imoa newsletter 2007 07

7/27/2019 IMOA Newsletter 2007 07

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Molybdenum,

Its Alloys, and Its

Processing

Table 1summarizes some of the properties ofmolybdenum and identi f ies competi t ive mater ia ls

and mat er ia ls systems. While i t is tempt ing to

bel ieve that appl i cations are control led by a single

property, in truth many molybdenum appl ications

exist because of a useful combination of several

properties. For instance, hot strength is a critical

property for high -tem perature tool ing l ike casting

die inserts, but molybdenum s high resistance to

fai lure by thermal shock and thermal fatigue are

equal ly important. These qual i t ies relate to

molybdenums unique combination of low heat

capacity and high therm al conductivi ty, which

min imizes thermal stresses. Molybdenum s long-

standing use as a power semiconductor heat sink

is due in part to its excellent thermal expansion

match w ith si l icon, but i ts good electrical and

thermal conductivi ty provide addit ional

advantages compared to competi t ive m ater ia ls.

Table I Isummarizes classes of molybdenum-

based al loys and mat er ia ls systems that have

evolved in order to optimize specific properties and

improve performance. Each of the systems

evolved in response to performance needs in

certain applications. The carbide-stabilized alloy

TZM is one of the oldest comm ercial alloys; MH C,

stabi l ized wi th hafn ium carbide precipi tates, is a

more recent memb er of the same family. Theseal loys improve molybdenum s hot strength, creep

resistance, and recrystallization resistance.

Al loying with tungsten also improves hot strength,

but molybdenum-tungsten al loys f ind widest use

in han dl ing m olten zinc, where they resist zinc

corrosion. The Mo-3 0 wt . % W al loy is nearly as

corrosion resistant as pure tungsten at a greatly

reduced density and cost. Oxide-di spersed alloys

impart extraordinary creep resistance at

temperatures as high as 20 00 C. Molybdenum

sheet clad with copper provides enhanced thermal

and electrical conductivity and increased thermal

expansion coefficient (CTE), allowing a good

mat ch with ceramic substrates used in int egrated

circuits. Copper-molybdenum powder composite

mat er ia ls have the added advantage of i sotropic

properties; if enhanced properties are required,

they can also be clad with copper. Molybdenum -

nickel laminates provide an easily soldered or

brazed nickel surface, el imina ting environmental l y

challenging nickel plating processes.

Molybdenum is produced by both powder metal-

lurgical (PM) a nd vacuum casting t echniques.

Figu res 1 and 2i l lustrate the two

processing routes schem aticall y. In the PM route,

pure metal powder is made from high-puri ty

s tar t ing mater ia l (amm onium d im o lybdate o r

molybdenum tr ioxide) in a two-step hydrogen

reduction process. This powd er is blended wi th

consti tuents appropriate to t he al loys being

manu factured. Blended powder is isostatical ly

pressed to produce a preform, which is sintered at

high tem peratures in hydrogen or vacuum to

produce a b i l le t tha t i s 94%-97% o f

molybdenum s pore-free density. Hot and cold

processing operations are combined with

appropriate intermediate and f inal anneal ing

practices to m anufacture mil l products (plate,

sheet, fo i l , ba r, rod, wire, and forgings).

PM processing has the advantage of being a

lower-cost route to produce mater ia l , and can

produce shapes with relatively low scrap losses.

2

Table I . Pr oper ti es of Molybdenum

Prop ert y Cl ass Pro perty Ap pl ica ti ons Com pet i ng M at eri al s

H ot str en gth Li gh ti ng, fu rn aces, Tu ng stenhot tool ing

Creep resistance Lighti ng, furnaces Tungsten , graphi te

Wear resistan ce Hot tool ing, Tu ngstenant i-f r i ct ion coat ings

M a ch i na b il i ty Fa b ri ca te d p a rt s f or a M a ny, m o st a r evariety of applicat ions more machinable

Co rr osi on r esi st an ce M et al h an dl i ng N ob le m et al s,and casti ng graphi te

Compat i bi l i ty with Glass melt ing electrodes, Plat inum , t in oxide,mo lten gla ss fur nace comp onents nickel all oys

Adherence to glass Light ing components, Titanium ,substrates integr ated circuits chro mi um

Etchabi l i ty Lighti ng com ponen ts, Ti tan ium ,integ rated circuits chro mi um

L ow v ap or p r essu r e H i gh t em p er a tu r e Tu n gst en ,vacuum com ponents tanta lum

Electron em ission Lam p com ponents Nickel , others

Thermal expansion Si l icon power devices, W, W-Cu, AlSiC,integ rated circuits, AlN, AlGrhot work tool ing Tradit iona l tool ing material s

Thermal conduct iv i t y Si l icon power devices, Copper, a luminum ,integ rated circuits, W, W-Cu, AlSiC,hot work tool ing AlN, AlGr

Electri cal condu ctivity Silicon power devices, Copper, alu mi num ,integr ated circuits W, W-Cu, AlSiC,

AlN, AlGrLow diffu sivity into Integr ated circuits, Ti,

other materia ls f lat panel displays Cu-Al

Low fr i cti on An ti - f r iction coat ings Carbon, brass

Mechanical

Chemical

Physical


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The oxide-doped alloys cannot be produced by

m elting techniq ues at all. Powder processes are

required to obtain th e f ine dispersion of oxide

particles in the molybdenum matr ix that are

responsible for these alloys extraordinary high-

temperature mechanical properties. PM processing

must be control led careful ly to avoid the

detrimental effects of adsorbed oxygen and oxide

fi lm s on powder particles. Al loys containing

reactive metals like Ti, Zr, and Hf form very stable

oxides that affect microstructure and can affect

performance as well. Manufacturers, over the

years, ma de great progress on these problem s,

and PM processing now accounts for the vast

major i ty of a l l molybdenum metal and al loy pro-

duced in the world.

Both vacuum arc-casting (VAC) and electron beam

(EB) melt ing are used to cast molybdenum and i ts

alloys. In the arc-casting process,

molybdenum ingot is melted using a

semi- continuous press-sinter-m elt (PSM)

process. The process consolidates powd er

blends into electrodes and melts the

electrodes in a water-cooled copper crucibleunder vacuum. Arc-cast ingots are usually

extruded in their first processing step to

prevent hot cracking at grain boundaries

and break dow n the l arge as-cast grains.

EB melting also uses a water-cooled

copper crucible to contain the melt. I t is

usually performed under lower pressures

than VAC m elting . EB m elting does not

require virgin powd er; th is means that the

process can be used to recycle process

scrap. Because the heat used to m elt the

mater ia l is appl ied independently of the

heat to maintain the molten sol id i f ication

pool, EB-melted ingots typical ly have

smaller grain size than VAC ingots.

Because of th is, EB-melted m ater ia l is

often forged in the as-cast condit ion.

Table I I . Molybdenum A lloys and Materi als Systems

System Exam ple Propert i es o f I nterest

Pure Mo 99.95 wt % Mo Elevated tem perature strength,thermal conduct ivi ty, therm al expansion

Mo-W Im proved hot strength ;Zn corrosion resistance

Subst i tut ional al loys

Mo-Re Impr oved low temperature duct i l i ty

TZM Imp roved hot strength and creep resistanceCarbide- stabi l ized al loys

MHC High er hot strength and creep resistancethan TZM

La O (ML,ODS-Mo) Outstanding hot strength and creep2 3

resistanceOxide- dispersed systems

YO (MY) Outstanding hot strength, creep resistance2 3

Cu- Mo -Cu lam in ate Engi neered ther mal proper ti es

Other system s Mo-Ni lam inate Solderabi l i ty

M o-Cu pow der com posi t e I so t rop i c engineered the rm a l p rope rt i es

3

Figur e 1.Powder metallu rgical processin g of molybdenum metal products.

Figur e 2.Processin g molybdenum via EB meltin g or arc-casti ng technol ogy. Cour tesy of PLANSEE Metall.

Court esy of PLAN SEE Metall.


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All ingot-casting techniques require a surfacepreparation step prior to forging or extrusion, in

order to remove surface porosity and possible

contaminants from the ingot mold. Cast al loys,

while typically more expensive to produce than

PM al loys, provide benefi ts for that addit ional cost.

