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  • May, 2018

    Industry Leading Provider of Outsourced Semiconductor Assembly, Test & Bumping Services

  • Safe Harbor Notice

    � This presentation contains certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the “SEC”) and in the Company’s other filings with the SEC.

    2

  • Group Snapshot

    Manufacturing footprint in China & Taiwan

    Shanghai, China ChipMOS Shanghai

    (JV with Unigroup)

    Hsinchu, Taiwan ChipMOS Taiwan

    Tainan, Taiwan ChipMOS Taiwan

    Overview

    (1) As of April 30, 2018

    Key milestones

    20012000 2011 2014 20182015 2016

    • Started TCP package for LCD driver IC and 12" wafer assembly and testing business

    • ChipMOS Bermuda listed common shares on the Nasdaq exchange market

    • Set up 12” Gold bumping, Cu RDL, MCP, Cu pillar, MCB bumping and WLCSP line

    • Listed ChipMOS Taiwan on TWSE

    • Announced the merger between ChipMOS Taiwan and ThaiLin

    • Invested in JMC and Ryowa

    • ChipMOS Taiwan merged ThaiLin

    • Announced strategic partnership with Tsinghua Unigroup

    • ChipMOS Taiwan merged ChipMOS Bermuda and issued ADS (Nasdaq Ticker: IMOS)

    2017

    • Completed whole investment tranche of Shanghai facility in Q1

    � Founded : 1997

    � Headquarters : Hsinchu, Taiwan

    � Ticker Symbol : TWSE : 8150.TW NASDAQ : IMOS (ADS)

    � Employees (1) : Taiwan : 5,785

    3

    • ChipMOS Taiwan formed Shanghai JV with Tsinghua Unigroup

  • Corporate Holding Structure

    4

    ChipMOS Taiwan

    Shanghai employee and strategic

    investors

    7%

    � Strategic investors led by Tsinghua Unigroup have invested RMB 498.43 million for a 54.98% stake in ChipMOS Shanghai-JV closed on March 24, 2017

    � Capital injection already done in March 2018, ChipMOS Shanghai received a total RMB 1,074 million in funding

    � ChipMOS is not consolidating ChipMOS Shanghai post the JV closure. ChipMOS Shanghai becomes a long-term investment of ChipMOS and recognized profit/loss generated pro rata.

  • ChipMOS Positioned to Expand Market Leadership

    MemoryDDIC

    Core

    Technology

    Mixed Signal

    � Offer turn-key solutions for core technology product segments

    � Dedicated OSAT capacity and strategically focused on collaboration-driven growth

    � Leverage current partnerships to expand customer base

    5

    Q1’18: 8%

    Q1’18: 45% Q1’18: 47%

  • Turnkey, High-yield, OSAT Partner of Choice

    6

    � Memory Supply Chain

    Design Wafer probing

    (ChipMOS) Ass’y/Test (ChipMOS) Module

    Foundry

    Design Foundry Wafer probing

    (ChipMOS) COF/COG (ChipMOS)

    Bumping (ChipMOS)

    COF film Manufacture

    Panel Module

    � DDIC Supply Chain

    �D D I C

  • Diversified Product Portfolio on Higher Growth Mark ets Q118

    7

    DDIC

    38% Smart Mobile

    19% Consumer

    12% Computing

    22% 9% TV Auto/Industry

    Smart phone Tablet Wearable device

    DSC, STB Pen driver Game Smart speaker

    PC/Laptop Server, SSD Hard disk Crypto-mining

    UHD/4K TV Industrial PC In-car Infotainment ADAS

    Memory & Mixed-signal

  • High ChipMOS Content in Smartphones

    � DDIC: COG &12”COF TDDI OLED driver

    � Power IC (Load switch) � MEMS:

    E-compass, Gyro, …

    � Niche DRAM Low power DRAM, mobile DRAM

    � NOR (OLED panel, TDDI)

    � Biometric sensor

    8

  • Growth in New Advanced Applications Market

    Interconnection

    Infotainment

    NOR Flash NAND Flash

    NOR FlashDDIC ADAS

    Niche DRAM

    Powertrain ECU Entertainment system

    In-car Sensor

    9

    Electronic Control Unit(ECU)

  • � Conversion of 12” fine pitch COF for full screen pan el and 18:9 panel

    � TDDI/OLED & 3D sensing ramping up

    Leverage DDIC Leadership Position

    10

    YoY: 24% QoQ: ~2%

    TDDI QoQ: 3.5%

  • More Intensive Process = Higher ASPs

    11

    UHD TV

    ASP ratio (vs. COG for DDIC )

    G ro

    w th

    r at

    e

    OLED Driver,

    TDDI, DDIC

    Mobile phone

    DDIC

    8” COF

    COG

    12” COG

    12” Fine Pitch COF

    TDDI

    � TDDI & OLED: longer testing time > x2 vs LCD DDIC

    � More process procedures

    � COG: Au bump – Wafer test (CP) – COG assembly (Lapping, dicing, P&P)

    � COF: Au bump – Wafer test (CP) – COF assembly (Lapping, dicing, COF bonding,.. ) – Final test (FT)

  • New Smartphone Features Driving DDIC Revenue Growth

    Source: WitsView Jul. & Aug., 2017

    2015 - 2020 AMOLED & TDDI Penetration in Global Smar tphone

    � Full-screen/18:9 switches COG to fine pitch COF and AMOLED require COF capacity � Integration of new smartphone features, including TDDI and fine pitch COF, driving need for

    added test capacity

    12

  • UHD/4K TV Growth DDIC COF Capacity Demand

    13

    2015 - 2020 UHD TV growth

    Source: Futuresource consulting, Apr.’2016 & HIS ma rket Jan.’2017

    � UHD(4K) TV & OLED propel significant memory/storage market growth in set top boxes, TV, home entertainment systems

    � Market penetration of UHD TV accelerating, & drives DDIC COF demand increasing

  • New Applications Driving Increased NOR Demand

    Source: HIS, Gartner, Synaptics, & summarized by Hai tong Securities, 2017

    � New end-product & application drive NOR flash demand, and particularly wafer test capacity

    � Margin benefit from fully utilized, fully depreciated wafer testers for NOR flash

    14

  • 15

    Q1’18 Financial Highlights

  • Q1’18 Revenue Breakdown (unaudited)

    17.5%

    11.3%

    26.5%

    27.1%

    17.6%

    Bumping (incl. RDL/MEMS/PM)

    LCD Driver

    Assembly

    Wafer Sort

    Package Test 16.5%

    7.0%

    22.2%

    0.8% 8.0%

    28.2%

    17.3%

    Au Bumping (incl. RDL)

    Logic/Mixed Signal SRAM

    Flash

    Niche DRAM

    Commodity DRAM

    DDIC

    By Manufacturing Segment By Product

    16

  • Q1’18 Capital Expenditures (unaudited)

    17

    CapEx

    ( NT$ M)

    Q1’18 CapEx Breakdown

    3,123.3

    4,702.7

    1,264.1 1,134.6 1,264.1

    -

    500

    1,000

    1,500

    2,000

    2,500

    3,000

    3,500

    4,000

    4,500

    5,000

    2016 2017 Q1'18 Q1'17 Q1'18

    Testing,

    29.3%

    Assembly,

    8.1%LCD Driver,

    55.0%

    Bumping,

    7.6%

  • Company Website

    � http://www.chipmos.com

    18

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