ic requirements for next generation systems...slide 1 ic requirements for next generation systems...
TRANSCRIPT
Slide 1
IC Requirements For Next Generation Systems
Club Vivado Users Group – Malcolm Penn – Oct 2015 Chairman & CEO, Future Horizons
Your Passport To Future Horizons
The Global Semiconductor Industry Analyst“Making Sense Of The Industry Tea Leaves”
(Google “Future Horizons” or “Malcolm Penn Semiconductors” For More Details)
Analysing The Facts Economy Unit Demand Fab Capacity ASPs
The FUD, The Hype & Delusion Perception Emotion Fashion Sentiment
Slide 2
Chronology & Background 1989 – Company Founded (Apr 1) Worldwide Semiconductor Industry Focus European & Russia/CIS Semiconductor Industry Specialisation Full Spectrum – Advanced Research To Market Development Market Research, Industry Analysis & Training Custom Consulting & Marketing Studies Due Diligence & IP/Product Positioning Business Development Opportunities & 1-2-1 Contacts Start-Ups Through Large Corporations & NXD Support Off-The-Shelf Research Reports & Industry Intelligence/Analysis Bespoke Research Assignments - From Proof Of Concept To Full Market Development Due Diligence Analysis - From Seed Funding Through IPO Competitive Benchmarking & Positioning - From the Basic IC Design & Technology Up Unique Combination Of Chip Design Know-How With Market & Business Insight
~5 Decades Of Semiconductor Industry ExperienceLonger Than ANY Other Industry Analyst & Most Industry Execs
(Google “Malcolm Penn Drums” For My Near Alternative & Formulative Early Career!)
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Ten Industry Mega-Challenges* New Start-Up Famine: Due to the high costs and loss of VC appetite driving
Shift to IP Fabless Market Saturation: With all IDMs now fabless the fabless sector can
no longer ‘outperform’ the market … it is the market Foundry Supply: With TSMC dominant, they can now only grow ‘with the market’ Fab-Tight Supply: Net new capacity now built to order not expectation Virtual OEM: The emergence of firms such as Amazon, Apple and maybe Google Market Opportunities: Need for more substantial research vs superficial
opinions, blogs and over-hyped head-line grabbing articles (e.g. the IoT Fiasco) Technology Challenges: Every new node (and transistor design) here on out
will be revolutionary not evolutionary Industry Consolidation: Reducing the overall market pie for the down-stream
providers and supplier choice for the up-stream customers ‘More Than Moore’: Assuming deeper importance as systems become smarter,
more intelligent, interconnected and communicative New Design Techniques: Addressing the increasing occurrence of errors in
the logic execution
* FH Research Report (Feb 2015) Subscribe To Our Regular Update Reports & Industry Briefings
Slide 5
Three Patterns Of Semiconductor Innovation
Disruptive Innovation Invention Of Transistor (Shockley, Bardeen, Brattain: 1947) Invention Of The IC (Kilby: 1958 / Noyce: 1959) Microprocessor Development (Faggin, Shima, Hoff, Mazor: 1971)
Exponential Innovation Moore’s Law (Gordon Moore: 1965)
Cyclical Innovation Makimoto’s Wave (Tsugio Makimoto*: 1991)
* Previously GM of Hitachi SC (1959-2001); Spearhead of 6147 High-Speed CMOS Intel 2147 SRAM Replacement
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Three Patterns Of Semiconductor Innovation
Disruptive Innovation Invention Of Transistor (Shockley, Bardeen, Brattain: 1947) Invention Of The IC (Kilby: 1958 / Noyce: 1959) Microprocessor Development (Faggin, Shima, Hoff, Mazor: 1971)
What Next? Post-CMOS Scaling (Materials & Structures)
Biological ICs/Systems (Grown Inside The Final Package) Quantum Computing (When We Finally Figure Out How)
Slide 7
Three Patterns Of Semiconductor Innovation
Exponential Innovation Moore’s Law (Gordon Moore: 1965)
What Next? Moore’s Law Is Dead (It’s Over At 28nm, That Much We’ve Been Told!!)
Slide 8
Shame No-One Told Samsung & TSMC LogicMemory
With 7nm, 5nm, 3nm, 2,25nm, 1.8nm & 1.3nm Well Understood (Whether anybody can afford them is another matter altogether!)
20062009 2010 2012 2013 2014 2015
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3D NAND … Tough But Getting There
Slide 9
Supply’s Not An Issue Either (If Pre-Ordered*)
Foundry Market By Feature Size
Slide 10
“We Do Not Build Speculative Capacity” – Dr Morris Chang, Jan 2015*(FH Advisory … Net New Capacity Is A One-Year Lead Time Item)
Slide 11
Three Patterns Of Semiconductor Innovation
Cyclical Innovation Makimoto’s Wave (Tsugio Makimoto: 1991)
What Next? Now This Question IS Interesting! (Not Just For Xilinx Either )
Slide 12
What Is Makimoto’s Wave?*
StandardDiscretes
Custom LSIsfor TVs,
Calculators
MemoriesMicro-
processors
ASICs
FieldProgram-mability
Standardization
Customization
'67 '77 '87 '97'57
'07
Standardized inManufacturing
butCustomized in
Application
* Named by D. Manners (Electronics Weekly , Jan. 30,1991)
Source: Dr. Tsugio Makimoto
Slide 13
Semiconductor Pendulum (Custom vs Standard Enigma)
StandardizationCustomization
Source: Dr. Tsugio Makimoto
Slide 14
Makimoto’s Wave Extension
'17SoC/SiP ‘27
HighlyFlexibleSuper
IntegrationHFSI
● Why HFSI? Same Reason As Before …Increasing design cost, Fragmented market
● HFSI Technological Breakthroughs1) Integration of multi-functions incl. FPGA2) Emergence of high-performance NVRAM
StandardDiscrete
CustomLSI
MPU &Memory
ASIC
FieldProgram-mability
Standardization
Customization
'67 '77 '87 '97'57
'07
Source: Dr. Tsugio Makimoto
Slide 15
Process Evolution Remains Key
*14nm A9 (Samsung) 96mm2 / 16nm A9X (TSMC) 105mm2
A9A9X*
Slide 15
Except For … The Interconnect!
