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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 1

Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode The first PrimePACK™ 2 product from Infineon implementing IGBT5 and .XT joining

technology with copper wire bonding and sintered silver die attach.

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

SP19492 – POWER Semiconductor report by Amine ALLOUCHELaboratory Analysis by Véronique LE TROADEC

October 2019 – SAMPLE

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/http://www.systemplus.fr/


SUMMARY

Overview / Introduction 4

o Executive Summary

o Market

o Reverse Costing Methodology

o Glossary

Company Profile 9

o Infineon profile

o Infineon Technology and Product Portfolio

o Supply Chain

Physical Analysis 14

o Synthesis of the Physical Analysis

o Package Analysis

Package Opening

Package Cross-section

o Si IGBT Die

IGBT Die View & Dimensions

IGBT Die Process

IGBT Die Cross-section

o Si Diode Die

Diode Die View & Dimensions

Diode Die Process

Diode Die Cross-section

Manufacturing Process 107

o Si IGBT Fabrication Unit

o Si IGBT Process Flow

o Si Diode Fabrication Unit

o Si Diode Process Flow

o Final Test & Packaging Fabrication unit

o Packaging Process Flow

Cost Analysis 128

o Synthesis of the Cost Analysis

o Yields Explanation & Hypotheses

o Si IGBT

IGBT Front-End Cost

IGBT Wafer Cost per Process Step

IGBT Die Probe Test & Dicing

IGBT Die Cost

o Si Diode

Diode Front-End Cost

Diode Wafer Cost per Process Step

Diode Die Probe Test & Dicing

Diode Die Cost

o DBC Cost

DBC BOM Cost

DBC Assembly Cost

o Module Cost

Module BOM Cost

Packaging Assembly Cost

Final Module Cost

Selling Price Analysis 151

o Definition of prices

o Estimation of selling price

Comparison 154

o Comparison of Infineon IGBT3 vs IGBT4 vs IGBT5.

Feedbacks 157

Company Services 159


Overview / Introductiono Executive Summaryo Marketo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Related Reports

About System Plus

Executive Summary

The market outlook for power electronics industry is promising. In 2018, the power semiconductor devices market segment represented US$17.5 billion, with a CAGR 2018-2024 of 3.2%.

The biggest growth in this market is driven by IGBT modules that represents 23% of the total market in 2018 and is expected to increase in the coming years. That’s why various players are currently investing in new manufacturing lines: Infineon have invested US$1.9 billion in Villach to build a second fab for power devices on 300 mm wafers.

Industrial is one of the main applications for IGBT modules. For this purpose, Infineon released the FF1200R12IE5 ; its first PrimePACK™ 2 product with IGBT5 and .XT joining technology. This novel joining technology implements copper wire bondings and sintered silver as die attach layer.

The module employs Infineon’s IGBT5 TRENCHSTOP™ and Emitter Controlled 5 diode in 1200V Half-Bridge configuration with a nominal current rating of 1200 A.

This report presents a deep analysis of the FF1200R12IE5 module. Supported by a full teardown of the module’s components and housing, this report reveals Infineon’s design of the IGBT5 and EC5 diode as well as its innovative assets in the PrimePACK™ 2 packaging.

This report includes an estimated manufacturing cost of all the module’s components and its selling price analysis. It proposes a comparison between, IGBT3, IGBT4 and IGBT5 technologies from Infineon.

These comparisons highlight differences in the die design, packaging and electrical performances.


Overview / Introduction

Company Profile & Supply Chain o Infineon Profileo Infineon Modules Portfolioo Supply Chain

Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Infineon PrimePACK™ with TRENCHSTOP™ IGBT5 .XT Portfolio

• Infineon proposes PrimePACK™ modules (with IGBT5 and .XT joining technology) in the PrimePACK™ 2 and PrimePACK™ 3+packages.

• FF1200R12IE5 is the first PrimePACK™ 2 product from Infineon with IGBT5 and .XT joining technology. It implements Infineon’s IGBT5 TRENCHSTOP™ and Emitter Controlled 5 diode in 1200V Half-Bridge configuration with a nominal current rating of 1200 A.

