infineon (ericsson microelectronics) modules and tools
DESCRIPTION
Infineon (Ericsson Microelectronics) Modules and Tools. OEM Bluetooth Solutions. Bluetooth Products. Bluetooth Technology IP. Ericsson Bluetooth Layers. SonyEricsson. Ericsson Microelectronics. Ericsson Technology Licensing. Existing (Older) Products. PBA31301 - PowerPoint PPT PresentationTRANSCRIPT
Kjell Jonsson 2002-10-07 Page: 1
Infineon (Ericsson Microelectronics) Modules and Tools
Kjell Jonsson 2002-10-07 Page: 2
Ericsson Bluetooth Layers
Bluetooth Technology IP
Ericsson Technology Licensing
Ericsson Microelectronics
OEM Bluetooth Solutions
Bluetooth Products
SonyEricsson
Kjell Jonsson 2002-10-07 Page: 3
Existing (Older) Products
• PBA31301– Plug and Play Class 2 Transceiver
• ROK101008– PtP MCM, Complete BT function
• ROK101007– 1st generation PtM MCM
Kjell Jonsson 2002-10-07 Page: 4
Development Products
• LPY 111 445• LPY 111 453
– Bluetooth Starter Kit
• LPY 111 xxx– New daughter modules for the Starter Kit
• LZY xxx yyy– Software for the Starter kits
Supports development using Bluetooth Modulesand chipsets. Easy upgrade with new daughter boards.
Kjell Jonsson 2002-10-07 Page: 5
Development Tools
Software
• ECP Software
• HCI Toolbox
•The Bluetooth Host Stack• One licence for development purposes only in executable form (for PC)• HCI driver• L2CAP• SDP• RFCOMM
Kjell Jonsson 2002-10-07 Page: 6
Expanding product portfolio
Kjell Jonsson 2002-10-07 Page: 7
Bluetooth Long Range Radio Module, PBA 313 02
• Features– Requires only an antenna and a 10-20 MHz reference
clock to form complete Bluetooth radio functionality– 11.8 X 11.8 Line Grid Array (LGA) package– Ideal for applications requiring a flexible form factor– A height of only 1.6 mm– Built in RF shielding!
• Key performance– Typical RF output power 17 dBm, Class 1 (“100 m”)– Sensitivity level -86 dBm (typical) at BER 0.1%– Temperature range -30 to +75ºC
• Pre-qualified to Bluetooth specification 1.1
Kjell Jonsson 2002-10-07 Page: 8
Bluetooth Radio, PBA 313 05
• A small cost effective Radio based on RFCMOS technology– Requires only an antenna and a 13 MHz reference clock
to form complete Bluetooth radio functionality– 9 x 9 Line Grid Array (LGA) package– Ideal for applications requiring a flexible form factor
• A height of only 1.6 mm– Self shielding design!
• Key performance– RF output power 0 dBm, Class 2 (“10 m”)– Sensitivity level -80 dBm (typical) at BER 0.1%– Temperature range -20 to +75ºC
• Pre-qualified to Bluetooth specification 1.1
Kjell Jonsson 2002-10-07 Page: 9
ARM core
Interruptcontroller
Counterstimers
Clock control
External Bus
ControlSRAM
UARTS+FIFO:s
I2CIF/ PIO
IROM
USBUSB+FIFO:s
RS-232
PCM
AMBA BUS
Ericsson
Bluetooth
Core
Bluetooth radio
I2C
Baseband controller
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Blink Overview PBM 990 90Bluetooth baseband chip with external Flash
• 0.25m• 2.5 V• Low Leakage process• Packaged in a 96 pin BGA.• 64 k byte SRAM• 4 k ROM• Variable system frequency• Ericsson Bluetooth Core
ARM7 core
Interruptcontroller
Systemcontroller
AHB/APBbridge
SRAM64kbyte
UART1
I2C
ROM4kbytes
UART2
AMBA
AHB
ExternalMemory
GPIO
AMBA
APB
USB
Kjell Jonsson 2002-10-07 Page: 11
Flink Overview PBM 990 80Bluetooth baseband with internal Flash
• 0.25m• 2.5 V• Low Leakage process• Packaged in a 64 pin BGA• Internal Flash 4 - 16Mbit• 64 k byte SRAM• 4 k ROM• Variable system frequency• Ericsson Bluetooth Core
ARM7 core
Interruptcontroller
Systemcontroller
AHB/APBbridge
SRAM64kbyte
UART1
I2C
ROM4kbytes
UART2
AMBA
AHB
FlashMemory4 -16Mb GPIO
AMBA
APBUSB
Kjell Jonsson 2002-10-07 Page: 12
MCM, ROK 101 007 & ROK 101 008 Multi-Service Applications
• Complete Bluetooth function HardWare: Radio, Baseband and Flash FirmWare: LC, LM and HCI
• Type approved according to FCC/ETSI• Class 2 (“10 m”)• 33 x 17 x 3 mm• Two versions
Point to Point (ROK 101 008) Pre-qualified for Bluetooth 1.0b + critical errata Point to Multipoint (ROK 101 007) Pre-qualified for Bluetooth 1.1
• Featuring 7 slaves 64k RAM, 8 Mbit Flash USB,UART,PCM,I2C,GPIO
BluetoothRadio
BASEBANDPCM
UART
USB
50 Antenna
MEMFW
HCIAu
dio
HCILink
Manager
FW = FirmWareLink Controller
FW
NOT for n
ew d
esig
ns !!
