javier garcia - verdugo sanchez - six sigma training - w1 process maps

Graphical Process Presentation

Process Maps Week 1

Knorr-Bremse Group

p

Content

• Different techniques for process mappingDifferent techniques for process mapping

• The role of process maps in the DMAIC p pcycle

• Use of top-level maps and detailed wall diagrams

• Examples of the different techniques

• Practical use of the tool

Knorr-Bremse Group 04 BB W1Process Maps, 04, D. Szemkus/H. Winkler Page 2/36

Six Sigma & the DMAIC Cycle

ControlMaintain

DefineMaintain

ImprovementsSPC

Control Plans

Project charter (SMART)

Business Score CardQFD VOC

D Documentation QFD + VOC

Strategic GoalsProject strategy

C M

MeasureB li A l iImprove

AIBaseline Analysis

Process MapC + E MatrixAnalyze

ImproveAdjustment to the

OptimumFMEA

Measurement SystemProcess Capability

Definition of critical InputsFMEA

S

FMEAStatistical Tests

SimulationTolerancing Statistical Tests

Multi-Vari StudiesRegression

Tolerancing


S I P ODefinition of a Process

Suppliert

CustomerRequirements Requirements

S I P O C

PROCESS• extern• intern

• extern• internInputs Outputs

Measurement

• A series of activities that transforms a set of inputs, into a specific set of outputs. Workforce, instructions (SOP) and equipment are involved in these activities and required forequipment are involved in these activities and required for information flow and material treatment.

• A process can be analyzed with respect to:Cost– Cost

– Cycle time– Defects


The Periphery of Processes

S I P O C

SupplierSupplier

Input / Requirements / Influence Factors

Process

O tp tOutput / Result / Customer Requirements

Customer

Processes are not islandsKnorr-Bremse Group 04 BB W1Process Maps, 04, D. Szemkus/H. Winkler Page 5/36

Processes are not islands

Diagram Techniques

G hValue Chain

GrowthMarketing

SIPOCDetailed

SIPOCDefects/Variation

Top Level Functional

L d ti

Complex Flows

Effi i /LLead time Efficiency/Lean

The content of this module

F h t t ifi di

The content of this module


For each strategy a specific diagram…

Diagram Techniques

Top level diagram:

Functional diagram:

PA

SS

EN

GE

R (

PA

X)

EN

T

CHECKBAG?

CHECKBAG?

NO

FLYINGFLYING

YES

WRITE UPBAG TAG

WRITE UPBAG TAG

ATTACH

PAXARRIVES @

TICKET COUNTER

PAXARRIVES @

TICKET COUNTER

PAXARRIVES @

DEPART.GATE

PAXARRIVES @

DEPART.GATE

PAXARRIVES @

DESTINATION

PAXARRIVES @

DESTINATION

PAXDEPARTS AIRPORT

PAXDEPARTS AIRPORT

Detailed wall diagram:

TIC

KE

T A

GE

BA

GG

AG

E H

AN

DL

ER

@ D

EP

AR

TU

RE

AIR

PO

RT

ATTACH TAG TO BAG

ATTACH TAG TO BAG

GIVE BAG TAG STUB

TO PAX

GIVE BAG TAG STUB

TO PAXPUT BAG ONCONVEYOR

PUT BAG ONCONVEYOR

SORT BAGS BY FLIGHT NO.

SORT BAGS BY FLIGHT NO.

PLACE BAGS PLACE BAGS

ON CART

DRIVE CART TOPROPER PLANE


LOAD LUGGAGELOAD LUGGAGE

ON PLANE FLYINGFLYING

BAG & PAX

MATCH?

BAG & PAX

MATCH?BAG

ARRIVES @NEXT

BAGARRIVES @

NEXTBAG ON

A

BAG ONA

AIRPLANE

YESNO

FILECLAIM

FILECLAIM

@B

AG

GA

GE

HA

ND

LE

R@

AR

RIV

AL

AIR

PO

RT

ON CARTON CART

ON PLANEON PLANE FLYING

SORTLUGGAGE

IN HOLD OFAIRPLANE

SORTLUGGAGE

IN HOLD OFAIRPLANE

PLACE ON PROPER CART FOR CONNECTING FLIGHT

CONTINUING FLIGHT SEND TO TERMINAL

TERMINATION FLT.

