introduction to automotive solutions from infineon
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Infineon Technology DayJochen Hanebeck
Oct-2010
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Global semi market is back on pre-crisis level
290
333
Revenue in US Dollar billion and market growth rate
Forecast range (average) market growth rateForecast range revenue
Revenue Market growth rate
Source: WSTS for historical data; Forecast: of VLSI, Gartner, iSuppli, WSTS, IC Insights, Future Horizons; market growth rate year-on-year.
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We align to our customer segments
Customers
Board
Automotive Industrial &Multimarket
WirelessSolutions
Mobile Phone
Platforms Mobile Software
RF Solutions Tuner and
Receiver
RF Power
Chip Card &Security
Payment
Communication Entertainment
Government ID Personal & Object ID
Platform Security
Power Semi-
conductors Power ICs
Microcontroller Sensors
Electric Drivetrain
Power Discretes
Power Modules Power ICs
ASICs RF & Protection
Devices
Microcontroller
Sales, Operations, Central Functions
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Infineon's revenue in Q3 was 1,209million
Oct-2010
Infineon Third Quarter FY10
Revenue in million Segment Result margin
+59%
Segment
Result880 52 110 163
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Revenue Split by Focus Area
Oct-2010
AutomotiveIndustrial &
Multimarket
Chip Card& Security
Energy Efficiency / Mobility
1,183m
Communications
537mSecurity
182m
WirelessSolutions
H1 FY10 revenue split
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Infineon Functional Organization
P. Bauer (CEO) Prof. Dr. H. Eul Dr. R. Ploss
B
oard
Operations
CentralFunctions
R
egions
Automotive
J. Hanebeck
C. Geisler
M. Seitz
Industrial &
Multimarket
A. Mittal
P. Schiefer
O. Schuster
Wireless
Solutions
W.K. Tan
C. Eisenschmid
Consolidation & External ReportingDr. F. Kirchmeier
Controlling & Projects
A. Sauer Corporate Dev. & Investor Relations
U. Pelzer
Enabling Technologies & Services
Dr. F. Neppl Public Authorities & Associations
Dr. A. Hoffmann
Accounting Services & ProcessesM. Schneider
Audit & Risk Management
R. Hawliczek Business Continuity
W.-R. Moritz
Communications
R. Driever Compliance Officer
R. Hawliczek
Finance & TreasuryF.-X. Gerard
Human Resources
Dr. T. Marquardt Information Technology
M. Schmelmer
Legal & Patent
M. v. Eickstedt
PurchasingH.-M. Schweizer
Quality Management
H. Mahler R&D Excellence
Dr. C. Kutter
Taxes
A. Rappl
Frontend - Power
Dr. H.-D. Loewe
Assembly & Test - PowerK. T. Ng
Frontend CMOS
P. Haidas
Assembly & Test CMOSW. T. Gan
Joint management responsibility of Division Head and Division Finance Head
Corporate Supply Chain
Dr. K. Gruber
FinanceP. Gruber
Chipcard & Security
Dr. H. Gassel
M. Friedinger
Sales,
Marketing &
Distribution
A. Mueller
Divisions&
Sales
Operations
Dr. R. Ploss
Japan
Y. Mori, A. Trost
Asia Pacific
A. Chong, T.T. Pow, H.-M. Stech
North America
J.-B. Loire, A. Prillwitz
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Energy Efficiency
Communications
Security
Strategic Cornerstones Aim at ExpandingLeadership Positions Using
Focus Areas Core Competencies
Analog / Mixed Signal
RF
Power
Embedded Control
Target Markets
Automotive
Industrial Electronics
Chip Card & Security
Mobile Phone Platforms
Manufacturing Strategy
Investment in in-house manu-
facturing for speciality technologies eg300mm for Power discretes
Manufacturing of standard techno-logies
in foundries. Below 65nm no investment
in own plants.
