industrial grade - simms · 2019-12-05 · to ensure reliable memory solution for automotive...

ATP Electronics, Inc.

Product Longevity & Stability Testing Capabilities Advanced Technologies& Enginerring Support

Targeted Product Portfolio, Engineered Specificallyfor Your Mission Critical Applications

Flash products & DRAM modules

INDUSTRIAL GRADE

Product Catalog 2017

Embedded Modules

2.5” SSDs

DRAM Modules

Memory Cards

ATP Product Catalog 2017

21 ATP ATP

ATP TAIWANHeadquarterTEL: +886-2-2659-6368FAX: [email protected], No. 185, Tiding Blvd. Sec. 2, Neihu, Taipei, Taiwan 11493

ATP JAPAN

TEL: +81-3-6206-8097FAX: [email protected]#1007, 10F 1-8-4 Kandasakuma-cho, Chiyoda-ku, Tokyo,Japan

ATP USA

TEL: +1-408-732-5000FAX: [email protected] North First Street, Suite #150 , San Jose, CA 95131,USA

ATP CHINA

TEL: +86-21-5080-2220FAX: [email protected] 2F, Building 15, No. 115, Lane 572, Bibo Road, Zhangjiang High-Tech Park Pudong, Shanghai, China 201203

ATP EUROPE

TEL: +49-89-374-9999-0FAX: [email protected]. 3, D-85716 Unterschleißheim,Germany

President

ATP started out in a 2 desk business suite in the Silicon Valley with the initial objective to build the world's highest quality small outline DRAM modules.

A lot has happened and changed in 25 years, but ATP's continues to be based off the same core value: Build and deliver the highest quality memory solutions to its customers.

Although this value is literally manifested from ATP products, supporting services, and testing capability, the fundamental strategy is based on alignment with long-term partnerships to our supply and customer base.

Our supply base continues to consolidate, which inherently drives their focus on larger consumption areas. This, in turn, creates opportunities for ATP to address specialty applications and special service requirements; these specialty requirements areas include embedded and industrial applications, which are growing dynamically in diversity and volume.

ATP has built a strong foundation to address these requirements by leveraging partnerships to create stability while adding value with technology.

With 25 years of memory experience, ATP will continue to strive for excellence in delivering high quality Flash & DRAM Modules to our worldwide customers.

On behalf of the company, I want to thank all our customers and partners for the 25 years, and we look forward to standing with you in the next 25.

ATP Celebrates 25th Anniversary

43 ATP

About ATP

Founded in Silicon Valley, ATP Electronics is a global industrial memory solution provider and manufacturer of high performance, reliable and durable NAND Flash and DRAM memory modules.

A technology driven company at heart, ATP strives on providing reliable storage solutions to mission-critical applications; with our core competencies on premium manufacturing quality, cutting-edge memory technologies and industry-validated product portfolio, ATP services on deploying reliable memory solutions to the Automotive, Industrial automation, Enterprise Mobility, Telecom, Healthcare and IoT Industries.

As a true memory manufacturer, ATP offers in-house memory design, testing, product tuning and validation from system to component level. In addition, ATP service strengthes lie in supply chain support with controlled/fixed BOMs, long-term product life cycle management and worldwide agile support in engineering and sales.

ATP Electronics is a certified Eco/ Green partner of tier 1 OEMs, our NAND flash / DRAM modules are fully RoHS and China RoHS compliant.

As an industrial memory pioneer for over 20 years, ATP is now headquartered in Taiwan, with offices in USA, Europe, Asia and continues to expand our memory services across the world.

Industry Association and Compliance


43 ATP ATP

Product Longevity and Stability

Testing Capabilities

Cutting Edge Memory Technology & Engineering Support

Long-term relationships with supply chain commitments ATP’s key partnership with Micron’s PLP (Product Longevity Program) offers long-term BOM stability for DRAM/NAND flash module solutions; this helps our clients have a competitive adaptable edge in the ever changing market industry and immensely reduces the frequency of painful redesign and requalification. Proactive supply chain disaster recovery planning with dual sourcing strategy on ATP products.

Controlled BOM Quality and engineering documentation provided. Long product life cycle with buffer inventory support and advance PCN/EOL notice.

Compliance with Industry certificates and requirementsCE, FCC certificationsRoHS

ATP Unique Memory Features Power failure protection (ATP patented technology) secures consistent flash operationand protect data integrity during unstable power supply conditions.

AutoRefresh (read centric operation) for read disturbance aversion & Dynamic Data Refresh (non-access areas) for data retention. SecureErase eliminates trace of the original data and offers a rigid/diverse variety of military and industrial protocols, including USA-AF AFSSI 5020, USA-Army 380-19, NAVSO P-5239-26, etc.

Industry Leading Engineering Support Capabilities Product customization & development. Responsive QA/FA support during the Mass Production phase. OEM joint validation programs available: “Our lab is your lab.”

ATP Core Competencies

IC level validation & storage device/module level test. Tailored testing criteria environmental setup & joint validation compliant with applications/industry standards and usage models. Mass production level RDT ( Reliability Demonstration Test .)

65 ATP

ATP’s Automotive memory solution is endorsed by worldwide OEM, tier 1 & 2 automotive product/service providers for our capability to support automotive product lifecycle from start to end.

To ensure reliable memory solution for automotive product lifecycle, ATP’s NAND flash products are developed, tested & validated; this process includes a streamline of ATP’s NAND flash IC level test, application usage specific test, industry standard test (AEC-Q100, MIL-STD, JEDEC,etc.) and power cycling test during product development phase.

ATP’s unique SiP (System-in-Package) technology offers greater memory reliability with extreme endurance against shock, vibration, high/low temperature, ESD, dust and humidity in on the road hosting environments.

In the mass production phase, ATP conducts 100% production level burn-in test to sort out manufacturing/component defects prior shipping memory products to customers.

ATP’s automotive memory products and technologies are fully compliant with automotive application’s quality standards.

Networking/telecommunication applications typically have the greatest memory demand for performance, reliability, and capacity.

To deliver memory solutions to networking/telecommunication clients, ATP’s industrial grade DRAM products offer industry leading production level TDBI (Test During Burn In) capability and utilizes a unique in-house testing solution to ensure long-term memory reliability, quality for operating under extreme networking/telecommunication temperature conditions.

Generating massive traffic along with multiple concurrent transactions is the nature of networking/telecommunication usage environments; ATP develops industrial grade SSDs, embedded SSDs modules featuring a wide range of capacities and robust IOPS performance with power failure protection technologies.

ATP commits to customers by implementing technological advancement, in conjunction with extensive processor/chipset compatibility (for DRAM products), supply chain longevity, logistic flexibility, and strong engineering support.

