electrical outlets

g. Interconnecting cables and power cords (keep cables away from traffic areas to help preventaccidents and equipment failures)

h. Floor vents

i. Enough space and lighting for people to work effectively on a daily basis and for periodicequipment servicing

j. Flexibility to accommodate additional equipment as your requirements increase

3. Implement the new floor plan, leaving empty space where the array will be installed. If the newfloorplan requires construction changes, consult with local contractors and your HP representatives.

Floor clearance requirementsThe total floor clearance required for the disk array includes:

• The actual space required by the equipment.• Service clearance — the floor space required to access the disk array. Never use this space for

storage.• Additional space required to properly distribute the equipment weight on your computer room's

raised floor. The amount of additional space required depends on your floor load rating.

To determine the floor clearance required for your disk array configuration:

1. Select your array configuration from the following five diagrams:

a. DKC only, Figure 4

b. DKC with one DKU, Figure 5

c. DKC with two DKUs, Figure 6

d. DKC with three DKUs, Figure 7

e. DKC with four DKUs, Figure 8

2. In each floor clearance diagram:

a. Clearance A is the space between the service clearance at the left side of the array (10 cmminimum for installing the kickplate) and any other object, such as a desk or wall.

b. Clearance B is the space between the service clearance at the right side of the array (10cm for the kickplate) and any other object.

c. Clearance C is the space between the service clearance at the front of the array and anyother object.

Use the value of C and your floor load rating to determine the values for A and B.


3. Determine how much space you can assign to clearance C. For maintenance purposes, try tomake C larger (100 cm) rather than smaller (0 cm). The smaller C is, the larger A and B mustbe.

4. In the table after the diagram, find the column that most closely matches the size of C. If your Cvalue is between two table values, use the larger table value. Then, find the row for your floorload rating. Where the column and row intersect is the A+B value.

5. To determine clearance A and clearance B, divide the A+B value between A and B. They do notneed to be equal. For example, if the A+B value from the table is 60 cm, then A can be 40 cmand B can be 20, or both A and B can be 30. However, if your configuration includes only aDKC, or a DKC and one DKU, then A must be at least 28 cm (11.1 in) to allow the DKC frontdoor to open.

6. Calculate minimum floor clearances for the array using the following worksheet.

BackFront (add down)Right (add down)Left (add down)

Not applicableC = _________+B = _________+A = _______+Clearance values

80 cm (31.5 in)80 cm (31.5 in)=10 cm (3.94 in)=10 cm(3.94 in)=Plus minimum serviceclearance

80 cm (31.5 in)Equals minimum floorclearances


Floor clearances, DKC only

Figure 4 Floor clearances, DKC only

Table 6 Overall floor clearance per floor load rating for a DKC only

If C=100 cm (39.4in)A+B=

If C=60 cm(23.6 in)A+B=

If C=40 cm(15.8 in)A+B=

If C=20 cm(7.9 in)A+B=If C=0A+B=

Floor loadrating(kg/m2)

00203040500

020304050450

2040506080400

40608090110350

80100120140170300


Floor clearances, DKC and one DKU

Figure 5 Floor clearances, DKC and one DKU

Table 7 Overall floor clearance by floor load rating for a DKC and one DKU

If C=100 cm (39.4in)A+B=

If C=60 cm(23.6 in)A+B=

If C=40 cm(15.8 in)A+B=

If C=20 cm(7.9 in)A+B=

IfC=0A+B=


020406080500

20507090110450

5080100130160400

90130160190230350

160210240280330300


Floor clearances, DKC and two DKUs

Figure 6 Floor clearances, DKC and two DKUs

Table 8 Overall floor clearance by floor load rating for a DKC and two DKUs

If C=100 cm (39.4in)A+B=

If C=60 cm(23.6 in)A+B=

If C=40 cm(15.8 in)A+B=

If C=20 cm(7.9 in)A+B=If C=0A+B=


0406090120500

3070100130170450

80130160200240400

140200240280340350

240320370430500300

NOTE:The clearance diagram shows a typical configuration. Other configurations are possible. Consult your HPrepresentative for help with equipment arrangements that differ from the one shown.


Floor clearances, DKC and three DKUs

Figure 7 Floor clearances, DKC and three DKUs

Table 9 Overall floor clearance by floor load rating for a DKC and three DKUs

If C=100 cm (39.4in)A+B=

If C=60 cm(23.6 in)A+B=

If C=40 cm(15.8 in)A+B=

If C=20 cm (7.9in)A+B=

IfC=0A+B=


05080120160500

50100140180230450

100170210260320400

190270320380460350

320420490570660300

NOTE:The clearance diagram shows a typical configuration. Other configurations are possible. Consult your HPrepresentative for help with equipment arrangements that differ from the one shown.


Floor clearances, DKC and four DKUs

Figure 8 Floor clearances, DKC and four DKUs

Table 10 Overall floor clearance by floor load rating for a DKC and four DKUs

If C=100 cm(39.4 in)A+B=

If C=60 cm(23.6 in)A+B=

If C=40 cm(15.8 in)A+B=

If C=20 cm (7.9in)A+B=If C=0A+B=Floor load

rating (kg/m2)

070100150200500

60130170230290450

130210270330410400

240340400480570350

400530610710830300

Environmental requirementsThe environmental specifications for operating this system must be satisfied before installation.


Altitude requirementsThe maximum altitude for system operation is 3,000 meters. For nonoperational or storage situations,the maximum altitude is 4,000 meters. The minimum altitude for system operation is –60 meters.

Air conditioning requirementsUse separate computer room air conditioning duct work. If it is not separate from the rest of thebuilding, it might be difficult to control cooling and air pressure levels. Duct work seals are importantfor maintaining a balanced air conditioning system and high static air pressure. Adequate coolingcapacity means little if humidity levels increase when the ducts are exposed to warm air, producingcondensation. Condensation on any disk hardware can damage the components.

Any questions regarding the adequacy of airflow construction should be referred to and evaluatedby a qualified structural engineer.

Temperature specificationsTable 11 Temperature specifications

RangeTemperature range type

21 to 24 degrees C70 to 75 degrees FRecommended operating temperature range

16 to 32 degrees C61 to 89 degrees FOperating temperature

–10 to +43 degrees C14 to 109 degrees FNonoperating temperature range

–25 to +60 degrees C–13 to +140 degrees FShipping and storage temperature (product packed infactory packing)

10 degrees C per hour18 degrees F per hourTemperature shock immunity (maximum rate oftemperature change)

At 40 degrees C104 degrees FOver-temperature warning

At 60 degrees C140 degrees FOver-temperature shutdown

Humidity specificationsMaintain proper humidity levels. High humidity levels cause galvanic actions to occur between somedissimilar metals. This eventually causes a high resistance between connections, leading to equipmentfailure.

Low humidity contributes to undesirably high levels of electrostatic charges. This increases theelectrostatic discharge (ESD) voltage potential. ESD can cause component damage during servicingoperations.

