IEEE

IEEE

COMPONENTS, Hybrids,

T E C ~ N O ~ O ~ ~ SociEi y ANd MANUfACTURiNC,

PROCEEDINGS OF

1993 JAPAN INTERNATIONAL ELECTRON IC MANUFACTURING

TECHNOLOGY SYMPOSIUM

JUNE 9-11,1993 KANAZAWA, JAPAN

PERMISSION TO REPRI T OR COPY

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Copyright 01 993 by the Institute of Electrical and Electronics Engineers, Inc.

PRINTED IN THE UNITED STATES OF AMERICA

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Refer to the IEEE Catalog Number, printed below.

IEEE Catalog Number 93CH3357-1

ISBN 0-7803-1 432-8 Softbound Edition 0-7803-1 433-6 Casebound Edition 0-7803-1 434-4 Microfiche Edition

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ORGANIZATION STEERING COMMITTEE IN JAPAN

General Chairperson K. Shono (Sophia University)

General Vicechairperson T. Kamei (Hitachi Co., Ltd)

Advisory T. Hara (Advantest Cop) T. Itoh (Waseda University) A. Kunioka (Aoyama Gakuin University) G. Matsumoto (Advantest Laboratories Ltd.) T. Muto (Society for Hybrid Microelectronics) K. Nihei (Oki Electric Industry Co., Ltd.) N. Takagi (Tokyo Engineering University) K. Takahashi (Tokyo Institute of Technology) T. Yamaguchi (Kka University)

Members H. Ariyoshi (Muraw h4anufacturing Co., Lid) T. Hakuta (Sony Corp.) S. Harada (Hitacbi Co., Ltd.) T. Higashi (Oki Electric Industry Co., Ltd.) K. Imamura (Foundation for Advancement of International Science) T. Edahiro (Nippon Telegraph and Telephone Corporation)

T. Masaki WK Corp.) Y. Mitsugi (Seiko Epson Corporation) N. Miura (Sanyo Flectric Co., Ltd.) T. Odajima (Hokuiku Toryo Co.. Ltd) S. Okuda (Fujitsu Iimitd) T. Okuda (Mitsubishi Electric Corp.) A. Kasami (Toshiha Corp.) K. Sugiyama (h4atsushita Electric Industrial Co., Ltd.) K. Yamamoto (IBM Japan, Ltd.) T. Takayasu (Hokuriku Electric Industry Co.. Ltd) T. Kamiyama (Taiyo Yden Co., Ltd) H. Nakano (NEC Corporation)

s. Kataoka (Sharp Corp.)

STEERING COMMITTEE IN USA & EUROPE

Liaison E.J. Vardaman (Techsearch International, Inc.. USA) J. Joly (Bull S.A., France)

A.J. Blodgett, Jr. (IBM Corporation. USA) M. Cassidy (AT&T Microelectronics, USA) K. Wyatt (Motorola. Inc.. USA) P.J. Walsh (Electronics Industries Association, USA) J. McMahon (Electronics Industries Association, USA) K. Yeung (AT&T. USA)

Membem

OPERATING COMMITTEE

General Chairperson K. Shono (Sophia University)

General Vice-Chairperson T. Kamei (H~tachi Co., Ltd.)

Advisory T. Itoh (Waseda University) A. Kunioka (Aoyama Gakuin University) F. Miyashiro (Tasbiba Corporation) K. Nihei (Oki Electric Industry Co., Ltd.)

Technical Program T. Ohsaki Corp.) K. Atsumi (Toshiba Corporation) K. Kishino (Sophia University) S. Kobayasbi (Hititchi Co., Ltd.) Y. Shimada (NEC Corporation)

Publicity

Finance

Publication

Operation

N. Iwase (Tashiba Corporation) K. Akiba (Sony Corp.)

S . Shibata (Oki Electric Industry CO., Ltd.) Y. Gotoh (Fujitpu Laboratories Ltd.) T. N a k a ~ n w (Matsushita Electric Industrial Co., Ltd.)