Applications Gateways Surveillance & Security Smart Industrial Application Cloud Computing Connected Devices/ IPCs/

Embedded Systems Drones

NETWORKING/TELECOM

As a member of the Intel IoT Solution Alliance, ATP is recognized as one of the leading IoT hardware platforms and manufacturers. ATP is committed to providing memory solutions that would aid IoT clients in creating a better, connected world. IoT gateway application with Linux OS frequently writes small log files from sensors/ recorders; this results in high writing amplification (WAI) that would gradually ill-affect the endurance and lower the life expectancy of the memory device.

Thanks to ATP’s Advanced Wear Leveling and block management algorithms; this optimizes writing files allocations to prevent excessive wears to NAND flash, prolonging the memory’s operational duration in IoT systems.

In addition, ATP’s SD Life Monitor/ S.M.A.R.T Tool provides real-time health check-ups by monitoring “spare utilization rate”, an early warning mechanism tool to avoid wear out and spare block exhaustion before the device expires.

ATP’s SD/microSD cards are ruggedized built with System-in-Package (SiP), which makes our cards IEC/EN 60529 IP67/IP57 compliant. In addition, 100% production level burn-in tests are conducted to ensure product quality and long-term reliability for the internet of things.

Applications WAN Optimization Appliances VPN/ Firewall Appliances/ Next-Gen

Firewalls Advanced TCA System Small Cell Routers/Gateways/Servers

Applications Automotive IVI Systems ADAS, DMS Event Data Recorder, Tachograph Navigation System In-Vehicle Infotainment/Rear Seat/

Entertainment System Fleet Surveillance Management In-Vehicle Computer Automotive Telematics Surveillance Systems Drive Recorders

AUTOMOTIVE

THE INTERNET OF THINGS ( IoT )

ATP Market Focus and Applications


65 ATP ATP

Applications Life support/Data Logging Bedside Infotainment Terminal Point-of-Care Mobile Device Patient Monitoring Device ECG /EEG/EMG* Monitor Sonogram/Ultra Sound Endoscopy System Diagnostic Imaging System

*ECG- Electrocardiogram EEG - Electroencephalography EMG- Electromyography

Applications HMI Robotics Industrial Control System Home/ Building Automation Industrial Instrument

Implementation of the storage unit in embedded systems / industrial PC requires top-notch engineering expertise and product usage technicality that only an experienced memory solutions provider like ATP can offer.

For industrial PC and embedded system intended application, while it is fundamental for the memory device to have faster data transfer and higher bandwidth; the storage unit also needs to be extremely durable, compact in form factor and power conservative.

With full control of the BOM, ATP designs and supports DRAM and industrial SSDs intended for IPC / embedded application. ATP’s memory products are anti-vibrational, shock resistant and wide temperature range operable. ATP can customize build, fine-tune storage/memory solution for the most demanding and unique embedded application.

The memory unit for enterprise mobility devices requires more than physical durability attributes but also needs assurance from reliable memory storage processes while under unstable power supply and frequent rewriting usage conditions.

Specialized in providing enterprise mobility memory solutions, ATP’s industrial grade memory cards have been previously tested and certified by Motorola Solution IHV. ATP’s industrial grade memory cards are built with SiP (System-in-Package technology); this manufacturing technology offers robust protection against water, dust, and ESD. In addition, ATP developed a series of “Data Integrity” technologies to secure dependable data storage in enterprise mobility environment.

Data integrity, reliability, and performance are crucial memory checklist for medical operations in the healthcare industry. To meet the intense usage condition from healthcare environments, ATP is committed to manufacturing premium levels of performance, reliability, and quality memory products.

ATP’s DRAM and NAND flash memory modules in a variety of form factors and densities have been utilized in hospitals, clinical and diagnostic machines for system boot-up, image capturing and data logging functions.

ATP offers TCO (Total cost of ownership) for long product life cycle, patented PowerProtector technology, SiP (System-in-Package) manufacturing technology, in-house DRAM module testing service, strong quality assurance (QA) and BOM support capabilities for the healthcare industry.

Industry 4.0 for automation marks the integration between cyber-physical systems, intended for the computerization of manufacturing.

This poses challenges for memory devices, given that the automation network is intertwined with a plethora of factory-level equipment to enterprise-level control systems in need for real-time data storage and transmission requirements. Naturally, memory attributes with power failure protection, data consistency/retention, and operating temperature becomes key factors to consider in realizing the “smart factory” for reliable automation acceleration.

ATP’s memory device is designed for endurance, reliability and optimized for intensive read/write operations; in addition, extensive platform/device validation combined with 100% burn-in testing to ensure memory reliability on automation applications.

Applications Industrial Control System Industrial PC/Embedded System Industrial Automation Factory Machinery Data Logging

ENTERPRISE MOBILITY

HEALTHCARE

AUTOMATION

INDUSTRIAL PC/ EMBEDDED

Applications Mobility ERP Barcode Scanning and Data Collection Mobile Payment Rugged and Field Handheld-Computing Mobile Healthcare

87 ATP

Industrial Temperature

Conformal Coating

Gold Finger

PowerProtector

Advanced Wear Leveling ESD Resistance

SD Life Monitor/ S.M.A.R.T.

AutoRefresh / Dynamic Data Refresh

Secure Erase

SiP (System - in - Package)

Wide temperature operable product (-40°C to 85°C) for industrial temperature hosting environments.

A protective coating of parylene (chemical compound) applied on electronic circuits to protect against dust, chemicals, extreme temperature, moisture, and corrosion.

30µ“ thickness of gold finger plating that optimizes signal transmission quality between the connector and DRAM modules.

ATP patented hardware-based technology designed to secure data integrity and data transmission during unexpected power failure.

An algorithm that evens the erase count to prolong product life expectancy.

Memory devices that are electrostatic discharge (ESD) resistant.

A real-time flash storage device monitor tool that detects flash health status and provides product life expectancy to the host.

AutoRefresh technology reduces read disturb and lower the risk of data loss in frequent read Dynamic Data Refresh offers long term data retention technology for non-frequent active areas.

Systematical deletion of information from original data.

Unique manufacturing process that fully encapsulates all exposed components to protect against harsh hosting environments.

ATP Technology

87 ATP DRAM Solutions

DRAM Solutions

ATP DRAM Modules for Networking & Embedded Applications.Tested by Next Generation TDBI and ATE with Increased Flexibility, Efficiency and Scalability.

The Ultimate DDR3L-1866 ECC SODIMM Solutionfor Intel Apollo Lake based IoT and Embedded PlatformsATP ‘s new DDR3L ECC SODIMM are to address the need for low voltage (1.35V) DDR3 memory running at 1866 MHz to maximize the system performance in conjunction with the Intel Apollo-Lake processors. Available in Commercial Temp (CT 0°C to 85°C) and Industrial Temp (IT -40°C to 95°C) range to meet the various operating conditions of any IoT system ,including industrial IoT and automation devices, telecommunication systems, healthcare devices and outdoor data collection systems.

Industrial TemperatureA cost-effective solution, with a wide temperature range from -40°C to 95°C, ideally suited for industrial applications in mission critical environments.