They are lower in impurities, especially volatile

species that evaporate in the casting process.

Al loying is accomplished in the m elt, where i t is

more l ikely to be homogenized than in sol id-statesintering. Since the technologies use a deoxidizer,

excess oxygen is not a problem . Oxygen contents of

10 ppm or less are normal in cast mater ia l .

In all of these processing techniques,

thermomechanical processing serves two roles: to

create a useful f inal product form, and to impart the

required mechanical properties. Manufacturers

employ var ious hot, warm, and cold deformation

processes in combination with annealing steps to

produce the desired microstructures and properties

in f in ished products. Round, f lat, and shape

rol l ing, rod and wire drawing, rotary forging,

swaging, forming and deep drawing are al l used to

process molybdenum.

Appl icat ions

Molybdenum touches our l ives every day, but inways that are usual ly invisib le to the end u ser.

Tradit ional appl ications consume signif icantvolumes of mater ia l , but new appl ications are

emerging that promise to supplant and surpass

many tradit ional appl ications.

Light ing

Lighting is the oldest appl ication for m olybdenum

metal. In fact, some appl ications in th is market

are nearly unchanged from the ear l iest appl ications.

Figu re 3i l lustrates the most highl y evolved

example of the tradit ional tungsten f i lament

incandescent lam p: the autom otive halogen

headlamp. The high temperatures in halogen

lamps require a pure silica (quartz) glass envelope.

Molybdenum seal ing r ibbons provide a transit ion

from the external lamp wir ing to the internal

refractory metal components. Molybdenum s low

thermal expansion coeff icient and good bonding

with si l ica glass make i t ideal for th is appl ication.

The profile of the strip used in the sealing ribbons is

engineered to minimize stresses in the glass arising

from expansion mismatches during manufa ctur ing

and operation. Molybdenum reflector caps controlthe shape of the lamp beam, so that i t does not

impa ir the vision of oncoming dr ivers. Str ip used

for reflectors must meet stringent surface finish and

ducti l i ty requirements because i t is drawn i nto the

cup shape at high speeds. Strip failure during

drawing creates significant productivity losses, and

may result in damage to expensive mult i -cavity

tool ing. Molybdenum also f inds appl ication in

other tradit ional l ighti ng appl ications such as

discharge lamps.

A example of an emerging l ighting appl ication is

shown in Fi gur e 4. The cold cathode

fluorescent lamp (CCFL) il luminates liquid crystal

flat pan el displays (FPDs). The dram atic increase in

sales of FPDs drives demand for molybdenum in

these lamps. Molybdenum hol low cathode cups

replaced the formerly used nickel cups due to its

better sputter resistance and emissivity, while doped

molybdenum lead pins replaced Kovar, offering a

much higher thermal conductivi ty and al lowing

lower lamp tem peratures. The rapidly evolving high

brightness l ight emitt ing diode (HBLED) technology

may also be an area wh ere copper-clad

molybdenum or Mo- Cu composites are needed.

Even though HBLEDs are extremely efficient in

4

Figu re 3.Aut omotiv e halogen lam p, show in g m olybdenum sealing ribbons and reflector caps.

Court esy of PLANSEE Metall.

Figu re 4.

Cold cathode fluorescence lamp (CCFL) and m olybdenum components.

Clockw ise from upper left: examples of lamp geomet ries,

molybdenum cups, Mo/Mo/Dum et electode assembly, HT pins.

Cour tesy of PLANSEE Metall.


5/16

comparison to tradit ional incandescent l amps, t hey

sti l l generate high power densit ies that require

eff icient heat removal.

Table I I Isumm arizes the status of l ighting

appl ications. Tradit ional appl ications depend

primari ly on molybdenums elevated temperature

strength and creep resistance, and its chemicalcompatib i l i ty w ith the gl ass systems and hal ogen

gases present in lam ps. Molybdenum s attractive

thermal properties (conductivi ty and expansion)

and electrical conductivity are also factors in these

appl ications. Because of molybdenum s unique

property suite, no suitable replacement m ater ia ls

have yet been found. Emerging appl ications l ike

CCFLs rely on the same suite of properties,

combined with sputter resistance and emissivity,

while HBLEDs exploit the thermal and electrical

properties of molybdenum . In these appl ications,

there are numerous al ternatives to m olybdenum.

Time an d the evolution of device design wi l l

determine the ul t imate optimal mater ia l choices.

The m ater ia l competi t ion is particular ly robust in

the area of HBLEDs, where many of the well-

developed thermal management mater ia ls also

compete, and where design im provements may sti l l

significantly reduce thermal loads on the devices.

Emerging appl ications, whi l e not yet consumi ng as

much powder as tradit ional ap pl ications, have

high growth rates. The quanti ty of molybdenum

powder required to serve tradit ional markets is

Table I I I . Characteri st i cs and Statu s of Li ghtin g I ndu str y App li cati ons

Ap p li ca t io n M o Pr od u ct El eva t ed - te mp er at ur e Ch em i ca l Ph ysi ca l Al t er na ti veMechanical Propert ies Propert i es Propert i es Mat erial s

Tr adi t ional appl icat ions

Halogen lamps

Dischargelamps

Sealing andsupport wire

Reflector caps

Sealing foil

CCFL lamps

HBLED lamps

CCFL: Mo cup and pin

for electrode

HBLED: MoCu or

Cu-Mo-Cuheat sink

CCFL: Strength for

seali ng process

Creep resistance

CCFL: Compatible

with mercury

CCFL: Electron

emission,thermal andelectricalconductivity

Sputterresistance

HBLED: Thermal

and electricalconductivity

CTE

CCFL: Ni & Ni a l loy Nb Kovar

HBLED: Cu Al AlSiC Al N Etc.

Strength forseali ng process

Creep resistance

Corrosionresistanceagainst l ampgases

Good bondstrength withglass

High melt ingpoint

CTE

Thermaland electricalconductivity

None

Mo powder demand: ~ 1300 mt / y r Marke t sta tus: shr i nk ing

Emerging appl icat ions

Mo powder demand: ~ 100 mt / y Marke t sta tus: rap id l y g row ing

5

Figu re 5.

Glass m elting furn ace components. Top left to bott om left: furn ace protection

shi elds, glass-meltin g electrodes, m olbdenum glass sti rrers. Right: schematic

of glass-meltin g fur nace show in g m olybdenum appli cations.



6/16

signifi cant now, but is decreasing. The extent towhich emerging m arkets wi l l replace tradit ional

markets wi l l depend cri t ical ly upon the evolution of

the appl ications within the markets, and upon

molybdenum s abi l i ty to succeed against competing

m aterials. Cost is a significant factor in all these

appl ications.

The tradit ional l ighting appl icationsare commodity- l ike businesses, and require low

costs. The emerging appl ications, aimed at th e

high- volume consumer markets, are also highly

cost-sensit ive. Mater ia l cost stabi l i ty and t igh t

control of manu factur ing costs are im portant factors

for success in this market.

Glassmaki ng and

High-temperature

Furnaces

Glass manufacturing and furnace construction have

long been important appl ications for molybdenum.Molybdenums high-temperature strength,

fabr icabi l i ty, and compatib i l i ty with most glass

composit ions make i t an ideal choice in

glassmaking. Fi gur e 5i l lustrates a typical

glass-melt ing furnace instal lation with

molybdenum components. Molybdenums strength,

creep resistance, and erosion resistance in glass

melts m ake i t ideal for sti r rers, g lass melt ing

electrodes (GMEs), and furnace shields, all of whichmust resist stresses and erosion imposed by the

mol ten glass. Moly bdenum also resists glass

corrosion, and the smal l amount s that dissolve in

the melt do not discolor the glass. Molybdenum

can be made wi th very low carbon con ten t (< 20

wt. ppm ), preventing the formati on of CO bubbles2

Table I V. Char acter i sti cs and Statu s of Glass and Fur nace I nd ustr y App li cation s

Glass tankcomponents

GMEs

Stirrers

Shields

Dies for glassfibermanufacture

Vacuumfurnaces

Hydrogenatmospherefurnaces

Heat shields

Heat ingelements

Supportstructures

Boats

Setter t i les

Strength

Creep resistance

Melt ing point


Low vaporpressure

Graphite

Tungsten

Tantalum

Ceramics

Compatibil itywith hydrogen

Strength

Creep resistance

Corrosionresistance i nmolten glass

No discolorati onof glass

No format ion

o f CO bubb les2

Melt ing point


Noble metals

Nickel baseal loys

SnO

Refractories

Mo powder demand: ~ 400 mt / y Marke t sta tus: shr i nk ing

Emerging appl i cat ions

Mo powder demand: ~ 300 mt / y Marke t sta tus: sl ow ly g row ing

Tradi t ional appl i cat ions

Ap p li ca ti o n M o Pr od u ct El eva te d- t em p er at ur e Ch em i ca l Ph ysi ca l Al t er na ti veMechanical Propert i es Propert ies Propert i es Mat erial s

Figu re 6.