Low humidity levels are often the result of the facility heating system and occur during the cold season.Most heating systems provide air with a low humidity level, unless the system has a built-in humidifier.


You should not see any condensation in or around the disk array under any conditions. There is noprocedure for recovery from moisture condensation.

Table 12 Humidity specifications

Noncondensing relative humidity (RH)Humidity range type

50% to 55%Recommended operating humidity range at 22 degrees C (71degrees F)

20% to 80%Operating humidity range at 22 degrees C (71 degrees F)

8% to 90%Nonoperating humidity range

5% to 95%Shipping and storage humidity range (product packed in factorypacking)

26 degrees C79 degrees FOperating maximum wet bulb temperature

27 degrees C81 degrees FNonoperating maximum wet bulb temperature

29 degrees C84 degrees FShipping and storage maximum wet bulb temperature

Mechanical vibration specificationsContinuous vibration can cause a slow degradation of mechanical parts and, when severe, can causedata errors in disk drives. Mechanical connections such as printed circuit assembly (PCA) conductors,cable connectors, and processor backplane wiring can also be affected by vibrations. Vibrationspecifications apply to all three axes. For specification tests, see ASTM D999-91 Standard Methodsfor Vibration Testing of Shipping Containers.

Table 13 Mechanical vibration specifications

SpecificationCondition

0.25 mm, 5–10 Hz 0.05 G, 10–300 HzOperating

2.5 mm, 5–10 Hz 0.5 G, 10–70 Hz 0.05 mm, 70–99 Hz 1.0G, 99–300 HzNonoperating

0.5 G, 15 min. (at four most severe resonances between 5 and200 Hz)

Shipping and storage (product packed inthe factory)

Shock specificationsTable 14 lists shock specifications. For horizontal shock testing methods, see ASTM D5277-92 StandardTest Methods for Performing Programmed Horizontal Impacts Using an Inclined Impact Tester. Forvertical shock testing methods, see ASTM D6055-96 Standard Test Methods for Mechanical Handlingof Unitized Loads and Large Shipping Cases and Crates.

Table 14 Shock specifications


NoneOperating

8 G, 15 msNonoperating



Horizontal, incline impact: 1.22 m/sVertical, rotationaledge: 0.1 mShipping and storage (in factory packing)

Acoustic specificationsThe acoustic emission specifications for the disk array are:

• 8.27 Bels (A) sound power• 65 dB (A) sound pressure, operator position (1 meter from the floor and surface of the rack)

You can reduce the ambient noise level caused by equipment and air conditioning blowers in yourcomputer room by:

• Installing a dropped ceiling covered in commercial-grade, fire-resistant, acoustic-rated, fiberglassceiling tile

• Covering the walls in sound-deadening material• Installing foam rubber removable partitions

Heat dissipation, power consumption, and air flowTable 15 describes the heat dissipation and power consumption of the HP XP12000 disk array whenloaded with the maximum number of disk drives.

Table 15 Maximum heat dissipation and power consumption specifications

Full array (1 DKC and 4DKUs)Each DKUDKCParameter

37.87.57.9Power consumption (kVA)

35.56.97.8Heat dissipation (kW)

1213692369826577BTUs per hour

3058459726697kcal per hour

Table 16 shows frame air flow requirements.

Table 16 Air flow specifications

Air flow(cubic meters/minute)DescriptionProduct No.

44HP XP12000 Disk Control Frame (DKC)AE002A

31HP XP12000 Disk Array Frame (DKU)AE045A

Table 17 presents the heat dissipation and power requirements of individual components.

Table 17 Component heat dissipation and power consumption specifications

PowerConsumption(kVA)

HeatOutput(kW)DescriptionProduct No.

1.2191.178HP XP12000 Disk Control Frame (DKC)AE002A




0.0820.08HP XP12000 SVP High Reliability Sup. KitAE003A

0.0020.002HP XP12000 Power Control I/F Kit for MFAE004A


0.3940.382HP XP12000/10000 32-Port 2-Gbps FC CHIPAE007A

0.3940.382HP XP12000/10000 32-Port 4-Gbps FC CHIPAE010A

00HP XP12000/10000 32-port 4-Gbps FC LW CHIPAE011A

0.3560.346HP XP12000/10000 8-Port FICON SW CHIPAE013A

0.3560.346HP XP12000/10000 8-Port FICON LW CHIPAE014A

0.3610.35HP XP12000/10000 16-Port FICON SW CHIPAE015A

0.3610.35HP XP12000/10000 16-Port FICON LW CHIPAE016A

0.3230.313HP XP12000/10000 16-Port EXSA CHIPAE017A

0.460.446HP XP12000/10000 8-Port 1-Gbps NAS SW CHIPAE018A

0.2040.198HP XP12000/10000 8-Port 1-Gbps iSCSI CHIPAE019A







0.0070.007HP XP12000 256 Cache Platform BoardAE027B

0.0660.064HP XP12000 DKC-DKU BatteryAE028A

0.0120.011HP XP12000/10000 1-GB Shared MemoryAE030A

0.0060.006HP XP12000 V2 Shared Memory Platform BoardAE032B

0.0590.057HP XP12000 Cache SwitchAE033A

0.3280.318HP XP12000 Standard Performance ACP PairAE034A

0.6860.659HP XP12000 Disk Array Frame (DKU)AE045A

0.2750.264HP XP12000 High Perf FC-AL Disk PathAE046A

0.0960.088HP XP12000 73-GB 15k-rpm Array Group–4 diskAE050A

0.10.092HP XP12000 146-GB 10-rpm Array Group–4 diskAE051A




0.10.092HP XP12000 146-GB 15k-rpm Array GroupAE052A



0.0240.022HP XP12000 73-GB 15k-rpm Spare DiskAE050AS





0.3710.360HP XP12000/10000 4-Gbps FICON SW CHIPAE062A

0.3710.360HP XP12000/10000 4-Gbps FICON LW CHIPAE063A

0.10.092HP XP12000 400GB 10k rpm Array Group-4 disksAE055A

0.0250.023HP XP12000 400GB 10k rpm Spare DiskAE055AS

Controlling dust and pollutionAirborne contaminants and particles of a certain size and hardness can damage the system. Someof the most common contaminants are dust, smoke, ash, eraser debris, food crumbs, and salty air.

Mechanical filters on the disk array protect it by trapping large dust particles. Smaller particles canpass through some filters, and can eventually cause problems in mechanical parts. Prevent small dustparticles from entering the computer room by maintaining its air conditioning system at a high staticair pressure level.

Your HP representative can help you determine if you need to be concerned about airbornecontaminants.

Preventing metallic particulate contaminationMetallic particulates can be especially harmful around electronic equipment. This type of contaminationmay enter the data center environment from a variety of sources, including but not limited to raisedfloor tiles, worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners, or printercomponent wear. Because metallic particulates conduct electricity, they have an increased potentialfor creating short circuits in electronic equipment.