Power Efficient & High PerformanceWith 1.35V Low Power Voltage and operating at 1866 MT/s, it can maximize the system performance.Supports large-scale operations without placing a heavy burden on power bills.

Reliability Designed, tuned, fully tested and validated without any system degradation or side effects.100% tested through ATP rigid testing methods (ATE/TDBI) to ensure long-term product reliability.

Part numbers Speed Voltage Temperature Rank PCB Height Gold Finger Density

XW1818E4GMPP-IT

1866 MHz 1.35V

0°C to 85°CCommercial Temp.

1

STD 30mm 30u''

4GB

XW1828E8GMPP-IT 2 8GB

XW1818E4GMPWP-IT-40°C to 95°C

Industrial Temp.

1 4GB

XW1828E8GMPWP-IT 2 8GB

Features

Product Information

109 DRAM Solutions DRAM Solutions

Legacy (SDR/DDR) DRAM ModuleMicron endorses ATP as a partner to support selected SDR/DDR DRAM Modules

ATP has instituted an agreement with Micron to continue to manufacture Legacy(SDR/ DDR) DRAM modules specifically for the existing customer base that cannot migrate. ATP will offer these modules in selected SODIMM, UDIMM and RDIMM form factors/densities, and continue to provide long-tern support and related product roadmaps.

Each module will be manufactured to the equivalent specifications and test processes of the corresponding Micron part number

License agreement with Micron 100% follow Micron’s design 100% follow Micron’s BOM selection, including key/passive components selection. 100% follow Micron’s firmware setting Equivalent specification & test processes

Together with ATP extended support to minimize customer’s effort on (re)qualification!

“Micron is committed to supporting legacy application requirements. By partnering with ATP we’re able to provide stability for our customers who are unable to transition their existing platforms,” said Bruce Franklin, Product Marketing Director of the Embedded Business Unit for Micron.“Embedded applications require a long life cycle, which is why AMD is pleased to collaborate with ATP and Micron to support the extended life of AMD’s Geode platform,” said Colin Cureton, Product Marketing Manager, AMD Embedded Solution. “ATP’s legacy SDR/DDR SODIMM module solutions utilizing Micron memory are a critical component to industrial control and automation, industrial PCs, HMI panels, point of sales and commu-nication applications.”

Standard Solution

Module Type DDR SO-DIMM DDR SO-DIMM (Industrial Grade)

Capacity 128MB/256MB/512MB/1GB 256MB/512MB/1GB

Function Unbuffered Non-ECC Unbuffered Non-ECC

Frequency 400MHz 400MHz

Pin Number 200pin 200pin

PCB Height 1.25" 1.25"

Build To Order (BTO)

Module Type DDR DIMM DDR DIMM DDR SO-DIMM SDRAM SODIMM

Capacity 1GB/2GB 256MB/512MB 256MB/512MB/1GB 64MB/128MB/256MB/512MB

Function Registered ECC Unbuffered ECC/Unbuffered Non ECC Unbuffered ECC Unbuffered Non ECC

Frequency 400MHz 400MHz 400MHz PC100

Pin Number 184pin 184pin 200pin 144pin

PCB Height 1.125"/1.2" 1.25" 1.25" 1.0"/1.25"

Guarantee :

Endorsement

Product Information



ATP Unique Features and Testing Systems

ATP has successfully integrated the DRAM ATE and TDBI tests and the SCADA system into one mass-production-scale burn-in system. ATP focuses on maximizing the ATE testing coverage and accelerating the TDBI testing cycle. A traceable record from IC level testing (from DRAM module level ATE production data to field product usage) has been built, collected, and analyzed via the SCADA system. The entire system is designed to (1) build a system for quality data acquisition, and (2) implement a system for improving the process, based on quality and reliability driven industrial and server environments. The new system provides a wide testing temperature, ranging from -40°to 85°C, which few other TDBI systems can provide. The combined tests have proven to effectively lower the field return rates from major ATP OEM customers. The system has demonstrated ATP’s value added and its commitments to industrial grade quality and reliability.

The Next Generation Test During Burn In – ATP TDBI System

The ATP New Automatic Test Equipment Test-ATE Test

The ATP TDBI system features a unique chamber design allowing for flexibility in customer specific temperature profiles and also features a flexible monitoring/control system.The elevated temperature burn in process reduces field failures due to fringe manufacturing defects and IC infant mortality. The design of the thermal chamber allows for a higher level of production level efficiency, scalability, and flexibility.

ATE provides electrical testing patterns with various parameters, such as marginal voltage, signal frequency, clock, command timing and data timing under continuous thermal cycles. For specific weaknesses of some ICs, ATE can provide specific testing patterns to stress the screening of the potential defects during the testing. Also, based on customers’ requests, tailor-made electrical testing patterns can be programmed and implemented into the ATE testing process. The ATE testing system is also able to pinpoint individual defective ICs and defective DRAM PCB boards, providing a much more efficient failure analysis method for both new product development and mass production stages.

The SCADA (Supervisory Control and Data Acquisition)The SCADA (Supervisory Control and Data Acquisition) feature of the TDBI system allows for true flexibility in application/customer specific temperature profiles and data patterns (customer specific software/ scripts). SCADA also offers real-time monitoring and production lot logging for QA traceability.

Remote monitoring and control over thermal burn-in testing array Real-time monitoring of testing cycle status on all systems Database containing all profiles, test cycles, and production logs for QA traceability


Industrial Temperature Conformal Coating

A cost-effective solution, with a wide temperature range from -40°C to 85°C, ideally suited for telecom, industrial and military/ aerospace applications.ATP offers two test ing Technologies for the Wide Temperature DRAM Solution: 1. Advanced IC Level Testing and 2. The Enhanced Module Level TDBI and ATE Testing Compared to other competitor’s WT DRAM solutions, the ATP-exclusive IC level and system level testing on DRAM ICs has made ATP WT DRAM modules more reliable in the long run, based on user data in the field. ATP WT DRAM solution has also provided a superior overall system-wide stability over typical commercial temperature DRAM modules.

Conformal Coating is a process in which a protective layer of Parylene is applied to electronic circuits and modules to protect against dust, chemicals, extreme temperatures, moisture, and corrosion. Uncoated surfaces are prone to damage and malfunction, hence the added protection becomes necessary for harsh environments.In contrast to dipping and spraying techniques, the chemical vapor deposition (CVD) provides a vacuum-like environment in which the Parylene particles coat all components and points of failure.ATP can also support special requirements calling for anti-sulfuric components upon request

In order to ensure the quality of the signal transmission between the connector and ATP DRAM module, ATP utilizes gold finger plating with 30μ” thickness, compared to competitors’ DRAM modules thickness typically at less than 10 μ”.

Electrical reliability requires clean power and low-impedance grounding. Traces must be laid out to minimize crosstalk and clock skew. Appropriate shielding is needed to block interference and prevent logic glitches. ATP’s PCB design can 100% fulfill above conditions and also improve signal quality of high speed.

