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HYB-MANHYBRID 3D MANUFACTURING OF SMART SYSTEMS

Johannes Hörber1, Martin Hedges1, Rob van Asselt2

1 : Neotech AMT GmbH, 2 : Philips Lighting Research

www.hybman.eu Contact: info@hybman.eu

Hyb-Man is a project labelled by the EUREKA Cluster PENTA,supporting innovation in micro and nanoelectronics based components & systems

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THE CHALLENGE: EVOLVING ELECTRONICS MARKET

Industries like Philips Lighting are facing:

• Demand on customized and personalized products leading to increased diversity

• Request for new product designs offering improved functionality and form factors

• Need for cost effective manufacturing of small series.

• Need faster response to changes in the market.

• “Digitization” of manufacturing and users

Electronics manufacturing is still heavily relying on mass production:

• Standard products and components,rigid supply chains

• High investment cost (tooling, R&D)

• Long initial lead times (tooling, shipment)

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THE APPROACH: HYB-MAN

The Hyb-Man project will develop hybrid 3D manufacturing methodsto enable flexible first time right production of smart systems

hybrid 3D manufacturing methods, combining: • additive manufacturing/3D printing• 3D electronic structure processing• 3D assembly & interconnect

development of methods and technologies towardsflexible first time right production

integrated smart systems with optimized design and enhanced functionality

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HYB-MAN BENEFITS

Highly flexible manufacturing processes

• no product specific tooling• no large inventory of parts or products• local production• high freedom of Design Substantial business benefits

• faster response to changes in the market• cost effective manufacturing of small series

and customer-oriented solutions• new product designs offering improved

functionality and new form factors.

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OPPORTUNITIES: NEW DESIGNS

discrete electronics “boxes”

distributed electronics/sensors/light sources

form freedom, adaptable shapes

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OPPORTUNITIES: FUNCTION INTEGRATION

Part count reduction easy assembly simplified supply chain

Integration miniaturization increased performance

combination/integration of functions

and parts consolidation

Typical product architecture large quantity of parts separate parts for

separate functions complex design of

interfaces (failure risk)

housing

optics

connection to peripheral electronics

internal electronics

mechanical fixtures etc.

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3D ELECTRONICS: COMMERCIAL PROCESSES AVAILABLE

Laser Direct

Structuring (LDS)

Printing

Piezo Jetting

Tool Based

In Mould Electronics

Digital Direct Metallization

Aerosol

Ink Jet

Dispensing

Pad Printing

FFF/FDM

LDS

(ProtoPaint)

2 Shot Moulding

Plating Based Examples:

Injection moldedstructural electronics

3D MID, Laser Direct Structuring

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3D PRINTED ELECTRONICS: CHALLENGES

Courtesy:

LITE-ON Mobile

Mechanical SBG

Approaches using n x 2D processing: Full 3D processing (5+ axes):

Challenges to move beyond the state-of-the-art:

1. Combination of different technologies (Additive Manufacturing + Printed Electronics + conventional electronics)for industrial processes (reliable, cost effective) and materials for serial products and

2. First time right design and manufacturing

3. New product designs fully benefiting from the 3D integration opportunities

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HYB-MAN APPROACH: WAY OF WORKING

• Product specifications and process requirements

Ambition

Objectives1. Essential

technologies2. First time

right production3. Demonstration in innovative products

• AM/3D printing• 3D electronics processing• 3D assembly & interconnect

• Process integration• Metrology and

control platform

Work package 1

Work package 2

Work package 3

Develop hybrid 3D manufacturing methods to enable flexible first time right production of smart systems

Work package 4• Demonstrator realization

and evaluation

• Design rules

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WORK PACKAGES: COMPLEX NETWORK OF INPUTS AND OUTPUTS

WP 1: User specifications

WP 2: Technology development and integration

WP 3: Knowledge rules for designand manufacturing

WP 4: Demonstration

verificationand validation

requirementsproduction process concept

smart systemspecifications for:- LED luminaires- automotive

sensors

process design rules

product design rules production

processes

productdemonstrators

process design rulesproduct design rules

technology demonstrators

new processes

integral process flow

verification

productevaluation data

evaluation/test methods

process capabilities

WP 5: Innovation management

WP 6: Project management and coordination

modelingrequirements

product specs

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HYB-MAN PARTNERS AND ROLES

Products IndustrializationProcesses, materials& equipment

know-howmaterialsprocesses

equipment

integratedsystems

new products

Together the partners cover the required competences and serve different markets

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EXAMPLE: ENHANCEMENT OF PRODUCT PORTFOLIO

Print Platforms Print/Functionalising Tools Pre/Post-Processing

45X – Volume Manufacture Piezo Jetting CNC Machining

15X – R&D/Product Development

Aerosol Based Plasma Cleaning

(Motion 3D CAD/CAM SW) Ink Jetting Sintering (Light/Laser)

Dispensing UV Curing

FDM Adaptive Tool Path Vision System

SMD Pick & Place

SMD

components

3D Printed Circuit

structuresPrinted

Device

Substrate

Building and

Embedding

Increased capabilities and toolsintegrated in machine platform to movefrom “printing on 3D” towards “3D printed”:

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INTERACTION WITH OTHER PROJECTS - AMPECS

Aims of the Project:1. Development of fully Additive Manufacturing Process for 3D Printing Electronics with Ceramic Substrates

2. The German-Spanish consortium will develop 3D printable ceramic materials for creating the structural body

and integrate printed electronics into and onto this component.

3. End use applications will cover areas where harsh environments exists such as automotive and aerospace

as well as in mobile communications.

courtesy: FAE - FRANCISCO ALBERO S.A.U.

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SUMMARY

Huge opportunities• product design• manufacturing (local, on demand)• supply chain and business model

Many challenges• technologies for serial products• industrial processes• first time right• new product designs

Changing environment and customer demands drive the need formore flexible manufacturing methods

smaller series, customized products – design freedom – faster response to changes

Multi-disciplinary approach and partnerships needed to move forwardmaterials – processes – equipment – process control –product design – manufacturing – inspection and test

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ACKNOWLEDGEMENT

Hyb-Man is a project labelled by the EUREKA Cluster PENTA,supporting innovation in micro and nanoelectronics based

components & systems

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THANK YOU FOR YOUR ATTENTION!