Industrial CommunicationsLEC-3 Series - Rugged Platforms for Power and Energy Applications

Volume 12.4 www.lannerinc.com

In response to the rising of smart grid and renew energy, Lanner Electronics Inc. , as a applied computing solution provider, releases LEC-3000 Series power communication platforms. The LEC-3000 Series provides the rich I/O interfaces, clear LED indicators and robust chassis design with fanless interior for the customers. The rack-mount LEC-3100, LEC-3110 and LEC-3210 is suitable for power T&D and substation applications, for wind turbine and solar panel control applications, the DIN-railed LEC-3010 and LEC-3012 is the first choice.

Communication Gateways

Concentrator

Data Gateways

Communication Gateways

LEC-3010 Fanless Industrial PCIntel Atom N450 CPU4 GbE LAN, 2 USB ports, 4 DI and 4 DO6 RS-232/422/485 with advanced ESD protectionDIN-rail mount

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LEC-3012 Fanless Industrial PCIntel Atom N455 CPU2 GbE LAN, 2 External USB ports4 Optical Isolated Serial portsDIN-rail mount

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LEC-3070 Fanless Industrial PCATMEL ARM9 CPU2 GbE LAN, 1 External USB ports4 Optical Isolated Serial portsDIN-rail mount

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LEC-3000A Fanless Industrial PCVIA Eden ULV 1GHz CPU2 GbE LAN, 4 Serial, 4 External USB portsCost-effective modelDIN-rail mount

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Lanner Power & Energy Solution Overview

In response to the rising of smart grid and renew energy, Lanner Electronics Inc. , as a applied computing solution provider, releases LEC-3000 Series power communication platforms. The LEC-3000 Series provides the rich I/O interfaces, clear LED indicators and robust chassis design with fanless interior for the customers. The rack-mount LEC-3100, LEC-3110 and LEC-3210 is suitable for power T&D and substation applications, for wind turbine and solar panel control applications, the DIN-railed LEC-3010 and LEC-3012 is the first choice.

Port Server

Communication Processors

Power SCADA

LEC-3070 Fanless Industrial PCATMEL ARM9 CPU2 GbE LAN, 1 External USB ports4 Optical Isolated Serial portsDIN-rail mount

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LEC-3110 Rackmount 1U Fanless Communication Platform

Intel Atom D525 CPUIEC 61850-3 Compliance6 GbE LAN, 10 Optical Isolated Serial COM portsSupport 1x SATA HDD/SSD,

Optional Optical Fiber Module

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•

LEC-3210 Rackmount 2U Fanless Communication Platform

Intel Atom D525 CPUIEC 61850-3 Compliance6 GbE LAN, 10 or 18 Optical Isolated Serial COM portsSupport 1x SATA HDD/SSD,

Optional Optical Fiber Module

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•

LEC-3100/3200 Rackmount 1U/2U Port ServerIntel Atom N270 CPU4 GbE LAN, 10 Optical Isolated Serial COM portsDual Power Input (AC&DC)Support 1x SATA HDD/SSD, Front and Rear USB ports

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LEC-3 Series LEC-3100 LEC-3110 LEC-3200 LEC-3210Processor Options Intel® Atom™ N270 (1.6GHz) Intel® Atom™ D525 (1.8GHz) Intel® Atom™ N270 (1.6GHz) Intel® Atom™ D525 (1.8GHz)Chipset Intel 945GSE+ICH7M Intel ICH8M Intel 945GSE+ICH7M Intel ICH8MBIOS AMI Flash BIOS AMI Flash BIOS AMI Flash BIOS AMI Flash BIOS

SystemMemory

Sockets 1 x 200-pin DDR2 SO-DIMM 1 x 204-pin DDR3 SO-DIMM 1 x 200-pin DDR2 SO-DIMM 1 x 204-pin DDR3 SO-DIMM Technology 200-pin DDR2 SO-DIMM x1 DDR3 SO-DIMM x1 200-pin DDR2 SO-DIMM x1 DDR3 SO-DIMM x1Max. Capacity Up to 2 GB Up to 4 GB (1GB built-in) Up to 2 GB Up to 4 GB (1GB built-in)