Over time, very fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin surfaces.If these whiskers are disturbed, they may break off and become airborne, possibly causing failuresor operational interruptions. For over 50 years, the electronics industry has been aware of the relativelyrare but possible threat posed by metallic particulate contamination. During recent years, a growingconcern has developed in computer rooms where these conductive contaminants are formed on thebottom of some raised floor tiles.

Although this problem is relatively rare, it may be an issue within your computer room. Since metalliccontamination can cause permanent or intermittent failures on your electronic equipment, HP strongly


recommends that your site be evaluated for metallic particulate contamination before installation ofelectronic equipment.

Data communication requirementsRoute data communication cables away from areas of high static electric fields created by powertransformers and heavy foot traffic. Use shielded data communication cables that meet approvedindustrial standards to reduce the effects of external fields.

Table 18 shows the data communication requirements for the XP disk array.

Table 18 Data communication requirements

DescriptionItem

If you plan to use HP StorageWorks XP Continuous Track (C-Track)modem-based remote support, you will need a dedicated analogphone line. HP recommends a data quality modem line with 28.8Kbps capability to support reliable file transfer and to serve the overallobjectives of the remote support solution. An HP representative willconfigure C-Track.

A dedicated analog phone line forC-Track modem-based remote supportoption (if chosen)

If you plan to use the HP StorageWorks XP Continuous Track (C-Track)Internet-based remote support solution, additional infrastructure andrelated site preparation is required. For detailed information, contactyour HP representative.

Internet connectivity infrastructure forC-Track Internet-based remote supportoption (if chosen)

Needed to connect the HP system to an available Ethernet port onyour public LAN. To ensure network security, consult with an HPrepresentative and your network administrator before selecting theappropriate location of your LAN drop.

A twisted pair (Cat 5) cableAnavailable LAN drop on your Intranet

Needed to allow your staff and HP representatives to communicateinside and outside your site.

A public voice phone line near the diskarray

HP StorageWorks XP Continuous Track (C-Track)HP StorageWorks XP Continuous Track (C-Track) detects and reports system problems to the HPStorage Technology Centers (STCs). C-Track transmits heartbeats, system information messages (SIMs),and configuration information for remote data collection and monitoring purposes. C-Track alsoenables the STCs to remotely diagnose issues and perform maintenance, if you permit remote access.

The C-Track solution offers Internet connectivity and modem connectivity. If you choose the Internet-basedremote support solution, additional infrastructure and site preparation are required. This additionalpreparation may include server and router requirements, which you and HP may be responsible forimplementing. For more information about the C-Track Internet-based solution, contact your HPrepresentative.

Electrical requirementsThe following topics explain the electrical requirements of your site to support the HP XP12000 DiskArray.


Line voltageLine voltage (AC) at the wall power outlet is a function of the local power utility and your buildingpower distribution network. Voltages outside of the operating range of the HP system can causeintermittent system errors or a complete system shutdown. If required, an HP representative and yourelectrician can determine the current line voltage and make recommendations. See“Electrical specifications” on page 49 for specific AC line voltage requirements.

Avoid the use of a line voltage conditioner.

Make sure that a power distribution unit (if used) provides the correct voltage to support your entiresystem.

Branch circuit breakersSee “Electrical specifications” on page 49 for specific branch circuit requirements for your powersituation.

Three-phase branch circuit breakersThe power cords supplied with each DKC or DKU configured for three-phase power are sized forconnection to a 30-amp circuit.

Single-phase branch circuit breakersThe power cords supplied with each DKC or DKU configured for single-phase power are sized forconnection to a 30- or 50-amp circuit.

Note that 30-amp, single-phase power is available by special order only.

FrequencyUsually, AC line frequency is determined by your local power providers. In some cases, electricalpower is supplied by generators. Shifts in AC line frequency can cause system errors. An HPrepresentative can monitor the frequency of the input AC line power and make recommendations, ifnecessary. The HP system requires that the line frequency be within 0.5 Hz of the rated line frequency(50 Hz or 60 Hz).

See “Electrical specifications” on page 49 for more information.

Safety and dedicated groundThe primary reason for grounding electrical systems is safety. The safety ground is required by theNational Electric Code (USA) and most other local, regional, and national codes. In addition to safetyground, HP requires that a dedicated (earth reference) ground be installed as a common referencepoint for all system components. Consult with an HP representative and your electrician to ensure thatyour electrical system meets all local and national safety codes.

Grounding requirementsYour site's electrical subsystem must meet all of the following conditions:

• Earth grounding as prescribed by your local country codes.


• An insulated grounding conductor that is identical in size and insulation material and thicknessto the ungrounded branch-circuit supply conductors. It should be green, with or without yellowstripes, and is to be installed as a part of the branch circuit that supplies the unit or system. Thismeans the ground conductor must be run in the same conduit, armored cable, or other cablebundle as the phase wires.

• The grounding conductor should be grounded to earth at the service equipment or other acceptablebuilding earth ground such as the building frames (in case of a high-rise steel-frame structure).

• IT-configured grounding systems are not certified for use with the HP system as these groundingsystems may not have solidly conductor-connected grounded power systems and/or they mayhave resistive impedance inserted in ground and/or neutral lines. The HP system requires a solidlyconductor-connected ground and may require a separate neutral in the case of WYE or STARconnections. For the HP system, TN grounding systems are preferred.

ReceptaclesEach disk array rack has two or four separate connections to AC power.

• For racks with two AC power connections, each input must be capable of supporting the rack'sentire current demand.

• For racks with four AC power connections, the two inputs to AC Box 1 or the two inputs to ACBox 2 must be capable of supporting the rack's entire current demand.

Figure 9 illustrates faul-tolerant wiring.

Figure 9 Fault-tolerant AC power example

When receptacles are used to connect disk array components to AC power, they must include adedicated ground connection that is insulated from the receptacle. It is important that the receptaclebox be grounded with an additional ground connection that is separate from the dedicated ground.The additional ground can be hard conduit.

Specific power plugs and receptacles are required for the DKC and DKUs depending on the poweroption you specify when ordering the disk array. The power cords on 60 Hz cabinets are shippedwith plugs attached and connected. The power cords on 50 Hz cabinets are shipped without plugs.


You are responsible for having the correct plugs and receptacles installed by an electrician incompliance with local electrical requirements and practices. See “Electrical specifications” on page49 for specific plug and receptacle part numbers and ordering information.

CAUTION:When installing the receptacles, the electrician must ensure that each receptacle has its own neutral (ifrequired) and ground. Using the same neutral/ground for more than one circuit causes voltage loss andheat problems and can create a fire hazard. A shared neutral conductor that fails open-circuit can causeovervoltage damage to equipment.

