introduction to fib
TRANSCRIPT
INTRODUCTION TO :DUAL BEAM FOCUSED ION BEAM
SCSAM Short CourseAmir Avishai
RESEARCH QUESTIONS
FIB slice showing detail of axons and myelin sheaths, Mitochondria.
Cross section of50nm Cu Vias
Solid Fuel Cell
Dual Beam FIBs Open New Dimensions
TEM Liftout
MEMS Device
Defect Analysis
OUTLINE
- Beam Optics and Signals Generated.- Beam Energy & Current and Ion-Solid Interactions.- FIB Applications.- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.- 3D Imaging.
FIB Flavors - LMIS (Ga) FIB vs Plasma (Xe) FIB
Laurens Kwakman - FEI
LMIS
Plasma
Helios 650
DUAL BEAM FIB OPTICS
FIB\SEM Schematic
Ion‐Solid Interactions
Secondary electronsSecondary ions, Backsputtered ions, Neutral atoms, Implanted ions,
•Sputtering/Milling•FIB Imaging
•Ion Channeling •Redeposition•Surface amorphisation
Detector selection for Secondary Electrons Produced by the Ion Beam
Low Voltage Sample Clean up (5kV)Notice the Shadowing
OUTLINE
- Beam Optics and Signals Generated.- Beam Energy & Current and Ion-Solid Interactions.- FIB Applications.- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.- 3D Imaging.
Prenitzer et al., M&M 2003
Ion‐Solid Incidence Angle & Sputter Yield
Milling Rate for different Materials
Prenitzer et al., M&M 2003
All cuts were done under the same conditions and are presented at the same magnification.
FIB Ion Channeling Effects on Contrast and MiIling
Science, Imaging and Microscopy, FIB Milling and Channeling, Nov. 01, 2008
FIB Ion Channeling Effects on Contrast and MiIling
C.A.Volkert MAY 2007
Science, Imaging and Microscopy, FIB Milling and Channeling, Nov. 01, 2008
FIB Surface Beam Damage As Function of Voltage
30 keV 5 keV 2 keV~ 21 nm ~ 2 nm 0.5nm -1.5nm
5 nm 2 nm 2 nm
With Cs corrected TF20Giannuzzi et al. M&M 2005
Beam current will effect mostly milling rate and heating
OUTLINE
- Beam Optics and Signals Generated.- Beam Energy & Current and Ion-Solid Interactions.- FIB Applications.- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.- 3D Imaging.
Gas Assisted Pattern options
Deposition Gases•Platinum•Tungsten•Carbon•Insulator•Non-standard Requests, Au
Reactive Gases•Iodine = EE•XeF2= IEE•Delineation Etch =DEE•Selective Carbon Milling = SCM
Failure Analysis ‐ Device
C NO
Al
Si
P
Al
P
Si
O
Al
P
Si
OC N
OAl
Si
PPt
Ga
Failure Analysis ‐ Device
Cross Sections of Polymers and Bio Samples
Photosensitive Polymers(Selective Carbon etch - Water)
Acrylonitrile butadiene styrene (ABS)
3 m
TiMg
Cross Section of Critical point dried Rods cell from a Wild Mouse Eye
Failure Analysis – Oxide & Polymer
Pt
O
C
Si
C
O
Si
Ga
in situ testing
Thermal Measurement on Carbon nanofiber
N. Mahanta & A. Abramson, CWRU
OUTLINE
- Beam Optics and Signals Generated.- Beam Energy & Current and Ion-Solid Interactions.- FIB Applications.- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.- 3D Imaging.
TEM liftouts
a. d.
c.
LEAP liftouts – Carburized Steel3D Atom Probe Tomography
Carbon Atom Map
CWRU - Danqi Wang
Create structure
Define Layer Alignment & Multi
site setup
Assign Actions to LayersLoad GDSII into NanoBuilder
Create (CAD) design
DEPOSIT
MILL
DesignCreation
ProcessDefinition
ProcessExecution
GDS editoror NanoBuilderbuilt-in editor
NanoBuilderNanoArchitect (offline)
DualBeam + NanoBuilder
FIB Prototyping NanoBuilder Work Flow
10 μm
50 μm
200 nm
Example: array of IR plasmonic waveguides
FIB Prototyping NanoBuilder
• Waveguides written with sub-50 nm accuracy over 200 x 200 µm2 area.
• Total processing time: 10 hours
Courtesy of CIC NanoGUNE - 2013
Multi-field writing with NanoBuilder
OUTLINE
- Beam Optics and Signals Generated.- Beam Energy & Current and Ion-Solid Interactions.- FIB Applications.- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.- 3D Imaging.
SERIAL ION ABLATION SEM VS SERIAL BLOCK FACE SEM
• HRSEM • Small field of view, slow cutting, • Wide range of thickness• Any material• High vacuum • Artifacts – curtaining• Site Specific
Ion beam Microtome• Regular FEG • Large Field of view, fast cutting• Limited thickness• Soft materials• High pressure mode and wet
mode• Artifacts – Chatter marks
3D IMAGING APPROACHES
3D Reconstruction of a Resin‐Bonded Interface of a Tooth
Phase 1Phase 2Phase 3
Phase fraction
Phase 1
Naima Hilli
3D VOLUME ANALYSIS & MICROSTRUCTURAL PARAMETERS
3D VOLUME ANALYSIS & MICROSTRUCTURAL PARAMETERS
The pillars are constructed both parallel and perpendicular to the interfaces. The investigation of parameters like tortuosity is performed.
Phase 1Phase 2Phase 3
Sample 1
Sample 2
Naima Hilli
Parameter Sample 1 Sample 2Phase 1 ( vol%) 20.1± 2.1 27.1± 1.2Phase 1 particle diameter (m) 2.3± 0.8 3.0± 1.1
Phase 2 (vol%) 40.2± 1.8 36.4± 2.3Phase 3 (vol%) 39.9± 1.4 36.5± 0.8
Tortuosity (Phase 1) 2.3± 0.6 1.7± 0.5
Examples of 3D SEM Imaging of Biological TissuesDr. Grahame Kidd, Lerner Institute Cleveland Clinic
Internodal axon samplesAxons n= 18diameters = 0.7 – 1.6 umlength sampled = 19‐36 ummitos / mm = 85 – 680mito vol : axon vol = 2.5 – 9%
Mitochondrian= 195length range = 0.5 – 13 um
Mitochondrial Sizes Internodal Cerebellar Axons
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 2 4 6 8 10 12 14
Length (um)
Volu
me
(um
)
Series1
Mitochondrial Diameters
00.10.20.30.40.50.6
0 2 4 6 8 10 12 14
Length (um)
(Cal
c D
iam
eter
um
)
Series1
Axonal mitochondria tend to be thin in cross section (0.1‐0.3 um) and increase in length as they increase in volume .
Quantitative Analysis – Axonal Mitochondria
500nm
Analysis of Void Defects in IC Device
QUESTIONS
Can you Find the Cat?!