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Mark Tate - Integrating Hybrid Pixel Detectors - BES Detector Workshop 2012 Cornell University
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Integrating Hybrid Pixel Detectors Mark W. Tate
Cornell University
• Intro to Pixel Array Detectors and Integrating PADs
• Survey of Detectors
• Facility Driven Needs
• Areas for R&D
• Summary
Mark Tate - Integrating Hybrid Pixel Detectors - BES Detector Workshop 2012 Cornell University
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Cornell PAD Group
• Actively working on PAD projects at Cornell:
– Darol Chamberlain
– Kate Green
– Marianne Hromalik
– Hugh Philipp
– Prafull Purohit
– Mark Tate
– Joel Weiss
– Sol Gruner
• PAD Design Collaborators:
– Area Detector Systems Corp.
– SLAC
• Past PAD Group Members:
– Dan Schuette
– Alper Ercan
– Tom Caswell
– Matt Renzi
– Guiseppe Rossi
– Sandor Barna
– Bob Wixted
– Eric Eikenberry
– Lucas Koerner
• Support:
– U.S. Dept. of Energy
– U.S. National Inst. Health
– U.S. National Science Found.
– Keck Foundation
Mark Tate - Integrating Hybrid Pixel Detectors - BES Detector Workshop 2012 Cornell University
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Large signal/x-ray Single photon sensitivity possible Energy resolution – w/ pulse height circuitry
Excellent PSF Charge cloud ~ 15 micron spread ** Signal < 10-4 in next pixel
Prompt signal collection ~ several ns collection **
Application specific pixel circuitry Electronic shuttering Photon counting High speed imaging Fast readout (~ msec framing possible) Increased dynamic range In-pixel frame storage Adaptive gain Phase-locked integration ...
Advantages of PADs
2740 20 e- / 10keV x-ray
X-rays
** can change for large pulses
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PADs come in two varieties
Photon counting PADs
• Front ends count each x-ray individually. (PILATUS, Medipix, Timepix, XPAD, etc.) Out growth of HEP.
• Many more are coming, especially from Europe.
• Instantaneous count-rate limited to ~106 -107x-rays/pix/sec.
SLS PILATUS
Integrating PADs • Use an integrating front-end to avoid the count-rate bottleneck.
• Capable of handling enormous count-rate.
• Proper signal recorded across pixel boundaries
• Cornell 100x92 pix prototype, first PAD to be applied.
• Existing variants include CSPAD, MMPAD.
• In the works: Cornell Keck PAD, AGIPD, LPD,
ADSC MM/Digital PAD, SOPHIAS, etc.
Cornell-SLAC LCLS
Cornell 100x92
prototype
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Integrating PAD Advantages: Recording small features at pixel boundaries
MMPAD raw data
Pixel 1
Pixel 2
Pixel 3
X-ray beam
Integrated spot intensity constant through charge sharing region!
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Example: Well Calibrated CCD
Variation of spot intensity over
multiple locations Tate, et al., J. Appl. Cryst. (1995), 28, 196-205.
DQE=(S/Nmeas / S/Nideal)2
There are no noiseless area detectors! Corollary: Every detector is limited in its accuracy.
Lots of reasons: Charge recombination, pixel-to-pixel variations in gain or collection
efficiency, absorption outside active detector region, in-pixel variations in sensitivity, detector gaps, point spread, stability, charge lost to adjacent pixel, etc.
A detector is only as good as it's calibrations. •Careful calibrations do help. Gain variations Image distortions
Geometrical absorption factors
•Fundamental limits to detector calibration. Rarely achieve better than 1% Systematics dominate noise!
Depends on nature of signal - especially challenging Features < 1-2 pixels in size (in-pixel variation in sensitivity) High local count rates (non-linear behavior)
Pixel Array Detectors: Calibration
… but don’t integrating detectors have read/dark noise?
Integrators can be made to threshold for single photons!
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Basic Integrator Front End
• Integration Capacitor Cint
Small - (~50 fF)
Single photon sensitivity
Large (~1 pF)
~104 x-rays full well
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Vref
VHV
Cint
Frame Reset
• Integrator Amplifier
Design to handle expected x-ray flux
e.g. 104 x-rays/s -> 4 A at input
CMOS processes
0.25 m - mature - 3.3V capable
0.18 m - 1.8 to 2.5 V - higher density
…
• Integrator Reset
Electronic shuttering
Sync to beam structure
• Pixel Back End
PAD specific functions
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CB Vb
RE
Output Stage
Input Stage
+60V
Diode
IR
2 pf SE Storage Stage
C1 C2 C3 C4 C5 C6 C7 C8
C1 - C8: 130 fF
Rapid framing (SE, IR closed)
1. select storage cap C1
2. Open IR switch (Frame integration begins)
3. Deselect Storage cap (Integration ends)
4. Close IR
repeat with C2 … C8
Pixel Read (open SE, close RE)
Connect storage caps in sequence with output
Pixels and caps both independently addressable
Rossi, et al., J. Synchr Rad, 6 (1999) 1096.