Power line transientsHeavy electrical loads from nearby machinery or equipment (for example, elevators or electric welders)can cause intermittent system problems with sophisticated electronic equipment, even if that equipmentis on a separate circuit breaker. When faced with these conditions, provide a separate, completelyindependent power panel with an isolated ground and circuit breaker coming directly from the mainbuilding power source or secondary power source.

If necessary, an HP representative can measure your power line noise level and make appropriaterecommendations concerning the use of line treatment devices.

Maximum peak inrush specificationsTable 19 Maximum peak inrush specifications

Three-phaseSingle-phasePowerCabinet

34 A46 A30-ampDKC

Not applicable60 A50-amp

26 A34 A30-ampDKU

Not applicable56 A50-amp

50-amp power configurations are single-phase only.

Crest factor specificationsTable 20 Crest factor specifications

Three-phaseSingle-phasePowerCabinet

1.671.6830-ampDKC

Not applicable1.5650-amp

1.531.6530-ampDKU

Not applicable1.5050-amp

50-amp power configurations are single-phase only.


Uninterruptible power supply (UPS)Most disk array units are installed in data centers where a UPS strategy is already in place. However,if you are making your first large disk array purchase, you may need a separate UPS solution.

CAUTION:This section discusses a product UPS. If you are planning or already have a site-wide UPS, HP recommendsagainst using a product UPS powered by a site-wide UPS for the XP12000 disk array.

Make sure your UPS satisfies the requirements in Table 21. Table values are based on a worst-casevoltage (rated voltage –10 percent) and a maximum configuration of DKC/DKUs. A phase imbalanceof 15 percent is also included in the calculation.

Table 21 UPS requirements

Three-phase 30ASingle-phase 50ASingle-phase 30AInput(VAC) Each DKUEach DKUDKCEach DKUDKC

20.0 A34.6 A40.0 A17.3 A20.0 A208

10.4 ANot applicableNot applicableNot applicableNot applicable400

In a maximum disk array configuration (one DKC and four DKUs), the array requires 31 kVA.

Sources of electrical interferenceEnsure that the disk array is protected from the sources of electrical interference descibed in Table 22.

Table 22 Protecting against electrical interference

DescriptionPotential source

Convenience power outlets for building maintenance equipment (suchas vacuum cleaners and floor buffers) must be wired from circuitbreakers on a power panel separate from the computer system panel.The ground wires from these outlets must be connected to the normalbuilding distribution panel and not to the system ground. If a separatepower source and separate ground are not provided, operation ofjanitorial equipment can induce electrical noise and cause abnormaloperation of the computer system. Your electrician can verify whetheror not maintenance outlets are on separate panels.

Wall outlets

In geographical areas subject to lightning storms, it may by advisableto install lightning protection for both personnel and computer systems.The principles of lightning protection and personnel safety areoutlined in detail in the lightning protection code contained in theNational Fire Protection Association (NFPA) Handbook.

Lightning

The HP system is specifically designed to reduce its susceptibility toradiated and conducted interference. Electromagnetic interferencecan cause a variety of system problems. An HP representative canadvise you about the most common causes of electromagneticinterference.

Electromagnetic interference


Delivery space requirementsThe delivery area must provide enough space and floor strength to support the packaged equipmentcartons for the disk array. Refer to the packaged dimensions in “Dimensions” on page 20 and thepackaged weights in “Weights” on page 20.

CAUTION:Make sure that your doorways and hallways provide enough clearance to move the equipment safely fromthe delivery area to the computer room. Permanent obstructions such as pillars or narrow doorways cancause equipment damage. If necessary, plan for the removal of walls or doors.

CAUTION:Make sure all floors, stairs, and elevators you use when moving the disk array to the computer room cansupport the weight and size of the equipment. Failure to do so could damage the equipment or your site.


3 Electrical specifications

The detailed electrical specifications in this chapter are provided to help your site electrician performany necessary electrical work related to site preparation.

AC line voltage requirementsPower specifications are presented in the following tables. Please note that in all tables 208 VAC is60 Hz only. Units with only two power cords require only two circuit breakers.

Table 23 50-amp, 50 or 60 Hz, single-phase DKC power specifications

240 VAC230 VAC220 VAC208 VAC200 VACParameter

221212202191184Minimum operating voltage (VAC)

254244233220212Maximum operating voltage (VAC)

18.819.620.521.722.6Rated line current per power cord(amps RMS)

22222Number of power cords

5050505050Recommended circuit breakers (amps)

22222Number of circuit breakers

6060606060Dropout carry-through time atminimum line voltage (ms)

Table 24 30-amp, 50 or 60 Hz, single-phase DKC power specifications




9.49.810.310.911.3Rated line current per power cord(amps RMS)







Table 25 30-amp, 50 or 60 Hz, three-phase DKC power specifications

415VAC

400VAC

380VAC

240VAC

230VAC

220VAC

208VAC

200VACParameter



6.36.56.910.911.311.912.513Rated line current per power cord(amps RMS)





Table 26 50-amp, 50 or 60 Hz, single-phase DKU power specifications




15.015.716.417.318Rated line current per power cord(amps RMS)





Table 27 30-amp, 50 or 60 Hz, single-phase DKU power specifications




7.57.88.28.79Rated line current per power cord(amps RMS)


Electrical specifications50





Table 28 30-amp, 50 or 60 Hz, three-phase DKU power specifications

415VAC

400VAC

380VAC

240VAC

230VAC

220VAC

208VAC

200VACParameter

382368350221212202191184Minimum operating voltage(VAC)

440424403254244233220212Maximum operating voltage(VAC)

5.05.25.58.79.09.410.010.4Rated line current per powercord (amps RMS)


3030303030303030Recommended circuit breakers(amps)



Receptacle part numbers and ordering informationTable 29 lists the plug and receptacle part numbers for 60 Hz configurations of the HP XP12000 diskarray.

Table 29 Plug and receptacle part numbers

ReceptaclePlugBreaker ratingPower source

Russellstoll 3933 (alt. 9C33U0) or 3753(alt. 9R33U0W)Russellstoll 3750DP30 A

Single-phase

Russellstoll 9C53U2 or 9R53U2WRussellstoll 9P53U250 A

Russellstoll 3934 (alt. 9C34U0) or 3754(alt. 9R34U0W)Russellstoll 3760PDG30 AThree-phase

Russellstoll connectors are available through most electrical distributors. HP has arranged for thedistributors listed below to stock these connectors. These distributors can ship worldwide via yourpreferred carrier.

Beck Electrical Supply, 2775 Goodrick Avenue, Richmond, CA 94801, USA Telephone: (800)466-4395, Fax: (800) 466-5442. Contact: Ken Mogan, [email protected].


Source Research, Inc. (SRI), 2160 Sunnydale Boulevard, Clearwater, FL 33765-2108, USA Telephone:(800) 356-0259. Contact: Erik Peterson, telephone extension 302, company website: http://www.sourceresearch.com/index.cfm.