Typical m olybdenum vacuum furn ace and component s.

Bottom right: load support stru ctu re. Top right: Heating elements and heat shi elds.


6


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in the molten glass due to reaction between glassand carbon in solution.

Figu re 6i l lustrates typical app l ications in the

vacuum furnace industry. Pure molybdenum,

oxide-dispersion strengthened alloys such as ML or

ODS Mo, and TZM are used because of their high

temperature strength and creep resistance.

Molybdenum s low vapor pressure at h igh

temperature means that i t does not contaminate

workloads, an important factor when heat treating

reactive metals l ike t i tanium . Molybdenum is used

for support structures, heat shields, heating

elements, and al l manner of vacuum furnace

hardware. Molybdenum s poor oxidation resistance

prevents its use in oxygen-containing atmospheres,

but it is used extensively for furnace boats, setter

t i les, heating elements, and load-bearing

components in hydrogen atmosphere furnaces.

Unl ike the refractory metals tantalum and niobium,

molybdenum forms no deleterious hydrides.

Hydrogen gas protects molybdenum against

oxidation, providing an ideal environment.

Table I Vsummarizes the status of glass

melting and furnace appl ications. Molybdenum

has held a signif icant posit ion in the glass melt ing

industry since the advent of electrically boosted

furnaces to increase productivi ty. Several mat erialstheoretical ly can compete with molybdenum in

certain areas, but none ha s a combination of

properties l ike molybdenum s. For examp le t inoxide and platinum are used in n iche appl ications

requiring specific chemical characteristics or other

properties, but they cannot compete w ith

molybdenums overall cost-effectiveness.

Imp rovements in eff iciency gained by furnace

design and operating practice have resulted in a

slowly decl in ing demand for molybdenum in

these applications.

Competing mater ia ls have had an effect on

molybdenum consumption in the furnace industry,

especially in vacuum furnace technology. Graphite

is a strong competitor for vacuum furnaces in

general duty appl ications. Molybdenum s place

in the vacuum furnace industry is in appl ications

that require the ul t im ate in cleanl iness and

contamination- free operation. Superal loys and

high-tech materials systems are processed in

al l -m olybdenum furnaces. This segment h as seena sl ight growth with t im e. With the increasing

interest in nuclear technology, there may be an

increase in demand for fuel sintering furnaces,

which typical ly use molybdenum components.

Mater i al Form in g

Molybdenum and i ts al loys have made important

contr ibutions to hot metal forming. Molybdenumshigh strength at elevated temperatures, creep

resistance, and resistance to thermal shock and

fatigue make i t the mater ia l of choice for

demanding appl ications. Hot work tool ing is

manufactured from TZM or MHC, because of their

improved strength and creep resistance over pure

molybdenum. Fi gur e 7i l lustrates two

wel l know n appl ications for these al loys:

isothermal forging dies and components, and

piercing plugs for stainless steel tube forming.

Molybdenums unique high-temperature

mechanical properties and wear resistance allow it

Figu re 7.

Traditional molybdenum applications in hot metal formi ng. U pper right: TZ M

and MHC isotherm al forging die components used to m anufacture aircraft gas

turbi ne (upper left) components. Lower right: T ZM piercing plugs for the

m anu facture of pierced stain less steel tubin g (lower left). Cour tesy of PLANSEE Metall.

Figu re 8.

Emerging application s of mol ybdenum alloys (right) and products made using

them (left). Top to bottom : MHC dies for brass extrusion, TZM

inserts for Al and Mg die-casti ng, TZM hot ru nn er die in serts for

plastic in jection m olding. Cour tesy of PLANSEE Metall. 7


8/16

to forge nickel base superalloys in thesuperplastic deformation regime. The machining

savings that accrue by producing a near net shape

part easily justify the expense of using massive

molybdenum die sets, in forging presses operating

in control led environments to p revent oxidationof the tool ing. Piercing plugs operate in am bient

atmospheres, and the same strength and w ear

resistance enable significant increases in

productivi ty in tube-making mil ls.

The molybdenum tr ioxide that forms during usecan also provide some lubricity, reducing friction

and im proving internal surfaces of the f in ished

product.

Fi gur e 8i l lustrates several emerging

appl ications for molybdenum tools. Some of these

were identi f ied in th e past, but ear l ier a l loys could

not provide the required performance.

Improvements in molybdenum al loy properties and

increased dem ands for productivi ty and qual i ty

have made them feasible, and they now consume

substantia l am ounts of mat er ia l . TZM al loy has

been used for many years as a die insert material

for brass extrusion dies, but was relegated to

leaded brass alloys and small sizes because of

strength l im itations. The higher strength MHC

alloy can extrude a wider range of stronger, more

abrasive alloys, and can produce larger sizes.

Molybdenum has also been used for inserts in

aluminum and magnesium die casting dies where

Table V. Character ist ics and Statu s of Materi al Form in g Appli cati ons

Isothermalforging

Tube form ing

Molten Znhandl ing

TZM and MH Cforging diesand accessories

TZM piercingplugs

Mo-W moltenZn tooling

Metalextrusion

Plasticinjectionmold ing

Al and Mgcasting

MHC dies

TZM hotrunner nozzles

TZM tool inserts

Extrusion and casting:

High temperaturestrength

Creep resistance

Thermalconductivity andheat capacity(therm al shockresistance)

Wear resistance

Stell ite

CuBe

Steel

Plastic injectionmolding: Good corrosion

resistanceagainst plasticsat mediumtemperatures

Casting: Stable to Al,

Mg, Zn attack


Creep resistance

TZM, MHC:None identif ied

MoW al loys: Corrosion

resistance i nmolten Zn

Goodhot strength

Thermalconductivity andheat capacity

(therm al shockresistance)

Wear resistance

None

Mo powder demand: ~ 100mt /y Marke t sta tus: stab le


Mo powder demand: ~ 10 mt / y Marke t sta tus: g row ing


Ap p li ca t io n M o Pr od u ct El eva t ed - te mp er at ur e Ch em i ca l Ph ysi ca l Al t er na ti veMechanical Propert i es Propert ies Propert ies Materi als

8

Figu re 9.Medical X-ray tube (right) and molybdenum components. Left, top to

bott om : rot atin g anodes, rotors, and cathodes. Cour tesy of PLANSEE Metall.

X-Ray TargetCathode components

Rotor

Mounting


9/16

hot cracking is a problem. Molybdenums

combination of low heat capacity and low thermal

expansion m ake i t signif icantly m ore resistant t o

surface cracks from thermal shock. Increasing

demands for qual i ty in automotive castings, and

casting d esign th at has pushed tradit ional d ie

materials to their limits, spurred an increased use

of TZM in critical regions of casting tools.

Manufacturers of p lastic in jection-m olded

components are finding advantages for TZM

tool ing, despite the fact that their operating

temperatures are much lower than

tradit ional metalworking or metal casting

processes. TZM s excellent strength, corrosion

and erosion resistance, and thermal stabi l i ty al l

contribute to its selection in this application.

Table Vprovides an overview of the m ater ia l

forming industry and molybdenums place in i t .

Here the emerging appl ications are evolutionary in

nature, representing extensions of applications long

known for molybdenum and i ts al loys. The

tradit ional appl ications provide a stable market,

whi le the em erging appl ications are growing.