Increased Thickness, Increased Strength

30μ”

ATP Unique Features and Testing Systems



* Available on a project basis.

Product Category Speed(MT/s) Form Factor Features

DDR4LRDIMM/RDIMM UDIMM/UDIMM ECCSO-DIMM/SO-DIMM ECCMini-RDIMMMini-UDIMM ECC

213324002666

• Low profile• Very Low Profile (VLP) options (VLP: 0.74" height)• Ultra Low Profile (ULP) options (ULP: 0.7"~0.72” height)

• Density: 4GB to 64GB • Increased performance and bandwidth (up to 3200 MT/s)• Decreased voltage for better power consumption• Provides better reliability, availability and serviceability

(RAS) and improves data integrity.

DDR3

LRDIMM/RDIMM UDIMM/UDIMM ECCSO-RDIMMSO-DIMM/SO-DIMM ECCmini-RDIMMmini-UDIMM ECC

1866160013331066

• Low profile• Very Low Profile (VLP) options (VLP: 0.74" height)• Ultra Low Profile (ULP) options (ULP: 0.7"~0.72” height)

• Density: 1GB to 32GB 32GB to 64GB(LRDIMM)• Chipkill support• Fly-by command/address/control bus with on-DIMM termination.• Higher bandwidth performance, effectively up to 1866 MT/s• Better performance at low power; 1.5V (Normal) and 1.35V(Low Voltage)

DDR2 RDIMMUDIMM/UDIMM ECCSO-RDIMMSO-CDIMMSO-DIMMmini-RDIMMFB-UDIMM*

800667533400

• Low Profile• Very Low Profile (VLP) options (VLP:0.72"~0.74" height)

• Density: 1GB to 8GB• Chipkill support

FB-DIMM• Low power and low voltage options• Apple FB-DIMM

DDR*

UDIMM/UDIMM ECC SO-CDIMM SO-DIMM

400333266

• Low Profile• Very Low Profile (VLP) options (VLP:0.72"~0.74" height)

• Chipkill support• Legacy system support

SDRAM*

SO-DIMM PC 133PC 100 • Low Profile • Legacy system support

Product Portfolio Category Product Features

Industrial Grade Family SO-DIMM

UDIMMRDIMMmini-DIMM

DDR4DDR3DDR2DDR*SDRAM*

• Extended temperature: -40°C ~ +95°C• Controlled BOM and SPD• For mission critical industrial applications• conformal coating

Complete DRAM Product Line

13 Flash Solutions

Flash Solutions

As planar NAND shrinkage faces difficulties in increasing cell density, 3D NAND is the next generation of technology for the flash memory industry and has been the focal development for all major NAND flash makers. The intuitive concept of design by stacking more layers vertically can expand the capacity from limited die size. Stacking up vertically instead of shrinking planarly allows larger NAND cells with better performance and endurance. ATP has utilized our own innovative 3D NAND packaging for different configurations, such as SDP, DDP, QDP, and ODP, to achieve the market’s demand of large NAND flash capacity products. Starting from wafer procurement, IC level testing to final 3D NAND packaging, ATP owns the advantage of production process management, BOM stability and control in NAND supply with better LTB/LTS over product life cycle, not to mention the cost effectiveness for avoiding a big market price premium and the flexibility of providing custom made packaging for meeting customers’ mission critical applications.

Larger density in single die Higher performance Better endurance

Features

ATP 3D MLC NAND SSD Product Lines

2D NAND & 3D NAND

Product Density

2.5” SSD M V 128GB to 2TB

mSATAMO-300A 128GB to 512GB

SlimSATAMO-297 128GB to 512GB

M.2 SATA2280/2260/2242 128GB to 1TB

Product 2D NAND 3D NAND

Image

Capacity Limited

Not cost effective - Shrinkingnode for density expansion

Increased by layersExpected to ↑ 10x

Material Floating Gate(Conductor)

Floating Gate(Conductor) orCharge Trap(Insulator)

Endurance(P/E Cycles)

Low High

[ More cells in less space → ↑ interference with adjacent cell → ↓ Endurance ]

Performance SlowerComplex program algorithms

FasterSimple algorithms

Overall power

High Low

[ ↓# of programming steps →↓Power Consumption ]

in ATP Packaging

Flash Solutions 14


Map Zone 1Frequently Read

Map Zone 2Seldom Read

SpareBlock

Access Frequency

High

Low

ATP Prominent Technology

ATP AutoRefresh and Dynamic Data Refresh checks not only error bits but also reads counts in both frequent and seldom read areas. Once reaching the error bit or read count threshold, the data will be moved to another healthy blocks to prevent data corruption. Without affecting read/write operation, Dynamic Data Refresh runs automatically in the background and sequentially scans the user area with flag record. Therefore, the risk of data loss owing to read disturb and data retention is mitigated and the product life is extended.

The need for higher capacity points is dictating the embedded market, so is product ability to function in harsh conditions. SLC NAND is faster and reliable in performance; however, the price may be expensive and consumers are either forced to spend extra money on SLC NAND or buy MLC NAND which bears the risk not being able to operate at extreme environments. To overcome environmental asperity, ATP has successfully developed an iTemp (Industrial Temperature) MLC solution, best suited for IIoT/industrial applications.

ATP PowerProtector, an advanced power protection mechanism integrating hardware designs and firmware algorithm, is designed for supplying sufficient power and sustaining data integrity during power failure in mission-critical applications. ATP PowerProtector stops receiving commands from host device after detecting the power failure and leverages the protection from DRAM cache to NAND flash to finish the last operation.

PowerProtector

ECC is automatically checked before uncorrectable failure occurs in every read operation.

ATP NAND Flash Product Level RDT

Data Protection Under Power Glitch

10ms

Pow

er (V

)

Time (ms) Without PowerProtector

PowerProtector

Pow

er (V

)

Time (ms) With PowerProtector

Industrial Temperature

AutoRefresh and Dynamic Data Refresh

Temperature Cycle Chamber85°C

25°C

-40°C

+85°C RDT -40°C RDT

Temp.

By conducting stringent iTemp validation testing technologies in both IC/NAND Flash level screening processes and high/low temperature tests, MLC type NAND Flash reliability is ensured and uncompromised in extreme temperature environments (-40°C~+85°C), placing itself in the market segment where normally SLC type NAND competes. ATP’s stringent advanced RDT (see Figure 1) is conducted for the entire storage drives (IC/NAND Flash/signal of SATA interface) with high/low temperatures as acceleration factors to detect infant mortality and defective modules, delivering enhanced reliability and prolonged product life span. The new iTemp MLC solution strikes a great balance between the demand of better total cost ownership (TCO) and NAND flash reliability.