Three-phase AC cabling for the USA (60 Hz)Each three-phase DKU has two main disconnect devices (two main breakers for dual power lines) sothat AC power to the unit can be supplied from separate power distribution panels with two powersupply cords.

CAUTION:An HP representative should be present whenever the disk array is being connected to a new power sourcefor the first time.

Connecting the external power supply cordsThe disk array is factory configured for 30-amp, three-phase power.

30-amp, three-phase power cordsWhen the disk array uses 30-amp, three-phase input power, the DKC and DKUs have two powercords each.

Figure 10 Fault-tolerant wiring with 30-amp, three-phase power cords

If one power source malfunctions, the other power source assumes the total load, providinguninterrupted operation. HP recommends that each power cord have a separate electrical circuit asits source, in case of a circuit failure. Each power supply cord is supplied with an attachment plugtype Russellstoll 3760PDG.

Be sure to install Russellstoll 3934 (alternate, 9C34U0) or 3754 (alternate, 39R34U0W) socketreceptacles between the power distribution panel of the building and the power plugs for the unit.


http://www.sourceresearch.com/index.cfm

http://www.sourceresearch.com/index.cfm

The power cords provided with the disk array are nonshielded, type ST or equivalent with four #8AWG (minimum) conductors terminated at one end with an assembled plug connector.

Three-phase AC USA branch circuit requirementsTo protect the disk array, your building must be wired correctly. Each supply (“hot”) conductor mustbe protected by a short-circuit protective device and by an overcurrent protective device. The tablesprovided in “AC line voltage requirements” on page 49 specify the overcurrent protective devicesrequired for three-phase operation.

All protective devices must comply with national standards of the country where the units are installed.If a protective device interrupts any supply conductor, it must also interrupt all other supply conductors.

Overcurrent protection is not required for the neutral conductor of this unit. Only 50 Hz, three-phaseconfigurations have a neutral conductor.

Three-phase AC cabling for Europe (50 Hz)Each three-phase DKU has two main disconnect devices (two main breakers for dual power lines) soAC power can be supplied from separate power distribution panels with two power supply cords.


Connecting the power supply cordsAll 50 Hz, European HP XP12000 disk array racks are shipped with unterminated power cords. Yourelectrician must select and install the correct power plug. Be sure to prepare the socket receptaclesand power cords between the power distribution board of the building and the attachment plugs forthe unit. 30-amp power cords of type H07RN-F or equivalent, with five 6 square mm conductors percord, are provided with the unit.

CAUTION:Be sure to connect the power cords to the distribution panel as shown in Figure 11. Improper wiring of theneutral conductor may cause damage to the disk array. To reduce the risk of a wrong connection, use aplug and socket that are approved for this disk array. It is your electrician's responsibility to select andinstall the proper plug.


Figure 11 Connecting European three-phase power cords

When connecting to 380 to 415 volt service, use a WYE configuration with neutral and groundconductors, in addition to the three-phase wires, for a total of five wires.

WARNING!High leakage current can occur between the power supply and the unit. To avoid electrical shock, makethe protective earth connection before the supply connections.

Three-phase AC European branch circuit requirementsWhen the supplied line to line voltage is in the 380 to 415 volt range, the connection must be afive-wire WYE or STAR connection.

To protect the disk array, your building must be wired correctly. Each supply (“hot”) conductor mustbe protected by a short-circuit protective device and by an overcurrent protective device. The tableslisted under the “AC line voltage requirements” heading provide specifications for the overcurrentprotective devices required for three-phase operation.

All protective devices must comply with the standards of the country where the units are to be installed.If a protective device interrupts a supply conductor, it must also interrupt all other supply conductors.

WARNING!Overcurrent protection is also required for the neutral conductor.

Single-phase AC cabling for the USAWhen configured for 50-amp, single-phase power, each XP12000 disk array rack has two powercords and two main disconnect devices so that AC power can be supplied from separate powerdistribution panels. When configured for 30-amp, single-phase power, each HP XP12000 disk arrayrack has four power cords and four main disconnect devices.


Connecting the power supply cordsThe XP12000 disk array can be factory-configured for 50-amp or 30-amp, single-phase power, asthe following text explains.


50-amp, single-phase power cordsEach 50-amp XP12000 disk array rack has two power supply cords with attachment plug typeRussellstoll 9P53U2.

Figure 12 Fault-tolerant wiring with 50-amp, single-phase power cords

Be sure to install Russellstoll 9C53U2 or 9R53U2W socket receptacles between the power distributionpanel of the building and the power plugs for the unit.

The power cords provided with the disk array are nonshielded, type ST or equivalent with three #6AWG (minimum) conductors terminated at one end with an assembled 9C53U2 plug connector.

30-amp, single-phase power cordsEach 30-amp HP XP12000 disk array rack has four power supply cords with attachment plug typeRussellstoll 3750DP.

Figure 13 Fault-tolerant wiring with 30-amp, single-phase power cords

Be sure to install Russellstoll 3933 (alternate, 9C33U0) or 3753 (alternate, 9R33U0W) socketreceptacles between the power distribution panel of the building and the power plugs for the unit.


The power cords provided with the disk array are nonshielded, type ST or equivalent with three #10AWG (minimum) conductors terminated at one end with an assembled plug connector.

Single-phase AC USA branch circuit requirementsTo protect the disk array, your building must be wired correctly. Each supply (“hot”) conductor mustbe protected by a short-circuit protective device and by an overcurrent protective device. The tableslisted in “AC line voltage requirements” on page 49 specify the overcurrent protective devices requiredfor single-phase operation.

All protective devices must comply with national standards of the country where the units are installed.If a protective device interrupts any supply conductor, it must also interrupt all other supply conductors.

In many cases, local codes do not allow a branch circuit fitted with a 50-amp receptacle or connectorto be protected by an overcurrent protection device with a rating lower than 50 amps. You can orderthe HP XP12000 disk array with the 30-amp power option to comply with these local codes. Yourelectrician knows the appropriate code requirements for your location/site.

Single-phase AC cabling for EuropeWhen configured for 50-amp, single-phase power, each rack has two power cords and two maindisconnect devices so that AC power can be supplied from separate power distribution panels. Whenconfigured for 30-amp, single-phase power, each disk array rack has four power cords and four maindisconnect devices.


Connecting the power supply cords

50-amp single-phase power cords for EuropeEach 50-amp HP XP12000 disk array rack has two power supply cords. The power cords includedwith the unit are type H07RN-F or equivalent with three 10 square mm conductors.



Figure 14 Connecting European single-phase power cords

30-amp single phase power cords for EuropeEach 30-amp HP XP12000 disk array rack has four power supply cords. The power cords includedwith the unit are type H07RN-F or equivalent with three 6 square mm conductors.


WARNING!High leakage current can occur between the power supply and the unit. To avoid electrical shock, be sureto make the protective earth connection before the supply connections.

