influence of electrical process parameters
TRANSCRIPT
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8/10/2019 Influence of Electrical Process Parameters
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Review
A review on inuence of electrical process
parameters in EDM process
T. Muthuramalingam a,*, B. Mohan b
aDepartment
of
Production
Technology,
M.I.T.
Campus,
Anna
University,
Chennai,
IndiabDepartment
of
Mechanical
Engineering,
CEG
Campus,
Anna
University,
Chennai,
India
1. Introduction
Electrical discharge machining (EDM), otherwise known as
thermal
erosion
process,
is
one
of
the
non-conventional
machining processes, where tool and workpiece do not come
into contact with each other during the machining process. The
progression of events constituting the process of material
erosion
from
the
work
surfaces
by
an
electrical
discharge
machining
can
be
explained
in
the
following
way.
If
an
appropriate voltage is developed across the tool electrode
(normally cathode) and the workpiece (normally anode), the
breakdown of dielectric medium between them happens due to
the growth of a strong electrostatic eld. Owing to the electric
eld, electrons are emitted from the cathode toward the anode
on
the
electrode
surfaces
having
the
shortest
distance
between
them. These electrons impinge on the dielectric molecules of
the
insulating
medium,
breaking
these
dielectric
uid
mole-
cules into positive ions and electrons. These secondary
electrons travel along on the same ionization path. This event
causes an increase in the electric eld strength across the work
surfaces
and
liberates
a
large
number
of
electrons.
It
creates
an
ionized
column
in
the
shortest
spark
gap
between
the
tool
electrode and the workpiece, thereby decreasing the resistance
of the uid column and causing an electrical discharge in the
shortest distance point between the tool and the workpiece. The
a r ch i ve s o f c i vi l a n d m e ch a ni c al e n gi n ee r in g x x x ( 2 01 4 ) x x x x xx
a
r
t
i
c
l
e
i
n
f
o
Article history:
Received 12 July 2013
Accepted 16 February 2014
Available online xxx
Keywords:
EDM
EWR
Discharge
MRR
Surface
a
b
s
t
r
a
c
t
Since the thermal energy produced in electrical discharge machining process is due to the
appliedelectrical energy, it is veryimportant to enhance theelectrical processparameters to
improve theprocess efciency. Thepresent study discusses about havingan overview of the
EDM process, modeling of processparameters, and inuence of process parameters such as
input electrical variables, pulse shape, anddischargeenergy onperformance measures such
as material removal rate, surface roughness and electrode wear rate. This study also
discusses about controlling the electrical process parameters, and empirical relationships
between processparameters and optimization of process parameters in EDM process. From
the review results, it has been observed that the efcacy of the machining process can be
improved by electrical process parameters, and only less attention has been given for
enhancing such parameters.
# 2014 Politechnika Wrocawska. Published by Elsevier Urban & Partner Sp. z o.o. All
rights reserved.
* Corresponding author. Tel.: +91 9994872013; fax: +91 4422232403.
E-mail addresses: [email protected], [email protected] (T. Muthuramalingam), [email protected] (B. Mohan).
ACME-201; No. of Pages 8
Please cite this article in press as: T. Muthuramalingam, B. Mohan, A review on inuence of electrical process parameters in EDM process,Archives of Civil and Mechanical Engineering (2014), http://dx.doi.org/10.1016/j.acme.2014.02.009
Available online at www.sciencedirect.com
ScienceDirect
journal homepage: http://www.elsevier.com/locate/acme
http://dx.doi.org/10.1016/j.acme.2014.02.009
1644-9665/# 2014 Politechnika Wrocawska. Published by Elsevier Urban & Partner Sp. z o.o. All rights reserved.
http://dx.doi.org/10.1016/j.acme.2014.02.009mailto:[email protected]:[email protected]:[email protected]://dx.doi.org/10.1016/j.acme.2014.02.009http://www.sciencedirect.com/science/journal/16449665http://www.elsevier.com/locate/acmehttp://dx.doi.org/10.1016/j.acme.2014.02.009http://dx.doi.org/10.1016/j.acme.2014.02.009http://www.elsevier.com/locate/acmehttp://www.sciencedirect.com/science/journal/16449665http://dx.doi.org/10.1016/j.acme.2014.02.009mailto:[email protected]:[email protected]:[email protected]://dx.doi.org/10.1016/j.acme.2014.02.009 -
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enormous thermal energy melts and vaporizes the materialfrom
the
workpiece,
which
creates
a
small
crater
over
the
work
surface. There happened a collapse of the ionized column with
the termination of the electrical energy by means of the
switching circuit and then surrounding dielectric uid occupies
its
place.