NEXTSTOP

STOPAIRPLANEAIRPLANE

CONNECTING FLIGHT

Pictures / graphics tells more than …


g p

The Basis for the Next Steps

Process Map C & E Matrix•SPC•Solder paste height •Set up control data •Solder quality•SPC•Solder paste height •Set up control data •Solder quality

1 2 3 4 5 6 7 8 9 10 11

Process Step Process Inputs Hea

vies

in

Pro

duct

Ligh

ts in

P

rodu

ctM

oist

ure

in

Pro

duct

Aci

dity

in

Pro

duct

Low

Cap

acity

F

rom

Uni

tE

xces

sive

D

ownt

ime

Mat

eria

l Lo

sses

Cor

rosi

on o

f E

quip

men

tP

oor

Rea

ctor

P

erfo

rman

ce

Total

139 Day Tanks Analysis 10 10 9 9 3359 Reactor Cat./HF Ratio 5 8 7 157

Reflow paste-print

SMD-Placement

Reflow-Soldering

SPC-check

M Circuit boardN LP-marksM Solder paste

M ComponentsC Placement programC BE post supply

C Solder profile ProgramS Auxiliary materialN Maintenance condition

N Control loop-information

I Control film

Solder paste height Set up control data Solder quality

Reflow paste-print

SMD-Placement

Reflow-Soldering

SPC-check

M Circuit boardN LP-marksM Solder paste

M ComponentsC Placement programC BE post supply

C Solder profile ProgramS Auxiliary materialN Maintenance condition


I Control film

Solder paste height Set up control data Solder quality

9 Reactor Cat./HF Ratio 5 8 7 1577 Reactor Rxr Temperature 6 5 4 7 14973 Lights Removal Condenser Leak 4 8 2 4 1 14874 Lights Removal Reboiler Leak 4 8 2 4 1 148131 Purification Low Stages 8 8 144144 Final Storage Containers 3 2 6 6 140100 Neutralization pH Value 6 6 3 13816 Catalyst Stripper Pluggage 3 6 5 3 137111 Drying Decomposition 2 6 3 2 2 13439 Drier Water Carryover 4 6 5 1 13234 Drier MolecularSieve 3 3 2 7 2 125THT- FinalWave-

pI Work instructionN ModelN Temperature

p pp yI Work instructionsN PneumaticN Maintenance condition

N Oven contamination I Control instructions

•Placement quality •Solder wave parameter •Go / no go•Defect number•Defect sheet•DiagnosisTHT- FinalWave-

pI Work instructionN ModelN Temperature

p pp yI Work instructionsN PneumaticN Maintenance condition


•Placement quality •Solder wave parameter •Go / no go•Defect number•Defect sheet•Diagnosis 34 Drier Molecular Sieve 3 3 2 7 2 125

Capability of process and

THTPlacement

Final inspection

WaveSoldering

M ComponentsI Roy.- ProgramI Placement instructionN Training

I Solder parameterM Auxiliary materialM Solder maskN Maintenance condition

I Inspection programN AdapterN Net work

•DiagnosisTHTPlacement

Final inspection

WaveSoldering

M ComponentsI Roy.- ProgramI Placement instructionN Training

I Solder parameterM Auxiliary materialM Solder maskN Maintenance condition

I Inspection programN AdapterN Net work

•Diagnosis

USLLSL

FMEA

measurement system

Process Step/Part Number

Potential Failure Mode Potential Failure EffectsSEV

Potential CausesOCC

Current ControlsDET

RPNActions

RecommendedResp.