Kjell Jonsson 2002-10-07 Page: 13
Complete Bluetooth function HardWare: Radio, Baseband and Memory FirmWare: LC, LM and HCI
Pre-qualified for Bluetooth spec 1.1 Type approved according to FCC/ETSI Class 2 (“10 m”) RF shield Size: 10.5x15.5x2.1 mm
2nd Generation MCM ROK 104 001
Featuring Point to Multipoint, 7 slaves 64k RAM, 4-16Mbit Flash USB,UART,PCM,I2C,GPIO
BluetoothRadio
BASEBANDPCM
UART
USB
50 Antenna
MEMFW
HCIAu
dio
HCILink
Manager
FW = FirmWare
Link Controller
FW
Kjell Jonsson 2002-10-07 Page: 14
BasebandPBM 990 90
Bluetooth Products Availability
ROK101 008
PBA 313 01 PBA 313 05PBA313 02
PBM 990 80
ROK101 007 ROK 104 001
MCM
Radio
Samples :
Volume :
Samples (early adopters) :
Volume :
Samples :
Volume :
NOW NOW NOW
NOW NOW NOW
NOW NOW
NOW NOW
NOW NOW NOW
NOW NOW NOW
Low CostLong RangeStd
Baseband Baseband + Flash
PtP PtM 1st gen PtM 2nd gen
Kjell Jonsson 2002-10-07 Page: 15
Do It Yourself vs Modular Solution
Do It Yourself• Need specialized RF knowledge• Each design requires certification• Diversion from core competency• Longer Time-to-Market• Overall optimization is difficult to
achieve
• May implement smaller and more area-flexible solution
• May have lower BoM cost
• May be more expensive overall– Design & Development Costs– Production Yields– Tighter Process Controls– Repair Cost– Certification and Type approval
Modular Solution• No specialized RF knowledge needed• Pre-certification possible• Can focus on core competencies• Shorter Time-to-Market• Optimized sub-assembly
• Fixed form factor• Generally more costly than BoM
• May be less expensive overall– Experience drives lower cost
Kjell Jonsson 2002-10-07 Page: 16
Ericsson Microelectronics Bluetooth SW Products
Bluetooth Stacks• Ericsson Bluetooth Host Stack• Ericsson Embedded Stack - Two CPU solution (ECP)
Software Tools• HCI Toolbox• ECP Software• PC reference Stack• Flash-tool
Kjell Jonsson 2002-10-07 Page: 17
LM
L2CAP
RFCOMM SDP TCS BNEP
SD
AP
GA
P
SP
PHCI
LM
HCI
“Bluetooth Host Stack Solution” “Bluetooth Embedded Stack Solution” “Bluetooth Embedded Application Solution”
Ericsson Bluetooth SW Stack products
MCM
HostNO HOST MC!
VS HCI
LM
L2CAP
RFCOMM SDP TCS BNEP
SD
AP
GA
P
SP
P
VS HCI
L2CAP
RFCOMM SDP TCS BNEP
SD
AP
GA
P
SP
P
API
Application
API
Application
API
Application
Serial Media - UART, USB Serial Media - UART, USB Serial Media - UART, USB
Kjell Jonsson 2002-10-07 Page: 18
HCI Toolbox
•Logical and stress testing
•Control of Radio
•Indicative BER testing
•Point-to-point & multi-point testing
•User defined macros
•Runs on PC/Windows environments
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Flash-tools
•Enables firmware upgrades
•Supports both USB (DFU 1.0) and UART
•Works on Windows/PC environments.