Y . Shirnura (Kogyo Chosakai Publishing Co., M.) A. Suzuki (&io Computer Co., Ltd)

H. Takamizawa (NEC Corporation) H. Hasegwa (Fujitsu Limited) T. Nukii (Sharp Corp.) A. Okamoto (TDK Corp.) H. Takamori (Nikko Company)

Social Arrangement I. Tachikawa (Hokuriku Taryo Co., Ltd.) M. Masuda (Seiko @son Corporation) M. Kondo (Konica Corporation)

Advanced Technology Corner H. Nakajima (Mitsubishi Electric Corporation) K. Hattori (Taiyo Y&en Co., Ltd.) Y. Igwhi (Oki Electric Industry Co., Ltd.) E. Kuroda (h4urata Mfg. Co., Ltd.) S. Sekihara (Sumitorno Metal Mining Co., Ltd.) M. Yamagisbi (Sanyo Electric Co., Ltd.) M. Yokoyama (Hokuriku Electric Industry Co., Ltd.)

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1993 PROCEEDINGS

Fourteenth IEEE/CHMT

International Electronics Manufacturing Technology (IEMT) Symposium

June 9 - 11,1993

Kanazawa City Cultural Hall

Karzazawa, Japan

SPONSORED BY The Steering Committee of 1993 JAPAN IEMT SYMPOSIUM

CO-SPONSORED BY IEEE Tokyo Section Tokyo Chapter of IEEE CHMT Society Foundation for Advancement of International Science

IN CO-OPERATION WITH (No special order is observed)

The Institute of Electronics, Information and Communication

The Institute of Electrical Engineers of Japan The Society for Hybrid Microelectronics The Japan Institute of Printed Circuit The Society of Instrument and Control Engineers The Japan Society of Precision Engineering The Japan Welding Society Japan Technology Transfer Association Japan Electronics Materials Society The Japan Society of Applied Physics The Society of Polymer Science, Japan The Japan Instilute of Metals The Ceramic Society af Japan Optoelectronic Industry and Teclmology Development Assdahon

Engtnmrs

V

I

Opening Addresses Welcome to 1993 JAPAN IEMT SYMPOSIUM .............................................................................................. K. Shono (General ChairpersodSophia University) Manufacturing Challenges in Today’s Economy ............................................................................................. E.J. Vardaman (USA LiasonlTechSearch Intemational, Inc.) Welcome Address for 1993 JAPAN IEMT SYMPOSIUM from Europe ...................................................... J . Joly (Europe. LiaisonlBuH S.A.)

2

3

4

Invited Lectures Future Prospects for the Multimedia Society and Hard-ware Technologies ............................................. H. Yasuda (NTT Corporation, Japan)

F. Funada (Sharp Corporahon. Japan) Hardware Technologies for Pen-Based Computers ..................................................................................... H. Yamamoto (Toshiba Corporation, Japan)

5

6

7

Liquid Crystal Displays: The Prominent Candidate for Multimedia Displays .........................................

WA1 Process1 WAI-I

WAI-2

WA1-3

WA1-4

WA1-5

A Study of Polyimide Adhesion to Epoxy Resin in 9

K. Takeuchi, N. Tsutsui I% N. Miura (IBM Japan, Ltd., Japan) Planarization Process of Copper-polyimide Thin Film Multilayer Substrate .......................... 13 Y. Kasuya, Y. Takahashi, Y. Uno, Y. lguchi & T. Kanamori (Oki Electric Industry Co., Ltd., Japun) Plasma Enhanced CVD Method for Simultaneous Deposition on Both Sides of the Substrate and Its Application to the In-line Multilayer Deposition System ........................................................................................................ 18 Y. Kokaku, H. Inaba, H. Kataoka, K. Abe & M. Sunagawa* (Hitachi, Ltd., Sinmeiwa Industries, Ltd.*, Japan) Polymer Ablation with a High Power Excimer Laser Tool in Manufacturing ......................... 22 G.E. Wolbold, C.L. Tessler & D.J. Tudryn (IBM Corporation, U.S.A.)

An In-line Vacuum Deposition System with a Capability of Composite Fabrication Process on Large Deposition Area ........................................................ 28 H. Kataoka, Y. Kokaku, N. Ohroku, K. Furusawa, K. Abe, M. Ueda*, M. Sunagawa* & S. Takigawa* (Hitachi, Ltd., Shinmaywa Industries, La.*, Japan)

PFP Using Multivariate Analysis of XPS Spectra ...........................................................................

