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1/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK on ANSYS Electronics Desktop
ANSYS Korea2017 ANSYS Electronics Simulation Expo, Seoul
Taeshin Kang
2/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Heat
Thermal Energy
• All matter is made up of atoms and molecules that are constantly moving.
• The motion of atoms and molecules creates a form of energy called heat or
thermal energy which is present in all matter.
• A temperature is an objective comparative measure of hot or cold.
• The Coldest theoretical temperature at which atom or molecule reach state of
motionless is Absolute Zero (-273.15 K).
Surrounding (Cooler)
Hot Body Cold Body
Surrounding (Hotter)
Heat is flow of energy from high temperature to lower temperature
3/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Modes of Heat transfer
Modes of Heat transfer
• Conduction
➢Occurs in a medium (fluid or solid)
➢Diffusion of heat due to temperature gradient within the medium.
• Convection
➢Heat is transported by a moving fluid (liquid or gas).
➢ Type : Natural Conv., Force Conv. and Mixed Conv.
• Radiation
➢ Emission of energy by photons within electromagnetic waves
Conduction Convection Radiation
Reference: https://en.wikipedia.org/wiki/Heat_transfer
4/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ANSYS ICEPAK – Computation Fluid Dynamics Solver
ICEPAK is an integrated “Electronics Cooling” solution for IC packages, printed circuit boards and complete electronic systems
Fluid flow ➢ Laminar
➢ Turbulent
Conjugate heat transfer➢ Conduction
➢ Convection Natural
➢ Convection Forced
➢ Radiation (Thermal and Solar)
➢ Joule Heating
Steady state and transient thermal analysis
Single or multiple fluids
Species transport
Parametrics and Optimization
Reduced Order Modeling (ROM)
Multi-physics coupling
Velocity streamlines and temperature contours for a card array in a VME box cooled by three axial fans
Temperature contours and fluid velocity vectors of a fan cooled rack mounted computer
5/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Heat Sources
The main sources of Heat within electronic equipment
Heating within active components
PCB layers : Joule heating
BUS Bar : Joule heating
Wiring : Joule heating
RF Losses
Eddy Current Losses
Components
Wirebond
7/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
DC Electro-Thermal Coupling
SIwave and ICEPAK automatically exchange power map and temperature data
• Accounts for Joule Heating losses within PCBs and packages for a more accurate temperature field
Current Density(SIwave)
Temperature(ICEPAK)
Power Map
Temperature
SIwave Thermal Solution leveraging ICEPAK Solver
Conduction & ConvectionHeat Transfer Modes
8/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ECAD vs. Lumped Board
Lumped BoardTo
pB
ott
om
ECAD Board
Higher temperatures More accurate heat dissipation
10/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Temperature-Dependent Antenna Performance
• Results:✓ RF Amp Junction Temp: 71.6 oC✓ Antenna + Channel Temp: 53 oC to 70 oC
Case 2: temperature-dependent RF material properties in HFSS + temperature-dependent a
mplifier model in circuit (amp @ 68 C)
• Significant de-tuning of input impedance
Drop in antenna efficiency due to increased operating Temperature:
47% (original) 32% (with Temperature feedback)
Antenna Efficiency:
Antenna Return Loss:
Temperature-Dependent Antenna Performance
11/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Most barrier walls : Different User Experience / User interface
AEDT GUI
ICEPAK GUI
12/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
2017 Galaxy S8 2010 Galaxy S
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ICEPAK on ANSYS Electronics Desktop
14/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK Vision R18.1 & Beyond
Create an Automated, Streamlined Electro-Thermal Multi-Physics Solution that utilizes Native MCAD/ECAD for First Pass Mesh/Solve Success
Key Drivers/Mandates
• Integration into AEDT
• Same UX / UI, Ease-of-Use
• Rapid Release Cycles
R18.1 First release
• Initial exposure with most common feature set
• CPS with Enclosure
• Steady-state thermal
Improved Workflow
• Integrated Electro-Thermal Workflow
• Native ACIS MCAD Modeler
• ECAD-MCAD Assembly
• Geometry Clean Up & Simplification
15/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ANSYS Electronics Desktop
HFSS
Maxwell
Q3D Extractor
ICEPAK solver
ICEPAK on
Ansys Electronics Desktop
16/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Activate ICEPAK on ANSYS Electronics Desktop
17/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK on Ansys Electronics Desktop
Same User Experience / User Interface
Easier coupled analysis
Tightly coupled analysis
Variable processing functions
Powerful optimization features
18/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Same UX / UI as Electronics
Project manager
Variables MRB, Context menu
Component Library
ACIS modeler
Modeler Tree
19/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Same as Electronics' Auto mesh setting : Slider Bar Meshing
Solver & Meshing Performance- Slider Bar Meshing- Add DME simplification to SCDM & AEDT 3D Modeler
ICEPAK mesh
20/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Simple user specified mesh regions
21/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK Solver Setup / Solve
22/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Material library for Thermal
Materials for Thermal Physics• Fluid materials : Liquid, gaseous materials relevant to electronics cooling applications• Solid materials : Insulations, epoxy, metals, Heat-spreaders, package materials, etc.• Surface materials : Paint, metals, plastics etc.