15 Flash Solutions

ATP SD Life Monitor, an early warning to prevent wear out/spare block exhaustion, activates real-time health check and provides storage identification information at a glance. A useful tool, with detailed SD/microSD information for engineering and QA inspection reference, is easy to install and user-friendly. Moreover, it also supports a wide array of customer’s operating systems/software integration.

Note : The compatibility and support of Life Monitor may vary on different platform / operating systems

ATP Secure Erase initiates a block-by-block data pattern write operation to systematically eliminate any trace of the original data. ATP Secure Erase ensures all data are completely removed, so they can’t be recovered. Therefore, it ’s best suited for Corporate Business (assets management), Government Agency and Military applications.

ATP S.M.A.R.T., a flash storage device health status monitoring tool, reliably detects the remaining life of the device and is available to be integrated into host systems. It is seen as an early warning command tool to prevent wear out and spare block exhaustion and furthermore allows users sufficient time for safe storage retirement and replacement.One practical example is frequent write operation required in automation applications; ATP S.M.A.R.T. is the optimal solution for sustaining endurance and service life of memory possibly impacted by high write amplification while small-file data are being frequently written.

New Feature: Enhanced SD Life Monitor Tool ATP SD Life Monitor with remaining life rate, spare block count, CID/CSD and so on.

New Secure Erase Tool for all ATP Products.

SMART tool Interface for SATA III product lines: (Windows version)

ATP SMART tool is designed for real- time health checks of the storage device, such as device temperature, firmware version, capacity and so on.

SD Life Monitor/S.M.A.R.T.

Secure Erase

Flash Solutions

Flash Solutions 16


ATP Prominent TechnologySystem-in-Package (SiP)

Endurance

(2.7K P/E cycles @ 55C)

Performance

MLC

Y

eMLC

3Y

MLC

X

eMLC

0.8X

ATP aMLC

3X ~ 5X

ATP aMLC

13Y ~ 15Y

MLC

Z

eMLC

0.25Z

ATP aMLC

5Z

ATP System-in-Package (SiP) fully encapsulates all exposed components and points of failure to protect against water(IPX7)/humidity, dust(IP5X/IP6X), electrostatic discharge, shock/vibration, and extreme temperatures.

• Advanced Wear Leveling Algorithm• Bad Block Management• Read Disturb Protector - AutoRefresh to ensure data

integrity during read operation• Enhanced F/W algorithm to minimize the risk of a

sudden power-off• Waterproof, Dustproof and ESD resistant• Highly reliable and environmental testing passed

(Bend/Torque/Salt Spray/Solar radiation)• Life Monitor (Note: The compatibility and support

of Life Monitor may vary on different platforms /operating systems)

• Write-Intensive: Data logging for surveillance, medical imaging, transportation ticketing systems, and drive recorders which requires high P/E cycles for frequent data writing.

• Read-Intensive: Boot-up for OS/application drive in the system for POS, ATM, Kiosk, and automation Applications.

ATP SiP vs Other Brands

Endurance/Price Comparisons of MLC/eMLC/aMLC

Target Applications

aMLC(advancedMLC)

17 Flash Solutions

Product Dimensions(L x W x H mm)

FlashType Densities Operating

Temp.

Data Transfer Rate

(MB/s)(max.)

TBW**(max.)

PowerProtector(H/W)

Secure Erase

(S/W)***

LifeMonitor(S/W)***

SATA

2.5" SSD

Velocity SII Pro

100.0 x 69.85 x 9.2

SLC

8GB~128GB

-40°C~+85°C Read: 530 MB/sWrite: 440 MB/s 21,333 TB

100.0 x 69.85 x 9.5 256GB

Velocity M V

100.0 x 69.85 x 9.2

100.0 x 69.85x 9.5(1.5TB~2TB)

iTempMLC 64GB~2TB -40°C~+85°C

Read: 530 MB/sWrite: 420 MB/s

4,267 TB

MLC 64GB~2TB 0°C~+70°C 5,120 TB

M.2

2280D2-B-M

80.0 x 22.0 x 3.5

iTempMLC 128GB~1TB -40°C~+85°C Read: 550 MB/s

Write: 450 MB/s 2,133 TB

MLC 128GB~1TB 0°C~+70°C Read: 550 MB/s Write: 450 MB/s 2,560 TB

2260D2-B-M

60.0 x 22.0 x 3.5

SLC 32GB~128GB -40°C~+85°C Read: 530 MB/s Write: 430 MB/s 10,667 TB

iTempMLC 64GB~512GB -40°C~+85°C Read: 550 MB/s


MLC 64GB~512GB 0°C~+70°C Read: 550 MB/s Write: 450 MB/s 1,280 TB

2242D2-B-M

42.0 x 22.0 x 3.5



Write: 150 MB/s 267 TB

MLC 32GB~128GB 0°C~+70°C Read: 520 MB/s Write: 150 MB/s 320 TB

mSATAMO-300A

50.8 x 29.85 x 3.4




MLC 16GB~512GB 0°C~+70°C Read: 550 MB/s Write: 450 MB/s 1,280 TB

SlimSATAMO-297

54.0 x 39.0 x 4.0

SLC 8GB~128GB -40°C~+85°C Read: 530MB/sWrite: 430 MB/s 10,667 TB



MLC 16GB~512GB 0°C~+70°C Read: 550 MB/sWrite: 450 MB/s 1,280 TB

CFast 36.4 x 42.8 x 3.6

SLC 8GB~32GB -40°C~+85°C Read: 500 MB/sWrite: 300 MB/s 2,667 TB


Write: 160 MB/s 267 TB

MLC 16GB~128GB 0°C~+70°C Read: 445 MB/sWrite: 160 MB/s 320 TB

Complete Flash Product Line

Flash Solutions 18


* Available on a project basis. ** All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications.*** ATP software support for demo use only.

Product Dimensions(L x W x H mm)

FlashType Densities Operating

Temp.

Data Transfer Rate

(MB/s)(max.)

TBW**(max.)

