interpack '09 asme/pacific rim technical conference and exhibition

28
© 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice Unified Thermal and Power Management in Server Enclosures Niraj Tolia, Zhikui Wang, Manish Marwah, Cullen Bash, Parthasarathy Ranganathan, Xiaoyun Zhu * * Now at VMware

Upload: truongmien

Post on 14-Feb-2017

225 views

Category:

Documents


1 download

TRANSCRIPT

Page 1: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

© 2009 Hewlett-Packard Development Company, L.P.The information contained herein is subject to change without notice

Unified Thermal and Power Management in Server Enclosures

Niraj Tolia, Zhikui Wang, Manish Marwah, Cullen Bash, Parthasarathy Ranganathan, Xiaoyun Zhu*

*Now at VMware

Page 2: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

2005: $26.5 Billion

Page 3: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

“The cost of power and cooling is likely to exceed that of hardware…”

- Luiz Barosso, Google

Page 4: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

“In the data center, power and cooling costs more than the IT equipment it supports.”

- Christian L. Belady, Microsoft (former HP)

Page 5: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Zephyr• Unified Power and Cooling Management

Contributions• Demonstrate how to do per-blade cooling• Save both cooling (21--30%) + system power (23--29%)

• Without impacting performance

Page 6: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Compact DesignDense Compute and Storage

Blade Servers:

Workloads are Virtualized

Page 7: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Compact DesignDense Compute and Storage

Blade Servers:

Workloads are Virtualized

Page 8: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Web ServerOS

Hardware

Virtualization:

Page 9: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

VM MonitorHardware

Virtual Machine

WebServerOS

Virtualization:

Page 10: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Virtual Machine

WebServerOS

OSVM MonitorHardware

VM MonitorHardware

Virtual Machine

App ServerOS

Virtualization:

Page 11: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Virtual Machine

WebServerOS

OSVM MonitorHardware

VM MonitorHardware

Virtual Machine

App ServerOS

Virtualization:

Page 12: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Virtual Machine

WebServerOS

OSVM MonitorHardware

VM MonitorHardware

Virtual Machine

App ServerOS

Virtualization:

Page 13: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

CPU P-states BladeEnclosure

PowerUtil

Temp.Zephyr

Min.Power

Tref

Utilref

Models

Fan Speed

VM Migr.Blade On/Off

Power ModelsTemperature Models

Page 14: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

0

50

100

150

200

250

0 20 40 60 80 100

Pow

er (

W)

Utilization

Power - P0Power - P4Power Model - P0Power Model - P4

Power Model: Single Blade

Page 15: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Power Model: Single Fan

0 6000 12000 180000

50

100

150

200

Speed (RPM)

Pow

er (W

)

Measured Fan PowerFan Power Model

Page 16: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Unfortunately, temperature models are significantly more complex.

Models don’t existsMany things affect temperatureInsufficient sensors in servers

Zonal Variations

Page 17: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Fan No.

Blad

e N

o.

1 2 3 4 5 6 7 8 9 10

123456789

10111213141516

Zonal Variation: Fan Influence

Page 18: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Temperature Models• Steady State Model−Assumes workloads, ambient environment is constant

• Transient Model−Finer-grained control in real-world environments

Page 19: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Temperature Models• Steady State Model−Assumes workloads, ambient environment is constant

• Transient Model−Finer-grained control in real-world environments

Page 20: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

ZephyrBlade

Enclosure

PowerUtil

Temp.

Min.Power

Tref

Utilref

Models

Fan SpeedCPU P-statesVM Migr.

Blade On/Off

Page 21: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

ZephyrBlade

Enclosure

PowerUtil

Temp.

Min.Power

Tref

Utilref

Models

Fan SpeedCPU P-statesVM Migr.

Blade On/Off

FC

ECGC

Page 22: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Group Controller (GC)• Goal: Minimize Power(Enclosure)

• Changes state every 10 minutes• Monitors Utilization, Inlet Temperature• Uses two-step optimization−Simulated Annealing for space search−Convex Optimization for Fan Cost + Blade Power Model

Page 23: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Experimental Setup

Storage Array

Controller

Temp and Util. DataVM Migration

Fan Speed Control

16 Blades (4 cores)5 P-States

10 Fans, 64 Xen VMs

Page 24: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

0

50

100

150

200

250

300

IT

Pow

er (W

)Static Integral Predictive Zephyr Zephyr + On/Off

Cooling Power Savings

626

Page 25: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

System Power Savings

0

500

1000

1500

2000

2500

3000

3500

4000

IT

Pow

er (W

)Static Integral Predictive Zephyr Zephyr + On/Off

Page 26: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Simulated Servers

239

34

68

102

136

170

204

120

154

190

222

256

290

0

50

100

150

200

250

300

0 20 40 60 80 100

Power Usage (W

)

Utilization

Real

EnergyProportional

PracticalNext-Gen

Page 27: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Simulation: Tamb+15C &13 servers types

Page 28: InterPack '09 ASME/Pacific Rim Technical Conference and Exhibition

Conclusions• Zephyr combines:−Concepts from Heat Transfer Theory with Systems

• Unified power and cooling management can save:−30% Cooling Power−29% Enclosure Power

Full Length Papers:www.hpl.hp.com/personal/Niraj_Tolia/