WA2 Process I1 WA2-1 A New Washingless Hybrid-mounting Technique for Bare Chip ICs and SMDs .................... 29

H. Ozaki (Sony Corporation, Japan) WA2-2 Towards Low Cost High Density Bumping .................................................................................. 33

A. Ainula, E. J b i n e n & S. talu (Picopak Oy, Finland) WA2-3 Zone-melting Recrystallization of Si Films by Flat Gas Flame Heating .................................... 37

S. Kanai, S. Futagi, M. Kugenuma, M. Takeuchi, A. Kitagawa, M. Suzulu & S. Taken&* (Kanazawa Univ., Seiko Epson Corporation*, Japan) Ball Grid Array (BGA): The New Standard for High U0 Surface Mount Packages ................................................................................................................ 41 B.J. Freyman & R.C. Marrs ( M o r Electronics, Inc., U.S.A.)

WA2-4

X

I

WB1 Material I WBI-1 Interactions between Thick Film Resistors and Alumina Substrate .............................. 46

H. Moriwaki, A. Suzuki, Y. Watanabe, M. Ishiwata, T. Kamata & K. Adach (Sumitomo Metal Mining Co., Ltd., Japan)

C . Val, M. Leroy & H. Boulharts* (Thomson-CSFDOI, Montpellier University*, France)

R. Kondo, H. Tsuyuki & Y. Suzuki (TDK Corporation. Japan) Automotive PWB Manufacturers Succeed with 100% Solids Conformal Coatings & No-clean Flux .............................................................................................................. 58 S . Wilson, M. Fogelsinger-Huss & M. Strong (Dow Coming Corporation, U.S.A.)

62 N. Wu (Shanghai HA1 YAN Radio Factory, China)

WB1-2 Adaptive Solder Paste Composites Smart Solder Pastes .............. .............. 50

WBl-3

WB1-4

Development of Thick Film Resistors Co-fireable with Ceramic Substrate 54

WBI-5 Trace Element Effect on Tin-lead (60%-40%) Solder Wetting .................................................

WB2 Substrate I WB2-1

WB2-2

WB2-3

WB2-4

WB2-5

Thermally Conductive Circuit Board Using Anodized Aluminum and

K. Takeda & Y. Uematsu (IBM Japan, Japan) Low Temperature Co-fireable Multilayer Ceramic Substrate with

H. &hi, Y. Baba, S . Segawa & S. Fukunaga (Matsushita-kotobuki Electronics Ind., Ltd., Japan) Development of Thick Copper Film Metallized Alumina Substrate for Small Size, High Power, On-board Power Supply .................................................................................... K. Tedoriya, A. Kanamaru & M. Mohri (Nikko Company, Japan) Manufacturing a Fine Pattern FPC of Aluminum-polyester Composite ................................... 77 K. Kondo, I. Kohara*, M. Takaishi*, Y. Yamamoto** & H. It0 (Oogi Chemical Industry Co., Ltd., Sharp Corporation*, DuPont Japan Technical Center**, J a p ~ n )

Multichip Module for 156MWs Optical Interface ........................................................................ 81 H. Tanaka, R. Nagaoka, T. Makabe, F. Yoshimura, Y. Kobayashi, T. Tamura, Y. Suzuki & F. Suzuki* (NJX Corporation, Nec Engineering, Ltd.*, Japan)

Polymer Thick Film ...................................................... .............. .......... 66

Internal Capacitor ............................................... .................... 70

WC1 Components I WCI-1

wc1-2

WC1-3

wc1-4

WCl-5

A Micro Step Motion of Polysilicon Structures on Silicon Substrate ........................................ 85 J. Zhu, T. Akiyama & K. Shono (Sophia University, Japan)