Single-phase AC European branch circuit requirementsTo protect the disk array, your building must be wired correctly. Each supply (“hot”) conductor mustbe protected by a short-circuit protective device and by an overcurrent protective device. The tableslisted in “AC line voltage requirements” on page 49 specify the overcurrent protective devices requiredfor single-phase operation. All protective devices must comply with national standards of the countrywhere the units are installed. If a protective device interrupts any supply conductor, it must also interruptall other supply conductors.

Overcurrent protection is also required for the neutral conductor.

In many cases, local codes do not allow a branch circuit fitted with a 50-amp receptacle or connectorto be protected by an overcurrent-protection device with a rating lower than 50 amps. You can orderan HP XP12000 disk array with the 30-amp power option to comply with these local codes. Yourelectrician knows the appropriate code requirements for your location/site.


4 Delivery and unpacking

The disk array equipment is shipped directly from HP. If the disk array is part of a system order, HPcoordinates shipment from all HP locations so that all of the equipment arrives at your site atapproximately the same time.

When your equipment ships, HP provides you with carrier information and an expected delivery date.Factors beyond HP's control can cause delivery delays. If you have not received your equipmentwithin two weeks of its shipment from HP, contact your HP sales representative, who will trace yourorder and expedite delivery.

CAUTION:Before delivery, make sure your site meets the explained in “Delivery space requirements” on page 47.

Checking for shipping shortage and damageUpon delivery of each equipment shipment:

1. Check the carrier's bill of lading to ensure that the items listed match the items delivered. Notifythe carrier immediately if there are any discrepancies or missing items.

2. Inspect all shipping containers for signs of damage, such as dents, scratches, cuts, or watermarks.

3. If you see any damage to the containers:

a. Note on the bill of lading that there is apparent damage, subject to inspection.

b. Arrange for the carrier's representative and an HP representative to be present when theitem in question is unpacked.

c. Contact your HP representative, who will make sure any damaged components are replaced,regardless of the circumstances and without waiting for any claim settlements.

Unpacking the equipmentHP representatives will supervise the unpacking and moving of the disk array equipment. It is yourresponsibility to provide the people, tools, and equipment necessary to perform these tasks.

Packaging configurationsXP disk array cabinets are shipped in one of three standard packaging configurations:

• Environmental pack — consists of stretch wrap over corner protectors. No special tools orprocedures are required to unpack shipments in this form. This packaging is used for most shipmentswithin the USA that are direct from the factory to the customer. HP uses special carriers with adedicated fleet of trucks and specially trained personnel.


• Full packaging — consists of a pallet, wooden loading ramp, inner packaging, and outercorrugated carton assembly.

• Full packaging with wooden crate — consists of full packaging encased in a wooden crate.

Required personnelHP recommends that three physically able personnel be available to assist with offloading the diskarray equipment from the pallet. Personnel must be knowledgeable and experienced with the safehandling of large, heavy, and sensitive computer equipment.

Required tools• Claw hammer (if full packaging with wooden crate)• Ratchet wrench or box-open end wrench sizes 11mm (7/16") and 19mm (3/4"), or adjustable

end wrench• 6mm hex wrench• Scissors or box knife to cut polyester banding• Safety glasses• Short stepladder (helpful, but not required)

Unpacking processIf you need to unpack the equipment without HP supervision, follow the instructions in this section.

1. Following the steps in “Removing packaging materials” on page 61, unpack the equipmentcartons outside of the computer room to avoid debris and possible contamination of the computerroom environment.

2. For software CDs, cables, and other installation hardware, leave the sealed cartons or packagesintact. HP representatives will unpack them when they install and configure the disk array.

3. As you unpack the cartons, match the delivered items to the packing list (invoice) for each carton.Contact your HP Service Representative immediately if any items are missing or are not the onesyou ordered.

4. Move all equipment to the computer room before the installation date.

Safety precautions

CAUTION:Be very careful when handling the equipment. Do not drop the equipment from a height of more than 0.5cm (0.2 in). Floor unevenness must be less than 1 cm (0.4 in).

WARNING!The equipment frames are very heavy. To avoid injury, use appropriate lifting tools and have three peopleunpack and move the equipment.

Delivery and unpacking60

CAUTION:Any movement of the equipment by forklift should be done prior to unpacking. The carton assembly providesthe most secure support of the equipment during movement. Transporting the equipment by forklift afterthe packaging carton has been removed is not advisable.

CAUTION:The equipment racks are top heavy and contain very sensitive electronic and mechanical components.When moving on frame casters, the rolling surface must be able to support the equipment weight and mustbe free of surface conditions that could cause shock or vibration to the rack contents.

WARNING!When using sharp objects or cutting tools, make sure that no part of your body lies in the path of the bladebit or point.

CAUTION:When detached from each other, DKCs and DKUs do not have side panels. Exposed printed circuit boards(PCBs) are present; however, normal handling of the rack by the metal frames does not pose any ESDrisks.

CAUTION:When disk array equipment is not located in a data center or computer room, it must be stored in acontrolled area that meets environmental requirements.

Removing packaging materialsUnpack the DKC first. DKC packaging contains a wooden ramp; standard DKU packaging does notcontain a ramp unless the DKU is shipped as an upgrade. You will use the ramp to unload both theDKC and DKUs.


1. If shipped in a wooden crate:

a. Using an 11mm (7/16") ratchet or wrench, remove the six lag screws at the base of thecrate.

b. Using the claw end of a claw hammer, remove the crate clamps, and then remove the cratepanels.

WARNING!Crate clamps are under tension. Wear safety glasses and hold onto the clamp withyour free hand during removal.

Steps 2 through 5 refer to Figure 15.

1. Polyester bands

2. Pallet nails

3. Carton fasteners


Figure 15 Removing the outer carton

2. Cut and remove the polyester bands.

3. Remove the nails attaching the carton to the pallet.

4. Remove the plastic carton fasteners.

5. Remove the carton.

Steps 6 through 8 refer to Figure 16.

5. Ramp4. Accessory boxes

7. Poly bag6. Corner pads

Figure 16 Unpacking the inner wrapping

6. Remove the accessory boxes, ramp, and corner pads.

7. Using a 6mm hex and 19mm wrench, remove the adapter plates that anchor the rack to thepallet.

8. Remove the poly bag covering the rack.

9. Following the instructions provided on the wooden ramp, attach the ramp to the pallet and rollthe rack onto the floor.

10. Visually check the unit for any damage. If any damage is visible, report it immediately to HP andthe shipping carrier.


Glossary

ACP Array control processor. On some HP XP models, such as the HP XP12000 DiskArray, the ACP handles the passing of data between the cache and the physicaldrives. On other HP XP models, such as the HP XP10000 Disk Array, this functionis handled by the disk adapter on the MIX board.

AL Arbitrated loop.

