IC PackagesThe protective container (housing) for an integrated circuit (die). Can include external leads to provide electrical access to the internal component. Packages provide physical and chemical protection of the circuits. Common package materials include Ceramic and Plastic. IC Plastic packages are also available in OPEN-CAVITY format. This “Open-Cavity” package is used for the Assembly and test of new I.C.(Prototype) designs. It allows for the I.C. design Engineer to test newdesigns ( FIB work, die probing, more ) - in the same plastic package as intended for Production.

IC Package MaterialsIC Package Materials» Open Cavity Plastic Packages» Ceramic Packages» Laminate Substrates» Custom Package Configurations

Quik-Pak can provide virtually any package you need for your prototype devices, such as Open Cavity Plastic (OCPP), ceramic, laminate substrates and even custom package configurations. If you don’t have a specific package identified, we can provide technical assistance to select the best package for your application.

IC Package ServicesOPEN CAVITY PACKAGESQuik-Pak is your same-day source for open cavity, plastic IC packages.We can configure any style, any size, any lead count, no limitations!

Quik-Pak patented technology can transform any transfer molded plastic device into a ready-to-assemble open cavity plastic package. All body sizes and lead counts are available with no limitations.

» BGA» QFP, LQFP, PQFP, TQFP» PLCC» SOP, SSOP, SOIC, TSOP, TSSOP, MSOP» SOJ» MLF, MLP, LPCC, QFN» SOT, TO» DPAK

Through Hole Packages

Semiconductor Transistor Case Packages

TO-3, Through-Hole, Metal Case [case mount]

TO-5, Through-Hole, Metal Case

TO-18, Through-Hole, Metal Case

TO-23, Through-Hole, Metal Case

TO-39, Through-Hole, Metal Case

TO-46, Through-Hole, Metal Case

TO-61, Through-Hole, Bolt Mount

TO-78, Through-Hole, Metal Case

TO-92, Through-Hole, Plastic Case

TO-99, Through-Hole, Metal Case

TO-204, Through-Hole, Metal Case

TO-220, Through-Hole, Plastic Case with Metal Tab

TO-254, Through-Hole, Metal Tab

TO-257, Through-Hole, Metal Tab

Screw Mount, Through-Hole, Metal Case

SOT-23; 3-lead surface mount package

SOT-223; 4-lead surface mount package [1 lead is a tab]

Additional types of Transistor cases; IC Package styles.

TO-39 Transistor Package

Transistor Package TO-3 Case style

TO-3 Metal Can, Flange Mount

This is a through-hole device, similar to a TO-23 package .

Case mount. A type of package which provides a method of readily attaching one surface of the semiconductor device to a heat dissipater to achieve thermal management of the case temperature. The case of this device is connected to the Collector.

Case temperature. Case temperature is that temperature measured at a specified point on the case of a semiconductor device.

TO-3 Metal Case

Transistor Can Packages TO-5 Case style, Metal Can

TO-5 Metal Can

Transistor Can Packages; TO-18 Case style, Metal Can

TO-18 Metal Can

Transistor Can Packages TO23 Case style

TO-23 Transistor Case

TO-23 is a two lead through-hole device. The third lead is the case.Case mount. A type of package (outline) which provides a method of readily attaching one surface of the semiconductor device to a heat dissipater to achieve thermal management of the case temperature.

Transistor Can Packages TO-39 Case, Through-Hole

TO-39 Package

The TO-39 package is a through-hole device [metal can].The TO-39 metal can has three terminals; Lead 1; Emitter, Lead 2; Base, Lead 3; Collector. Additional types of Transistor cases; IC Package styles.

TO-39 Transistor Lead Identification

Transistor Can Packages; TO46 Case style, Metal Can

TO-46 Metal Can

TO-46 is a through-hole device with a metal lid.Terminal identification; Pin 1 Emitter, Pin 2 Base, Pin 3 Collector. Note the location of the tab to the pins.Types of Transistor cases; Transistor Packages.Manufacturers of FETs and BJTs [Transistor Manufacturers]How to Derate Transistors

Transistor Can Packages TO61 Case style, Bolt Mounting

TO-61 Package

The TO-61 package is a through-hole case mount device.

Case mount. A type of package which provides a method of readily attaching one surface of the semiconductor device to a heat dissipater to achieve thermal management of the case temperature. The TO-61 Case is isolated from any of the terminal leads.

Terminal Leads; Lead 1 Emitter, Lead 2 Base, Lead 3 Collector.

Transistor Can Packages TO-78 Case style, Metal Can

TO-78 Metal Can

The TO-78 package is a 6 pin device in a metal can. This is a through-hole device.Example configuration; Dual Transistor package, NPN/PNP transistors.

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This category is for integrated circuit packages. Transistor packages can be found here and passive device packages (e.g. resistors) can be found here.

Subcategories

This category has the following 7 subcategories, out of 7 total.

B

[+] BGA (8 F)

C

[+] Chip-on-board (1 F)

D

[+] Dual inline packages (3 C, 1 P, 45 F)

M

[+] Multiwatt Packages (1 F)

P

[+] PGA (4 F)

Q

[+] QFN (2 F)

T

[+] TO-263 (2 F)

Media in category "IC Packages"

The following 60 files are in this category, out of 60 total.

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