The
melted
debris
is
removed
by
the
ushing
process.
The conduction of dielectric medium can be determined by the
current,
duration
and
pulse energy
[1].
Fig.
1
explains
the
formation of ionized column in the shortest distance of work
surfaces using the EDM process [1].
2. State of art in EDM process
Since the electrical discharge machining process is of with
non-linear
nature,
it
requires
a
lot
of
improvements
on
it.
Many authors have discussed about the research works for
improving process efciency of the EDM process. The funda-
mentals of EDM process mechanism and research works
carried out from the inception to the development of the die-
sinking EDM process within the past decade have been
discussed
by
Ho
and
Newman
[2]. It
has
been
reported
and
discussed
about
the
EDM
researches
relating
to
improve
the
process performance measures, optimizing the process vari-
ables, and monitoring and control of the sparking process.
Abbas et al. presented the recent research trends to improve
the performance characteristics involved in all the aspects ofelectrical discharge machining process. They discussed about
the need for controlling the process parameters to enhance the
machining process efciency of the EDM process [3]. The
development of new technologies for improving the surface
quality of workpiece is a signicant research area in EDM
process.
Kumar
et
al.
presented
a
review
on
the
phenomenon
of surface modication by EDM and future trends of its
applications [4]. It has been observed that most of the research
works concentrated on surface modication using the powder
mixed
dielectric
medium
in
EDM
process.
The
study
of
the
impact of the electrical process parameters on surface
modication of the workpiece has been taken up by very
few researchers.
3. Enhancing the performance of pulsegenerator
Since the electrical energy is supplied to the EDM process
informing the DC pulses, the pulse generator needs to be
upgraded
to
improve
the
performance
measures
in
the
machining process. The lower energy pulses enhance thesurface nish of the workpiece whereas the higher energy
pulses improve the material removal rate.
Jahan
et
al.
conducted
a
detailed
experimental
investiga-
tion
to
nd
out
the
inuence
of
major
operating
parameters
on
surface quality of tungsten carbide with both transistor and
RC-type generators in EDM process [5]. It has been proved that
RC pulse generator has produced a smoother surface nish
than the transistor pulse generator due to its lower discharge
energy
distribution
over
the
surface
of
tungsten
carbide.
Han
et
al.
designed
and
developed
a
modied
transistor
pulse
generator with pulse frequency of 1 MHz to produce higher
material removal rate than the RC pulse generator in the
electrical discharge machining process [6]. They found that thetransistor
pulse
generator
has
provided
two
or
three
times
higher machining speed than the conventional RC pulse
generator while machining tungsten workpiece with brass
electrode.
A
pulse
generator
based
on
xed
pulse
width
modulation
has been developed by Yan and Liu to generate the high
frequency
4.4
MHz
and
short
duration
pulse
control
signals
to
reduce surface roughness of the workpiece tungsten carbide in
the EDM process [7]. From the experimental results, it has been
observed that the very low discharge energy pulse applied
between
tool
and
electrode
has
improved
the
surface
quality
of
workpiece during the machining process. Yan and Chiang
discussed about the development and application of a newpower supply in wire electrical discharge machining process
[8].
A transistor-controlled power supply composed of a low
energy discharge circuit has been designed to provide the
functions of high frequency and lower energy pulse control.
The experimental results have shown that the low peak
current has been resulted in better surface nish in EDM
process.
Muthuramalingam
and
Mohan
discussed
about
effect
of
uniform
distribution
for
improving
the
surface
quality
using
iso current pulse generator in EDM process [9]. Fig. 2 shows the
surface quality of workpiece made by three different pulse
generators. It has been observed that the iso current pulse
generator could produce better surface nish than theconventional pulse generators such as RC pulse generator
and transistor pulse generator.
