ic fabrication

Semiconductor device fabrication From Wikipedia, the free encyclopedia This article needs additional citations for verification. Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. (September 2008) Semiconductor manufacturing processes 10 µm – 1971 6 µm – 1974 3 µm – 1977 1.5 µm – 1982 1 µm – 1985 800 nm – 1989 600 nm – 1994 350 nm – 1995 250 nm – 1997 180 nm – 1999 130 nm – 2001 90 nm – 2004 65 nm – 2006 45 nm – 2008 32 nm – 2010 22 nm – 2012 14 nm – 2014 10 nm – 2016 7 nm – 2018 5 nm – 2020 Half-nodes v t e NASA's Glenn Research Center clean room. Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process, from start to packaged chips ready for shipment, takes six to eight weeks and is performed in highly specialized facilities referred to as fabs.

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Semiconductor device fabricationFrom Wikipedia, the free encyclopedia

This article needs additional citations for verification. Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. (September 2008)Semiconductormanufacturingprocesses10 m 19716 m 19743 m 19771.5 m 19821 m 1985800 nm 1989600 nm 1994350 nm 1995250 nm 1997180 nm 1999130 nm 200190 nm 200465 nm 200645 nm 200832 nm 201022 nm 201214 nm 201410 nm 20167 nm 20185 nm 2020Half-nodesv t e

NASA's Glenn Research Center clean room.Semiconductor device fabrication is the process used to create the integrated circuits that are presentin everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

The entire manufacturing process, from start to packaged chips ready for shipment, takes six to eight weeks and is performed in highly specialized facilities referred to as fabs.