introduction to vlsi cmpe/elee 4375 introduction
DESCRIPTION
Introduction to VLSI CMPE/ELEE 4375 Introduction. Outline. Syllabus Logistics (time, place, instructor, website, textbook) Grading Topics Outcomes Introduction to VLSI A brief history MOS transistors CMOS logic gates. Time and Place Class: 8:45 am - 9:35 am - PowerPoint PPT PresentationTRANSCRIPT
Introduction to VLSICMPE/ELEE 4375
Introduction
CMOS VLSI Design
Outline
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Syllabus Logistics (time, place, instructor, website, textbook) Grading Topics Outcomes
Introduction to VLSI A brief history MOS transistors CMOS logic gates
CMOS VLSI Design
Course Information (1)
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Time and Place
Class: 8:45 am - 9:35 am MWF Engineering Building 1.262
Instructor Hasina Huq [email protected] ENGR 3.278, 665-5017 Office hours: MTW 1.00 pm -3.00 pm or walk in or by
appointment
CMOS VLSI Design
Course Information (2)
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Prerequisites Digital logic (ELEE 2330) and Electronic 1(ELEE 3301), or
equivalent I assume you know the following topics
Boolean algebra, logic gates, etc. MOSFET characteristics Undergraduate physics: Ohm’s law, resistors, capacitors, etc. Undergraduate math: calculus
CMOS VLSI Design
Course Information (3)
Text Ken Martin, Digital Integrated Circuits design, Oxford,
Reference Class handouts Cadence manual set H.Craig Casey, Jr., Devices for Integrated Circuits,
John-Wiley,
Baker, Li, & Boyce, CMOS Circuit Design, Layout,
and Simulation, IEEE Press, 1998.
Account UNIX (lab access)
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CMOS VLSI Design
Course Information (4)
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Grading 60% project 5% homework 15% mid-term exam 20% final exam
Laboratory Based Projects (3) 60% (10%, 20%, 30%) Final project include design, report and presentation Total 100%
CMOS VLSI Design
Course Information (5)
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Topics NMOS,PMOS CMOS logic gate fabrication and layout MOS transistor characteristics Performance analysis for VLSI circuits digital circuits design Integrated Circuit (IC) design Compact & cost effective design System on chip
CMOS VLSI Design
Course Information (6)
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Use the Electric CAD tool to design a chip including (depending on tool availability)
Schematic entry Layout Transistor-level cell design Gate-level logic design Hierarchical design Switch-level simulation (IRSIM) Design rule checking (DRC) Electrical rule checking (ERC) Network consistency checking (NCC) HDL design (Verilog) Place and route Pad frame generation and routing Pretapeout verification
CMOS VLSI Design
Course Information (7)
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Outcomes Estimate and optimize combinational circuit delay using
RC delay models and logical effort Design high speed and low power logic circuits Understand interconnect and reliability issues Design functional units including adders, multipliers,
DFF, ROMs, SRAMs, and PLAs Beware of the VLSI trends and challenges
CMOS VLSI Design
Introduction
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Integrated circuits: many transistors on one chip. Very Large Scale Integration (VLSI): very many Complementary Metal Oxide Semiconductor
Fast, cheap, low power transistors
Today: How to build your own simple CMOS chip CMOS transistors Building logic gates from transistors Transistor layout and fabrication
Rest of the course: How to build a good CMOS chip
CMOS VLSI Design
A Brief History
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1958: First integrated circuit Flip-flop using two transistors Built by Jack Kilby at Texas Instruments
2003 Intel Pentium 4 processor (55 million transistors) 512 Mbit DRAM (> 0.5 billion transistors)
53% compound annual growth rate over 45 years No other technology has grown so fast so long
Driven by miniaturization of transistors Smaller is cheaper, faster, lower in power! Revolutionary effects on society
CMOS VLSI Design
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The impact of ICs on modern society has been pervasive. Without them current computer, electronics systems and information-technology revolution would not exist. Immense amount of signal and computer processing is realized in a single IC.
Most of the students of Computer/ Electrical Engineering are exposed to Integrated Circuits (IC's) at a very basic level, involving circuits like multiplexers, Flip flop, encoders etc. But there is a lot bigger world out there involving miniaturization, that a micrometer and a microsecond are literally considered huge! This is the world of VLSI - Very Large Scale Integration.