Han et al. designed and developed a new transistor type
pulse generator with high frequency response to produce
higher erosion rate of the workpiece in the electrical discharge
machining
process
[10]. From
the
experimental
results,
it
has
been observed that the modied transistor pulse generator has
produced 24 times higher material removal rate than the RC
pulse generator in the EDM process. Yan and Lai presented the
development
of
a
ne-nish
power
supply
with
high
frequen-
cy in EDM process [11]. This power supply has been composed
with full bridge circuit, two snubber circuits and a pulse control
circuit. It has been found that the proposed power supply has
Fig. 1 Basic mechanism involved in EDM.
a rc h iv es o f c i vi l a n d m e ch an i ca l e n gi ne e ri n g x xx ( 2 01 4 ) x xx x x x2
ACME-201; No. of Pages 8
Please cite this article in press as: T. Muthuramalingam, B. Mohan, A review on inuence of electrical process parameters in EDM process,Archives of Civil and Mechanical Engineering (2014), http://dx.doi.org/10.1016/j.acme.2014.02.009
http://dx.doi.org/10.1016/j.acme.2014.02.009http://dx.doi.org/10.1016/j.acme.2014.02.009 -
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produced
lower
discharge
energy
and
thus
contributed
to
lower surface roughness. Muthuramalingam and Mohan
developed a semiconductor based pulse switching circuit to
produce lower energy discharge pulses during nishing levelof
the
process
for
enhancing
the
EDM
performance
character-
istics [12]. Casanueva et al. attempted to establish a new EDM
impulse generator based on high frequency switched DC-to-
DC series-parallel resonant converter [13]. It has been claimed
that
the
capacitance
effect
has
affected
the
overall
impedance
of the EDM arrangement and thus altered the machining
characteristics
of
EDM
process.
4. Inuence of pulse shape on performancemeasures
Studying the variation of the EDM process response char-acteristics due to change in shape of the generated pulse is one
of
the
research
aspects
in
the
EDM
process.
The
discharge
pulse shape affects the average spark energy which is
delivered on the surface. Since the machining characteristics
in EDM process depend on the electrical energy, the pulse
shape which has an effect on the machining characteristics
such as material removal rate, surface quality and electrode
wear
rate
as
shown
in
Fig.
3.
The
effects
of
the
voltage
excitation
of
the
pre-ignition
spark pulse on the performance measures such as material
removal rate, electrode wear rate and average surface
roughness have been discussed by Ghoreishi and Tabari
[14]. Based on the results, it is clear that applying voltageexcitation of the pulse has produced an effective pulse which
in turn increased material erosion and surface quality. The
inuence of the current impulse on machining tungsten
carbide
and
SKD
die
steel
with
electrolytic
copper
tool
electrode in the EDM process has been investigated by Tsai
and Lu [15]. From the experimental results, it has been found
that the material removal rate and tool wear rate have beenaffected
by
the
energy
density.
Muthuramalingam
and
Mohan
discussed about inuence of discharge current impulse on the
performance measures in EDM process [16].
Son et al. investigated the inuences of electrical pulse
condition
on
the
machining
characteristics
in
the
EDM
process
[17]. It has been found that the duration of pulse considerably
affects
the
machining
characteristics
such
as
material
removal
rate, tool wear rate and surface accuracy. It has also been
realized that the shorter EDM pulse could be efcient to make a
precision part. Liu et al. described the inuence of the EDM
discharge
pulse
shape
on
the
machining
characteristics
such
as material removal mechanism of Si3N4TiN [18]. The surface
texture of machined workpiece has been investigated withdifferent form of discharge pulse such as relaxation and iso
current
pulse.
It
has
been
proved
that
uniform
discharge
energy has produced good surface topography.Janardhan and
Samuel analyzed the effect of machining parameters on
material removal rate and average surface roughness using
the pulse train data acquired at the spark gap with the help of
MATLAB software package [19]. It has been observed that the
material
erosion
rate
has
been
increased
with
decrease
in
the
pulse
off
time
in
EDM
process.