An Ultra Miniature Surface Mount Radio Frequency Coaxial Connector ............................... 89 H. Ogura, K. Sayanagi & T. Yorita (Kanazawa Murata Manufacturing Co., Ltd., Japan) Nonvolatile Memory Based on Reversible Phase Transition in Chalcogenide Semiconductor Thin Film .......................................................................................... 93 K. Nakayama, T. Kitagawa, K. Hashimoto, K. Ohtuka, A. Kitagawa & M. Suzuki (Kanazawa University, Japan) Surface Mount Type SAW Filter for Hand-held Telephones ..................................................... 97 S. Suma, T. Tagami, K. Gunji, I. Iwase & N. Sakamoto (Oki Electric lndustry Co., Ltd., Japan) Thin Film Tri-electrode Electroluminescent Display Device and

Z.W. Porada (Krakow Polytechnic, Poland) the Effect of Aging Process on Its Parameters ............................................................................. 101

WC2 Components I1 WC2-1 An Ultra Miniaturized Dielectric Band Pass Filter for

800MHz Band Cordless Telephone System ..... T. Tsujiguchi, H. Katoh & H. Matsumoto (Kanazawa Murata Manufacturing Co., Ltd., Japan)

A 1.SGHz-band SAW Filter Using Flip-ChipBonding Technique . K. Onishi, S. Seki, Y. Taguchi, Y. Bessho, K. Eda & T. Ishida (Matsushita Electric Industrial Co., Ltd., Japan) An Automatically Assembled Miniaturized SMD Isolator for 1.9GHz Band Communications Systems. Y. Ishikawa, T. Okada, H. Dejima, T. Joudo & T. Kawanami (Murata Manufacturing Company Limited, Japan) Development of a Laser Function Trimming for Car Radio Tuners ... T. Sato, T. Wada & Y. Kagiya (Matsushita Communication Industrial Co., Ltd., Japan) Super Uniform Silicon Photodiode Covering from the UV to IR Regions .................................... 121 Y. Fujii, H. Mori, R. Kyuushima, A. Usami* & T. Wada* (Hamamatsu Photonics K.K., Nagoya Institute of Technology*, Japan)

...................................... 105

....................................... 109 WC2-2

WC2-3 ........................................................................... 1 13

WC2-4 117

WC2-5

TA1 Packaging Technology TAI-I

TA1-2

TA 1-3

TA14

TA1-5

TA 1-6

TA 1-7

High-Pin-Count Quad Flat Package with Thin-film Termination Resistors ................................ 125 S . Sasaki & T. Kishimoto ("IT Electrical Communications Laboratories, Japan) Ceramic Flat Packages for High-speed and High-frequency ......................................................... 129 K. Nagata, T. Miyamoto & F. Miyagawa (Shinko Electric Industries Co., Ltd., Japan) Superminiaturized Leadless Double-balanced Mixermodulator with Thick Film PrinUfire Process ......................................................................... M. Ohsawa, Y. Arai, Y . Ando, T. Wada* & MA. Stein* (Taisei Inc., Electro-Science Laboratories Inc.*, Japan) Comparative Economic Analysis of MCM-D Fabrication Costs ..................... P. Garrou, J. Can, D. Frye, R. Heistand & D. Burdeaux (Dow Chemical, U.S.A.

A Mixed Solder Grid Array and Peripheral Leaded MCM Package ........................................... 141 H. Hashemi, D. Cobb, M. Olla, M. McShane*, G. Hawkins* & P. Lin* (Microelectronics and Computer Technology Corporation (MCC), Motorola Inc.*, U.S.A. )

Hermetic Sealing Method for High-speed MC Ms...... ..................................................... T. Handa, S. Iida, J. Utsunomiya & M. Sawano (Oki Electric Industry Co., Ltd., Jupm) Applications and Technology for Laminate Multichip Modules ................................................... 151 R.T. Crowley & E.J. Vardaman (Techsearch International, Inc., U.S.A.)

.......................... 133

TA2 CIM & Manufacturing TA2-1 A Survey of Critical Metrology Needs for IC Interconnect Processes Based on

Assessment by Quality Functional Deployment (QFR) Methodology ........................................... 155 D.E. Pope, S . Prough & K. Wienecke (Intel Corp., U.S.A.)

Diagnosis of Dynamic Processes Described by Nonlinear Uncertain Models ............................... 161 A.Y. Shumsky (Far Eastem Polytechnic Institute, Russia) An Intelligent Adaptive Manufacturing Method with Application to Electronics Assembly ......................................................................................................................... 165 C.R. Standridge & D. Wader* (Florida A&M University, Jet Propulsion Laboratory*, U.S.A.)