Analyzed module

Source: Infineon, Product Brief: “PrimePACK™ with TRENCHSTOP™ IGBT5 .XTThe dawning of a new era”

Analyzed module

Source: Infineon Technologies 2015, PrimePACK™withIGBT5 & .XT, Z. Zhenbo



Company Profile & SupplyChain

Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design


Cost Analysis


Comparison

Related Reports

About System Plus

Cu Terminal leads (x)

FF1200R12IE5 – Optical View©2019 by System Plus Consulting

Nuts M8 (x4)

Terminal Lugs (x7)

x-plated CuBaseplate

IGBT5 (x)

(16x) Diode EC5:

o Dimensions:

xx mm² (xxmm x xxmm)

o Electrical Connection: xx sintering on DBC

+ xx ⌀xxµm wire bonding (.XT Technology)

Ni-plated Cu Baseplate:

o Dimensions:

xxmm x xxmm x xxmm

PrimePACK™2 Packaging:

o Dimensions: 171 mm x 89 mm x 37 mm

Synthesis of the Physical Analysis

Silicone gel NTC

Package Housing

(16x) IGBT5:

o Dimensions:

xx mm² (xxmm x xxmm)

o Electrical Connection: xx on DBC

+ xx ⌀xxµm wire bonding (.XT Technology)

Al2O3 DBC (x)

Al2O3 DBC (x4):

o Total thickness: xx µm

o Electrical Connection:

xx Solder on Baseplate

x Terminal substrate (x)

Nuts M4 (x7)

Diode EC5 (x)






Cost Analysis


Comparison

Related Reports

About System Plus

Package Opening – Disassembling (4/6)

xxx

Housing removal Steps – Optical Views©2019 by System Plus Consulting

Copper terminal leads (x3)

Terminal Lugs (x7)

o The protective gel is following the shape all around the housing borders.This implies that the silicone gel deposition is performed xxx

Protective gel






Cost Analysis


Comparison

Related Reports

About System Plus

Package Opening – Baseplate Dimensions

Baseplate Characteristics

o Dimensions: xxmm x xxmm x xmm

xx mm

xx mm

x m

m

Housing removal Steps – Optical Views©2019 by System Plus Consulting






Cost Analysis


Comparison

Related Reports

About System Plus

DBC – Terminal substrate Wire Bonding:

o x wires

o x bond wire

o .XT Technology

o Diameter: x µm

o Average length: x mm

o Total Number: x

DBC -to next- DBC Wire Bonding:

o x between the x DBCs of dies.

o x bond wire

o .XT Technology

o Diameter: x µm

o Average length: x mm

o Total Number: x

Wire Bonding (2/3)

Wire bonding – Optical View©2019 by System Plus Consulting

DBC – Terminal substrate

wire bond (x)

DBC -to next- DBCwire bond (x)






Cost Analysis


Comparison

Related Reports

About System Plus

Package Cross-Section

Package Cross-section (Tilted) – Optical View©2019 by System Plus Consulting

Cu Baseplate

xx xx

xxx

Al2O3

xxx

CuAlumina DBC

Cu

xxx

xxx






Cost Analysis


Comparison

Related Reports

About System Plus

Package Cross-Section – DBC Thickness

xx

xx

xx

xx

xx

xx

xxx

DBC Thickness:

o (Cu/Al2O3/Cu) DBC

o Top Cu layer: xx µm

o Al2O3 layer: xx µm

o Bottom Cu layer: xx µm

o Total DBC substrate: xx µm

DBC solder:

o Material: xx (xx)

o Thickness: xx µm

xx

xx µm

xx µm

xx µm

xx µm

xx






Cost Analysis


Comparison

Related Reports

About System Plus

Si IGBT - Die Dimensions

IGBT Die – Optical View©2019 by System Plus Consulting

o Die dimensions: xx mm² (xx x xx)

xx m

m

xx mm

xx pad

xx pad






Cost Analysis


Comparison

Related Reports

About System Plus

Die Process – Delayering

Die Delayering – Optical View©2019 by System Plus Consulting

Before delayering xx removal xx removal

xx xx

Xx removal






Cost Analysis


Comparison

Related Reports

About System Plus

Die Process – Delayering

Die Delayering (Cu removal) – Optical View©2019 by System Plus Consulting

Die Delayering (Cu, Ti, W removal) – SEM View©2019 by System Plus Consulting

xx µm

o Transistor pitch: xx µm






Cost Analysis


Comparison

Related Reports

About System Plus

Die Cross-Section – Ring

Die Cross-Section – Optical View©2019 by System Plus Consulting

xx

xxx

xx

xx

xx

xx µm

xx µm

o Guard Ring: xx µm






Cost Analysis


Comparison

Related Reports

About System Plus

Die Cross-Section – Optical View©2019 by System Plus Consulting

Die Cross-Section

xx

xx

xxx

Die Cross-section – SEM View©2019 by System Plus Consulting

xx

xx

xx

xx

xx

xx µm

xx µm

xx µm

xx µmxx

xx

xxx

xx

xx

xx




Physical Analysis

Manufacturing Process Flowo Si IGBT Fab Unito Si IGBT Process Flowo Si Diode Fab Unito Si Diode Process Flowo Packaging Fab Unito Packaging Process Flow

Cost Analysis


Comparison

Related Reports

About System Plus

IGBT Process Flow (2/4)

Frontside

• LOCOS (Oxide #1 formation)

Frontside

• xx

• Poly

Frontside

• xx

• Oxide xx

Drawing not to Scale

xxxx

xx




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Si Diode Process Flow (1/2)

Frontside

• xx

• xx

Frontside

• Oxide

Frontside

• xx


xx

xx

xx

xx




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Module Process Flow




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Module Process Flow (3/4)

Xx welding of terminals on

DBC

• xx Welding of terminals: xx

Placement

• Housing is xxx

Placement

• xxx





Physical Analysis


Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost


Comparison

Related Reports

About System Plus

IGBT Front-End Cost

The Front-End cost ranges from $xx to $xx according toyield variations.