2x104 x-rays full well 2 x-rays noise 150 ns min frame 600 ns min between frames 150 m pixel
Cornell 100x92 PAD: Microsecond Imaging 8 frame rapid storage
{
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Science with Cornell 100x92 PAD
Trenkle, et al., Applied Physics Letters (2008), 93, 081903
Reactive foil dynamics @ 50 s w/ Hufnagle Group, Johns Hopkins
Cai, et al., Appl. Phys. Lett., 83, 2003, 1671-1673
Liu, et al., Appl. Phys. Lett. 94, 2009, 084101-1 to -3.
MacPhee, et al., Science, 295, 2002, 1261-1263.
Kyoung-Su Im, et al., Phys. Rev.Lett. (2009) 102, 074501
Shock Wave Imaging @ 5 s w/ Jin Wang group at APS
Fuel Sprays @ 5 s
Radiographs +
Tomographic reconstructions w/ Jin Wang group at APS
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Cornell Keck PAD
Koerner & Gruner, J. Synch. Rad. 18 (2011) 157.
Improvements to microsecond imager
Goals: • Image successive synchrotron bunches
- successive frames <150 ns apart
• Multiple accumulation periods per image
- phase to repetitive signal
- (analogous to lock-in)
• Improved data output
- < 1 ms to read frame
16x16 pixel prototype tested
128 x 128 pixel modules under construction
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15 x 200 ns
summed
after read
15 x 200 ns
summed using
in-pixel accumulation
Noise reduced!
Accumulator summing Sums of 15 frame periods
(30 kHz signal)
Cornell Keck PAD 16 x 16 testing
Successive bunch isolation 100 ns integrations
4 bunches - blanks between bunches
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Goals: • Increase dynamic range (107 x-rays/pixel) • Keep high count rates (>108 Hz) • Fast framing (~ 1ms deadtime) • Single photon S/N (S/N=6 @ 8 keV)
• 150 m pixel
Methods: • Integrating pixel w/ digital overflow counter / charge removal • Analog remainder read at end of frame • Fabricated in 0.25 m TSMC 3.3 V, metal on metal capacitors
Chip development: Collaboration with Area Detector Systems Corporation
Mixed Mode PAD Extended Dynamic Range Detector
S.G. Angello, et al, IEEE 2004 Nuc. Sci. Symposium, Rome, (Oct. 16-22, 2004).
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Mixed Mode Pixel Integrating pixel w/ overflow counter / charge reset
Monostable
Vref
Integrator
Vth
Comparator
Sample and Hold
VHV
18-Bit Counter
Analog Vout
Vlow
Vref
Csub
Cint
Frame Reset
Digital Out
100 – 1000 X-ray capacity
High gain for sensitivity
Charge
removal
Exceed threshold:
• remove charge
• increment counter
“Remainder” read
at end of frame
Number of overflows No dead-time for charge
removal
… although it takes 1 s
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MMPAD X-ray Testing Count Rate / Dynamic Range
Aluminum diffraction
CHESS F2 (No beam stop!)
•1 sec integration
•2x107 x-rays/pix
in center
•700 x-rays/pix
in weakest spots
x1
x104 One image displayed
at four scales
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2x3 tiled array of MMPAD chip Assembled 2012 @ Cornell for synchrotron experiments
1100 Hz max framing Large dynamic range High photon rates
Mixed Mode PAD 2x3 Array for kHz Imaging
Ptychography at APS 2-ID-B High dynamic range - low energy 2.5 keV - 108 photons/s in 150 nm focus (w/ Vine, McNulty at APS, Mancuso Group at European XFEL)
1 s image from Pt zone plate 105 photons full scale
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2 ms images from Al3Ni bilayer foil undergoing reactive mixing 5 x-rays / pixel full scale
Photon energy spectrum from single image at left.
Time resolved reactive foil mixing at CHESS A2 Single photon sensitivity - 15 keV (w/ Darren Dale : CHESS, Todd Hufnagle Group : Johns Hopkins)
0, 1, 2, … 15 keV photons
+ Ni fluorescence
Mixed Mode PAD 2x3 Array for kHz Imaging
0.0 s 2.5 s
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LCLS Coherent X-ray Imaging Experiment All the photons arrive in a subpicosecond pulse - Integration required
What to expect from small particle &
xtal scattering at the CXI beamline
Rate: 120 Hz
Energy: 4-8 keV
Signal: << 1 photon/pix to >103/pix
S/N > 3 @ 8keV
Full well > 103 photons
Detector coverage needed:
Pixel Size: 100 - 200 m
# pixels > 500 x 500
CSPAD - Cornell: Detector chips. SLAC: Mechanicals & off-chip electronics
S/N=8
2700
110 m
1516 x 1516
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CSPAD Pixel-Level Schematic
Programmable per pixel
490 fF Low gain
(2700 x-rays)
75 fF High gain (S/N ~8)
In pixel ADC
Global ramp
Philipp, et al., IEEE Trans. Nucl. Sci. (2010). 57, 3795-3799.