A Synthesis of Adaptive Control Systems for High Speed Robots ................................................ 168 V.F. Filaretov (Far Eastem State Technological University, Russia)

A N . Zhirabok & U.V. Prmbrazhenskaya (Far Eastem Polytechnic Institute, Russia)

TA2-2

TA2-3

TA2-5

TA2-6 Robust Fault Detection in Technological Equipment ..................................................................... 172

I

TA3 Interconnection I TA3-1 Fine Pitch and High Lead Count Multilayer Ceramic QFP ............................................. .., 176

Y. Nakatsuka, Y. Morita, M. Fujii, T. Yamamoto, H. Ohtani* & E. Takahashi* (Sumitomo Metal Industries, Ltd., Sumitomo Metal Ceramics, Inc.*, Japan)

Experimental and Analitical Study of Fine Pitch QF’P Solder-joint Reliability .......................... 18 1 Y. Kojima, J. Sakiura & K. Matsunaga (Fujitsu Limited, Japan)

Single Point Outer Lead Bonding Technology for High Pin Count Ceramic PGA ..................... 183 T. Ando, K. Atsumi, M. Nakazono, T. Tomioka, Y. Tane, J. Nakano & S . Hirata (Toshiba Corporation, Japan) Development of “The MAPLE Method” .......................................................................................... 187 K. Endoh, N. Hashimoto & K. Nozawa (Seiko Epson Corporation, Japan)

D. Miller, T. Gregorich, H. Hoang & S. Mok (Motorola, U.S.A.) Pin Brazing Techonology for a High Performance Aluminum Nitride Package ............. K. Iyogi, K. Yamakawa, K. Koiwa, T. Yasumoto, T, Matsu-ura, M. Endo & N. Iwase (Toshiba Corporation, Japan)

TA3-2

TA3-3

TA34

TA3-5 Repair of Flip Chips (DCA) on Glass Epoxy Printed Circuit Boards ........................................... 191

TA3-6

TB1 Material11 TBI-1

TB 1-2

TBI-3

TB1-4

TB 1-5

TB1-6

Study on High Frequency Permeability of Magnetic Multilayer Films ........................................ 196

Water-based Copper Oxide Compositions for Microcircuit Applications ................................... 200 M. Senda & 0. Ishii (NTT Interdisciplinary Research Labs., Japan)

C.B. Wang, Y. Yokotani* & T. Ogawa* (Du Pont Japan Technical Center, Matsushita CRL*, Japan) Molding Compound Trends in a Denser Packaging World. I. Technology Evolution ................ 204 L.T. Nguyen, R. Lo & J. Belani (National Semiconductor Corp., U.S.A.)

A New Ionic Type Photosensitive Polyimide for Microelectronics ................................................ 2 13 M. Asano, M. Eguchi, K. Kusano & K. Niwa (Toray Industries, Inc., Japan) Joint of High Tc Superconductor with Low Loss and High Strength ........................................... 217 N. Suzuki, 0. Ishii & 0. Michikami (NlT Interdisciplinary Research Laboratories, Japan) Comparison of Reliability and Characteristics between Two Types of Adhesiveless 2-meial TAB Tape ........................................................................................................ 22 1 Y. Mashiko & S . Nishiyama (Mitsui Mining & Smelting Co., Ltd., Japan)

TB2 Substrate I1 TB2-1

TB2-2

TB2-3

A New Circuit Patterning Method for PCBs. .................................................................................. 230 A. Yoshizumi & S. Shmizu (Toshiba Corporation, Japun) Whisker Reinforced Copper/glass-ceramic Multilayer Substrate .................. K. Ikuina, M. Kimura & K. Utsumi (NEC Corporation, Japm) Development of Zero X-Y Shrinkage Sintered Ceramic Substrate ... H. Nishikawa, M. Tasaki, S . Nakatani, Y. Hakotani & M. Itagaki (Matsushita Electric Industrial Co., Ltd., Japan)

T. Koezuka, Y. Suto & M. Ando (Fujitsu L

A. Harada, Y. Kaneko & T. Kishimoto (NIT Communication Switching Labs., Jupm) Near Surface Region of Modified SAW Substrates as a Component of

J. Kapelewski & A. Dukata (Institute of Technical Physics WAT, Poland)

....................................... 238

TB2-4 U0 Pin Solder Point Inspection System ... ........................................ 242

TB2-5 Air Cooling of MChls Mounted on Card-on-board Packaging Systems ......