The main part of the wafer cost is due to the xx (xx%)followed by the xx cost (xx%) .




Physical Analysis




Comparison

Related Reports

About System Plus

IGBT Wafer Cost Per Process Steps




Physical Analysis




Comparison

Related Reports

About System Plus

Packaging Assembly Cost




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Estimated Manufacturer Price

The module manufacturing cost ranges from$xx to $xx according to yield variations.

By taking into account a gross margin of xx%for Infineon (2018 results), the module sellingprice is estimated to range from $xx to $xxaccording to yield variations.




Physical Analysis


Cost Analysis


Comparisono Comparison between

IGBT3, IGBT4 and IGBT5 from Infineon

Related Reports

About System Plus

IGBT3 vs IGBT4 vs IGBT5 from Infineon

IGBT4 – SEM View©2019 by System Plus Consulting

Infineon IGBT IGBT3 (600V) IGBT4 (1200V module) IGBT5 (1200V module)

Wafer thickness (µm) xx xx xx

Metal contact layer (µm) xx xx xx

Pitch (µm) xx xx xx

Trench depth (µm) xx xx xx

Trench oxide thickness (µm) xx xx xx



xx xx xx

xx xx




Physical Analysis


Cost Analysis


Comparisono Comparison between

IGBT3, IGBT4 and IGBT5 from Infineon

Related Reports

About System Plus

IGBTx – SEM View©2019 by System Plus Consulting



IGBT3 vs IGBT4 vs IGBT5 from Infineon

o As the IGBT3 and IGBT4, the IGBT5 technology from Infineon is based on xx xx. The xx region are xx

o The main evolution from IGBT3/4 to IGBT5 technology is xx

o The xx contact layer in the IGBT5 module is xx since the xx

o For a same voltage of xx, xx

Infineon IGBT IGBT3 (xxV) IGBT4 (xxV module) IGBT5 (xxV module)

Current of Inverter’s IGBT (A) xx xx xx

Die area (mm²) xx xx xx

Current density (A/mm²) xx xx xx

Die cost ($) xx xx xx

Die Ampere cost ($/A) xx xx xx




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

POWER SEMICONDUCTORS & COMPOUND• ABB LinPak 1700V 2x1000A Power Module• 1200V Silicon IGBT vs SiC MOSFET Comparison 2018• Infineon FS820R08A6P2B HybridPACK Drive IGBT Module• Infineon EconoPACK4™ 1200V IGBT4 Module• Infineon FS600R07A2E3 HybridPACK2 100KW 3-phase

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

POWER ELECTRONICS & COMPOUND SEMI• Status of the Power Electronics Industry 2019• Status of the Power Module Packaging Industry 2019

https://www.systemplus.fr/reverse-costing-reports/infineon-fs820r08a6p2b-hybridpack-drive-igbt-module/https://www.systemplus.fr/reverse-costing-reports/infineon-fs820r08a6p2b-hybridpack-drive-igbt-module/https://www.systemplus.fr/reverse-costing-reports/1200v-silicon-igbt-vs-sic-mosfet-comparison-2018/https://www.systemplus.fr/reverse-costing-reports/1200v-silicon-igbt-vs-sic-mosfet-comparison-2018/https://www.systemplus.fr/reverse-costing-reports/abb-linpak-1700v-2x1000a-power-module/https://www.systemplus.fr/reverse-costing-reports/abb-linpak-1700v-2x1000a-power-module/https://www.systemplus.fr/reverse-costing-reports/abb-linpak-1700v-2x1000a-power-module/https://www.systemplus.fr/reverse-costing-reports/1200v-silicon-igbt-vs-sic-mosfet-comparison-2018/https://www.systemplus.fr/reverse-costing-reports/infineon-fs820r08a6p2b-hybridpack-drive-igbt-module/https://www.systemplus.fr/reverse-costing-reports/infineon-econopack4-1200v-igbt4-module-2/https://www.systemplus.fr/reverse-costing-reports/infineon-fs600r07a2e3-hybridpack2-100kw-3-phase/https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/


COMPANYSERVICES




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Pluso Company Serviceso Contact

Business Models Fields of Expertise

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Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Pluso Company Serviceso Contact

Contact

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