PowerProtector(H/W)

Secure Erase

(S/W)***

LifeMonitor(S/W)***

PATA/IDE

Compact Flash 36.4 x 42.8 x 3.3

SLC 512MB~32GB -40°C~+85°C Read: 61 MB/sWrite: 55 MB/s 1,280 TB

aMLC 4GB~16GB 0°C~+70°C Read: 110 MB/sWrite: 80 MB/s 128 TB -

MLC 8GB~32GB 0°C~+70°C Read: 110 MB/sWrite: 46 MB/s 38 TB -

USB Drive

eUSB

2.54mm36.9 x 26.6 x 11.52.00mm36.9 x 26.6 x 8.4

SLC 1GB~32GB -40°C~+85°C Read: 30 MB/s Write: 27 MB/s 640 TB

MLC 8GB~32GB 0°C~+70°C Read: 22 MB/s Write: 15 MB/s 19 TB

NANODURA 34 x 12.2 x 4.5 SLC 512MB~8GB -40°C~+85°C Read: 21 MB/sWrite: 16 MB/s 96 TB - -

SD

SD/SDHC/SDXC 32.0 x 24.0 x 2.1

SLC 512MB~8GB -40°C~+85°C Read: 69 MB/s Write: 38 MB/s 192 TB

-

aMLC4GB~64GB

-25°C~+85°CRead: 95 MB/s Write: 79 MB/s 512 TB

iTempaMLC -40°C~+85°C

MLC

8GB~128GB


iTempMLC -40°C~+85°C

microSD/ microSDHC/microSDXC

15.0 x 11.0 x 1.0

SLC 512MB~8GB -40°C~+85°C Read: 82 MB/s Write: 39 MB/s 192 TB

-

aMLC4GB~32GB


iTempaMLC -40°C~+85°C

MLC8GB~64GB


iTempMLC -40°C~+85°C

2019 Memory Cards Memory Cards

• Advanced Wear Leveling Algorithm• Bad Block Management / Error Handling Mechanism • Read Disturb Protector - AutoRefresh to ensure data integrity during

read operation• Data Retention – Dynamic Data Refresh to mitigate the risk of data

retention especially for non-read area• Power failure Protection • SiP (System-in-Package) Technology - IP57/IP67 Waterproof/Dustproof

test (IEC 60529); ESD resistant• Highly reliable and passes environmental testing (Bend/Torque/Salt

Spray/Solar radiation)• SD Life Monitor (Note : The compatibility and support of Life Monitor may vary on different platforms/operating systems)

To meet the various and stringent industry requirements, ATP flash products are developed and pass a series of qualification process and testing for reliability, durability, data integrity, and better TCO under extreme environmental conditions. ATP Industrial Grade SD/microSD cards, with built-in SLC (Single Level Cell) and iTemp MLC/aMLC type NAND flash, are perfect fit for high demanding industrial applications such as automation, internet of things (IoT), healthcare, handheld devices, military, and aviation.

ATP’s memory cards are with versatile purpose-built features and a complete portfolio of validation processes. ATP implements AutoRefresh/Dynamic Data Refresh technology activates data integrity protection in both read intensive applications and seldom accessed area. To conquer the unstable power issue, ATP initiates SPOR (Sudden-Power-Off Recovery) FW backup mechanism to trace previous valid data effectively. In terms of real time health check of SD products, ATP SD life Monitor/single command enables to detect the remaining life and to provide details. Following the industry trend of Software Integration, ATP is able to grant software support using vendor command to avoid interrupting in multitasking OS environment. The comprehensive validation process starts from its in-house NAND flash IC level test, specific industry standard test (AEC-Q100, MIL-STD, JEDEC…etc), power cycling test to 100% mass production burn in test. Moreover, ATP environmental testing and SiP (System-in-Package) technology guarantee the long-time reliability and consistent performance.

SD/SDHC/SDXCmicroSD/microSDHC/microSDXC

Key Features

Memory Cards



Product Name microSD/microSDHC/microSDXC

Flash Type SLC aMLC / iTemp aMLC MLC/ iTemp MLC

Density 512MB to 8GB 4GB to 32GB 8GB to 64GB

PerformanceSequential Read up to 82 MB/s Sequential Read up to 88 MB/s Sequential Read up to 74 MB/s

Sequential Write up to 39 MB/s Sequential Write up to 78 MB/s Sequential Write up to 75 MB/s

Interface

High Speed ModeClass 6 (512MB to 2GB) Class 10 (4GB to 8GB)

Ultra High Speed ModeUHS-I, U3 (4GB to 8GB)

Ultra High Speed ModeUHS-I , U3

Ultra High Speed ModeUHS-I, U1 (8GB)

UHS-I, U3 (16GB to 64GB)

Operating Temperature -40°C to 85°C -25°C to 85°C ; -40°C to 85°C -25°C to 85°C ; -40°C to 85°C

Storage Temperature -55°C to 90°C

Reliability

Advanced Static/Dynamic Wear-Leveling/ AutoRefresh & Dynamic Data Refresh**

TBW* (max.) : 192 TB TBW* (max.) : 256 TB TBW*(max.) : 77 TB

MTBF@25°C: >5,000,000 hours MTBF@25°C: >3,000,000 hours MTBF@25°C: >2,000,000 hours

Number of Insertions: 10,000 minimum

Dimensions: LxWxH (mm) 15.0 x 11.0 x 1.0

Specifications

*All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications.**Available on a project basis.

Product Name SD/SDHC/SDXC

Flash Type SLC aMLC / iTemp aMLC MLC/ iTemp MLC


PerformanceSequential Read up to 69 MB/s Sequential Read up to 95 MB/s Sequential Read up to

91 MB/s

Sequential Write up to 38 MB/s Sequential Write up to 79 MB/s Sequential Write up to 59 MB/s

Interface

High Speed ModeClass 6 (512MB to 2GB) Class 10 (4GB to 8GB)


Ultra High Speed ModeUHS-I , U3


UHS-I, U3 (32GB to 128GB)

Operating Temperature -40°C to 85°C -25°C to 85°C ; -40°C to 85°C -25°C to 85°C ; -40°C to 85°C

Storage Temperature -55°C to 90°C

Reliability

Advanced Static/Dynamic Wear-Leveling/ AutoRefresh & Dynamic Data Refresh**

TBW*(max.) : 192 TB TBW*(max.) : 512 TB TBW*(max.) : 153 TB

MTBF@25C: >5,000,000 hours MTBF@25C: >3,000,000 hours MTBF@25C: >2,000,000 hours




With the more advanced SATA interface, the ATP Industrial Grade CFast is the ideal replacement for CompactFlash. The CFast is fully compliant with CFA's CFast specification version 2.0 with a SATA III 6 Gb/s interface. The ATP CFast with PowerProtector guarantees a reliable controller and lasting NAND flash operations with a backup power circuit during a power failure. By utilizing SLC NAND flash memory and Advanced Wear Leveling technology, the ATP Industrial Grade CFast has a higher program/write endurance and a longer product lifespan.

Product Name CFast Card

Flash Type SLC iTemp MLC MLC

Density 8GB to 32GB 16GB to 128GB 16GB to 128GB

PerformanceSequential Read up to 500MB/s Sequential Read up to 445MB/s Sequential Read up to 445MB/s

Sequential Write up to 300MB/s Sequential Write up to 160MB/s Sequential Write up to 160MB/s

Interface SATA III 6 Gb/s

Operation Temperature -40°C to +85°C -40°C to +85°C 0°C to 70°C

Reliability

AutoRefresh, PowerProtector, Advanced Wear Leveling

TBW* (max.) : 2,667 TB TBW* (max.) : 267 TB TBW* (max.) : 320 TB

MTBF @25°C: >2,000,000 hours



CFast Card

• SLC (Single Level Cell) NAND Flash with a longer lifespan• MLC (Multi Level Cell) NAND Flash with higher capacity• iTemp MLC (Multi Level Cell) NAND Flash- Industrial Temperature operable• Enhanced endurance with Advanced Wear Leveling algorithm• Bad Block Management• Read Disturb Protector - AutoRefresh to ensure data integrity during read operation• Built-in hardware-based data protection technology during power failure – PowerProtector• Supports S.M.A.R.T. ATA feature set• RoHS compliant and CE/FCC certification

Specifications

Key Features

*All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications.