TB2-6 Layered Structure .............................................................................................................................. 250

TB3 Optoelectronics I TB3-1

TB3-2

TB3-3

TB3-4

TB3-5

TB3-6

TB3-7

On Chip Digital Output Semiconductor Sensor Employing CMOS Inverter Array ..... A. Kasamatsu, B. Kim & K. Shono (Sophia University, Japan) Optical Waveguide-to-photodiode Coupling Technique Using Total Internal Reflection Mirrors Fabricated in Polyimide Optical Waveguides ................................................ 255 S. Kolke, N. Matsuura & H. Takahara (NTT Interdisciplinary Research Laboratories. Jupan)

Low Frequency Noise Measurements on the Light Output and Current of Laser Diodes S . Yang, T. Mizunami & K. Takagi (Kyushu Institute of Technology, Japan)

Thermal Interaction in LD Arrays ................................................................................................... 263 T. Hayashi, K. Sato* & S. Sekine* ("IT Interdisciplinary Research Laboratories, N?T Opto-electronics Laboratories*, Japan)

K. Ozaki, T. Nagai, S. Wakana, Y. Sato & Y. Go Shaping and Coupling of Opitical Thick Film Waveguides. Z. Keresztes-Nagy & G. Harsanyi (Technical University of Budapest, Hungary) 2-D Measuring Fiber-optic Network ................................................................................................ 275 Y.N. Kulchin, O.B. Vitrik & O.V. Kirichenko (Far Eastern State Technical University, Russia)

...................................................................... 259

Optical Delay Tester ...............................................

TCl Measurement & Evaluation TCI-I

TCI-2

TC 1-3

TC1-4

TCI-5

TC 1 -6

TC1-7

Stress Analysis on Hybrid Multilayer Substrate Composed of

H. Arima, H. Sotokawa, R. Sam, F. Shoji, H. Shigi & T. Hatsuta (Hitachi, Ltd., Japan)

Automation of Memory Failure Analysis by Conbining an Expert System with

H. Hamada, T. Tsujide & T. Hishii (NEC Corporation, Japan)

S . Ishikawa, K. Ishihara, Y. Miyamoto, I. Miyazaki, T. Ohshima & M. Sat0 (Hitachi, Ltd., Japan)

Y. Shigeyama, N. Kakimori, Y. Yamamoto, Y. Iwata, K. Nishigaki & H. Nakamura (Sharp Corporation, Japan)

K. Sawada, T. Nakazawa, N. Kawamwa & T. Sudo (Toshiba Corporation, Japan) Surface Defect Inspection for Small Sizes of Chip-electronic-parts Applying Color Image Analysis Techniques .................................................................................... 299 K. Taniguchi, S. Nagata, X. Xiao Linn, T. Uno, H. Yamamoto, T. Se&*, S . Kawabata* & N. Yamma* (Fukui University, Murata Manfg. Co., Ltd.*, Japan) High Speed Electrical Characterization and Simulation of a Pin Grid Array Package ................................................................................................. T.W. Goodman, H. Fujita, Y. Murakami & A.T. Murphy* (Sony Corporation, Du Pont Electronics*, Jupan)

Polyimide and Ceramics ............... .................... ................................................. 279

a Memory Testertanalyzer .........................................................................

Fail Bit Analysis System for Semiconductor Memory Wafers ....................................................... 287

................................... 283

Cream Solder Inspection Technology by Projecting Phase-shifted Fringes ......