COATING & IMAGING

DIRTY PHOTOMASK MICROCRACKING, DELAMINATION, STREAKS 8

LOW FREQUENCY OF CLEANING

8

SOP, VISUAL INSPECTION

7 448

INCREASE FREQUENCY TO ONCE EVERY 20 PANELS

MG

33323130292827

IMPROVE CLEANING METHOD

PF

PURCHASE OFF-LINE CLEANING SYSTEM

MG

TEST ON-LINE MASK REPLACEMENT

PF


Benefits of Process Maps

• Basis for the Cause & Effect matrix

• Basis for the FMEABasis for the FMEA

• Inputs for the capability summary

• Inputs for Multivari Studies• Inputs for Multivari-Studies

• A living document

– Process description (ISO …)

– Basis for “on the job training”


The Process Presentation

There are several possibilities for a process map…

How we think it is... How we wish it is...How it is in reality...


Top Level Diagram

The procedure for process map creationThe procedure for process map creation

Name of the process

Split in detailed stepsCustomer

Split in detailed stepsInputs

Outputs

• _______ • _______• _______• _______

Important partial steps

• _______• _______• _______

• _______• _______• _______

• _______• _______• _______

• _______• _______• _______


Top Level Diagram

An example:An example:

Passenger arrives at

check-in counter

Tag bag atcheck-in counter

Transport bag to baggage claim area

Passenger leavesairport

Transport bag to plane

Transfer bagto connecting

plane

• Check final destination

• Place bag on cart bound for d i d fli h

• Unload bags not designated for flight

i i

Porter:

Pl b i• Prepare tag

• Attach tag to bag

S l b i

designated flight

• Wait until cart isfull, or until 15 minute before

h d l d fli h

continuation on cart

• Drive cart to terminal

• Separate bagsdi

• Place bags in designatedbaggage claimscarousel

P• Staple bag receipt to ticket

• Place bag on moving belt

scheduled flight

• Drive cart to plane

• Load bags to plane

according toconnecting flights

• Load bags oncarts in terminald i d f

Passenger:

• Check tag against receipt

If b i f ddesignated forconnecting flight, or transport to baggage claim area

• If bags is not found, file claim


Detailed Process Mapping

• What is the purpose of the tool • When should a process map p p– Graphical description of the

process

p pbe used?– Always

• What will the tool identify?– All process inputs (X)

• What are the outputs of a process map?– All process inputs (X)

– All process outputs (Y)– Data collection points

process map?– Identification of systems

which need a measurement system evaluation

p– The first relationships, which

will be investigated by the FMEA

system evaluation– Identification of outputs for

capability studiesFMEA– Shows all value adding and

non value adding process

p y– Identification of gaps in the

control planO t iti f li i tisteps – Opportunities for elimination of process steps


Process Description

• The process map shall describe:

– Main activities / tasks

– Sub processesSub processes

– Process boundaries

Inputs (X)– Inputs (X)

– Outputs (Y)

• Has to be checked and updated frequently

y f x x xk= ( , ,..., )1 2y f x x xk( , ,..., )1 2


Preparation for Process Mapping

• Selection of team members:– Planning / manufacturing engineers– Operators

Supervisor– Supervisor– Maintenance staff

• Necessary inputs:– Brainstorming

O ti l– Operating manuals– Technical specifications– Experience of the operatorsExperience of the operators– 6 Ms

Men, Machine (Equipment), Method (Technique), M t M t i l M th N t (E i t)Measurement, Material, Mother Nature (Environment)


Steps to Create a Process Map

Identification of the process, the inputs (from suppliers) and outputs (from customers), can be

1suppliers) and outputs (from customers), can be external as well internal (partners) suppliers and customers (helpful S.I.P.O.C.)!

Identification of all process steps

P t D i i

2

Process step Decision

Further symbols e.g.: Power point > Auto form > Flow diagrams

Listing of all output variables for each process step

Listing of all input variables for each process step

3

Listing of all input variables for each process step

Characterization of the process inputs in controllable i t i ( t t ll bl ) d i t ti

4inputs, noise (not controllable) and instructions


Step 1:

Identification of the process and the inputs/outputs

• Identification of Inputs– Material (raw materials, parts, etc.)– Information (order, specifications, etc.)