Mark Tate - Integrating Hybrid Pixel Detectors - BES Detector Workshop 2012 Cornell University
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CSPAD @ LCLS - 1.9 Å Structure from microcrystals
Bragg spots typically >> 1 photon/frame
- other experiments will require single photon sensitivity
1.5x106 frames - 4.5% were crystal hits
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Single Module CSPAD 8 keV Photon Energy Histogram
Counting Photons in a Pixel
1
# e-/hole pairs = total energy in pixel / 3.65 eV
Set software threshold
Thresholding: Allows suppression of read noise
and dark current at low fluence.
False positive rate set by S/N
0 photons
1 photon
2
3
20
False Positive Rates
Threshold set to -
3 : 1x10-3
4 : 3x10-5
5 : 1x10-6
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This ring: ~10-3 photons/pixel/frame
Between peaks: ~ 10-4 photons/pix/frame
Raw sum of 1000 frames Accumulation of read noise
+ detector systematics
Single 10 ms image ~ 30 photons
Single Module CSPAD - Low Flux Diffraction
Same 1000 frames
w/ thresholding
Philipp, Tate, & Gruner, JINST (2011) 6, C11006.
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FELs: Bigger Challenges with Smaller Particles Reconstruction with low fluence images of unknown orientation
But will it work with a real detector
and with real data?
Expectation Maximization Loh & Elser, Phys Rev E, 80(2009)1715.
1. How much information is needed (photons per frame)?
2. Can imager provide the needed S/N?
3. Is there an algorithm that works? (tied to question 1)
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Single Module CSPAD
No rotation
1.2 million x-rays
0.2 x-ray/pix/frame
sum of 432 frames
Turn intensity WAY down and rotate mask: 2.5 x-rays per FRAME (3 frames shown)
Discard angular information for frame
Philipp, Ayyer, Tate, Elser & Gruner, Optics Express, 20 (2012) 13129.
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Mask rotating
1.2 million x-rays
10-4 x-ray/pix/frame
sum of 450,000 frames
No rotation
1.2 million x-rays
0.2 x-ray/pix/frame
sum of 432 frames
Expectation
Maximization
Philipp, Ayyer, Tate, Elser & Gruner, Optics Express, 20 (2012) 13129.
It Works!!
Mark Tate - Integrating Hybrid Pixel Detectors - BES Detector Workshop 2012 Cornell University
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XFEL AGIPD
B. Henrich, et al., Nucl. Instr. and Meth. A (2010)
European XFEL - 2700 pulses at 4.5 MHz every 0.1 s 3 stage adaptive gain - single photon to 104 photons/pixel
>200 storage elements - 4.5 MHz flash frame operation
200 m pixels (to fit all the storage cells)
Automatic gain switching
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XFEL Large Pixel Detector (LPD)
European XFEL - 2700 pulses at 4.5 MHz every 0.1 s 3 parallel storage stages - multigain
512 storage elements / gain
500 m pixels
Simultaneous recording
at 3 gains
Rutherford Appleton / Glasgow
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Source/Experiment Driven Requirements • Synchrotrons / ERLs / USRs
– 100x92 microsecond imaging
– MMPAD up to 1 kHz imaging for small arrays- large dynamic range
– Keck PAD synchrotron bunch isolation - phased accumulation
o Reduce readout dead time (to <1 s)
o Increase sustained frame rate (to > 1kHz)
o Higher Energy Detectors - HiZ sensors
o Lower Energy Detectors - diode structure limitations - higher sensitivity electronics
o Even small detectors (with existing capabilities) will make a big impact
• LCLS + other low duty pulsed FELs
– CSPAD single photon to 3000 x-rays/pixel
o Extend dynamic range and low energy operation
o Is the low end low enough? (e.g. use higher sensitivity front end)
o Can we extend full well to 106 or 107 per pulse?
charge collection from diode slows @ large pulse- use MMPAD approach? Nonlinear
integrators?)
• European XFEL - rapid multiframe storage
– AGIPD, LPD
o These detector types will be useful at other sources as well
27 O = suggested areas for effort - = exists or in the works
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Areas for R&D
• Extended dynamic range at high instantaneous rates (e.g. FELs)
• Understand sensor dynamics at high photon densities
• Single bunch imaging (limits to timing?)
• Phased integration of repeating signal (lock-in)
• Through Silicon Vias (TSV) / packaging for larger tiled arrays / 3D integration
• Smaller pixels - (but…lower voltages for smaller feature processes)
• Edgeless sensors
• Hi-Z Sensors
• Low energy sensor windows / increase pixel sensitivity
• Silicon On Insulator (SOI)
• Calibration procedures / tools for characterization
pixels are multigain, multiframe, etc.
test rate dependence, energy dependence, timing, …
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Summary
Needed Efforts for Integrating PADs
• Improve dynamic range
• Take advantage of timing structure of beam
– Single bunch imaging (limits to timing?)
– Phased integration of repeating signal (lock-in)
– Use low rep rate of LCLS to extend dynamic range
• High energy (>20 keV) detectors
• Low energy (< 4 keV) detectors
• Sensor improvements
• Smaller pixels
• Improvements to packaging / 3D integration
• Streaming images at > 1 kHz
• Spend time on Calibrations
• Get detectors on Beamlines!
– including small versions of existing detectors
• Tight feedback loop between users and developers