Yeo
et
al.
proposed
a
new
pulse
discriminating technique for monitoring electrical discharge
machining process [20]. This system has employed the current
pulse as the main detecting parameter as it has been
considered to be a better representation of the spark energyinside the plasma channel as compared to the voltage. There
should be less arcing effect to enhance the surface nish for an
ideal EDM process. Muthuramalingam and Mohan discussed
and proved that the uniform duration pulse shape for the
discharging phenomenon in EDM process has improved the
surface
quality
of
the
workpiece
with
less
arcing
effect
[21].
5. Inuence of electrical process parameterson
performance
measures
There are many research works that have been conducted to
nd the inuence of process parameters especially electrical
Fig. 2 Surface topography of machined surface using different pulse generators.
Fig. 3 Relation between pulse shape and machining
characteristics in EDM process.
a rc h iv e s o f c i vi l a nd m ec h an ic a l e ng i ne e ri n g x xx ( 2 01 4 ) x x x xx x 3
ACME-201; No. of Pages 8
Please cite this article in press as: T. Muthuramalingam, B. Mohan, A review on inuence of electrical process parameters in EDM process,Archives of Civil and Mechanical Engineering (2014), http://dx.doi.org/10.1016/j.acme.2014.02.009
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process parameters on EDM process. Most of the researchworks
reveal
that
the
discharge
current
and
machining
time
have the most inuencing nature on the EDM performance
measures. Fig. 4 shows the SEM images of EDM surface while
machining AISI 202 stainless steel with tungsten carbide tool
electrode.
Gostimirovic et al. investigated the effects of electrical
process
parameters
on
the
performances
of
die-sinking
electrical discharge machining process with RC pulse generator
while machining manganese-vanadium tool steel workpiece
using graphite tool electrode. They found that the discharge
current
and
pulse duration
have
highly
inuenced
the
material
removal rate of the EDM process [22]. Mohan et al. analyzed the
effect of EDM process parameters such as electrode material,polarity, pulseduration, current and rotation of the electrode on
the
material
removal
rate,tool
wear
rate
and
surface
roughness
[23]. It has been found that the material removal rate and tool
wear rate have been increased with the discharge current during
machining process. Nowicki et al. analyzed the effects
individual electrical discharge on the crater volume of the
workpiece in EDM process [24]. They found that the crater
surface
exhibits
strong
interaction
with
the
electrical
discharge
spark.
Mohan
et
al.
investigated
the
surface
roughness
of
the
SiC/6025Al composite surface using electrical discharge ma-
chining process with brass as the tool electrode [25]. From the
experimental results, it has been observed that increasing peak
current has resulted in higher surface roughness during themachining process.
Seo et al. discussed about the drilling process of a
functionally graded 1535 vol.% of silicon carbide particulate
reinforced Al359 metal matrix composite byelectrical discharge
machining process to assess the machinability and workpiece
quality
[26].
It
has
been
observed
that
the
peak
current
and
pulse
on time have increased the material removal rate. It has also
been reported that increase in percentage SiC particles has
increased the material removal rate and electrode wear rate.
Puertas
et
al.carried
out
a
study
on
the
inuence
of
the
factors
of
current intensity, pulse time and duty cycle over the material
removal rate, surface quality and electrode wear rate [27]. They
modeled the relationship between the input parameters and
response
parameters
in
the
die-sinking
EDM
process
using
response surface methodology. It has been concluded that the
lower values of the current intensity and the machining time
have to be used in order to obtain a good surface nish. The use
of the dimensional analysis for investigating the effects of the
electrical and the physical parameters on the material removal
rate
of
a
die-sinking
EDM
process
has
been
described
by
Yahya
and Manning [28]. From the experimental results, it has beenfound that the material removal rate has been increased with
discharge current, gap voltage and pulse on time.
Huang
et
al. made
an
attempt
to
unveil
the
inuence
of
the
process
parameters
on
the
machining
performances
in
the
EDM
process [29]. It has been found that the pulse on time and spark
gap have the most signicant nature to affect the performance
measures such as surface roughness and white layer depth
using numerical analysis. Kuppan et al. reported about the
experimental
investigation
of
small
deep
hole
drillingof
Inconel
718
with
electrolytic
copper
tool
electrode
using
the
electrical
discharge machining process [30]. The experimental results
have shown that the material removal rate has been increased
with the increase in the peak current and duty factor. Patel et al.investigated
the
feasibility
of
fabricating
micro holes in
SiCpAl
composites using electrical discharge machining with a rotary
tube electrode [31]. They have investigated the material removal
rate, electrode wear rate and hole tapper as the responses for the
study.
