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ISO/TS 16949:2009

KEC semiconductor

lead-free

package

3

••Management Philosophy Creating electronic technologies is our business. Always thinking from an international perspective

and working to develop ourselves to our full potential, we strive to provide the finest products as well

as help improve the quality of life for all. We share this joy with society.

••Quality Management Designing and Manufacturing Products from the Customer Viewpoint

KEC's quality policy has always been that all products must always be designed and manufactured

from a customer perspective. Consequently, the company has moved from a quantity-driven

manufacturing approach to a quality-first strategy.

KEC has continuously enhanced the quality of its products by strictly observing its technology and

manufacturing standards. It applies the same standards and quality assurance systems to all production

facilities in order to keep the quality of its products at the same superior level.

The consistency in its commitment to quality has resulted in numerous achievements of international

quality standards:

ISO/TS16949:2009 automotive quality system standards within the global automotive industry.

KEC maintains its quality inspection independent in effort to rule out possibilities of defects on

products. It is also strengthening employee training programs and other quality management activities

to reach a zero-defect level.

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••Environment ManagementRealizing their duty of exerting effort for human health and environmental protection, all at KEC are

doing their best to preserve the environment through cleanliness, saving and recycling and to ensure

health and safety in the work place.

KEC controls pollutants more strictly than is required legally, and takes samples periodically for

analysis to prevent environmental accidents. Also, for efficient control of discharge facilities, the

facilities data related to water and air quality are recorded on history cards.

In addition, KEC exerts an effort to grow out of manual disposal of waste and pollutants and realizes

environmental management for reduction of waste discharge, increased recycling, and environmental

affinity process development.

In particular, after obtaining the ISO 14001 certification in March 1998, the working personnel in the

environmental management system are doing their best to realize environment management in every

field.

••Environmental Safety and Health Policy1. We continue our efforts to minimize water and air pollutants and waste that affect our environment.

2. We continue our efforts to minimize our exposure to danger by improving potential safety

and reducing health hazards.

3. We stick to all environmental safety and health regulations and related requirements.

4. We endeavor to save energy and make products with environmental affinity.

5. We cultivate quality to improve our environmental safety and health.

6. We announce our achievement in environmental safety and health and provide the same upon

request from relevant parties.

••KEC Definition of Lead-Free For information seen on this Data, KEC defines "Lead-free" as lead concentration that does not

exceed 0.1% by weight of the KEC components. KEC has selected Sn or SnAgCu alloy as the

replacement for SnPb solder used in terminals of packages.

Please contact your local KEC Sales representatives for the additional information.

Lead-Free Products Groups

5 http://www.kec.co.kr

◈◈ Small Signal Device

◈◈ Power Device

◈◈ IC Device

◈◈ Automotive Device

6

Lead-Free Semiconductor

http://www.keccorp.com

■Making Package Terminals Lead-free

Making terminals Lead-free

SMD Package THD Package

Lead-Free Specifications

Package Conventional Specifications Lead-free Specifications

Surface Mount Type

(SMD)

Sn-Pb PlatingPure Tin Plating

Sn-Pb Dipping

Ni, Au Plating Same as conventional specification

Pin Insertion Type

(THD)

Sn-Pb Plating Pure Tin Plating

Sn-Pb Dipping SnAgCu Dipping

Ni, Au Plating Same as conventional specification

Lead-Free Soldering Temperature Profile

Time (sec)

Reflow Temperature Profile

150 C

200 C

Peak : 260 C

Tem

per

ature

( C

) 217 C

255 C

60~180sec 60~150sec

20~40sec

Time (sec)

Flow Temperature Profile

100 C

120 C

Peak : 265 C

Tem

per

ature

( C

)

30 5sec

Preheating Zone

+_

10 1sec+_

+0+0

-5

Lead-Free Master Plan Schedule


KEC has initiated conversion of all products into lead-free finish packages.KEC has targeted the all products of lead-free in January 2004.

■ The lead-free production launched from 2002, and the preparation for lead-free mass-production

has been set up for all packages since 2003.

■ The higher melting points of lead-free solders and the resulting higher mounting temperatures

require enhanced heat resistance in components.

■ Lead-free products are differentiated from conventional products by “/P”marking on the label

of inner boxes, carton boxes and reels respectively.

■ Lead-free products differ from the finish material of their terminals only, so there are no differences

in their electrical characteristics between lead-free products and conventional products.