AL-PA Arbitrated loop physical address.

allocation The ratio of allocated storage capacity versus total capacity as a percentage.“Allocated storage” refers to those LDEVs that have paths assigned to them. Theallocated storage capacity is the sum of the storage of these LDEVs. Total capacityrefers to the sum of the capacity of all LDEVs on the disk array.

array group A group of 4 or 8 physical hard disk drives (HDDs) installed in an XP disk arrayand assigned a common RAID level. RAID1 array groups consist of 4 (2D+2D)or 8 HDDs (4D+4D). RAID5 array groups include a parity disk but also consistof 4 (3D+1P) or 8 HDDs (7D+1P). All RAID6 array groups are made up of 8HDDs (6D+2P).

BC HP StorageWorks Business Copy XP software enables you to maintain up to nineinternal copies of logical volumes on the disk array.

C-Track HP StorageWorks XP Continuous Track detects internal hardware componentproblems on a disk array and automatically reports them to the HP STC (StorageTechnology Center). C-Track also enables STC remote diagnosis of the array.There are Internet-based and modem-based C-Track solutions.

Continuous Access HP StorageWorks XP Continuous Access Software enables you to replicate datastored on a local disk array to a remote disk array.

cache Very high speed memory that is used to speed I/O transaction time. All readsand writes to the XP array family are sent to the cache. The data is buffered thereuntil the transfer to/from physical disks (with slower data throughput) is complete.The benefit of cache memory is that it speeds I/O throughput to the application.The larger the cache size, the greater the amount of data buffering that can occurand the greater throughput to the applications.XP arrays support a range of cache memory. In the event of power loss, batterypower holds up the contents of cache for up to 36 hours.

channel adapter(CHA)

The channel adapter (CHA) provides the interface between the disk array andthe external host system. Occasionally this term is used synonymously with theterm channel host interface processor (CHIP).

channel hostinterface processor(CHIP)

Synonymous with the term channel adapter (CHA).


channel processor(CHP)

The processors located on the channel adapter (CHA). Synonymous with CHIP.

command device A volume on the disk array that accepts Continuous Access or Business Copycontrol operations which are then executed by the disk array.

control unit To organize the storage space attached to the DKC, you can group similarlyconfigured logical devices (LDEVs) with unique control unit images (CUs). CUsare numbered sequentially. The disk array supports a certain number of CUs,depending on the disk array model. Each CU can manage multiple LDEVs.Therefore, to uniquely identify a particular LDEV requires both the CU numberand the LDEV number.

CU Control unit.

CVS Custom volume size. CVS devices (OPEN-x CVS) are custom volumes configuredusing array management software to be smaller than normal fixed-size OPENsystem volumes. Synonymous with volume size customization (VSC).

disk adapter (DKA) Synonymous with the term ACP.

disk unit (DKU) The array hardware that houses the disk array physical disks.

disk controller(DKC)

The array hardware that houses the channel adapters and service processor(SVP).

disk recovery andrestore unit (DRR)

The unit responsible for data recovery and restoration in the event of a cachefailure.

disk group The physical disk locations associated with a parity group.

disk type The manufacturing label burned into the physical disk controller firmware. Inmost cases, the disk type is identical to the disk model number.

emulation modes The logical devices (LDEVs) associated with each RAID group are assigned anemulation mode that makes them operate like OPEN system disk drives. Theemulation mode determines the size of an LDEV.OPEN-3: 2.46 GBOPEN-8: 7.38 GBOPEN-9: 7.42 GBOPEN-E: 13.56 GBOPEN-K: Not available on this arrayOPEN-L: 36 GBOPEN-M Not available on this arrayOPEN-V: User-defined custom size

EPO Emergency power-off.

ESCON Enterprise System Connection (the IBM trademark for optical channels).

expanded LUN A LUN is normally associated with only a single LDEV. The LUSE feature allowsa LUN to be associated with 1 to 36 LDEVs. Essentially, LUSE makes it possiblefor applications to access a single large pool of storage. The LUSE feature isavailable when the HP StorageWorks LUN Configuration Manager product isinstalled.

ExSA Extended serial adapter.

Glossary66

failover Disconnecting a failed unit or path and replacing it with an alternative unit orpath in order to continue functioning.

FC Fibre Channel.

FC-AL Fibre Channel arbitrated loop.

FCP Fibre Channel Protocol.

fence level A level for selecting rejection of a write I/O request from the host according tothe condition of mirroring consistency.

FICON IBM mainframe Fiber Optic Connection.

GB Gigabytes.

GLM Gigabyte link module.

HA High availability.

HBA Host bus adapter. A built-in function or a card installed in a PC or other hostcomputer to enable connection of the host to the SAN.

host mode Each port can be configured for a particular host type. These modes arerepresented as two-digit hexadecimal numbers. For example, host mode 08represents an HP-UX host.

hot standby Using two or more servers as a standby in case of a primary server failure.

HP Hewlett-Packard Development Company.

I/O Input/output (applies to an operation or device).

LAN Local area network.

LD, LDEV Logical device. An LDEV is created when a RAID group is carved into piecesaccording to the selected host emulation mode (that is, OPEN-3, OPEN-8,OPEN-9). The number of resulting LDEVs depends on the selected emulationmode. The term LDEV is often used synonymously with the term volume.

LED Light emitting diode.

local disk A disk in the host.

LU Logical unit.

LUN Logical unit number. A LUN results from mapping a SCSI logical unit number,port ID, and LDEV ID to a RAID group. The size of the LUN is determined by theemulation mode of the LDEV, and the number of LDEVs associated with the LUN.For example, a LUN associated with two OPEN-3 LDEVs has a size of 4,693MB.

LUSE Logical unit size expansion. See also Expanded LUN.

m Meters.

MB Megabytes.

MCU Main control unit.


MIX A circuit board in the disk control unit that includes disk adapters and channeladapters for interfacing disk drives and the host to cache memory.

mirroringconsistency

The consistency (usability) of data in a volume (for example, S-VOL).

mm Millimeters.

MR Magnetoresistive.

ms, msec Milliseconds.

mutual hotstandby system

Two servers that are poised to cover for each other if necessary.

NAS Network attached storage.

node Logically speaking, an environment where instances can be executed. Physically,a processor, which is an element of a cluster system.

NVS Nonvolatile storage.

OFC Open Fibre Control.

OLM Optical link module.

OS Operating system.

PA Physical address.

parity group A parity group is a disk configuration in which multiple disks work together toprovide redundancy. Synonymous with “array group.”

partition Dividing a specific physical disk into two or more areas as if there are two ormore physical disks.

path Paths are created by associating a port, a target, and a LUN ID with one ormore LDEVs.

PCI Power control interface or peripheral component interconnect.

port A physical connection that allows data to pass between a host and the diskarray. The number of ports on an HP XP disk array depends on the number ofsupported I/O slots and the number of ports available per I/O adapter. The HPXP family of disk arrays supports Fibre Channel (FC) ports as well as other porttypes. Ports are named by port group and port letter, such as CL1-A. CL1 is thegroup, and A is the port letter.