Medical

Medical appl ications of molybdenum are almost

exclusively components of h igh-energy rotatin g

anode tubes used in computerized axial

tomography (CAT) scanners. Some molybdenum isalso used i n t he detector a rrays of CAT scanners,

but here i t competes against tun gsten, which

absorbs the scattered radiation even more

effectively than molybdenum. Fi gur e 9

i l lustrates molybdenum appl ications in a typical

rotating anode X-ray tube. The rotating anode, the

tubes "business end," uses pressed, sintered, and

forged TZM. The anode contain s a focal track of

W-Re al loy m anufactured integral ly with th e rest of

the target in this process. Electrons emitt ed by the

cathode assembly bombard the W- Re track as the

anode rotates, causing the track to emit X-rays.

The electron beam heats the W-Re track nearly to

i ts melt ing point immediately underneath the

beam, generating enormous amounts of heat. The

tube stores this heat in a graphite heat sink brazed

to the TZM t arget, and then re-radiates i t from the

heat sink to the surrounding environment, w hich in

the case of the tube assembly is an oil bath.

The rotor used to spin the target also reaches high

temperatures, so it is made from TZM alloy.

The rotor is designed to l imi t the am ount of heat

transferred down the shaft to the bearings.

Table VI . Characteri st i cs and Statu s of Medi cal App li cati ons

X-ray tubes

X-ray detectors

Rotating anodes

Bearings androtors

Cathode p arts

Collimatorcomponents


Creep resistance None identif ied

Tubes: Thermal

conductivity CTE

Collimators: Radiation

absorption

Dimensional

control of sheet

Surface finish

Tubes: Tungsten

Collimators: Tungsten

Tungstenheavy alloy

Mo powder demand: ~ 350mt /y Marke t sta tus: sl ow ly g row ing

Tradi t ional appl icat ions

App l i ca t i on M o Pr oduct El eva t ed - t em pe ra t ur e Chem i ca l Physi ca l Al t er nat i ve

Mechanical Propert i es Propert i es Propert i es Ma terial s

Figu re 10.

Traditional m olybdenum electronic applications. Clockwi se from upper left:

Di odes used for low power rectification, m olybdenum heat sink s used in t hat

application , molybdenum base plates for high-power sem icondu ctors, assembled

power semi conduct or packages. Court esy of PLANSEE Metall.

9


10/16

X-ray tu be components are a tradit ional

appli cation. The designs are high ly evolved, and

the higher power densities they require push the

mater ia ls to th eir l imit s. Larger and larger targets

spinning at faster and faster speeds are needed to

handle the energy deposited by the electron beam.

Weight restrictions driven by stress and balance

considerations continue to force reduction in

molybdenum weight in the targets. As a result, the

amount of powder required to serve the m edical

industry grows only slowly.

Table VIsummarizes these considerations.

Given the unique engineering requirements of X-ray

tube design, molybdenum is one of only a few

alternatives now avai lable.

Electronics

Electronic applications have required molybdenum

from the ear l iest days. Molybdenum s elevated

temperature strength and creep resistance,

compatib i l i ty with tube glass formulations, low

vapor pressure, and compatib i l i ty with standard

metalworking technologies made i t an optim choicein vacuum tubes. These applications

consumed a signif icant amount of mater ia l for

many years. With the advent of sol id-state

electronics, i t appeared that m olybdenums place

in the industry might disappear. However,

molybdenums unique combination of physical

properties (excel lent thermal expansion m atch with

si l icon, good electr ical and thermal conductivi ty) ,

good m echanical properties at am bient

temperatures, ease of plating, and compa tib i l i ty

with existing brazing and solder ing technologies

made i t the mater ia l of choice for construction of

these devices as well. Mol ybdenum is used

extensively in the industry as a heat sink m ater ia l

for rectifier diodes in consumer goods, and for

high- power semiconductors used in motor control

and pow er generation. Figu re 10i l lustrates

some of these compon ents. The smal l heat sink s

are manufactured by the mil l ions dai ly in highly

automa ted pressing and sinter ing operations, whi le

the heat sinks for large power devices are typically

made from sheet that is stamped, machined, and

plat ed to exacting specifications. These tradit ional

appl ications consume molybdenum at growth rates

that m irror the overal l economic development

of the world, an d are t ied to rai l transportation,power generation, and capital investment in

manufactur ing plant equipment.

Molybdenum is also found in tool ing and other

equipment used to manufacture electronic devices

and mult i layer circui t board assembl ies.

Molybdenum sheet is used in m asks to apply circui t

inks in mult i layer ceramic circui t board assembl ies.

In the same technology, molybdenum powders

formulated to specific particle size distributions are

contained in inks that create the circuits on these

boards.

Arc chambers of ion im planter equipments used to

dope semiconductors are often entirely made of

molybdenum or TZM enabl ing a long service l i fe in

the highly corrosive environment created by the

chemicals used in this process.

Appl ications for molybdenum are also emerging in

the integrated circui t and power semiconductor

areas. Fi gur e 11i l lustrates a few.

Integrated circuits are built on ceramic substrates

having higher thermal expansion coeff icients than

si l icon. Molybdenums thermal expansion

coefficient (CTE) must be modified to provide an

acceptable expansion m atch. This can be done by

cladding molybdenum sheet with copper, bycreating a MoCu powder composite ma ter ia l , or

even by cladding this composite mater ia l with

copper. This approach can produce tail ored

thermal properties and im proved device

performance. Telecommunications growth is a

maj or dr iving force in th is market. The expansion

of m obi le te lephone technology around the globe

created a large demand for integrated circuits,

which generate high power densit ies and requireadvanced thermal management mater ia ls. The

same ma ter ia ls used in te lecommuni cation have

recently found a ppl ication in h eat sinks for

integrated gate bipolar transistor (IGBT) power

modules used in hybrid vehicles.

Figu re 11.

Emerging molybdenum electronic applications. Clockwi se from upper left:

Radio frequency in tegrated circuit for telecommun ications,

PVD-coated Cu-Mo-Cu h eat sin ks for radio frequency packages, nick el plated

baseplates for power electroni cs, tw o IGBT power modules for hybri d vehicles.

Center: Cu-CuMo-Cu clad sheet m icrostru cture.Cour tesy of PLANSEE Metall.

10


11/16

Table VI Isummarizes molybdenum usagein electronic applications. The traditional

applications use more or less material in concert

with the general world economy, a nd particular ly

in relation to capita l- intensive investments.

The emerging appl ications show rapid growth in

mater ia l consumption, an d are l ikely to surpass

the tradit ional app l ications.

Table VI I . Characteri st i cs and Statu s of Electr onic Appl ications

App l i ca t i on M o Pr oduct El eva t ed - t em pe ra t ur e Chemi ca l Physi ca l Al t er nat i veMechanical Propert ies Propert ies Propert ies Mat erial s


Powersemiconductors

Multi layerceramic boardmanufactur ing

Devicemanufactur ing

Semiconductors: Mo

semiconductorbase plates

Mo gla ssdiode pins

Multi layer boards: Fine powders

Sheet masksfor circuitapplication

Device

manufactur ing: Ion implanter

par ts

Radio

frequency,server, andprocessorchips

IGBTs forhybrid cars

Cu-Mo-Cu

MoCu

Cu-MoCu-Cu

None iden ti f ied None identi f ied

CTE

Thermal andelectricalconductivity

Cu Al AlSiC Al N Others

None identif ied

Mult i la ter boards Controlled

etchabilityDevicemanufacturing: Corrosion

resistanceagainstdopantchemicals

Semiconductors: CTE

Thermal andelectricalconductivity

Multi layer boards: Powder

sinteringpropertiesmatchinga luminasubstrates

Resistan ce t o

erosion frommetal powder-f i l led inks

Strength andstiffness

Flatn ess contr olof sheet

Power semi-conductors:

AlSiC

Multi layer boards: Glass ceram ic

boardsemployingal ternate inkformulat ions

Mo powder demand: ~ 400 mt / y r Marke t sta tus: stab le

Mo powder demand: ~ 350 mt / y Marke t sta tus: rap id l y g row ing


11

Fi gur e 12.

Traditional m olybdenum coatin g applications. Clockwi se from low er left:

coating a shaft for w ear resistance, mol ybdenum -coated synch roni zer rings,

m olybdenum w ire for flam e spray coating. Court esy of PLANSEE Metall.


