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©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
First Consumer application in the Intel Core 8th generation i7-8809G
PACKAGING report by Stéphane ELISABETHOctober 2018 – Version 1
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Intel
o EMIB technology
o CPU Supply Chain
Market Analysis 26
o Package Memory Market
o Market Forecast
Physical Analysis 26
o Summary of the Physical Analysis 27
o Intel NUC8i7HKV Teardown 29
o Packaging Analysis 34
Package Views & Dimensions
Board Cross-Section
Package Dissasembly
Package Cross-Section:
Metal Frame, Laminate Substrate, Silicon Bridge
o AMD Radeon RX Vega M - GPU Die 49
Die View & Dimensions
Die µBumps
Die Cross-Section: Silicon Bridge to GPU
o Samsung HBM2 61
Memory Die View & Dimensions
Memory Die TSVs & µBumps
Driver Die View & Dimensions
Driver Die TSVs & µBumps
Die Cross-Section: HBM to Silicon Bridge
TSVs, µBumps, Package to Silicon Bridge
o Silicon Bridge 79
Die View & Dimensions
Die test Features & µBumps
Die Cross-section:
Substrate, Metal Layers, Process
Die Process Characteristic
Physical Comparison: NVIDIA vs. AMD vs. Intel 87
o Structure, Supply Chain, 2.5D Process, HBM Process
Manufacturing Process 92
o GPU, HBM2, Silicon Bridge Die Front-End Process & Fabrication Unit
o HBM2 TSVs & µBumps Process Flow
o PCB Substrate EMIB Process Flow
o Final Test & Packaging Fabrication unit
Cost Analysis 119
o Summary of the cost analysis 120
o Yields Explanation & Hypotheses 122
Selling price 123
Feedbacks 125
SystemPlus Consulting services 127
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and sellingprice of the Intel Core i7-8809 with EMIB technology.
• We have analyzed the Intel Core i7-8809G which is the eight generation of Intel core i7 processor. The Processor features a computer processor unit (CPU), a discrete graphics processor unit (GPU) and a second generation of high bandwidth memory (HBM2) on the same package. The GPU has an 4GB high bandwidth cache assembled from one 4-Hi HBM2 stacks giving almost 200 GB/s of bandwidth.
• Focusing on the GPU and HBM integration, the report shows that in a small package area 29x19 mm 12-layer flip-chip ball grid array (fcBGA) package, the component uses almost 700 mm² of silicon, an impressive silicon-to-package ratio. Regarding the HBM2, only one stacks of 1GB are used to obtain the 4GB capacity. As for NVIDIA’s GPUs, Samsung is the provider of the HBM2 stacks. The 4GB HBM2 consists of four 1GB HBM2 dies and a buffer die at the bottom of the stack, which are all vertically interconnected by TSVs and microbumps.
• Compared to NVIDIA or AMD which uses Interposer, with via-middle Through Silicon Vias (TSVs), the Intel product uses EMIB technology which consist in a silicon bridge buried in the PCB substrate making the interconnection between the HBM2 stacks and the GPU. This approach has some inherent advantages such as the ability to implement high density interconnect without requiring TSVs and to support the integration of many large dies in a high area. The only other application available on the market is into a high-end FPGA, the Stratix X.
• The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding processes, equipment and materials. Also, the complete manufacturing supply chain is described, and manufacturing costs are calculated.
• The report compares the Intel solution with AMD’s Radeon Vega Frontier solution and NVIDIA’s Tesla P100, highlighting the integration choices made by both companies.
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 4
Overview / Introduction
Company Profile & Supply Chain o Intelo Intel Core 8th Generationo Hetero. Integrationo CPU Supply Chaino Intel EMIB
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
CPU Supply Chain
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 5
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Intel NUC8i7HVK Teardown
Mini PC Overview – Front, Back, & Side View©2018 by System Plus Consulting
2x Thunderbolt
2x Display Port
2x Ethernet 4x USB 3.01x HDMI
1x SD Card Slot 2x USB 3.0 1x HDMI 1x USB-C
Venting Grid
220 mm
14
0 m
m
39 mm
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Overview
• Single package with Radeon Vega GPU and 4GB HBM2 Memory on a PCB substrate.