Package Deformation and Cracking Mechanism Due to Reflow Soldering ................................. 295

.303

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TC2 Reliability TC2-1 Influence of Newly Molding Compound Properties on

Package Failure during Reflow Soldering Process ......................................................................... 308 M. Murayama, H. Ito, K. Tada, H. Fujioka & H. Kanegae (Mitsubishi Electric Corp., Japan)

TC2-2 Conditions for Reliable Ball-wedge Copper Wire Bond 312 J.F.J.M. Caers, A. Bischoff*, J. Falk** & J. Roggen*** ( W.C. Heraeus GmbH*, Demetron GmbH**, IMEC vzw***, The Nerherlands) New Wave Soldering Machine for Zero Defect Soldering .............................................................. 3 16 N. Hanamitsu, E. Ohtsubo, T. Takei & H. Takakusagi (Oki Electric Industry Co., Ltd., Japan) Degradation of TAB Outer Lead Contacts Due to the Au-concentration in Eutectic T idead Solder 322 E. Zakel, G. Azdasht & H. Reichl (Technical University Berlin, Germany) A Comparative Study of Commercially Available “No-clean” Solder Pastes:

N. Potier, S. Mellul& M. Leturmy (L‘Air Liquide, France)

TC2-3

TC2-4 ........................................................................................................

TC2-5 The Influence of a Protective Atmosphere ............................... 330

TC3-1

TC3-2

TC3-3

TC3-4

TC3-5

TC3-6

TC3 Design Packaging of Pointing Device for Notebook PC with 84/89 Keys S. Yamada & K. Tsuchiya (IBM Japan, Ltd., Japan) Tape Automated Bonding Packages: Electrical Considerations for High Frequency Applications ............................................................................................................ 34 1 M. Bedouani (Bull S.A. Research Center, France)

Numerical Calculation of Ground-plane Impedance in Multilayer Printed Circuit Boards ................................................................... ............. 345 K. Sakakibara & T. Mikazuki (NTT Communication Switching Laboratories, Japan) Thermal Stress Analysis of Conductive Adhesive Joints ................................................................ 349 A.O. Ogunjimi, D. Whalley & D. Williams (Loughborough University of Technology, U.K.) A 3D Assembly Simulation System for Parts with Geometric Deviations .................................... 354 K. Inoue & A. Okano (IBM Research, Japan) Design for Manufacturing of High Density Wirebonded VLSI Packages .................................... 358 J. Joly, J. Guemalec & X. Saint-Manin (Bull SA, France)

FA1 Interconnection I1 FA 1- 1 A Stud-bumpbonding Technique for High Density Multi-chipmodule ...................................... 362

Y. Bessho, Y. Tomura, Y. Hakotani, M. Tsukamoto, T. Ishida & K. Omoya (Matsushita Electric Industrial Co., Ltd., Japan) Fine Pitch TAB-LSI Interconnection Technology in MCM ........................................................... 366 F. Mori, K. Kudo & K. Tsukamoto (NEC Corporation, Japan) A Low Cost Multi-chip Module Using Fine Line Thick Film and Solder Ball Bump Interconnection Methods ................................................................................... 370 M. Segawa, Y. Saito*, T. Ogashiwa** & H. Akimoto** (Toshiba Corporation, Toshiba AVE Co., Ltd.*, Tanaka Denshi Kogyo Ltd.**, Japan)

FA1-2

FA1-3

FA2 OptQelectronics I1 ..... 374 FA2-1 Error-free Subsystem Optical Interconnections .....................................................

A. Takai, M. Haneda, T. Kato, S . Hanatani & Y. Motegi (Hitachi, Ltd., Japan)

Photointerrupter Using 3-dimensional Molded Plastic Plated with

N. Matsuoka, M. Kimoto, Y. Wada, T. Hanamoto, M. Nakamichi & (Sharp Corporation, Japan)

T. Kakinuma & S. Shikii (Oki Electric Industry Co., Ltd., Japan) Small-sized 10 GbiUs Optical Transmitter and Receiver Modules Including 8-bit MUXlDEMUX ICs ......................................................... T. Umeda, K. Kaminishi, E. Takagi, J. H a n k , A. Tohdake, Y. Shizuki, K. Yoshihara, N. Shigeno & K. Chinen (Toshiba Corporation, Japan)

FA2-2 Conductive Wiring .............................................................................. 378

FA2-3 Erbium-doped Fiber Amplifier .. ................................................................................. 38 1

FA2-4

Invited Lecture Recent Progress on Opto-Electronics Technology for Future Multi-Media World ..................................... 389 K. Kobayashi(NEC Corporation, Japan)

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