integration of nano transistor food biosensors
DESCRIPTION
Integration of Nano Transistor Food Biosensors. Gary K. Maki*, Wusi C. Maki* and Nirankar Mishra CAMBR, University of Idaho, Post Falls, ID. October 21, 2009. BC Food Protection Association Workshop Supported by USDA. * Now with Integrated Molecular Sensors. - PowerPoint PPT PresentationTRANSCRIPT
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October 21, 2009
Gary K. Maki*, Wusi C. Maki* and Nirankar Mishra
CAMBR, University of Idaho, Post Falls, ID
Integration of Nano Transistor Food Biosensors
BC Food Protection Association Workshop Supported by USDA
*Now with Integrated Molecular Sensors
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Integration of MicroelectronicsCAMBR/NASA Custom Processors
• Reed Solomon Coder– Programmable error
correction, message length• Lossless Data Compressor
(USES)• Low Density Parity Check
Encoder– Landsat Data Continuity
Mission• High Performance Data
Compression– MMS mission
• New correlator work underway– GeoStar IIP
Delivered November 2008
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GeoStar System• The GeoStar system enables astronomers to advance science
with a space based imager which will correlate data from 588 separate antennas.
• This requires a custom processor board capable of 442,368,000,000,000 correlations per second while using less than 120W for the correlations.
• Equivalent to 17,332 Quad Intel Processors consuming 346,600 watts (not counting memory)
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Nano Technology Promise
• Increased Sensitivity– Electronic device size approximate size of
detection molecule• Nano transistors on order of 50 nm capable of
manufacture in modern semiconductor foundries– IBM, Intel, TSMC markets 45 nm electronics– With proper integration, possible to mass produce
sensitive detection electronics• $20 detectors with integrated microprocessors with
USB interfaces
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Au AuNano FET
Al Al
VSSAmplifier ComputerDigitizer
Off Chip Communications
Silicon Substrate
Self-assembled monolayerCapture Molecule
Target Molecule
Integration of Electronic Biosensor
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Detector Sensor
Electronic Amplifier
Micro processor
Communication Link
Cell Phone Internet Satellite Computers
National Data Base
Pathogen Biomarker Capture &
Amplification
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Technologies/Expertise
• Molecular Biology/Biochemistry• Nano Technology• Semiconductor Fabrication• Surface Chemistry• Electronics
– Digital Design– Analog Design– Special purpose computers
• How to integrate people/technologies
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Work Together• Multiple disciplinary
– Speak the same language• Substrate
– Understand basic concepts• Cross Knowledge borders
– Ph.D’s are experts in narrow fields– Ph.D’s do not like to show ignorance Electronic Engineering Molecular Biology
Chemistry
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Food Safety Detection Targets
• Toxins– SEB SEC (Staph)– Stx1, Stx2 (E. coli)
• Bacteria signature DNA– 16S rRNA gene
• Bacteria signature RNA– 16S rRNA
• E. coli O157:H7 – Specific phage KH1
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Nano-FET Nano-FET
Nano-FETNano-FET
Ideal Detection Real Detection
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Au AuNano FET
Al Al
VSSAmplifier ComputerDigitizer
Off Chip Communications
Silicon Substrate
Self-assembled monolayerCapture Molecule
Target Molecule
Established Bio-Recognition Methods
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Au AuNano FET
Al Al
VSSAmplifier ComputerDigitizer
Off Chip Communications
Silicon Substrate
Self-assembled monolayerCapture Molecule
Target Molecule
Established Microelectronic Technology
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Bio-MolecularRecognition
Signal Generation
Electronic Signal
Amplification
Digitalization
Challenges In Signal generation and Interface
The interface of Nano- and Micro-electronics
The interface of Bio-Molecules and Nano-sensing
surface
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Interface QuestionsCharge must be generated from target recognition
Charge must be brought to the sensing surfaceInsulator layer on the nanowire must be as thin as possible
Nanowire must be affected by very small E-fieldWhich generates a detectable electronic signal
Electronic signal is amplified and digitalized
How to generate charge? What kind of charge? How much?
How to attach the charge to the surface? How to make ultra-thin insulator layer?
How to integrate nano-/micro-electronics? Temperature and packaging problems
Signal level: magnitude only? Phase? Electronic amplify?
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Challenges in Charge Generation
• Not all molecules are alike– Charge quantity variable
• Example
– Charge sense variation• DNA negative charge• Poly-lysine positive charge• Steroid hormone charge neutral
• Transistor Impacts– Transistor variation with different targets– Transistor surface modification
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Solution for Charge Generation
• Keep engineer’s life simple– Known amount of charge– Known charge sense– No transistor surface modification
• Ease design pain• Enable mass production
• Engineers have to design only one thing and produce billions of identical copies
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Universal Signal Molecule
Target RecognitionSignal Molecule
Generation
Same SignalMolecule
- known charge
Target InvariantElectronics
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Universal Nano-FET Biosensor
PNA
Signal Molecule
Antigen
Antibody
Universal Detection Model
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Transistor Design
• Device which detects molecular charge• Specifications
– Wafer– Doping level– Nanowire Length– Contact material– Insulator layer– Sensing area
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Signal Data
• Nano Transistor– nano amp current
• Noise Problems– External noise
• Light, 60 Hz, electrical ground movement
• Long wires from nano FET to instrument
• No alligator clips– Internal noise
• Electrical grounding, cross talk, leakage
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Transistor Layout
Au Pad Au PadDoped Silicon
Top View
Silicon Wafer
Insulation LayerDoped Silicon
Au PadPNAAu Pad
Side View
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Areas of Concern
Silicon Wafer
Insulation Layer
Au PadPNAAu Pad
Side View
Contact
Doped Silicon
High reliability needed
Example 0.01% Modern VLSI chip with 100M Xsters4 contracts per transistor10,000 Xsters non-functional
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Areas of Concern
Silicon Wafer
Insulation Layer
Au PadPNAAu Pad
Thickness
Doped Silicon
Nano FET Surface ThicknessSmall for good E-FieldThick for insulation
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Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
University of Idaho - CAMBR 25
Au Pad Au PadDoped silicon
Digital Electronics
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Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
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Au Pad Au PadDoped silicon
Digital ElectronicsAnalog Signal to DigitalWith multiple sensors, quality control routineData Analysis to map Target IdentifyIntelligent I/O InterfaceInternet Communication
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Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
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Au Pad Au PadDoped silicon
Digital Electronic ProblemsProcessing Order1. Create Digital Circuits (20 layers)2. Place Gold pads3. Place doped silicon on gold pads
• High Temperature Process• Nano packaging solution ?
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Integration of Nano- and Microelectronics
Microelectronics
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Hybrid Packaging Approach
•Short wire interface•Common ground•Noise reduction elements•Single package
Nano-device Micro-electronics
Hybrid Package
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Conclusion
• Systems Level Problem• Various Technology experts needed• Integrated team is needed• Resource costs are High
– nano foundry (already exists)– Digital/Analog Design Tools
• Commercial costs > $1M/year• Engineering experts needed• Commercial fabrication > $200K/run
– Biomolecular laboratory