7/18/2019 HW1Soln

http://slidepdf.com/reader/full/hw1soln-56d623e976f26 1/1

  Introduction to Microelectronic Fabrication – Second Edition

1.3 (a) n = π (300)2/(4)(20

2) = 177

(b) n = 148

1.10 (a) L = 2*(25mm)(18mm/0.5um) = 1800 m !

(b) L = 2*(25mm)(18mm/0.2um) = 4.5 km !!

1.12 (a) From Fig. 1.1b , a 75 mm wafer has 130 total dice. The cost per good die is$400/(0.35 x 130) = $8.79 for each good die. (b) The 150 mm wafer has a total of600 dice yielding a cost of $400/(0.35 x 600) = $1.90 per good die.

1.14 Thermal oxidation

n

+

 diffusion mask Mask 1Oxide etchn

+ diffusion and oxidation

Contact opening mask Mask 2Oxide etchMetal depositionMetal etch mask Mask 3Metallization etch

1.15

C

B

E

n+p

n+  

- 1 - © 2002 Prentice Hall