12/16

Coatings

Figur es 12an d 13i l lustrate tradit ional

coating appli cations. Flame spraying has been used

for years to improve the wear and friction propertiesof automotive components like gears, synchronizers,

and piston r ings. Recently, engineered molybdenum

powders have taken a more promin ent role in these

appl ications, using plasma spray technology. The

powders are often al loyed with nickel and chromium

to produce highly corrosion resistant coatings.

The composit ional f lexibi l i ty an d im proved

performance has al lowed molybdenum thermal

spray powders to gain the l ion s share of thetradit ional coating market. Even so, th is tradit ional

market is not growing, but stable.

Figur es 14an d 15i l lustrate coating

appl ications that are growing steadi ly, aft er several

years of very rapid growt h. They are in the

Table VI I I . Characteri st i cs and Status of Coatin g Appl ications

Flamespraying ofwear par ts

Plasmaspraying ofwear par ts

Mo spray wire

Mo and Moalloy powderblends

PVD coatingof TFT-LCDan dsolar pan els

Mo and Moalloy sputteringtargets

None identif ied

Good el ectri calconductivity

No diffusion ofMo into Al, Cuand gla ss

Cu and Alalloys

Ti

Cr

Organicmater ia lswith spincoating

Good adhesionto glass

Good etchingbehavior

Compatibil itywith processingenvironments

High yield strengthcontrib utes to goodwear properties

Corrosionresistanceagainst oils

Low fr i ction

Good wearresistance

Carbon

Brass

CrN (pistonrings)

Mo powder demand: ~ 500mt /y Marke t sta tus: stab le

Emerging appl i cat ions

Mo powder demand: ~ 2000 mt /y Market status: steadi ly growing

Tradi t ional appl icat ions

Ap p li ca ti o n M o Pr od uct El ev at ed - te mp er at ur e Ch em i ca l Ph ysi ca l Al t er na ti veMechanical Propert ies Propert i es Propert ies Materi als

12

Figu re 13.

Thermal spray coating w it h powders. Clockw ise from u pper left: engineered powder

for plasm a spray applications, plasm a spray torch, aircraft engine empl oying plasm a

spray coatin gs. Courtesy of H.C. Starck, I nc.


13/16

solid-state electronics area, where sputtered

molybdenum coatings are used in the production of

solar cel ls and thin f i lm transister f lat panel

displays (TFT-FPDs). Molybdenum bonds well to

glass, matches the thermal expansion of the glassor silicon substrate well, forms a stable diffusion

barrier, and is compatible with processing

environments used during device m anufactur ing.

Figu re 14shows the growth in glass

substrate sizes for flat panel display manufacturing

over the past several years. The nested blue

squares illustrate the glass panel sizes that are

coated using various generations of the technology

(each glass panel yields multiple FPD glasses).

Early in development of FPD manufactur ing

processes, molybdenum targets were sized to equal

the glass substrate being coated. This required

manu facturers to f ind ways to rol l larger and larger

plates. The largest m olybdenum targets made were

the Generation 5 t argets. At th is point in the

process evolution, equipment designers realized

they would soon exceed the abi l i ty of m i l ls to rol l

individual molybdenum targets. Succeeding

generations continued to coat larger and larger

glass panels, but sputtering is now accomplished

with an array of narrow and long molybdenum

targets, each with i ts own magnetron. An example

of such a target array is also shown in

Figu re 14. Molybdenum tubular targets are

also avai lable. Figu re 15shows examples of

both f lat targets and cyl indr ical targets.

Table VI IIsummarizes tradit ional andemerging coating appl ications. Whi le wire and

powder demand for tradit ional thermal spray

appl ications is stable, the amount of molybdenum

required for emerging appl ications in the sputter ing

target market continues to increase at a steady

rate, after several years of rapid growth . Here

success depends upon molybdenums physical and

chemical properties, not on i ts high- temperature

strength and creep resistance, properties that havebeen responsible for molybdenums success in its

tradit ional app l ications.

Fi gur e 14.

Emerging coating application s in fl at panel display (FPD) technology. Clockw ise from top

left: Modern w all-moun ted FPD, Gen 6/7 target array, schematic of relative production

glass sizes as a function of process generation (dim ensions in mm ), moun ted Gen 5 target.

Cour tesy of PLANSEE Metall.

???

2200x2700

1800x2300

1431x1700x10

880x980x10

500x500x6

Gen 8

Gen 7

Gen 6

Gen 5

Gen 4

Gen 3

Figu re 15.

Targets can be manu factured as flat panels bonded to copper substrates

(right t op, bottom ), or as tu bul ar targets (left). Cour tesy of PLANSEE Metall.

13


14/16

Summary

Table I Xsummarizes characteristics of

tradit ional and emerging appl ications, and

presents estim ates of the molybdenum

powder required to serve each application

type in 2005 . There is a shift in the

properties that dr ive m olybdenum s use in

emerging markets. Elevated temperature

strength and creep resistance have been key

in tradit ional appl ications, but emerging

appl ications take advantage of

molybdenums unique combination of

physical properties (coefficient of thermal

expansion, thermal conductivity, electrical

conductivi ty) and chemical properties

(compatib i l i ty with the appl ication

environment). This change br ings with i t

more competi t ion. Elevated temperature

mechanical properties are directly correlated

with melt ing temperature, l imit ing the

number of potentia l competi t ive mater ia ls.

Physical properties do not necessarily

correlate with melt ing temperature, and

this al lows a w ider spectrum of competi tvematerials. In fact, creative materials system

design w ith composite m ater ia ls can readi ly

create new materials systems capable of

competing with molybdenum and in some

cases exceeding molybdenums performance in

emerging app l ications.

Emerging applications are also concentrated in

markets like consumer electronics that are

extremely price sensitive. Cheaper alternati ve

solutions are constantly being evaluated in these

appl ications, and mat er ia ls substi tution is

commonplace. Molybdenum has always been a

target for substitution because of its cost.

It is not used unless it confers a clear performance

advantage or an overal l cost benefi t.

Molybdenum has not previously faced the breadth

of potentia l competi t ion that i t now faces in

emergin g applicatio ns. There are reasons for

optimism, as wel l as caution regarding the growth

of molybdenum appl ications, as noted in thefol lowing points:

Tradit ional app l ications are mainly based

on m olybdenums uniqu e mechanical properties at

elevated tem peratures, with very few mater ia l

al ternatives (optimism);

Demand for tradit ional appl ications is

stable or shrinking (caution);

Mater ia l requirements for emerging

applications are already one third of those for

tradit ional appl ications and have potentia l

for strong growth (optimism);

Emerging appl ications are mainly based on

molybdenum s chemical and physical properties

with many competing m ater ia ls whose pr ices are

lower and less volati le (caution);

Emerging appl ications are mainly in the

price-sensitive electronics and automobile industry(caution); and

Averaged over all products, raw material

costs account for 60 % or more of total p roduction

costs, and are the main cost driver (caution).

The stable or decl in ing nat ure of tradit ional

appl ications means that n ew appl ications based on

molybdenums unique suite of mechanical,

physical, and chemical properties are critical to the

health of the molybdenum metal industry.

Molybdenum technologists have establ ished an

enviable record of new product generation over the

years, and there is every reason to expect them to

continue to identi fy new opportunit ies for growth.

However, to be successful in emerging markets

where cost is constantly under pressure, reasonable

and stable raw mater ia l pr ices are requirements.

