MFF – Charles University, Prague, 20.05. 2014

Involvement in ATLAS upgrade

M. Havránek on behalf of FNSPE-CTU

Faculty of Nuclear Sciences and Physical Engineering of the Czech Technical University

(FNSPE-CTU)

MFF – Charles University, Prague, 20.05. 2014 2

Newly formed HW group at FNSPE

New laboratory at FNSPE

Part of the people came from Institute of Physics, ASCR

Involvement of PhD students:M. Carna – evaluation radiation hardness

Z. Janoska – IC design

M. Hejtmanek – image processing (MediPix)

O. Korchak – TCAD simulations, chip testing

M. Marcisovsky – general advisor

Professionals:V. Vrba – group leader

M. Havranek – IC design, institute representative

G. Neue – test system development

V. Kafka – IC design

L. Tomasek – sensor/chip testing, software development

MFF – Charles University, Prague, 20.05. 2014 3

Experience obtained so far

Sensor development

- n on p sensor development

- TCAD simulations

Read-out system development

- universal FPGA based read-out system

IC design (150 nm technology) - test structures (transistor arrays)

- charge sensitive amplifier

Evaluation of radiation hardness (150 nm CMOS technology) [1] Nucl. reactor60Co

[1] M. Carna et al: Radiation hardness evaluation of the commercial 150 nm CMOS process using 60Co source, IWORID2013 proceedings, accepted by JINST

MFF – Charles University, Prague, 20.05. 2014 4

International collaboration

M. Havranek – 3 years stay at Bonn University* Pixel capacitance measurement chip - PixCap - IC design, development of measurement setup, capacitance measurements → publication [1]

Pixel FE development in 65 nm CMOS technology - design of two 65 nm pixel FE prototypes (FE-T65-0, FE-T65-1)

- test system HW/SW development, chip characterization → publication [2]

capacitance [fF]

180 µm

25 µ

m

capacitance [fF]

Diam

ond

Diam

ond

Si pla

nar

Si pla

nar

* Supervised by H. Krüger and T. Hemperek

MFF – Charles University, Prague, 20.05. 2014 5

International collaboration Depleted Monolithic Active pixel sensor - design of DMAPS prototype chip EPCB01

- sensor characterization, radiation test → publication [3]

Z. Janoska next month going to CPPM Marseille (HV MAPS testing)

References:[1] M. Havranek et al: Measurement of pixel sensor capacitance with sub-femtofarad precision, NIMA, vol. 714, 2013[2] M. Havranek et al: Pixel front-end development in 65 nm technology, JINST, vol 9, 2014[3] M. Havranek et al: DMAPS: a fully depleted monolithic active pixel sensor – analog performance and characterization, submitted to JINST (05/2014)

MFF – Charles University, Prague, 20.05. 2014 6

Role in the ATLAS Collaboration

Membership in RD53 Collaboration since April 2014

RD53 Collaboration:

- design of the next generation of ATLAS/CMS Pixel chip

(phase 2 upgrade in ~2022)

Planned activities in RD53:

- studies of low power analog pixel front-end in 65 nm

- chip testing, small pixel sensor design

evaluation of radiation hardness with neutrons and gammas (60Co)

Participation in planned design of prototype pixel arrays prior to submission of large FE chip

Involvement in AIDA 2 Collaboration

- AIDA activities: sensor design on a p-substrate

- sensor testing, production, evaluation of radiation hardness

- supporting students working at projects for RD53

MFF – Charles University, Prague, 20.05. 2014

Thank you for attention