The
experimental
results
have
revealed
that
pulse on
duration has signicantly affected the response characteristics
involved
in
EDM
process.
Pelicer
et
al.
focused
on
investigating
the inuence of EDM process parameters and electrode
geometry on feature micro accuracy on tool steel for mold
fabrication purposes [32]. A set of designed experiments with
varying
process
parameters
such
as
pulse current,
open
voltage
and pulse duration have been carried out in H13 steel using
different shaped copper electrodes. It has been concluded thatthe triangular shaped electrode would produce highly inef-
cient
output,
since
the
fast
wearing
nature
of
the
electrode
edges. Wang et al. carried out a series of experiments to
investigate the impacts of machining polarity, electrode
rotation speed and nominal capacitance on the material
removal rate and tool wear rate with poly crystalline diamond
[33]. It has been demonstrated that favorable machining
performance
of
EDM
process
on
the
workpiece
could
be
achieved
in
tool
with
negative
polarity
as
compared
to
the
positive polarity.
Tosun et al. presented an investigation on the effect and
optimization of machining parameters on kerf and material
removal rate in wire EDM process with Taguchi method [34].Theexperimental studies have been conducted under varyingpulse
duration, gap voltage, wire speed and ushing pressure with
AISI 4140 steel as workpiece material. Based on the ANOVA
method, the high effective parameter on both kerf and material
removal rate has been found as pulseduration.Ji et al. presented
a
new
process
of
machining
SiC
ceramics
using electrical
discharge milling process [35]. The effects of tool polarity, pulse
duration, voltage and peak current on the process performances
such as material removal rate, electrode wear rate and surface
roughness
have
been
investigated.
It
has
been
found
that
the
negative polarity tool electrode with longer pulse duration has
produced high material removal rate and surface roughness.
Rebelo et al. presented an experimental study on the effect of
Fig.
4
SEM
images
of
surface
using
EDM
process.
a rc h iv es o f c i vi l a n d m e ch an i ca l e n gi ne e ri n g x xx ( 2 01 4 ) x xx x x x4
ACME-201; No. of Pages 8
Please cite this article in press as: T. Muthuramalingam, B. Mohan, A review on inuence of electrical process parameters in EDM process,Archives of Civil and Mechanical Engineering (2014), http://dx.doi.org/10.1016/j.acme.2014.02.009
http://dx.doi.org/10.1016/j.acme.2014.02.009http://dx.doi.org/10.1016/j.acme.2014.02.009 -
8/10/2019 Influence of Electrical Process Parameters
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electric
discharge
machining
parameters
on
material
removal
rate and surface quality with high strength copperberyllium
alloys [36]. They found that the plasma diameter has been
decreased with pulseduration and discharge current during the
machining process.
Yu et al. examined the use of electrical discharge machin-
ing
on
machining
poly-crystalline
silicon
[37]. The
effects
of
different WEDM process parameters on machining character-istics have been explored. From the experimental results, it
has been indicated that the pulse on time has the great
inuence
on
the
cutting
speed
in
Wire
EDM
process.
Batish
et
al.
investigated
the
effect
of
process
parameters
and
mechanism of material deposition in electric discharge
machining on surface properties of EN31, H11 and high carbon
high chromium die steel materials [38]. It has been discussed
about material transfer mechanism involved in EDM process.
It
has
been
found
that
die
steels
have
been
machined
effectively
with
copper
tool
electrode
using
EDM
process.
Patel et al. presented a detailed experimental investigation of
machining characteristics such as surface integrity and
material removal mechanisms of advanced ceramic compos-ite
Al2O3SiCwTiC with EDM process [39]. It has been
concluded that the surface roughness and material removal
rate have been increased with pulse duration in EDM process.
6. Inuence of discharge energy onperformance measures
In view of the fact that when the discharge energy is converted
into the thermal energy to melt and vaporize the material in
EDM
process,
it
is
unavoidable
to
discuss
the
inuence
of
the
pulse energy on the machining characteristics in such a
process.Jahan et al. conducted an experimental investigation with
the
view
of
obtaining
ne
surface
nish
in
die-sinking
EDM
process of tungsten carbide using different tool electrodes
such as tungsten, copper tungsten and silver tungsten [40]. It
has been found that the surface nish has been inuenced by
the discharge energy during machining process. It has been
realized that the lower discharge energy has produced good
surface
nish.