14

Table I X. App li cati on Characteri st i cs and

Estimated 2005 Powder D emand

Tradit ional :

Stable or slowlygrowing markets

Molybdenum powder demand, mt :

Light ing 1300Glass/ Furnace 700

Mater ia l form ing 100

Medical 350

Electronics 400

Coating 500

Other 3000

Tota l 6350

Lighting 100

Mater ial form ing 100

Electronics 350

Coat ing 2000

Tota l 2550

Emerging:

Steadily growingmarkets

Very im portant Less i mportant Im portant Li m i ted

Appl i cat io n Elevated- tempera ture Chemi cal Physical Al ternat i veMechanical Propert ies Propert ies Propert i es Ma terial s

Elevated- tempera ture Chemi cal Physical Al ternat iveMechanical Propert ies Propert i es Propert ies Materi als

Un im portant Very i mportant Very Im portant M any

Molybdenum powder demand, mt :


15/16

AUSTRALIA

Moly M ines Ltd46- 50 Kings Park Road, West Perth,WA 60 05, AUSTRALIATe l: + 6 1 8 9 4 2 9 3 3 0 0 ;

Fa x: + 6 1 8 9 4 2 9 3 3 9 9Emai l : in fo@ molymines.comWebsite: www.molymines.com

AUSTRIA

Interalloys Trading & Business ConsultingGmbHFloragasse 7, A-1 040 Vienna, AUSTRIATe l: + 4 3 1 5 0 4 6 1 3 8 ; Fa x: + 4 3 1 5 0 4 6 1 9 2Emai l : in tera l@ ycn .com

Plansee SE660 0 Reutte, AUSTRIATe l: + 4 3 5 6 7 2 6 0 0 0 ; Fa x: + 4 3 5 6 7 2 6 0 0 5 0 0Emai l : in fo@ plansee .comWebsite: ww w.plansee.com

Treibacher Industrie AGAuer-von-Welsbach, Strasse 19330 Althofen, AUSTRIATe l: + 4 3 4 2 6 2 5 0 5 ; Fa x: + 4 3 4 2 6 2 5 0 5 8 4 16Emai l : f e rd inand .kamp l@ t reibacher .comWebsite: www.treibacher.com

BELGIUM

Sadaci NVLangerbruggekaai 13, B-9000 Gent, BELGIUM.Te l: + 3 2 9 2 5 4 0 5 1 1 ; Fa x: + 3 2 9 2 5 4 0 5 7 1Email: daisy.sergeant@ sadaci.be

Website: www.sadaci.be

CANADA

Oriental Minerals Inc24t h Floor, 11 11 West Georgia Street, Vancouver,BC, V6E 4M3, CANADATe l: + 1 6 0 4 6 8 1 5 7 5 5 ; Fa x: + 1 6 0 4 6 8 4 2 9 9 0Emai l : in fo@ or ien ta lm inera ls .comWebsite: www .or ientalminerals.com

CHILE

Codelco Chil eHuerfanos 1270, Sant iago, CHILETe l: + 5 6 2 6 9 0 3 4 0 6 ; Fa x: + 5 6 2 6 9 0 3 3 6 6Email: vperez@ codelco.cl

Website: www.codelco.cl

Estudios Antofagasta Copper LtdaAhumada 11, Oficina 613, Sant iago, CHILETe l: + 5 6 2 3 7 7 5 0 0 0 ; Fa x: + 5 6 2 3 7 7 5 0 9 6Emai l : gsanchez@ aminera ls.clWebsite: www.antofaga sta.co.uk

Molibdenos y Metales SAHuerfanos 812, 6th Floor, Sant iago, CHILETe l: + 5 6 2 3 6 8 3 6 0 0 ; Fa x: + 5 6 2 3 6 8 3 6 5 3Emai l : in fo@ molymet .clWebsite: www.molymet.cl

CHINA

Chaoyang Jinda Molybdenum Co LtdNo 78 8 Sect ion 4, Longshan Street, Chaoyang,Liaoning, 122000, CHINATe l: + 8 6 4 2 1 2 9 7 6 8 8 8 ;Fa x: + 8 6 4 2 1 2 9 7 6 6 6 6Emai l : j i ndamo lybdenum@ 163.comWebsite: www.j indamoly.com

Grand Bui ld Metal International Co Ltd100 2B East Ocean Centre, 98 Granvi l le Road,Kowloon, Hong Kong, CHINATe l: + 8 5 2 3 5 4 2 5 6 5 9 ;Fa x: + 8 5 2 3 5 4 2 5 65 5Emai l : g randbu i ld@ grandbu i ld .com.hk

Huludao Hongda Moly Co LtdNo 16-1 3-14 -15 Sou th Boha i St ree t,Lianshan Distr ict , H uludao,L iaon ing 125 001 , CHINATe l: + 8 6 4 2 9 8 5 8 6 6 6 6 ; Fa x: + 8 6 4 2 9 2 1 3 9 8 8 8E m ai l : d r ea m l i a ng @ 2 6 3 . n e tWebsite: www.hongdamoly.com

Jiangsu Fengfeng Tungsten andMolybdenum Mater ia ls Co LtdTang Jia Se,The Northern Suburbs of Dongtai,Jiangsu 224200, CHINATe l: + 8 6 5 1 5 5 2 7 3 3 1 1 ;

Fa x: + 8 6 5 1 5 5 2 7 1 2 3 7E m ai l : d j p p aa @ 1 2 6 . co mWebsite: www .fengfeng.com.cn

Jinduicheng M olybdenumGroup Co Ltd17th Floor, Jie Rui Mansion,No 5 West section of the second South Ring Road,Xian, Shaanxi 710068, CHINATe l: + 8 6 2 9 8 8 3 7 8 6 7 6 ;Fa x: + 8 6 2 9 8 8 3 7 8 7 7 1Emai l : j ck@ jdcmmc.comWebsite: www.jdcmm c.com

Luoyang Luanchuan MolybdenumGroup Co Ltd374 Junshan West Road,

Luanchuan County, Luoyang,Henan 47150 0 , CHINA

Te l: + 8 6 3 7 9 6 6 8 1 9 8 5 5 ;Fa x: + 8 6 3 7 9 6 6 8 1 9 8 54E m ai l : w e n hu i w @ 1 2 6 . co mWebsite: ww w.clcmo.com

15

LISTof MEMBERSR

INTERNATIONAL MOLYBDENUM ASSOCIATIONSecretary-General: Michael Maby Technical Director: Nicole Kinsman

HSE Managem ent Team : Sandra Carey and Wieslaw Piatki ewi cz

MembershipWelcome to:

Comm ercial Met als Co , a US company i nvolved inm arketin g, distribut ion and project in vestm ent on m oly

related product s

Dala M ining LLC, a private com pany in corporated

in t he Republic of Kazakhstan, w orkin g on thedevelopment of the Kokt enkol m olybdenum project

Glencore In ternat ional AG, a Sw iss company tradingFerro Molybdenum and Molybdenum Oxide

Hal dor Topsoe A/S, a Dani sh consum er ofm olybdenum com pounds used in m anufacturi ng of

catalysts, and a suppl ier of technology for sul phu ric acid

recovery from m olybdenum sul phide and other metal

sulphi de roaster of f-gasses

Joe H Smi th Co Ltd , a long-term distri but or inSouth ern U SA for a major US producer

Oriental Minerals Inc, a Canadian -basedexploration and m ine development com pany, wi th a

diverse port foli o of precious and base metals projects in

South Korea. The Com pany's current projects inclu de

the Sangdong tu ngsten-m olybdenum m in e, historically

one of the largest past produci ng tun gsten m in es in the

world

Stainless Steel World Conference

As an official "Supporter" of theseconferences w hich a re organised every t wo

years by "Stainless Steel World", IMOA draws

the attention of readers to the 2007 event

which will be held from 6-8 November in

Ma astricht. For further informa tion, visit

th eir website - www.stainless-steel-world.net,or contact t hem by email

[email protected] Fax No: +31 575 511099

REACH .

Molybdenum Consor t i um

formed by IMOA .

Member compani es and

non-member s i nvi t ed t ojoi n.

