Department of Electrical and Computer Engineering

SDP team Yngvesson

Ioan TiheneaTomas Broka

Dmitriy StupakSergey Derivolkov

IR CARBON NANO-TUBE TRANCIEVER

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

Recap Design OverviewFor our Senior Design Project we are working

on creating a communication system that has two computer interface terminals, some signal processing at each end and an Infrared communication channel (transceiver) in the center.

The key component to our SDP project is a Single Walled Carbon Nanotube (SWNT) thin film detector detecting IR radiation which changes the resistivity across it; this will be interpreted in binary values.

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

System OverviewComputer Interface

Signal Processing

Transceiver

Computer Interface

Signal Processing

Input from keyboard by user CPU

USB Interface

Software

MultiprocessorDigital to

Analog circuit

Focusing Lenses

USB Cable

IR Radiation

2 wire cable

Legend

Bolometer Analog to Digital Circuit

Multiprocessor

USB Interface

CPU Display

Software

System Block Diagram

LED emiter SWNT film Detector

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

Signal Processing Block (Transmitter End)

Microcontroller IR LED and Circuitry Silicon Laboratories SiLabs C8051F340 USBXpress

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

Transceiver

 

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

Signal Processing Block (Receiver End)

Amplifier and Comparator Circuitry for clean pulses Microcontroller

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

Suspension Method

Fabrication of Supporting Washer

Electrical Contacts Connecting SWCN Film

to Supporting Washer

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

Fabrication Techniques Used Plasma etching premade film

• Film was placed in oxygen plasma to etch down to required thickness.

Vacuum filtration method• Pour CNT solution onto membrane and vacuum non-CNT

liquid out. Then dissolve membrane. Dry drop method

• Place electrical contacts on glass slides and putting drops of the CNT solution between them.

Department of Electrical and Computer Engineering

SEM Image

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

Group BreakupSergey Derivolkov, EE: Designed the system overview and helped provide more efficient procedures for the

fabrication. Also used SEM to take pictures of the NanoComp film and measured the thickness.

 Dmitriy Stupak, EE: Designed the circuitry to test the film resistivity and the effects of IR radiation. He

also joined Ioan during plasma etching procedure and used Profilometer to measure the thickness of the etched film.

 Tomas Broka, CSE: Worked on fabrication procedure for the first couple films. Tomas also set up the

website of the team and he is in charge of ordering components, equipment, and keeps contacts up to date through emails and through the website. Also he worked with SEM to take images.

 Ioan Tihenea, EE: Worked on plasma etching procedure for the film offered by NanoComp. He used

Atomic Force Microscope (AFM) to take images of the films surface. He also was involved as well as Tomas in the fabrication.

Department of Electrical and Computer Engineering

Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions

Department of Electrical and Computer Engineering

Questions

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Department of Electrical and Computer Engineering

SiLabs C8051F340 Microcontroller• 48 MIPS 8051 CPU• 64 kB Flash memory• 4352 B RAM• USB 2.0• Integrated transceiver• Integrated clock recovery• 4 kB buffer RAM• Full (12 Mbps), or low-speed operation

• Control endpoint plus six bi-directional endpoint pipes

• 10-bit, 200 ksps ADC• Two asynchronous comparators • Voltage reference • Temperature sensor • 40 Digital I/O