Yeo
et
al.
discussed
about
the
machining
of
zirconium
based
bulk
metallic
glass
by
EDM
process
with
different tool electrodes such as copper, brass and tungsten
rod electrode [41]. The experimental results have shown
that the usage of lower input energy has produced the
lower surface roughness and electrode tool wear. Khanraet al. investigated the inuence of energy input on the
workpiece surface during the machining in the EDM process.
In this experimental investigation, a well-polished mild steel
(C 0.18%) plate has been used for machining byEDM [42]. It has
been observed that the energy input has inuenced the debris
particle
size
in
the
EDM
process.
Popa et al. showed the importance of optimizing the
process parameters that could inuence the quality of the EDM
process [43]. They formulated the equation of crater depth in
terms
of
discharge
energy
in
EDM
process.
From
the
relation,
it
has been observed that the crater depth has been increased
with the discharge current owing through the workpiece and
tool electrode. Kojima et al. described about the spectroscopic
measurement
of
arc
plasma
diameter
in
EDM
[44]. They
found
that the arc plasma has been increased with increasing
discharge current. It has been veried that crater diameter and
depth decrease with increasing gap width due to the increased
plasma diameter. The arc plasma diameter has been increased
with increasing spark gap and thus claried the reason for
lower
material
removal
rate
and
smoother
surface
nish
with
longer spark gap. Wong et al. developed a single spark pulsegenerator using resistancecapacitance arrangement to study
the erosion characteristics in the EDM process from the crater
size
[45].
The
volume
and
size
of
the
craters
have
been
found
to
be
more consistent at lower energy discharge sparks than the
higher energy discharge sparks. The higher energy pulse leads
to the micro surface crack on the work surface. Guu et al.
aimed to investigate the machining characteristics of manga-
nesezinc ferrite magnetic materials using electrical discharge
machining
process
[46]. The
experimental
results
have
indicated that the morphology of debris revealed the mecha-
nism of material removal. It has been observed that the better
machined surface has been obtained by setting processparameters
at
low
pulse
energy.
Nowicki
et
al.
made
an
attempt to machine supercial layer of the workpiece using
brush EDM process by modifying the spark energy [47]. The
theoretical modeling of the EDM process based upon the heat
transfer
equations
has
been
established
by
Singh
[48]. In
the
study, the input energy equation has been developed as a
function
of
pulse
duration,
current,
polarity
of
electrode
and
properties of the workpiece and tool electrodes. This model
has been helpful to calculate the optimal process parameters
for obtaining optimum discharge energy.
7.
Monitoring
and
control
of
the
EDM
process
The
EDM
process
parameters
have
to
be
monitored
during
the
machining process so that the controlling of those parameters
can be done to obtain the required response parameters. The
main action of monitoring and controlling the process is to
observe and measure process parameters to reduce the
deviation of performance measures from the expected level.
An
adaptive
control
system
for
process
monitoring,
identication
and
control
in
the
wire
electrical
discharge
machining process has been developed by Yan [49]. It has been
realized that the wire breaking has been controlled by
adjustment of pulse interval of each pulse cycle of supply.
Caydas et al. developed an adaptive neuro-fuzzy inferencesystem model for the prediction of the surface roughness of
machined surface using wire EDM process as a function of
process parameters such as open circuit voltage, pulse
duration and wire feed rate [50]. From the experimental
results, it has been found that the proposed control system has
improved
the
surface
quality
in
EDM
process.