CMOS VLSI Design
The course will help you to understand why you need to learn the Chip / Integrated Circuit (IC) Design technologies.
This involves packing more and more logic devices into smaller areas and smaller areas.
This has opened up a big opportunity to do things that were not possible before. VLSI circuits are everywhere ... your computer, your car, your brand new state-of-the-art digital camera, the cell-phones, and what have you. All this involves a lot of expertise on many fronts within the same field, which we will look at in the course.
At UTPA we use Cadence simulation tool which is an industry standard simulator
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CMOS VLSI Design
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Modern ICs are enormously complicated. A large chip may have more transistors than there are people on Earth i.e. may contain millions of transistors. The rules for what can and cannot be manufactured are also extremely complex. An IC process may well have more than 600 rules. CAREER: Design Engineer: Takes specifications, defines architecture, does circuit design, runs simulations, supervises layout, tapes out the chip to the foundry, evaluates the prototype once the chip comes back from the fab. TYPICAL COMPANIES AND JOBS? Intel, IBM, Texas Instruments, Motorola, National Semiconductor, Maxim, Linear Technology, Siemens, Qualcomm
CMOS VLSI Design
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University: Most of the universities in USA are offering VLSI course at undergraduate level because of reality, demand. Dept: Electrical and Computer Engineering: University of Texas at Austin, Rice University, Department of Electrical and Computer Engineering at Texas A&M University, Dept. of Electr. Eng. & Comput. Sci., Univ of Michigan. Ann Arbor, MI, Department of Electrical and Computer Engineering UC Berkeley
CMOS VLSI Design
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CMOS VLSI Design
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CMOS VLSI Design
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CMOS VLSI Design
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CMOS VLSI Design
Invention of the Transistor
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Vacuum tubes ruled in first half of 20th century Large, expensive, power-hungry, unreliable
1947: first point contact transistor at Bell Labs John Bardeen and Walter Brattain at Bell Labs Read Crystal Fire
by Riordan, Hoddeson
CMOS VLSI Design
Transistor Types
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Bipolar transistors npn or pnp silicon structure Small current into very thin base layer controls large currents
between emitter and collector Base currents limit integration density
Metal Oxide Semiconductor Field Effect Transistors nMOS and pMOS MOSFETS Voltage applied to insulated gate controls current between
source and drain Low power allows very high integration Simpler fabrication process
CMOS VLSI Design
MOS Integrated Circuits
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1970’s processes usually had only nMOS transistors Inexpensive, but consume power while idle
1980s-present: CMOS processes for low idle power
Intel 1101 256-bit SRAM Intel 4004 4-bit Proc
CMOS VLSI Design
Moore’s Law
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1965: Gordon Moore plotted the number of transistors on each chip Fit straight line on semilog scale Transistor counts have doubled every 26 months
Year
Transistors
40048008
8080
8086
80286Intel386
Intel486Pentium
Pentium ProPentium II
Pentium IIIPentium 4
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
1,000,000,000
1970 1975 1980 1985 1990 1995 2000
Integration Levels
SSI: 10 gates
MSI: 1000 gates
LSI: 10,000 gates
VLSI: > 10k gates
CMOS VLSI Design
Corollaries
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Many other factors grow exponentially Ex: clock frequency, processor performance
Year
1
10
100
1,000
10,000
1970 1975 1980 1985 1990 1995 2000 2005
4004
8008
8080
8086
80286
Intel386
Intel486
Pentium
Pentium Pro/II/III
Pentium 4
Clock S
peed (MH
z)
CMOS VLSI Design
Scaling Down: a Mystery
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In 1971, minimum dimensions of 10 um in 4004. In 2003, minimum dimensions of 130 ns in Pentium4. Scaling down forever ? (No, transistors cannot be
less than atoms) Many predictions of fundamental limits to scaling
have already proven wrong We believe that scaling will continue for at least
another decade. What is the future?
CMOS VLSI Design
Periodic Table
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CMOS VLSI Design
Dopants
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Silicon is a semiconductor Pure silicon has no free carriers and conducts poorly Adding dopants increases the conductivity Group V (Arsenic): extra electron (n-type) Group III (Boron): missing electron, called hole (p-
type)
As SiSi
Si SiSi
Si SiSi
B SiSi
Si SiSi
Si SiSi
-
+
+
-