See IMOA websi te for detai ls

(i n Engli sh and Chi nese)


16/16

DENMARK

Haldor Topsoe A/SNymoellevej 55, DK-2800 Lyngby, DENMARKTe l: + 4 5 4 5 2 7 2 0 0 0 ; Fa x: + 4 5 4 5 2 7 2 9 9 9Emai l : ca ta lys t@ topsoe .dkWebsite : w ww.topsoe.com

FRANCE

Ampere Al loys12 Mail Jol iot Cur ie,Saint Ouen LAumone (95), 95310 FRANCETe l: + 3 3 1 3 4 3 2 4 0 0 7 ; Fa x: + 3 3 1 3 0 3 7 0 5 8 4Email: f .celer ier@ amperealloys.com

Arcelor Mittal Purchasing5 Rue Luigi Cherubini93212 La Plaine Saint-Denis Cedex, FRANCETe l: + 3 2 2 5 3 3 3 6 1 3 ; Fa x: + 3 2 2 5 3 3 3 6 0 1Email: car l . landuydt@ purchasing.arcelor .comWebsite: www.arcelor .com

Molycorp Inc129 rue Servient, 69 003 Lyon, FRANCETe l: + 3 3 4 7 8 6 3 7 9 3 6 ; Fa x: + 1 2 8 1 2 7 6 9 3 1 7Emai l : gdebeco@ molycorp .comhttp:/ /www.molycorp.com

GERMANY

CM ChemieMetal l GmbH Bitter fe ldChemiePark Bit ter feld-Wolfen, Areal E,Niels-Bohr-Strae 5, D-06749 Bit ter feld, GERMANYTe l: + 4 9 3 4 9 3 6 0 4 0 0 0 ; Fa x: + 4 9 3 4 9 3 6 0 4 0 0 1Emai l : in fo@ chemiemeta l l . deWebsite: www.chemiemetal l .de

GfM Fesil GmbHSchif ferstrasse 200, D-47 059 Duisburg, GERMANYTe l: + 4 9 2 0 3 3 0 0 0 7 0 ; Fa x: + 4 9 2 0 3 3 0 0 0 7 1 1 0Emai l : in fo@ gfm- fesi l . deWebsite: www.gfm-fesi l .de

Grondmet Metal l -und Rohstoffver tr iebsGmbHLuegallee 55, 4 054 5 Dsseldorf Oberkassel,

GERMANYTe l: + 4 9 2 1 1 5 7 7 2 5 0 ; Fa x: + 4 9 2 1 1 5 7 7 2 5 5 5Emai l : in fo@ grondmet .deWebsite: www.grondmet.de

FW Hempel M etal lurg ical GmbHLeopoldstr . 16, D-40 211 Dsseldorf , GERMANYTe l: + 4 9 2 1 1 1 6 8 0 6 0 ; Fa x: + 4 9 2 1 1 1 6 8 0 6 4 8Emai l : in fo@ meta l lu rg ical .deWebsite: www.metal lurgical.de

Metherma GmbHArnheimer Str . 103D-40 489 Dsseldorf , GERMANYTe l: + 4 9 2 1 1 4 0 8 0 8 4 0 ; Fa x: + 4 9 2 1 1 4 0 7 1 2 6Emai l : mo lybdenum@ metherma.de

HC Starck GmbHIm Sch leeke 78 - 9 1 ,

D-38 642 Goslar , GERMANYTe l: + 4 9 5 3 2 1 7 5 1 0 ; Fa x: + 4 9 5 3 2 1 7 5 1 6 1 9 2Emai l : in fo@ hcsta rck .comWebsite: www.hcstarck.com

IRAN

Pars Molybden CoNo 46 Bahar Al ley, South Shiraz StMolla Sadra Ave, 14358 Tehran, IRANTe l: + 9 8 2 1 8 0 6 3 9 1 7 ; Fa x: + 9 8 2 1 8 0 6 1 4 7 6Emai l : in fo@ parsmo lybden.com

ISRAEL

Comm odit y Resources IncDor Dor VDorshav 4, Jerusalem 931 17, ISRAELTe l: + 9 7 2 2 5 6 1 0 6 5 8 ; Fa x: + 9 7 2 2 5 6 1 0 6 6 0

Emai l : jdm@ at tg lobal .ne tMetal-Tech LtdRamat Hovav, PO Box 2412,Beer-Sheva 84874, ISRAELTe l: + 9 7 2 8 6 5 7 2 3 3 3 ; Fa x: + 9 7 2 8 6 5 7 2 3 3 4Emai l : genera l@ meta l - tech .co. i lWebsite: www.metal- tech.co. i l

JAPAN

Kohsei Co LtdKohsei Building, 2-11 Kobunacho NihonbashiChuo-ku, 103-0024 Tokyo, JAPANTe l: + 8 1 3 5 6 5 2 0 9 0 1 ;Fa x: + 8 1 3 5 6 5 2 0 9 0 5Emai l : i t ibu@ kohse i . co . jpWebsite: www .kohsei.co. jp

Mitsubishi Corp16-3 Konan 2 -chome, M ina to -ku ,Tokyo 108-8228, JAPANTe l: + 8 1 3 6 4 0 5 3 2 7 3 ;Fa x: + 8 1 3 6 4 0 5 88 7 1Emai l : yu j i . fukumoto@ mi tsub ish icorp .comWebsite: ww w.mit subishicorp.com

Sojitz CorpFerroalloys Section 1Iron Ore and Ferroalloys Dept1 -20 Akasaka 6 -chome, M ina to -ku ,Tokyo 107-8655, JAPANTe l: + 8 1 3 5 5 2 0 3 5 2 9 ;Fa x: + 8 1 3 5 5 2 0 3 5 1 7Emai l : ma tsumura.h i rosh i@ so ji t z . comWebsite: ww w.soji tz.com

Taiyo Koko Co Ltd3-1, 3-chome Marunouchi, Chiyoda-ku,Tokyo 100-0005, JAPANTe l: + 8 1 3 3 2 1 6 6 0 4 1 ; Fa x: + 8 1 3 3 2 1 6 6 0 4 5Emai l : t r ade@ ta iyokoko .co . jp

KAZAKHSTAN

Dala M ining LLC050043, Koshek Batyr , 5, Almaty,KAZAKHSTANTe l: + 7 3 2 7 2 2 6 6 8 2 0 ; Fa x: + 7 3 2 7 2 2 6 6 8 2 3Emai l : in fo@ da lamin ing .kz

LUXEMBOURG

Traxys Europe SA3 rue Pletzer, Centre Helfent, L-80 80 Bertrange,LUXEMBOURG

Te l: + 3 5 2 4 5 9 9 9 9 1 ; Fa x: + 3 5 2 4 5 9 9 9 9 2 2 3Email: heinz.duecht ing@ traxys.com

MEXICO

Mexicana de Cobre SA de CVAv Baja Cali fornia 200, Col. Roma Sur06760 Mexico DF, MEXICOTe l: + 5 2 5 5 5 2 6 4 7 7 7 5 ;Fa x: + 5 2 5 5 5 2 6 4 7 7 6 9Emai l : a r ch iba ldo .deneken@ mm.gmex ico .comWebsite: www .gmexico.com

Molymex SA de CVTehuantepec No 90 Col. Centenario,Hermosil lo, Sonora 83260, MEXICOTe l: + 5 2 6 6 2 2 8 9 3 6 4 0 ;Fa x: + 5 2 6 6 2 2 8 9 3 6 5 0Emai l : admin is t rac ion@ molymex.com.mx

Website: www.molymex.com.mx

PERU

Southern Copper CorporationAv Caminos del Inca 171Chacarilla del Estanque, Surco, Lima 33, PERUTe l: + 5 1 1 5 1 2 0 4 4 0 ; Fa x: + 5 1 1 2 1 7 1 3 5 1Email: jd lheros@ southernperu.com.peWebsite: w ww.southernperu.com

RUSSIA

Baltic Enterprise Ltd40, The 17th Line, VO, Saint-Petersburg,1991 78 , RUSSIATe l: + 7 8 1 2 3 2 5 8 6 8 8 ;Fa x: + 7 8 1 2 3 2 5 8 6 8 7

E m ai l : b m @ s ol i . ruWebsite: www.soli . ru

JSC Polema CorpPrzhevalskogo Str 3, Tula, 300 016 , RUSSIATe l: + 7 0 9 5 6 3 3 1 1 7 7 ; Fa x: + 7 0 9 5 6 3 3 1 5 2 7Emai l : po lema@ metho ld ing .comWebsite: www.polema.ru

SWEDEN

AB FerrolegeringarPO Box 71 63, Sveavgen 9, 103 88 Stockholm,SWEDENTe l: + 4 6 8 4 5 4 6 5 6 0 ; Fa x: + 4 6 8 7 9 6 0 6 3 6Emai l : in fo@ ferro legeringar .seWebsite: www.ferroleger ingar.se

Outokumpu Stainless AB

PO Box 74, S-774 22 Avesta, SWEDENTe l: + 4 6 2 2 6 8 1 0 0 0 ; Fa x: + 4 6 2 2 6 8 1 3 0 5Emai l : in fo .sta in less@ outokumpu.com