Yilmaz et al. introduced a used friendly intelligent system
based on the knowledge of the skilled operators for the
selection of the EDM process parameters for machining AISI
4340
stainless
steel
[51]. The
system
has
been
provided
with
a
compact selection tool based on expert rules and enabled an
unskilled user to select necessary parameters which lead to
lower electrode wear rate and better surface quality. Zhou and
a rc h iv e s o f c i vi l a nd m ec h an ic a l e ng i ne e ri n g x xx ( 2 01 4 ) x x x xx x 5
ACME-201; No. of Pages 8
Please cite this article in press as: T. Muthuramalingam, B. Mohan, A review on inuence of electrical process parameters in EDM process,Archives of Civil and Mechanical Engineering (2014), http://dx.doi.org/10.1016/j.acme.2014.02.009
http://dx.doi.org/10.1016/j.acme.2014.02.009http://dx.doi.org/10.1016/j.acme.2014.02.009 -
8/10/2019 Influence of Electrical Process Parameters
6/8
Han
developed
an
adaptive
control
system
which
directly
and
automatically has regulated the tool down time for improving
the process performance in EDM process [52]. It has been
observed that this adaptive system would improve the
machining rate, due to the automatic adjustment of spark
gap. Yan and Chien developed a new pulse discriminating and
control
system
for
process
monitoring
in
EDM
process
[53].The
effects of pulse interval, machining feed rate and workpiece onthe variation of the proportion of normal spark, arc and short
circuit in the total spark have been discussed. The experimen-
tal
results
have
indicated
that
the
developed
control
system
has
signicantly
reduced
the
arc
discharge
in
EDM
process
to
achieve stable machining.
Chang designed a proportional derivative controller of the
spark gap between an electrode and a workpiece to analyze the
non-linearity involved in EDM process [54]. They concluded
that
this
non-linearity
has
reduced
the
effective
discharge
in
electrical
discharge
machining
process.
Behrens
and
Ginzel
proposed a neuro-fuzzy based gap width controller for a highly
efcient removal mechanism in EDM process [55]. The
experimental results have indicated that the proposedcontroller
has
enhanced
EDM
process
to
achieve
the
better
surface nish of workpiece. Kao and Shih monitored the
discharge current in electrical discharge machining using high
speed data acquisition with high frequency response [56].
From
the
experimental
results,
it
has
been
found
that
decrease
in air gap between tool and workpiece has improved the
material
removal
rate
in
EDM
process.
Tong et al. designed an experimental system with a macro/
micro dual feed spindle to improve the machining perfor-
mance of servo scanning micro EDM process, which utilized an
ultrasonic
linear
motor
as
the
macro
drive
and
a
piezoelectric
actuator as micro feeding mechanism [57]. Based on LabVIEW
software package, a real time control system has beendeveloped to control coordinately the dual-feed spindle to
drive
the
tool
electrode.
Fenggou
and
Dayong
presented
a
method to automatically determine and optimize the process
parameters on the EDM sinking process with the application of
articial neural network [58]. The experimental results have
proved that automatic determination of current value would
be the efcient method on improving EDM performance.
8. Modeling of EDM process parameters
The process parameters modeling helps to analyze the
inuence process parameters on the machining character-istics in any of the machining process. This section is
discussed about the mathematical modeling of process
parameters and simulation models in the EDM process.
8.1.
Theoretical
modeling
of
EDM
process
Since the two electrical conductors such as tool electrode and
workpiece are separated by a dielectric medium, the EDM
arrangement can be modeled as a capacitor. Liu et al.
constructed
a
plate
capacitor
model
for
electrical
discharge
machining process [59]. The correlation actions of process
parameters and energy distribution have been discussed
based on the eld electron emission theory. It has been
observed
that
machining
time
plays
a
major
role
to
improve
the process efciency. Das andJoshi developed a comprehen-
sive mathematical model to predict the spark erosion rate
involved in EDM process [60]. They found that the plasma
current and plasma radius have been increased with pulse
duration. Salonitis et al. developed the thermal based model
for
the
determination
of
the
material
removal
rate
and
average
surface roughness achieved as a function of the processparameters in the EDM process [61]. Spadlo et al. developed a
thermo model for brush electrical discharge alloying process
[62].
It
has
been
realized
that
material
removal
depends
on
the
discharge
current
pulse
owing
through
the
dielectric
medi-
um.
8.2.
Optimization
of
EDM
process
Most
of
the
research
works
have
been
carried
out
to
optimize
the
electrical
process
parameters
in
EDM
process.
Marafona
and Wykes described an investigation into the optimization of
material removal rate in the electric discharge machining
process with copper tungsten tool electrode [63]. From theexperimental
results,
it
has
been
proved
that
large
current
intensity would result in higher material removal rate.
