improving conformity of sputtered titanium nitride
TRANSCRIPT
Granted in the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231.
IMPROVING CONFORMITY OF SPUlTERED TITANIUM NITRIDE
U.S. Patent 5,833,817. Nov. 10, 1998 C.S. Tsai et al., assignors to Taiwan Semiconductor Mfg. Co. Ltd., Hsin- Chu, Taiwan
A method of improving step cover- age and conformity of a layer of material deposited by a physical- vapor-deposition technique onto a substrate having vertical walled openings with aspect ratios greater than 0.3 comprising depositing a first layer of material whereby non- uniform coverage is produced be-
coming progressively thinner along the said walls; depositing a pho- toresist layer over the first layer of material; subjecting the substrate to an etching technique; removing the photoresist layer; and deposit- ing a second layer material onto the substrate by a physical-vapor- deposition technique.
COPPER FOIL FOR A PRINTED CIRCUIT BOARD
U.S. Patent 5,833,819. Nov. 10, 1998 M. Ohara et al., assignors to Mitsui Mining & Smelting Co. Ltd., Tokyo
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An apparatus for producing an electrolytic copper foil for a printed wiring board comprising a rotary cathode; a primary anode installed opposite to the rotary cathode; means for applying an electric cur- rent having a current density to the primary anode; means for supply- ing a copper electrolyte; and an electrodeposition starting surface.
ELECTROPLATING APPARATUS
U.S. Patent 5,833,820. Nov. 10, 1998 V. Dubin, assignor to Advanced Micro Devices Inc., Sunnyvale, Calif:
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