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ITRS Conference July 2010 , San Francisco, CA 1

ITRS Factory Integration (FI) Update

Gopal Rao

July 2010

San Francisco, CA

 July 2010 Meeting Attendees:

Michio Honma, Shige Kobayashi, Gopal Rao, Andreas Neuber, Terry

Francis, James Moyne,Patrick Fernandez, Chris Keith, Daniel Stevens, Les Marshall, Peter

Csatary,

Richard Oechsner, Bruce Klafter, Jim Jewett, Parris Hawkins, Mark Denome,

Michael Mocella, Masazumi Fukushima

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  ITRS Conference July 2010 , San Francisco, CA 2

Agenda

1. Factory Integration Scope and Drivers

2. Key Technologies and Mapping of FI

agenda

3. Energy Conservation

4. FI Agenda for next 6-9 months

5. Summary

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  ITRS Conference July 2010 , San Francisco, CA 3

Factory Integration Scope and Drivers

Wafer 

Mfg

Chip

MfgProduct

Mfg      D      i     s       t      r      i      b 

     u       t       i     o 

     n

• FEOL• BEOL

• Probe/Test• Singulation

• Packaging• Test

Si Substrate

Mfg

Reticle

Mfg

Increasing cost &

Cycle time implications

Factory is driven by Cost, Quality, Productivity, and SpeedReduce factory capital and operating costs per functionFaster delivery of new and volume products to the end customer Efficient/Effective volume/mix production, high reliability, & high equipment reuseEnable rapid process technology shrinks and wafer size changes

FactoryOperations

ProductionEquipment AMHS

Factory Information& Control Systems Facilities

UI

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  ITRS Conference July 2010 , San Francisco, CA 4

Key Technologies that will Impact Factory Design 2010 and future years were targeted to meet productivity and capture technology requirements

Key process & device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho(EUVL), New Device Structures, new materials, wafer size conversion & huge productivity improvements, naturalresource conservation

Economic and business challenges are equal to our manufacturing and process technology challenges in scopeand breadth to attain efficiency and effectiveness

20142014

FI ScopeFI Scope

MappingMapping

––

ForFor

illustratioillustrationn

purposepurpose

onlyonly

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 ITRS Conference July 2010 , San Francisco, CA 5

Energy FocusRegulation Research

Operations (Fac/FO) Production Equipment

een Buildings/ Sub Fabergy Conservation/Waste Reduction

eterstegration with Smart Gridta Visualization

tegration with Renewable Energy Generationetricsctory Operational Policies

• Semi Standard S23 Next Gen Standard• Smart Sensors• Data Integration & Networking

• Data Visualization•Fab/Sub fab sync•Idle mode• Metrics

Carbon TaxRegional RegulationsRenewable Energy Generation IncentivesUtility CostsMetrics

• Modeling & Simulation of energy consumption• Sensor Development• Energy Recovery from processes• Energy Mapping – Factory, Tool and with in To• Energy Storage

 

Dot size indicatesamount of work 

needed

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 ITRS Conference July 2010 , San Francisco, CA 6

FI Agenda – Next 6-9months

Energy Workshop Continue discussions on energy, regulation etc and bring to IRC/TWGs key

recommendations for integration into roadmap Use workshops to dig deeper into tough issues

AEC/APC

450mm Comprehend FI issues and challenges for 450mm wafer size conversion

Development of baseline process for generating metrics Define a generic process flow Benchmarking/data quality Development of 300mm/450 mm fab model for energy and related

modeling/simulation

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FI Agenda – Next 6-9months

Formal process being developed for communicating researchopportunities that evolve from FI new topic discussions toAcademia, Suppliers, IRC, TWGs

Cost is one of the key parameters for staying on Moore’s Law FI will develop a proposal

Waste reduction in other TWGs Productivity improvements/metrics

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Factory Integration Summary

All FI technology requirements tables and potential solutionstables updated

Operations, Equipment, AMHS, FICS and Facilities Identified key focus areas for FI Technology requirement and potential solutions for 300/450mm Energy Conservation Waste reduction due to intrinsic equipment & factory system losses and better 

visibility of data

AMC solutions for equipment and FOUP Working with other TWG on cross-cut issues With FEP, Litho, Metrology, Yield Enhancement and ESH EUVL, energy conservation, etc.

Business strategies, market demands, and process technologychanges continue to make factories difficult to integrate

Work with other forums/WG to ensure synergy ISMI 450mm WG, SEMI, etc.