Scandinavi an Steel ABBirger Jar lsgatan 15, SE 111 45 Stockholm,SWEDENTe l: + 4 6 8 6 1 4 2 8 5 0 ; Fa x: + 4 6 8 6 1 1 6 4 3 4Email: metals@ scandinaviansteel.se

SWITZERLAND

Cronimet Suisse AGAllmendstrasse 11, CH-6312 Steinhausen,SWITZERLANDTe l: + 4 1 4 1 7 4 8 5 0 4 0 ; Fa x: + 4 1 4 1 7 4 8 4 2 0 1Email: tendoornkatt . f r i tz@ cronimet.ch

Glencore International AGBaarermattstrasse 3, CH-6341 Baar, SWITZERLANDTe l: + 4 1 4 1 7 0 9 2 0 0 0 ; Fa x: + 4 1 4 1 7 0 9 3 0 0 0Emai l : in fo@ glencore.comWebsite: w ww.glencore.com

UK

Adams Metals Ltd1 Milkhouse Gate, Guildford, Surrey, GU1 3EZ, UKTe l: + 4 4 1 4 8 3 5 7 7 9 0 0 ; Fa x: + 4 4 1 4 8 3 5 7 8 0 0 8To l l F re e: + 1 8 0 0 4 7 3 8 4 2 7 ;Fa x: + 1 8 0 0 4 7 3 8 4 2 8Emai l : in fo@ adamsmeta ls .comWebsite: www.adam smetals.com

Alfred H Knight International LtdEccleston Grange, Prescot Road, St Helens,Merseyside WA10 3 BQ, UK

Te l: + 4 4 1 7 4 4 7 3 3 7 5 7 ; Fa x: + 4 4 1 7 4 4 2 7 0 6 2Emai l : enqu i r ies@ ahkgroup .comWebsite: www.ahkgroup.com

Derek Raphael & Co Ltd8-10 Castle Street, Cirencester,Gloucestershire GL7 1QA, UKTe l: + 4 4 1 2 8 5 8 8 5 8 2 1 ; Fa x: + 4 4 2 0 7 5 0 4 8 4 8 3Emai l : a raphae l@ derek- raphae l . co .ukWebsite: www.derek-raphael.co.uk

Alex Stewart (Assayers) LtdCaddick Road, Knowsley Industrial Estate,Merseyside L34 9ER, UKTe l: + 4 4 1 5 1 5 4 8 7 7 7 7 ; Fa x: + 4 4 1 5 1 5 4 8 0 7 1 4Email: enquir ies@ alexstewart.comWebsite: w ww.alexstewart.com

Wogen Resources Ltd

4 The Sanctuary, Westminster , London,SW1P 3JS, UKTe l: + 4 4 2 0 7 2 2 2 2 1 7 1 ; Fa x: + 4 4 2 0 7 2 2 2 5 8 6 2Emai l : A l lan .ker r@ wogen .comWebsite: www.wogen.com

Wyseway (UK) LtdPower Road Studios, 11 4 Power Road,Chiswick, London W4 5PY, UKTe l: + 4 4 2 0 8 7 4 2 3 4 2 0 ; Fa x: + 4 4 2 0 8 7 4 2 3 4 2 1Emai l : ma i l@ wyseway.co .uk

USA

Albemarle Corp451 Flor ida Street, Baton Rouge, LA 70801, USATe l: + 1 2 2 5 3 8 8 8 0 4 2 ; Fa x: + 1 2 2 5 3 8 8 7 6 8 6Emai l : ch r is_ kn igh t@ albemar le.com

Website: www.albem arle.comBarex Resources Inc105 B Van Hout en Avenue, Passaic Park,NJ 07055-5518 , USATe l: + 1 9 7 3 7 7 8 6 4 7 0 ;Fa x: + 1 4 1 3 4 6 0 7 9 3 0Email: nrs@ barexresources.com

Bear Metal l urg ical Co679 East But ler Road, But ler , PA 16002, USATe l: + 1 7 2 4 2 8 3 6 8 0 0 ;Fa x: + 1 7 2 4 2 8 3 6 0 7 8Emai l : m ike .bourgeo is@ bearmet .com

The Chem- Met CoP O Box 819 , Cl in ton , MD 20735- 0819 , USATe l: + 1 3 0 1 8 6 8 3 3 5 5 ;Fa x: + 1 3 0 1 8 6 8 8 9 4 6

Emai l : a fox@ chem-metco .com

Climax Molybdenum CoOne North Central, Phoenix, AZ 85 004 , USATe l: + 1 6 0 2 3 6 6 8 1 0 0 ;Fa x: + 1 6 0 2 3 6 6 7 3 2 9Emai l : c l imax@ phe lpsdodge.comWebsite: www.cl imaxmolybdenum.com

Commercial Metals Co205 0 Center Avenue, Suite 25 0, Fort Lee, NJ0 7 6 4 7 , U S ATe l: + 1 2 0 1 3 0 2 0 8 8 8 ;Fa x: + 1 2 0 1 3 0 2 9 9 1 1Emai l : j z@ cmc.comWebsite: www .cmc.com

Comsup Commodities Inc220 0 Fletcher Avenue, 7th Floor, Fort Lee, NJ0 7 0 2 4 , U S ATe l: + 1 2 0 1 9 4 7 9 4 0 0 ;Fa x: + 1 2 0 1 4 6 1 7 5 7 7Emai l : comsup@ comsup inc.com

CRI/Criterion IncTwo Greenspoint Plaza, Suite 1 000 ,16825 Northchase Dr ive, Houston, TX 77060,USATe l: + 1 2 8 1 8 7 4 2 6 6 1 ; Fa x: + 1 2 8 1 8 7 4 2 5 8 0Email: ken.darmer@ cri-cri ter ion.com

Gulf Chemical & Metal lurg i cal CorpPO Box 2290, Freeport, Texas 77542-2290, USATe l: + 1 9 7 9 2 3 3 7 8 8 2 ; Fa x: + 1 9 7 9 2 3 3 7 1 7 1Emai l : kev in. jones@ gu l fchem.com

Kennecott Molybdenum Co

8315 West 3595 Sou th,PO Box 6001, Magna,U t a h 8 4 0 4 4 - 6 0 0 1 , U S ATe l: + 1 8 0 1 2 5 2 3 0 0 0 ; Fa x: + 1 8 0 1 2 5 2 3 2 9 2Emai l : cowley j@ kennecot t . com

Osram Sylvania Products IncHawes Street, Towanda, PA 18848, USATe l: + 1 5 7 0 2 6 8 5 0 0 0 ; Fa x: + 1 5 7 0 2 6 8 5 1 1 3Emai l : susan .dunn@ sylvan ia .comWebsite: www .sylvania.com

Powmet In cPO Box 5086, 2625 Sewell Street, Rockford,IL 61125 , USATe l: + 1 8 1 5 3 9 8 6 9 0 0 ; Fa x: + 1 8 1 5 3 9 8 6 9 0 7Emai l : wc t@ powmet .com

Shangxiang Mi nmetals Inc

150 N Santa Anita Avenue, Suite 500, Arcadia,CA 91006, USATe l: + 1 6 2 6 4 4 5 8 9 4 6 ;Fa x: + 1 6 2 6 4 4 5 6 9 4 3Emai l : georgesong@ emeta lmarke t . com

Sheng Tong Enterprises (USA) Corp17870 Cast leton Street, Suite 240,City of Industry, CA 9174 8, U SATe l: + 1 6 2 6 5 8 1 7 1 0 5 ;Fa x: + 1 6 2 6 5 8 1 7 1 9 5Emai l : j iwe i j ia@ r isingst . comWebsite: w ww.r isingst.com

Joe H Smith Co LtdPO Box 837, Cypress , TX 774 10 , USATe l: + 1 2 8 1 4 6 9 7 1 1 0 , Fa x: + 1 2 8 1 8 9 0 6 5 4 1Emai l : khsmi th@ sbcg loba l .ne t

Thompson Creek Metals Co945 West Kenyon Avenue, EnglewoodCO 80110-3469 , USATe l: + 1 3 0 3 7 6 1 8 8 0 1 ;Fa x: + 1 3 0 3 7 6 1 7 4 2 0Emai l : margo l@ tcrk .comWebsite: w ww.thom psoncreekmetals.com

LISTof MEMBERS continued

imoa newsletter 2007 07

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