USBUSB 2.0 compliant hosts x3, Type A connector, Internal pin-connector x1

USB2.0 compliant, 2x Type A connector,1x internal Type A con-nector, 2x internal pin header

USB 2.0 compliant hosts x3, Type A connector, Internal pin-connector x1

USB2.0 compliant, 2x Type A connector,1x internal Type A con-nector, 2x internal pin header

OS Support Window XP Embedded, Linux Window XP Embedded, Linux Window XP Embedded, Linux Window XP Embedded, Linux

NetworkingLAN 4x10/100/1000Mbps,

1x10/100Mbps Autosensing6x10/100/1000Mbps, Autosensing

4x10/100/1000Mbps, 1x10/100Mbps Autosensing

6x10/100/1000Mbps, Autosensing

Magnetic Isolation Protection 1.5 KV built-in 1.5 KV built-in 1.5 KV built-in 1.5 KV built-in

Serial Interface

Serial Standard 2xDB9 & 2x20pin terminal block for 10 x RS-232/422/485

2xRS-232/422/485(LEC-3110A)10xRS-232/422/485(LEC-3110AU8)

2xDB9, & 2x20pin terminal block for 10xRS-232/422/485(LEC-3200)2xDB9 & 4x20pin terminal block for 18xRS-232/422/485(LEC-3200C)

10xRS-232/422/485 or18xRS-232/422/485(LEC-3210AU16)

ESD Protection 15 KV for all signals 15 KV for all signals 15 KV for all signals 15 KV for all signals

Isolation Protect Digital Isolation Protection 2KV Optically isolation Digital Isolation Protection 2KV Optically isolation

Digital I/ODigital Input None 5,6,7,8 None 5,6,7,8Digital Output None None, Even, Odd, Space, Mark None None, Even, Odd, Space, Mark

Display Display Interface DVI-I x1; DVI-D:1600x1200 DB15 x1 for VGA(2048x1536) DVI-I x1; DVI-D:1600x1200 DB15 x1 for VGA(2048x1536)Weight 2.8Kg 3.2Kg 3.2Kg 5.2Kg

Dimensions (WxHxD) 440x44.5x301mm (17.32”x1.75”x11.85”)

440x44.5x301mm(17.32”x1.75”x11.85”)

440x89x351.5mm (17.32”x3.50”x13.84”)

440x89x351.5mm (17.32”x3.50”x13.84”)

Environment

Operation Temperature -20~55°C -20~55°C -20~55°C -20~55°C

Storage Temperature -40~80°C -40~80°C -40~80°C -40~80°C

Power Input Voltage Dual Power Input9~36Vdc, 100~240 Vac

Dual Power Input12~36Vdc, 85~264Vac/ 77~370Vdc

Dual Power Input9~36Vdc,100~240Vac

Dual Power Input12~36Vdc,85~264Vac/77~370Vdc

ReliabilityAlter tool Built-in buzzer and RTC (real-time

clock) with battery lithium backupBuilt-in buzzer and RTC (real-time clock) with battery lithium backup

Built-in buzzer and RTC (real-time clock) with battery lithium backup

Built-in buzzer and RTC (real-time clock) with battery lithium backup

Automatic Reboot Trigger Watchdog Timer 1~255 level Watchdog Timer 1~255 level Watchdog Timer 1~255 level Watchdog Timer 1~255 level

Ordering Information LEC-3100 LEC-3110A, LEC-3110AU8 LEC-3200, LEC-3200C LEC-3210AU8, LEC-3210AU16LEC-3210AU8F4

Selection Guide

LEC-3 Series LEC-3000A LEC-3010 LEC-3012 LEC-3070Processor Options VIA Eden ULV 1Ghz Intel® Atom™ N450 (1.66GHz) Intel® Atom™ N455 (1.66GHz) ATMEL ARM9260, 200MHzChipset VIA VX800 Intel ICH8M Intel ICH8M NoneBIOS AMI Flash BIOS AMI 8Mbit SPI Flash ROM BIOS AMI 8Mbit SPI Flash ROM BIOS None

SystemMemory

Sockets 1 x 200-pin DDR2 SODIMM 1 x 200-pin DDR2 SODIMM 1 x 204-pin DDR3 SODIMM 64MB SDRAMTechnology DDR2 SODIMM x1 DDR2 SODIMM x1 DDR3 SODIMM x1 NoneMax. Capacity 2GB Up to 2 GB Up to 2 GB None