Memory Cards



The ATP Industrial Grade CompactFlash Card has enhanced endurance levels for an extended product life cycle by utilizing SLC NAND flash and the Advanced Wear Leveling technology. Moreover, AutoRefresh technology monitors the error bit levels during each read operation to ensure better data integrity.

Product Name CompactFlash Card

Flash Type SLC aMLC MLC


PerformanceSequential Read up to 61MB/s Sequential Read up to 110MB/s Sequential Read up to 110MB/s


Interface UDMA 0~4 UDMA 0~6

Operation Temperature -40°C to 85°C 0°C to 70°C 0°C to 70°C

Reliability

Advanced Wear Leveling Algorithm & Bad Block Management Algorithm

TBW* (max.) : 1,280 TB TBW* (max.) : 128 TB TBW* (max.) : 38 TB

MTBF @25°C: >5,000,000 hours MTBF @25°C: >2,000,000 hours MTBF @25°C: >2,000,000 hours



CompactFlash Card

Specifications

• SLC (Single Level Cell) NAND Flash with a longer lifespan• MLC (Multi Level Cell) NAND Flash with higher capacity• aMLC (advancedMLC) NAND flash and Global Wear Leveling technology with a longer

lifespan• Enhanced endurance with Advanced Wear Leveling algorithm• Bad Block Management• Read Disturb Protector - AutoRefresh to ensure data integrity during read operation• Built-in hardware-based data protection technology during power failure – PowerProtector• Supports S.M.A.R.T. ATA feature set• RoHS compliant and CE/FCC certification

Key Features


2423 SSDs SSDs

2.5’’ SATA SSDs

The ATP Velocity SII Pro 2.5” SSD with SATA III interface is the best-in-class wide-temp industrial grade SLC SSD solution with enterprise-class features. SII Pro SSD offers outstanding performance and proven reliability, ideal for extreme performance, and consistent data integrity requirements (ATP PowerProtector technology), suited for POS, industrial computers, data center and industrial applications in mission- critical, high shock and vibration environments.

Product Name Velocity SII Pro SSD 2.5”

Flash Type SLC

Density 8GB to 256GB

Performance

Sequential Read up to 530 MB/s

Sequential Write up to 440 MB/s

Random Read IOPS up to 78,000


Operating Temperature -40°C to +85°C

Reliability

Advanced Wear Leveling, PowerProtector, AutoRefresh

TBW* (max.) : 21,333 TB

MTBF @ 25°C : >2,000,000 hours

Dimensions: LxWxH (mm)100.0 x 69.85 x 9.2 (8GB to 128GB)

100.0 x 69.85 x 9.5 (256GB)

Velocity SII Pro

Specifications

Key Features• Ideal for heavy program/erase applications• High Performance with SATA III interface• Enhanced endurance with Advanced Wear Leveling algorithm• Built-in hardware-based data protection technology during power failure-PowerProtector• NSA Compliant Secure Erase• Supports S.M.A.R.T. ATA feature set• MIL-STD-810G compliant• RoHS compliant and CE/FCC certification


2423 SSDs SSDs


Velocity M V

Utilizing MLC NAND flash components, the ATP Velocity M V Enterprise Grade SSD is the best-in-class MLC SSD solution with enterprise-class features for cost-sensitive clients. M V SSD offers outstanding performance and proven reliability, ideal for extreme performance, and consistent data integrity requirements, suitable for POS, industrial computers, data center and industrial applications exposed to high shock and vibration environments.

• Designed for enterprise applications requiring high endurance on MLC technology• High performance with SATA III Interface• Enhanced endurance with Advanced Wear Leveling algorithm• Built-in hardware-based data protection technology during power failure – PowerProtector• NSA Compliant SecureErase• Supports S.M.A.R.T. ATA feature set• MIL-STD-810G Shock/Vibration compliant• RoHS compliant and CE/FCC certification

Product Name Velocity M V 2.5” SSD

Flash Type iTemp MLC MLC

Density 64GB to 2TB 64GB to 2TB*

Performance

Sequential Read up to 530MB/s Sequential Read up to 530MB/s

Sequential Write up to 420MB/s Sequential Write up to 420MB/s



Operating Temperature -40°C to +85°C 0°C to +70°C

Reliability

Advanced Wear Leveling, PowerProtector, AutoRefresh

TBW** (max.) : 4,267 TB TBW** (max.) : 5,120 TB

MTBF @25°C: >2,000,000 hours

Dimensions: LxWxH (mm)100.0 x 69.85 x 9.2 (64GB to 1TB)

100.0 x 69.85 x 9.5 (1.5TB to 2TB)*

Specifications

Key Features

* 1.5TB & 2TB available on a project basis.**All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications.

2625 Embedded Modules

Embedded Modules

Product Name M.2

2242 SATAIII 2260 SATAIII 2280 SATAIII

Flash Type SLC iTemp MLC MLC SLC iTemp MLC MLC iTemp MLC MLC

Density 8GB to 64GB 32GB to 128GB 32GB to 128GB 32GB to 128GB 64GB to 512GB 64GB to 512GB 128GB to 1TB 128GB to 1TB

Performance

Sequential Read up to 530MB/s





Sequential Write up to 400MB/s











Operating Temperature -40°C to +85°C -40°C to +85°C 0°C to 70°C -40°C to +85°C -40°C to +85°C 0°C to 70°C -40°C to +85°C 0°C to 70°C

ReliabilityTBW* (max.) :

5,333 TBTBW* (max.) :

267 TBTBW* (max.) :

320 TBTBW* (max.) :

10,667 TBTBW* (max.) :

1,067 TBTBW* (max.) :

1,280 TBTBW* (max.):

2,133 TBTBW*(max.):

2,560 TB

MTBF @ 25°C: >2,000,000 hours

Dimensions: LxWxH (mm) 42.0 X 22.0 X 3.5 60.0 X 22.0 X 3.5 80.0 X 22.0 X 3.5

The ATP M.2 2242/2260/2280 Embedded SSD is the Next Generation Form Factor (NGFF) storage solution. It provides outstanding performance and proven reliability for product operation,which is perfect for networking and thin clients, also suitable for enterprise stor-age systems consistent data integrity requirement such as POS, industrial computers, and data center applications.