23/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK components library
Support
- Variable Fan library- Variable Heatsink library- Customized Component
Native component migration - Fans : Adda, Delta, EBM, Elina, Jaro, Nidec, NMB, Panasonic, Papst, SanyoDenki, Sunon- Heatsinks : Aavid ( Only component heatsinks migrated)1
24/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Support 3D Model Simplification
Simplify arbitrary shaped object into simpler shapes
• Available for ICEPAK and all 3D products
Simplification Types
• Bounding Box
• Primitive Fit
• Polygon Fit
Simplify in specific coordinate system
Option to separate into primitives bodies
Bounding Box
Polygon Fit
Primitive Fit
Primitive Fit in Relative CS
Simplify
With Separate Bodies
26/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Field Plot
Various thermal plot
27/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Field Plot
Velocity
Thermal by air speed
28/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Script support for automation
- Native Java, VB, and IronPython Scripting with Record & Playback capabilities- Open Command Window for IronPython
29/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK on Ansys Electronics Desktop
Same User Experience / User Interface
Easier coupled analysis
Tightly coupled analysis
Variable processing functions
Powerful optimization features
30/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Conventional Coupling with ANSYS HFSS / Maxwell / Q3D
Electric Field
Surface heat flux in Aluminum housing
Volumetric heat density in Lossy material
• Surface and volume losses for a waveguide termination are mapped from HFSS to ICEPAK
Natural convection
Fan coolingwith heat sink
Natural convection with heat sink
Heat Losses
Temperature
HFSS / Q3D Workbench ICEPAK
31/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
AEDT-ICEPAK EM & ICEPAK Dynamic Thermal Link
• Maps Power Loss into AEDT-ICEPAK
Assign EM Loss ‘Thermal BC’ to selected volumes and/or surfaces
Pick sources -> AEDT Design and Solution
Ability to view or edit link
• Variables, Freq. from source design
• Solve/update source design
32/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
AEDT-ICEPAK EM & ICEPAK Dynamic Thermal Link
33/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
Q3D EM Loss
AEDT-ICEPAK EM & ICEPAK Dynamic Thermal Link
ICEPAK Dynamic Link
ICEPAK Thermal with EM loss
34/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ECAD Trace Mapping vs. Explicit Trace Modeling
• Case study on a flip-chip package in a JEDEC 𝜃𝑗𝑏 setup
• Die power: 1 Watt, ambient temperature: 0oC
• 𝜃𝑗𝑏= maximum die temperature
ECAD model with imported traces Explicit model with all the details
Model Number of Objects Mesh Count Preparation Time RAM Solve Time
ECAD 7 ~3.3 M Minutes 4.2X Reduction 5.3X Faster
Explicit 1581 ~11 M ~ Days 1X 1X
35/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ECAD meshing with HFSS 3D layout
MCAD Project ~34 MB
Solver & Meshing Performance- Improve via mapping, geometry handling & linkages to SIwave & RedHawk
ECAD Project ~0.5 MB
36/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ECAD meshing with HFSS 3D layout
Coarse : 50 200 Fine : 800
Automatic PCB Metal Fraction for ICEPAK
37/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK with ECAD
Thermal conductivity X
Top Bottom
Thermal plot & PCB mesh
Customized mesh region
HFSS 3D layout Field Thermal surface plot
38/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK on Ansys Electronics Desktop
Same User Experience / User Interface
Easier coupled analysis
Tightly coupled analysis
Variable processing functions
Powerful Optimization / DOE features
39/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ACIS Parametric model : Same as Electronics
ACIS Parametric Technology
• Dynamic Edits - Change Dimensions
• Add Variables➢ Project Variables (Global) or Design Variables (Local)
➢ Animate Geometry
➢ Include Units – Default Unit is meters
• Supports mixed Units
40/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK Parametric simulations with Electronics
ICEPAK HFSS
41/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK Parametric simulations with Electronics
Via drill size variations
Via pad size variations
Via pad size
Via drill size
42/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK Parametric simulations with Electronics
Input current variations
Input current
43/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
AEDT : Integrated Design Of Experiments
44/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
AEDT : Integrated Design Of Experiments
Via pad diameter : 5 stepDrill diameter : 5 stepInput voltage : 10 step
Parametric sweep250 case
1 Case 15 min250 Case 62.5 Hour
1 Case 15 min13 Case 3.25 Hour
DOE sweep13 case
45/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
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46/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
HPC for ICEPAK on AEDT
ANSYS Electronics HPCANSYS HPC available at R19
47/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul
ICEPAK on Ansys Electronics Desktop
Same User Experience / User Interface
Easier coupled analysis
Tightly coupled analysis
Powerful optimization features
Variable processing functions