USBUSB 2.0 compliant hosts x4, Type A connector, Internal pin-connector x2

USB 2.0 compliant hosts x2, Type A connector, Internal pin-connector x2

USB 2.0 compliant hosts x2, Type A connector, Internal pin-connector x2

USB 2.0 compliant hosts x1, Type A connector, Internal pin-connector x1

OS Support Window XP Embedded, Linux Window XP Embedded, Linux Window XP Embedded, Linux Embedded Linux

NetworkingLAN 2x10/100/1000Mbps,

Autosensing,RJ-454x10/100/1000Mbps, Autosensing,RJ-45

2x10/100/1000Mbps, Autosensing,RJ-45

2x10/100Mbps, Autosensing,RJ-45

Magnetic Isolation Protection 1.5 KV built-in 1.5 KV built-in 1.5 KV built-in 1.5 KV built-in

Serial Interface

Serial Standard 2x10pin terminal block for 4xRS-232/422/485

1x10, 2x10 pin terminal block for 6 x RS-232/422/485

1xDB9 for RS-232, 2x10pin termi-nal block for 4xRS-232/422/485

1x DB9 for RS-232, 2x10pin termi-nal block for 4xRS-232/485

ESD Protection None 15 KV for all signals 15 KV for all signals 15 KV for all signalsIsolation Protect None None 2 kV Optically isolation 2KV Optically isolation

Digital I/ODigital Input 4xDI 4xDI 4x 2KV Optically isolation NoneDigital Output 4xDO 4xDO 4x 2KV Optically isolation None

Display Display Interface DB15 x1 for VGA(2048x1536) DB15 x1 for VGA(2048x1536) DB15 x1 for VGA(2048x1536) NoneWeight 1Kg 1.7Kg 1.7Kg 1.7KgDimensions (WxHxD) 60x165x126mm 60x165x127mm 69x169.5x127mm 69x170x127.6mm

Environment

Operation Temperature -10~55°C/14~131°F -10~55°C/14~131°F -10~55°C/14~131°F -40~70°C/-39.9~157.9°F

Storage Temperature -20~80°C -20~80°C -40~80°C -40~85°C

Power Input Voltage +12~36Vdc +12~36Vdc +12~36Vdc +9~36Vdc

Reliability

Alter tool Built-in buzzer and RTC (real-time clock) with battery lithium backup

Built-in buzzer and RTC (real-time clock) with battery lithium backup

Built-in buzzer and RTC (real-time clock) with battery lithium backup

Built-in buzzer and RTC (real-time clock) with battery lithium backup

Automatic Reboot Trigger

Watchdog Timer 1~255 level time interval system reset, software programmable

Watchdog Timer 1~255 level time interval system reset, software programmable

Watchdog Timer 1~255 level time interval system reset, software programmable

Watchdog Timer 1~255 level

Ordering Information LEC-3000A LEC-3010 LEC-3012 LEC-3070

The Application of Lanner’s Communication Platform in a Wind Power Monitoring System

Wind power can be constrained by environmental conditions, with wind turbines operating year-round in harsh, unattended wind farms. This is a concern for most wind power generation companies, including a company in China that needed a stable and reliable communication platform to help supervise and monitor their wind farms.

With a communication platform, information from the wind farms could be collected, stored, and analyzed remotely without having staff at these remote locations. This company had very specific requirements for their communication platform and needed a customized solution. Lanner was the perfect partner for this project, working side by side with the China-based wind generation company to provide a customized version of the LEC-3110–Lanner’s high performance, low-power consumption, fanless communication platform. The modular design of LEC-3110 allowed for easy configuration based on different product specifications to meet the customer’s requirements.

Lanner’s LEC-3110 plays a vital role in the supervision and monitoring of wind farms for one of China’s wind power generation companies. Real-time data can now be collected, stored, and analyzed remotely, giving assurance to a safely operated and reliable wind farm. Lanner’s LEC-3110 is now being utilized in wind farms across China, including Liaoning, Inner Mongolia, Shandong, and Hunan.