14/16nm >20 Million Transistors On A Pin Head SRAM Cell ~ 0.070µ2 – TSMC / 0.059µ2 - Intel
Chip Size Dominated By Interconnect Not Gates Probably Why Some Firms Skipping 10nm For 7nm
Needs New Interconnect Techniques On-Chip Wireless vs Track? (1cm Range / Tens of GHz, Not ISM Bands) On-Chip Optical? (Alternative to Wireless) Network On Chip? (e.g. Dundee Spacewire Technology)
12-Layer Metal, Top Layer 0.1mm Wide (L1 Too Wide Also) For Many Chips Shrinks Below14/16nm Are ‘Irrelevant’ (No Gain)
Slide 16
Spacewire Network On A Chip
Source: Dundee University/Future Horizons
Slide 17
Smartphone Automotive – Engine Management Automotive – Chassis & Safety Printers Home Automation Industrial Projection Displays
(MEMS) Sensors Key Too
Source: Future Horizons (2015 MEMS Market Update Report)
Slide 18
Plus Low-Volume (High-Value ) Aerospace & Defence
(enabling spin-off products such as commercial ‘drones’) ‘Wearables’’, Medical Products & Other ‘IoT’ Applications Gaming, Robotics & Toys (‘Other Sales’)
MEMS Product ExamplesMicrophone
Source: Knowles/ChipWorks
InkJet Print Head RF Switching
Source: IOPSource: STM Source: InvenSense
Camera Focusing
Source: Freescale
10-Axis Gyroscope Pressure Sensor
Source: OmronD
Source: Future Horizons (2015 MEMS Market Update Report)
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Other Key ChallengesConnectivity:Currently – Low Number Of High Bandwidth, Single ConnectionsIoT – ‘Trillion’ Low Bandwidth, Unique IP Addresses (Router vs IPv6 Issue)
Security:Currently – FirewallIoT – Built Into Device (From Thermostats To Dolls; From TVs To Cars)
Processor:Currently – S’Ware Hackable MPU (Intel, PowerPC, ARM, XMOS …)IoT – Reverse-Engineer ‘Impenetrable’ FPGA Code
Software:Currently – 1-10 Threads, Serial Code – Point-To-Point Network CentricIoT – Millions Of Threads, Parallel Code – Neural Network Centric
SoC Design:Currently – Independent Design Teams, Chip Partitioning-BasedIoT – Agile Development, Collaborative, Cross-Functional, 2-Week Sprints
Chip Market Drivers
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Smartphone – Ubiquitous & TransformativeFrom Jan 2007 Launch
From Homosapiens
To ‘Planet Of The Phones’
To Phonosapiens … 21st Century Oods?
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From Automation To Design Services
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To The Much Over-Hyped ‘IoT’ Industry & Governments Talk About IoT As If It Were One Space, One Solution – It Is Of Course Not … It Represents A Wide Range Of Markets, Applications, Technologies & (Eventually Real) Opportunities
Slide 24
Micro-Fluidics (Lab-On-A-Chip)
Similar Techniques To Inkjet-printer, Already Surprisingly Large Market (~$2b) Highly Specialised BUT Chemistry Dominates This Field NOT The MEMS Device
Source: ElveFlowSource: Berkeley
Think Vitamins & ‘Voodoo’ Healthcare Sales … This Market Is Huge(But Not For The Chip Suppliers… Think Apple & Amazon!!)
Source: Future Horizons (2015 MEMS Market Update Report)
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Data Explosion
Source: Intel
Slide 26
2015 = 2x (only)
Slide 27
Semiconductor Innovation
So ‘No Pressure’ There Folks … !!
Slide 27
Slide 28
Makimoto’s Wave – Observation
Standardization
Customization
'17SoC
& SiP‘27
HFSIStandardDiscrete
CustomLSI
MPU &Memory
ASIC
FieldProgram-mability'67 '77 '87 '97
'57'07
SASC?
Amplitude Of Sine Wave Decreasing At Successive PeriodsEach Less Flexible / Less Programmable Than Before …
Source: Dr. Tsugio Makimoto / Future Horizons
‘47‘37 SASC
??
Slide 29
Makimoto’s Wave – Ultimate End Game
Self Aware Self Configuring ICs (Systems) Think For Themselves & Configure Accordingly Intelligent ICs … The Ultimate Hardware Solution
Be Careful What You Wish For!
Slide 30
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