M.2

Specifications

Key Features• Adheres to M.2 specification v1.0 defined by PCI-SIG• Built-in hardware-based data protection technology during power failure - PowerProtector• Ultra high performance solution for small form factor embedded and industrial applications• Supports S.M.A.R.T. ATA feature set• RoHS compliant and CE/FCC certification



2625 Embedded Modules Embedded Modules

Specifications

Product Name mSATA



Performance

Sequential Read up to 530MB/s Sequential Read up to 550MB/s Sequential Read up to 550MB/s


Random Read IOPS up to 76,000 Random Read IOPS up to 70,000 Random Read IOPS up to 70,000


Operating Temperature -40°C to +85°C -40°C to +85°C 0°C to 70°C

Reliability

AutoRefresh, PowerProtector, Advanced Wear Leveling

TBW* (max.) : 10,667 TB TBW* (max.) : 1,067 TB TBW* (max.) : 1,280 TB

MTBF @ 25°C: >5,000,000 hours MTBF @ 25°C: >2,000,000 hours

Dimensions : LxWxH (mm) 50.8 x 29.85 x 3.4

• Adheres to the JEDEC mechanical specification MO-300A• Built-in hardware-based data protection technology during power failure - PowerProtector• Ultra high performance solution for small form factor in embedded and industrial applications• Supports S.M.A.R.T. ATA feature set• RoHS compliant and CE/FCC certification

The mSATA Industrial Grade Embedded Module is designed for small form factor embedded and networking applications with space constraints and high performance requirements. To further ensure data integrity, the ATP PowerProtector technology allows the ATP mSATA to intelligently manage the read and write process under a sudden power failure, thus surpassing the technical and space limitations offered by existing power failure protection solutions. PowerProtector’s leaner requirements for board footprint allows for support in smaller form factors such as mSATA.

mSATA

Key Features



• JEDEC standard: MO-297(SlimSATA) compliant• Enhanced endurance with Advanced Wear Leveling algorithm• Built-in hardware-based data protection technology during power failure - PowerProtector• Supports S.M.A.R.T. ATA feature set• RoHS compliant and CE/FCC certification

Product Name SlimSATA



Performance

Sequential Read up to 530MB/s Sequential Read up to 550MB/s Sequential Read up to 550MB/s


Random Read IOPS up to 76,000 Random Read IOPS up to 70,000 Random Read IOPS up to 70,000


Operating Temperature -40°C to +85°C -40°C to +85°C 0°C to 70°C

Reliability

Advanced Wear Leveling, AutoRefresh, PowerProtector

TBW* (max.) : 10,667 TB TBW* (max.) : 1,067 TB TBW* (max.) : 1,280 TB

MTBF @25°C: >5,000,000 hours MTBF @25°C: >2,000,000 hours


With its small size and JEDEC MO-297 standard compliant, the ATP SlimSATA with PowerProtector is an ideal solution for business-critical embedded and networking applications. Featuring a standard SATA interface and premium grade NAND flash components, ATP SlimSATA offers ultra-fast read performance of up to 550 MB/s and write performance of up to 450 MB/s. The ATP SlimSATA ofers an alternatie solutionfor embedded applications such as IPC, AdvancedTCA, single board computers, surveillance & security and networking, which have space constraints and require high performance and reliability.

SlimSATA

Specifications

Key Features


Embedded Modules


2827 Embedded Modules Embedded Modules

eUSB SSDPin-Pin Replacement for Intel ® Z-U130 Value SSD

• Product flexibility as a boot drive• Enhanced endurance with Advanced Wear Leveling algorithm• Built-in hardware-based data protection technology during power failure - PowerProtector• RoHS compliant and CE/FCC certification

Product Name eUSB SSD

Flash Type SLC MLC

Density 1GB to 32GB 8GB to 32GB

PerformanceSequential Read up to 30MB/s Sequential Read up to 22MB/s

Sequential Write up to 27MB/s Sequential Write up to 15MB/s

Connector Pin 9 Pins Internal USB (USB 2.0 & 1.1 compliant)

Operating Temperature -40°C to +85°C 0°C to +70°C

Reliability

Advanced Wear Leveling

TBW* (max.) : 640 TB TBW* (max.) : 19 TB

MTBF @ 25°C: >5,000,000 hours MTBF @ 25°C: >2,000,000 hours

Profile Standard Profile Low Profile

Dimensions : LxWxH (mm) 36.9 x 26.6 x 11.5 36.9 x 26.6 x 8.4

Connector Pin Pitch 2.54 mm 2.00 mm

The ATP eUSB SSD is specifically designed to support applications that previously used Intel's Z-U130 Value SSD such as networking, embedded, and medical applications. In addition, utilizing PowerProtector technology ensures a reliable controller and lasting NAND flash operation with a backup power circuit during a sudden power failure.

Specifications

Key Features



ATP Industrial Grade USB Drives are designed for mission-critical embedded applications with space constraints, high performance and high data retention requirements. The drives have extraordinary endurance of 60,000 program/erase cycles, while most MLC-based USB drives on the market have less than 3,000 program/erase cycles. The Industrial Grade USB Drive is ideal for industrial applications such as medical, IPC and automation.

• Enhanced endurance with Advanced Wear Leveling algorithm• 10 years of data retention for SLC-based ATP Industrial Grade USB Drive • System in Package (SIP) Technology: extreme operating temperature: -40°C to 85°C;

water/moisture, vibration, shock and electrostatic discharge resistant• NSA Compliant SecureErase• RoHS compliant and CE/FCC certification

NANODURA

Product Name USB Drive - NANODURA

Flash Type SLC

Density 512MB to 8GB

PerformanceSequential Read up to 21MB/s


Interface Compatible with USB 2.0 (480Mbps)

Operating Temperature -40°C to +85°C

Reliability

Advanced Wear Leveling

TBW* (max.) : 96 TB

MTBF @25°C: >5,000,000 hours



Specifications

Key Features


Embedded Modules

Flash Solutions 30



Product Dimension (Size) Comparison

SlimSATAM.2 2242M.2 2260M.2 22802.5’’ SATA SSD

eUSB CF CFast SD/ SDHC/ SDXC microSD/ microSDHC/ microSDXC

mSATA

100.0 mm

69.85 mm

60.0 mm

22.0 mm

80.0 mm

22.0 mm

50.8 mm

29.85 mm

42.0 mm

22.0 mm

39.0 mm

54.0 mm

36.4 mm

42.8 mm

36.4 mm

42.8 mm

36.9 mm

26.6 mm

32.0 mm

24.0 mm

11.0 mm

15.0 mm

ATP CHINATEL: +86-21-5080-2220FAX: [email protected]

ATP EUROPETEL: +49-89-374-9999-0FAX: [email protected]

ATP TAIWAN(HQ)TEL: +886-2-2659-6368FAX: [email protected]

ATP JAPANTEL: +81-3-6206-8097FAX: [email protected]

ATP USATEL: +1-408-732-5000FAX: [email protected]

© Copyright 2017 ATP Electronics, Inc. All rights reserved.


industrial grade - simms · 2019-12-05 · to ensure reliable memory solution for automotive...

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