P-P Point-to-point.

PS Power supply.

RS Russellstoll, a registered trademark indicating a brand of electrical plugs andreceptacles manufactured by Thomas & Betts Corporation.

RAID Redundant array of independent disks.

RAID group See “array group.”

Glossary68

RAID level A RAID Level is one of the ways that disk drives are grouped together to improveperformance, data availability/reliability or both. RAID levels are defined fromRAID0 to RAID6. HP StorageWorks Disk Arrays in the XP product family supportRAID1, RAID5 and RAID6. Not all of these RAID levels are supported by all HPXP family members. Consult the owner's guide or your HP representative for thedetails of which RAID levels are supported by your specific HP XP disk array.

RAM Random access memory.

RM HP StorageWorks XP RAID Manager, a command line interface for managingXP arrays.

R-SIM Remote service information message.

R/W, r/w Read/write.

script file A file containing a shell script.

SCSI Small computer system interface.

shell script A command sequence executed by a UNIX shell.

sidefile An area of cache used to store the data sequence number, record location,record length, and queued control information.

SIM Service information message.

SMI-S Storage Management Initiative Specification.

SMS System managed storage.

SNMP Simple Network Management Protocol.

SSID Storage subsystem identification.

STC HP Storage Technology Center.

SVP Service processor, which is the PC built into the disk controller. The SVP providesa direct interface into the disk array. SVP use is reserved for HP supportrepresentatives only.

TB Terabyte.

TCP/IP Transmission control protocol/Internet protocol

TID Target ID.

VSC Volume size customization. Synonymous with CVS.

VOLID Volume ID.

volume Synonymous with LDEV.


Glossary70

Index

AAC line voltage, 43, 49acoustics, 39additional components, 21air conditioning, 37

and dust control, 41and metallic particulate contamination, 41

air pressure, 25, 41airborne contaminants, 41altitude, 37antistatic

carpeting, 29containers, 25

audience, 9

Bbranch circuit requirements, 53, 54, 56, 57branch circuits, 43building codes, 25, 26, 43, 43

CC-Track, 42cables, 29

and mechanical vibration, 38and raised floors, 27as safety hazards, 26, 30Cat 5, 42floor cutouts for, 27in floorplans, 29routing, 42sealing, 25shielded, 42unpacking, 60

circuit breakers, 43, 49clearance, required, 30components, additional, 21

computer roomair pressure, 25data communication requirements, 42electrical requirements, 43environmental requirements, 36, 42general requirements, 25, 25vapor barrier, 25windows, 25

conductiveflooring, 25furniture, 25wax, 25

configurations, supported for the disk array, 19conventions

storage capacity values, 10text symbols, 10

conventions, document, 9customer self repair, 11customer, site prep responsibilities of, 13

Ddata communication requirements, 42

See also cables, 42delivery

of equipment, 59space requirements, 47

dimensions, 20disk array

acoustic specifications, 39configurations, 19delivery of, 59dimensions, 20electrical specifications, 49floor clearance, 30heat dissipation, 39humidity specifications, 37power connections, 44power consumption, 39unpacking, 59vibration specifications, 38weights, 20

disk array frame. See DKU, 19disk control frame. See DKC, 19DKC, description of, 19DKU, description of, 19


documentrelated documentation, 9

document conventions, 9documentation

HP website, 9providing feedback, 12

dust control, 41

Eearth ground requirements, 44electrical interference, 46electrical requirements, 43electrical specifications, 49electromagnetic interference, 46electrostatic discharge. See ESD, 25environmental requirements, 36, 42equipment servicing hazards, 26ESD, 25, 37

Ffault tolerant power connections, 44fire safety, 26floor, 26

clearance, 30conductive, 25covering, 29cutouts, 27, 29grid panels, 27grounding, 25, 27load rating, 27, 29tiles, and metallic particulate contamination,41waxed, 25

floorplan, 29frequency, 43

Ggrid panels, floor, 27grounding, 43, 44grounding requirements, 44

Hhazards, servicing, 26heat dissipation, 39help

obtaining, 11help, obtaining, 13, 13HP

Subscriber's choice website, 12technical support, 11

HP representativesand airborne contaminants, 41and building construction, 30and electrical requirements, 43, 43and electromagnetic interference, 46and equipment delivery, 17, 59and equipment unpacking, 59and network security, 42and power connections, 52, 53, 54, 56and power line transients, 45and site safety, 26and the site prep checklist, 14and the site prep team, 13, 13and XP Continuous Track, 42

HP Service Representative, 13, 13, 59, 60humidity, 37

and ESD, 25

IInternet-based remote support, 42, 42

LLAN connection, 42lightning, 46line current, 49line voltage, 43

Mmechanical vibration specifications, 38metallic particulate contamination, 41modem-based remote support, 42moisture, 25

Nnoise level, 39

Ooperating voltages

30-amp single-phase DKCoperating voltages, 49

30-amp single-phase DKUoperating voltages, 50

30-amp three-phase DKCoperating voltages, 50

30-amp three-phase DKUoperating voltages, 51

50-amp single-phase DKCoperating voltages, 49

50-amp single-phase DKUoperating voltages, 50

72

Pparticulate contamination, metallic, 41phone line, 42physical specifications, 19pollution control, 41power

receptacles, 44requirements, 42, 49uninterruptible, 46consumption, 39cords, 49cords, floor cutouts for, 27cords, single-phase for Europe, 56, 57cords, single-phase for USA, 54, 56cords, three-phase for Europe, 53cords, three-phase for USA, 52, 53line transients, 45

Rrack stability

warning, 11raised floor, 29

See also floor, 27receptacles, 44, 51receptacles, power, 44related documentation, 9remote support, 42representatives, of HP. See HP representatives,13

Ssafety, 26sales representative. See HP ServiceRepresentative, 60service clearance, 29Service Representative. See HP ServiceRepresentative, 60servicing hazards, 26single-phase cabling

Europe, 56, 57USA, 54, 56

single-phase circuit breakers, 43site prep

checklist, 14customer responsibilities, 13tasks, 13team, 13time allowances, 16

site preparationobjectives, 13resources, 13

sound pressure, 39space planning, 29

specificationselectrical, 49

static discharge mats, 29storage capacity values

conventions, 10Subscriber's choice, HP, 12symbols in text, 10

Ttechnical support

HP, 11service locator website, 12

text symbols, 10three-phase cabling

Europe, 53, 54USA, 52, 53

three-phase circuit breakers, 43

Uunpacking equipment, 59UPS, 46

Vvapor barrier, 25vibration specifications, 38

Wwarning

rack stability, 11waxed floors, 25websites

customer self repair, 11HP, 12HP Subscriber's choice, 12product manuals, 9

weights, 20calculating, 23

wet bulb temperature, 38windows, in the computer room, 25

XXP Continuous Track, 42, 42


hp xp 12000

Documents