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Cleaner
Infineon Automotive - We make cars
The Automotive Division focuses on Products for
three Major Growth Drivers
Best-in-class powertrain products
(TriCore, Sensors, Power ICs) System & application know-how
Optimizedhybrid and electric drivetrain
products (HybridPack)
Energy management concepts
Electrificationof functions and
replacement of relais & mechanical
functions
Dedicated sensor, power andmicrocontroller products
Innovativesensor technologies:
Magnetics (Hall, I-GMR), MEMS (Inertia,
pressure) and SiGe (Radar, ACC)
Safety standard compliant products PRO-
SILTM (SIL3 or ASIL-D standard)
Scalable product portfolio to address lowcost car design and production
Easy to integrate chipset solutions for
safety and powertrain and body
Software and support structure to
enable emerging country OEM and Tier1s
Optimized Chipsets forE-bikes
Safer Affordable
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1. Freescale 16,1%
2. Infineon 7,8%3. NXP 7,1%
4. STM 6,6%
5. ON 4,3%
6. TI 3,7%
7. Renesas 3,3%
8. NEC 3,1%
Source: Strategy Analytics, April 2010
1. Infineon 9,0%
2. Freescale 8,0%
3. STM 7,7%
4. NEC 7,3%
5. Renesas 7,0%
6. NXP 6,4%
7. Toshiba 5,6%
8. Bosch 4,9%
1. Infineon 13,6%
2. STM 10,5%
3. Bosch 10,4%
4. Freescale 8,5%
5. NXP 8,2%
6. TI 5,9%
7. NEC 5,3%
8. ON Semi 2,9%
1. STM 9,2%
2. Infineon 8,8%3. Freescale 7,6%
4. NXP 7,0%
5. NEC 4,5%
6. Renesas 3,9%
7. Toshiba 2,8%
8. ROHM 2,7%
1. Renesas 19,8%
2. Toshiba 18,0%3. NEC 15,6%
4. ROHM 3,8%
5. Fujitsu 3,6%
6. TI 3,2%
7. Sanken 3,1%
8. Infineon 2,8%
3,9%
5,7%
8,2%
9,0%
1994 1998 2002 2009
Infineon Automotive
Market Share Development
Infineon is the
worlds #1
in Automotive!
Europe
Worldwide Automotive Semiconductor Ranking
APAC + ROW NAFTA Japan
ROW: Key Rest-Of-World countries
Brazil, Russia
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Infineon Automotive Semiconductor Solutionscombine Sense, Compute and Actuate
Magnetic Sensors
Temperature
Sensors
16/32 bit C 32 bit TriCore
(C + DSP)
MOSFETs IGBTs
Regulators
Transceivers
Smart Power
System ICs
Pressure Sensors Magnetic (Hall)
Sensors
Pressure Sensors
TPMS
Magnetic (Hall)
Sensors
RF ICs
8 bit Cs
16/32 bit Cs
32 bit TriCore
(C + DSP)
8 bit Cs
16/32 bit Cs
Magnetic Sensors
Temperature
Sensors
RF ICs
Diodes
Transistors
MOSFETs
Regulators
Transceivers
Smart Power System ICs
Transceivers
Diodes
MOSFETs
Transistors
Regulators
E-Power
Smart Power
Sense Compute Actuate
Powertrain
Safety
Hybrid Electrical Drives
Body & Convenience
Diesel Engine Mgmt.
Gasoline Engine Mgmt.
Transmission Control
Starter / Alternator
ABS/ESP/Traction Control SuspensionAirbag/Restraint Systems Side-airbag
Power Steering Tire Pressure Monitoring
Light Control
Heating, Ventilation,
Air Condition
Door & Seat
Smart Battery Terminal
Hybrid motor drive
Regenerative braking Battery management
8 bit Cs
16/32 bit Cs
32 bit TriCore(C + DSP)
HybridPack
IGBTs
Regulators Transceivers
Smart Power
MOSFETs
Our target markets
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High Commitment to
the Automotive
Industry
+
Focus and long
experience on
power
semiconductors
=
Ideal Match for HEV
/ EV
Power
Semiconductors*
** Power SemiconductorSource: IMS;Including power semis forautomotive
Automotive
Semiconductor*
*Application-specificsemiconductorSource: Strategy Analytics
Infineon AutomotiveYour trusted partner for HEV / EV
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Electric Vehicles (EV) and Hybrid EVsdrive semiconductor demand
Fuel cost, CO2 reduction and price are main
drivers for EVs and HEVs
Powertrain semiconductor (SC) bill-of-material
(BOM) of an EV/HEV is 2 to 3 times higher
than total Auto (ICE) Semiconductor Bill-of-
Materials
50-80% related to IGBT and diode chips in
state-of-the-art module packages
Auto(ICE) vs. EV/HEV Semiconductor BOM
Fast followers enter
HEV market
Market growthfostered by
new vehicle
launches
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Infineon AutomotiveYour trusted partner for automotive applications
Broad innovative product portfolio, leading edge technologies and
system expertise
Growing global customer base
Global No. 1 for automotive semiconductors
Strategic partnerships on all levels of the value chain
Automotive ExcellenceTM:
Most comprehensive quality program in the industry
Strong growth perspective driven by Low cost cars and HEV/EV
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