Package Top View©2018 by System Plus Consulting Laminate substrate
(12 layers PCB)
Metal Frame
HBM2 Stack
4 stacked memory dies (4GB) +
1 Driver die
CPU
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section
Package Cross-section plane©2018 by System Plus Consulting
Package Cross-section – Optical View©2018 by System Plus Consulting
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section – Laminate Substrate
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section – Silicon Bridge – GPU
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section – HBM2 Memory – TSVs
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section – Silicon Bridge – HBM Memory
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section – Silicon Bridge – HBM Memory
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Silicon Bridge – Die View and Dimensions
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o GPU Dieo Views & Dimensionso µBumpso Die Cross-section
o HBM2 Dieso DRAM & Driver Views
& Dimensionso Die Cross-section
o Silicon Bridgeo View & Dimensionso Die Cross-Sectiono Die Process
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section – Silicon Bridge – Metal layers
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparisono NVIDIA vs. AMD vs. Intel
o Structureo Supply Chaino Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Comparison - NVIDIA vs. AMD vs. Intel – Structure
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo GPU FE Process & Fab. Unito HBM2 FE Process & Fab. Unito HBM2 Stacking Process Flowo Silicon Bridge FE Process & Fab.
Unito PCB Substrate Process Flowo PCB Substrate Fab.Unito Final Test & Assembly Unit
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
PCB Substrate – EMIB Process Flow
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso GPU Wafer & Die Costo HBM2 Wafer & Die Costo Silicon Bridge FE Costo Silicon Bridge Die Costo PCB Substrate Mnf. Costo EMIB cost per process stepso Component Cost
Selling Price Analysis
Related Reports
About System Plus
GPU Wafer & Die Cost
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso GPU Wafer & Die Costo HBM2 Wafer & Die Costo Silicon Bridge FE Costo Silicon Bridge Die Costo PCB Substrate Mnf. Costo EMIB cost per process stepso Component Cost
Selling Price Analysis
Related Reports
About System Plus
HBM Stacking Cost (TSV + µBump)
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso GPU Wafer & Die Costo HBM2 Wafer & Die Costo Silicon Bridge FE Costo Silicon Bridge Die Costo PCB Substrate Mnf. Costo EMIB cost per process stepso Component Cost
Selling Price Analysis
Related Reports
About System Plus
Silicon Bridge Wafer & Die Cost
©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
PACKAGING• AMD Radeon Vega Frontier Edition• NVIDIA Tesla P100 GPU with HBM2• Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• Status of the Advanced Packaging Industry 2018• Status of Advanced Substrates 2018: Embedded Dies & Interconnects, Substrate Like PCB Trends• 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
PATENT ANALYSIS - KNOWMADE
PACKAGING• TSV Stacked Memory Patent Landscape
In the last few years, as the central andgraphics processing unit (CPU and GPU)technology has advanced, the need forhigh DRAM memory bandwidth has led toan increased focus on high bandwidth on-package links. And so, localized high-density interconnects devices betweentwo or more dies has been investigated toprovide high bandwidth signaling in orderto open up new opportunities forheterogeneous on-package integration.The typical proposed devices areinterposers in glass, organic or siliconsubstrates. Intel has developed its ownapproach called an Embedded Multi-dieInterconnect Bridge (EMIB), which offerssimpler integration.
We have analyzed the Intel Core i7-8809G, which is the eight generation ofIntel core i7 processor. The processorfeatures a CPU, a discrete GPU andsecond generation high bandwidthmemory (HBM2) on the same package.The GPU has a 4GB high bandwidth cacheassembled from one 4-Hi HBM2 stack offour DRAM dies, giving almost 200GB/s ofbandwidth.