Matoorian et al. presented the application of the Taguchi
robust design methods to optimize the precision and accuracy
of
the
EDM
process
for
machining
of
precise
cylindrical
forms
on hard and difcult-to-machine materials [64]. They found
that
the
current
intensity
of
the
EDM
process
affects
the
material removal rate greatly. Muthuramalingam and Mohan
developed Taguchi-DEAR methodology based optimization of
electrical process parameters [65]. Tzeng and Chen described
about
the
application
of
the
fuzzy
logic
analysis
coupled
with
Taguchi methods to optimize the precision and accuracy of the
high speed electrical discharge machining process [66]. Themost important factors affecting the precision and accuracy of
the
high
speed
EDM
process
have
been
identied
as
duty
cycle
and peak current. Kuriakose and Shunmugam developed a
multiple regression model to represent relationship between
the input and output process variables [67]. They have done
the multi objective optimization method based on non-
dominated sorting genetic algorithm to optimize the EDM
process
parameters.
9. Conclusion
The present study discussed about the review of contributionof electrical process parameters for efcient EDM process in
various aspects such as state of art, inuence of the discharge
energy, modeling of EDM process parameters, pulse genera-
tors, pulse shape, monitoring the parameters and optimiza-
tion of EDM process parameters. The review has been carried
out
in
all
aspects
and
types
of
EDM
process
such
as
die-sinking
EDM, wire EDM and micro EDM. The following conclusions can
be mainly made based on the literatures:
(i)
Most
of
the
literatures
have
discussed
about
inuence
of
process parameters on the performance measures,
modeling and optimization of process parameters in-
volved in the electro erosion process.
a rc h iv es o f c i vi l a n d m e ch an i ca l e n gi ne e ri n g x xx ( 2 01 4 ) x xx x x x6
ACME-201; No. of Pages 8
Please cite this article in press as: T. Muthuramalingam, B. Mohan, A review on inuence of electrical process parameters in EDM process,Archives of Civil and Mechanical Engineering (2014), http://dx.doi.org/10.1016/j.acme.2014.02.009
http://dx.doi.org/10.1016/j.acme.2014.02.009http://dx.doi.org/10.1016/j.acme.2014.02.009 -
8/10/2019 Influence of Electrical Process Parameters
7/8
(ii)
It
has
been
found
that
peak
current
and
pulse
duration
are
dominating the performance measures in EDM process.
(iii) It has been observed that only less attention has been
given for enhancing the electrical process parameters in
EDM process in terms of pulse modication, monitoring
and adaptive controlling of the process parameters.
(iv)
It
has
also
been
observed
that
only
very
few
literatures
are
available describing the hybrid modern manufacturingtechniques such as electro chemical discharge machining
(ECDM).
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ACME-201; No. of Pages 8
Please cite this article in press as: T. Muthuramalingam, B. Mohan, A review on inuence of electrical process parameters in EDM process,Archives of Civil and Mechanical Engineering (2014), http://dx.doi.org/10.1016/j.acme.2014.02.009
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b.elsevier.com/S1644-9665(14)00046-6/sbref0070http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0100http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0100http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0100http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0100http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0100http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0120http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0120http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0120http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0120http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0120http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0170http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0170http://dx.doi.org/10.1016/j.acme.2014.02.009http://dx.doi.org/10.1016/j.acme.2014.02.009http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0170http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0170http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0165http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0160http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0155http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0150http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0145http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0140http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0135http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0130http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0125http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0120http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0120http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0120http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0115http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0110http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0105http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0100http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0100http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0100http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0095http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0090http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0085http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0080http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0075http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0070http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0070http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0070http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0070http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0065http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0065http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0065http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0060http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0060http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0060http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0060http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0055http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0055http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0055http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0050http://refhub.elsevier.com/S1644-9665(14)00046-6/sbref0050http://refhub.else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a rc h iv es o f c i vi l a n d m e ch an i ca l e n gi ne e ri n g x xx ( 2 01 4 ) x xx x x x8
ACME-201; No. of Pages 8
Please cite this article in press as: T. Muthuramalingam, B. Mohan, A review on inuence of electrical process parameters in EDM process,hi f i il d h i l i i ( ) h //d d i / /j
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