Lead-free Research

2001 2002 2003 2004

Pilot Production

Mass Production

System Set-up

All Lead-free

Products can be

supplied if requied

Lead-Free Materials

SMD THD

MaterialConventional Sn90-Pb10/Sn63-Pb37 Sn63-Pb37

Lead-free Pure Tin (Sn 100%) Sn-Ag-Cu

Lead-Free Reliability Evaluation Item

Evaluation Item Heat Resistance Solderability Joint Strength Whisker

Test MethodDipping TestReflow Test

Dipping TestReflow Test

Shear Test Storage Test

Package Type

Product Group

Package Name

AppearanceCurrent

Soldering Method

Lead-Free Soldering (Soldering Method & Solder Composition)

Sn Plating

SnAgCuDipping

Ni Plating

Au Plating

HeatResistance

Temp.

SMD

(Sur

face

Mou

ntT

ype)

IC

*Note 1)

Sn-10Pb Plating

265℃10sec

TR

Sn-10Pb Plating

Sn-37Pb Dipping

265℃10sec

Diode

Sn-10Pb Plating

Sn-37Pb Dipping

265℃10sec

Auto-motive

MR DO-218

Ni Plating Sn-10Pb Plating

265℃10sec

TH

D(P

inIn

sert

ion

Typ

e)

IC

IPAK DIP SIP

SSIP

Sn-10Pb Plating

265℃10sec

TRTO-92TO-3PTO-126TO-220

Sn-37Pb Dipping

265℃10sec

DiodeSn-37Pb Dipping

265℃10sec

Auto-motive

B-PF H-PF

Ni Plating 265℃10sec

8

Lead-Free Specifications for Various Packages


*Note 1) Packages : DPAK/5, ESM, ESC, FLP, SMA/F, SOT-23, SOT-89, TESV/6, TSM, TSV/6, USM, USC, USV/6/8, VSM


Lead-Free Reliability Test Results

1. Solderability Test Results : SMD (Surface Mount Type)■■ Solderability Test has been performed to ensure both conventional and lead-free process compatibility

of KEC devices. Test results demonstrate that KEC lead-free devices can be successfully integrated

into either conventional or lead-free solder mounting environment.

SolderPaste

PeakTemperature

Type of Lead Frame

Conventional (Sn90-Pb10, Plating)

Lead-free (Pure Tin Plating)

Sn63-Pb37 220℃

Sn96.5-

Ag3.0-

Cu0.5240℃

•Test Package : SOT-23.•Pre-treatment : Steam Aging 8hr, Mounting on PCB for Reflow Test.

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2. Solderability Test Results : THD (Pin Insertion Type)■■ Solderability Test has been performed to ensure both conventional and lead-free process compatibility

of KEC devices. Test results demonstrate that KEC lead-free devices can be successfully integrated

into either conventional or lead-free solder mounting environment.

SolderPeak

Temperature

Type of Lead Frame

Conventional (Sn63-Pb37, Dipping)

Lead-free (SnAgCu, Dipping)

Sn63-Pb37 230℃

Sn96.5-

Ag3.0-

Cu0.5240℃

•Test Package : TO-92.•Pre-treatment : Steam Aging 8hr, PCB Mounting Test at Flow.



3. Mounting Test Results : Joint Strength

Reflow TestSolder Paste

Type of Lead Frame

Conventional (Sn90-Pb10, Plating)

Lead-free (Pure Tin Plating)

Sn63-Pb37

0

10

30

20

15

25

Join

t S

tren

gth

(N

)

Number of Temperature cycle

200 400 600 800 1000

35

40

0

10

30

20

15

25

Join

t S

tren

gth

(N

)


200 400 600 800 1000

35

40

Sn96.5-

Ag3.0-

Cu0.5

0

10

30

20

15

25

Join

t S

tren

gth

(N

)


200 400 600 800 1000

35

40

0

10

30

20

15

25

Join

t S

tren

gth

(N

)


200 400 600 800 1000

35

40

•Test Package : SOT-23.•Temperature Cycle Test condition : -55℃/+150℃.•Test Method : Shear Test.

12



4. Whisker Evaluation Test

Test Condition Pure Tin Plating on Cu Lead Frame

TCT

(-55℃↔150℃)

High Temperature

High Humidity

Storage

(85℃/85% RH)

1,000 cycle

1,000 hr

10㎛㎛

8㎛㎛

iso/ts 16949:2009 - kec homepage · iso/ts 16949:2009. kec semiconductor ... iso/ts16949:2009...

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