Integrating Lanner’s LEC-3110 Communication Platform with a Substation Monitoring System

It’s not too difficult for a substation automation company, based in Hebei, China, to find industrial computer manufacturers. The challenging task was finding a partner who was capable of providing cost-effective customized solutions to meet their needs.

This company decided to go with Lanner’s LEC-3110, a fanless 1U rackmount communication platform with an Intel® Atom D525 processor. This industrial-grade platform has a solid chassis design with a fanless interior, allowing it to be dustproof and increasing the product lifespan. The LEC-3110 has passed a series of temperature, shock, and vibration tests, including the EMC regulation, IEC 61850-3, and has Level 4 certification from the China Electric Power Research Institute.

The substation monitoring system consists of a central station and several monitoring stations. The LEC-3110 platform is utilized at the monitoring station where it collects real-time data and transmits this information to the central station through an Ethernet channel.

With integrating Lanner’s LEC-3110, this company can now access remote data and monitor their substation equipment. With the reliability of LEC-3110, the company saw a reduction in maintenance and engineering costs, helping contribute to the company’s bottom line.

Adjustment Workstation

Ethernet SwitchServer

Protocol Converter Workstation

Central Station

LEC-3110 Communication Platform

Computer Room Equipments: AC/DCPower Voltage, Temperature,Humidity, Smoke detector, Air ConditioningWater detection

Battery: Total Voltage,Total Current, Single Voltage,Single Impedance

Communication Power Equipments: High/Low Voltage equipments, Adjust current equipments, Inverter power generation

Monitoring Station

EthernetChannel

Wind Tower

Increasing pressure station Wind Test Station

Communication Modem

Field Data collection center Region Branch office, data center HQ office, data center

- Historical Data Server- Real time Data Server- Data Comm. Server- Application Server

- Historical Data Server- Real time Data Server- Data Comm. Server- Application Server

Figure. The wind power monitoring system architecture.

Application Stories

Lanner Electronics Inc.7F, No.173, Sec.2, Datong Rd. XiZhi District, New Taipei City 221, TaiwanT: +886-2-8692-6060F: +886-2-8692-6101E: connect@lannerinc.com E: marketing@lannerinc.com

Lanner Electronics Inc.41920 Christy StreetFremont, CA 94538T: +1-510-979-0688F: +1-510-979-0689E: sales_us@lannerinc.com

LEI Technology Canada Ltd6461 Northam DriveMississauga, ON, L4V 1J2Toll_free: +1 877-813-2132T: +1 905-362-2364F: +1 905-362-2369E: sales_ca@lannerinc.com

立华科技北京市海淀区农大南路33号厢黄旗东路兴天海园一层T: +86 010-82795600F: +86 010-62963250 E: service @ls-china.com.cn

China

CanadaUSA

Taiwan

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Please verify specifications before quoting. All product specifications are subject to change without notice. No part of this publication

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Electronics Inc. All brand names and product names are the trademarks or registered trademarks of their respesctive companies.

© Lanner Electronics Inc., 2012

Why Lanner?Wide Selection of Industrial PCsLanner Engineers have used their wealth of experience in creating a broad line of IPCs that can be stand alone products in harsh

industrial as well as commercial settings. The clever chassis design gives enough heat dissipation to cool most Lanner IPCs, while

the hinged bottom chassis and externally accessible CF sockets are often praised by our customers. With a wide selection of IPCs,

we have products for many niche applications, including: in-vehicle computing, video surveillance, SCADA communication relays,

factory automation, machine vision, digital signage, DVRs, and many more.

Strong AlliesIntel

Lanner Electronics is an Associate Member of the Intel Embedded Alliance. This alliance is committed to developing modular

standard driven solutions based on technologies, processors, products, and services from Intel.Intel provides standard Intel-based

industry building blocks to help create better quality systems. These modular blocks allow members of the Alliance to produce

products with enhanced performance, greater scalability, and maximum flexibility. Intel helps the Embedded Alliance Partners by

offering profitable new communications services and lower infrastructure costs.

MicrosoftAs a Windows Embedded Partner, Lanner is given early access to product plans, Microsoft information

events and the latest embedded developments. In 2011 and 2012, Lanner was awarded the Windows

Embedded Partner of the Year.