Whereas NVIDIA and AMD both useinterposers with via-middle TSVs, the Intelproduct uses EMIB technology. Thisconsists of a silicon bridge buried in theprinted circuit board (PCB) substrate,making the interconnection between theHBM2 stack and the GPU. The approachhas some inherent advantages, such asthe ability to implement high-density in
interconnect without requiring TSVs andto support the integration of many largedies in a large area.
Focusing on the GPU and HBMintegration, the report shows that in asmall 29mm x 19mm area 12-layer flip-chip ball grid array (fcBGA) package, bothcomponents use under 700mm² of silicon,an impressive silicon-to-package ratio.
This report includes a complete physicalanalysis of the packaging process, withdetails of all technical choices regardingprocesses, equipment and materials. Also,the complete manufacturing supply chainis described, and manufacturing costs arecalculated.
The report compares the Intel solutionwith AMD’s Radeon Vega Frontier andNVIDIA’s Tesla P100, highlighting theintegration choices made by allcompanies.
COMPLETE TEARDOWN WITH
• Detailed photos and cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Physical comparison with NVIDIA Tesla and TSMC CoWoS, and AMD Radeon Vega and SPIL CoW
First consumer application in the Intel Core 8th Generation i7-8809G, theworld’s first On-Package CPU and GPU with High Bandwidth Memory.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Intel EMIB
Pages: 130
Date: October 2018
Format: PDF & Excel file
Price: EUR 3,490
Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
Company Profile and Supply Chain
Market Analysis
Physical Analysis
• Intel NUC8i7HVK Teardown
• Processor Package
Views, dimensions and overview
Die sizes
Board cross-section
Package disassembly and cross-section: metal frame, laminate substrate, silicon bridge
• GPU die
Views, dimensions and marking
Microbumps
Silicon bridge to GPU cross-section
• Driver and DRAM Die
Views, dimensions and marking
Microbumps and TSVs
HBM2 stack cross-section
Silicon bridge to HBM2 cross-section
• Silicon Bridge Die
View, dimensions and marking
Microbumps
Silicon bridge cross-section: Substrate, metal layers, process
AUTHORS
• Comparison with NVIDIA Tesla P100 and AMD Radeon Fury X
Manufacturing Process Flow
• Global Overview
• HBM2 Stack Process Flow
• Silicon Bridge Process Flow
• EMIB Process Flow
Cost Analysis
• Overview of the Cost Analysis
• Yield Hypotheses
• GPU Front-End and Die Cost
• Silicon Bridge Wafer and Die Cost
• DRAM Front-End Cost
TSV manufacturing cost
Microbumping manufacturing cost
• DRAM Die Cost
• Logic Die Cost
• HBM2 Stack Cost
• EMIB Assembly Manufacturing Cost
• Final Component Cost
Estimated Price Analysis
INTEL'S EMBEDDED MULTI-DIE INTERCONNECT BRIDGE (EMIB)
RELATED REPORTS
AMD Radeon Vega Frontier EditionThe first SiC power module in commercialized electric vehicles.November 2017 - EUR 3,490*
NVIDIA Tesla P100 GPU with HBM2TSMC CoWoS – Samsung HBM2 – 2.5D and 3D Packaging.February 2018 - EUR 3,490*
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone XThe latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC’s updated inFO packaging.June 2017 - EUR 3,490*
Véronique Le Troadec hasjoined System Plus Consultingas a laboratory engineer.Coming from Atmel Nantes,she has extensive knowledge infailure analysis of componentsand in deprocessing ofintegrated circuits.
Dr Stéphane Elisabeth has joinedSystem Plus Consulting's team in2016. He has a deep knowledgeof Materials characterizationsand Electronics systems.He holds an Engineering Degreein Electronics and NumericalTechnology, and a PhD inMaterials for Microelectronics.
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©2018 by System Plus Consulting | Intel Core i7-8809G with EMIB Technology 23
Overview / Introduction
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Physical Comparison
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Cost Analysis
Selling Price Analysis
Related Reports
About System Pluso Company Serviceso Contact
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