• Identification of the OutputsU th d t d i QFD f th id tifi ti f th– Use the product design - QFD for the identification of the final product specification

WaxInputs Outputs

WaxOxidation

LMWPE WaxAir flow

Acid numberColorAir flow

TemperaturePressure

ColorViscosityDrop testHardness


Hardness

Step 2:

Identification of all process steps

• Include all steps, value adding and non value ddiadding– Activities/Transformations, Inspections/Tests,

Rework ScrapRework, Scrap

Preparation Reactor Oxidation Stabilization Filling

Bring in waxHeat up reactor temp.

Parameter adjustmentFrequent observation of

acid number

Parameter adjustmentslow pressure reduction

Temp. observation

Check nozzle typeParameter adjustment

Consistence observationobservation


Step 3:

Consider process as well product output variables

Listing of all important output variablesConsider process as well product output variables

Outputs•TimeA id b

•TimeA id b

Outputs

Preparation Reactor


Stabilization


•Acid number•Viscosity•Reactor temp.•Temp. profile

•Acid number•Color•Viscosity•Reactor temp.•Temp profileTemp. observation •Temp. profile•Gas flow

Oxidation Filling

OutputsOutputs•Time•Acid number•Color

•Oxidation time•Acid number•Color


acid number


Consistence observation

Color•Viscosity•Drop test•Hardness•Granulate optic

Color•Viscosity•Reactor temp.•Temp. profile•Gas flow observation p


Step 4:

Characterization of the important input variablesThe input variables can be characterized as followsThe input variables can be characterized as follows

•Controllable•Noise (not controllable)•Instructions (Standard operating procedures)

Controllable inputs: Changeable inputs which have an effect of the

Instructions (Standard operating procedures)

Controllable inputs: Changeable inputs which have an effect of the outputs (results). Can be adjusted.

Noise inputs: Input variables which have an effect on the outputs (results) but difficult or not possible to control(results), but difficult or not possible to control.

Example: Environment conditions like humidity

Instruction (Standard operating procedures): Qualitative or quantitativeInstruction (Standard operating procedures): Qualitative or quantitative variables, which specifically describe the operation of a process (e.g. parameter adjustments, etc.)

C iti l i t (KPIV) V i bl hi h h t ti ti l i ifi tCritical inputs (KPIV): Variables which have a statistical significant effect on the outputs (results).


Example Process Description:

Add and characterize input variables

Outputs•TimeA id b

•TimeA id b

Outputs•Wax I

C

Inputs InputsMix speed C

Preparation Reactor


Stabilization


•Acid number•Viscosity•Reactor temp.•Temp. profile

•Acid number•Color•Viscosity•Reactor temp.•Temp profile

•Feed rate C•Mix speed C•Temp. C•Pressure CAir flow C

•Temp. C•Pressure C•Air flow C•% O2 in air NAi t C Temp. observation •Temp. profile

•Gas flow•Air flow C•% O2 in air N•Viscosity N•Wax temp N

•Air temp. C

Oxidation Filling

OutputsOutputs•Time•Acid number•Color

•Oxidation time•Acid number•Color

Inputs•Given SZ I•Mix speed CT C

Inputs•Line speed C•Line temp. CFl t C


acid number


Consistence observation

Color•Viscosity•Drop test•Hardness•Granulate optic

Color•Viscosity•Reactor temp.•Temp. profile•Gas flow

•Temp. C•Pressure C•Air flow C•% O2 in air N•Air temp N

•Flow rate C•Nozzle type I•Whole size I•Room temp. N•Mix speed C observation p•Air temp. N

•Humidity N•Mix speed C•Tank temp. C


Another Example

The Top Level

Sub-assembly manufacturing

Input Output

g

Order Sub assembly qualityOrderMaterialWork plan

Sub-assembly qualityNumber of defectsProcess time

Adjustment instructionsMachine

Process timeDiagnostic resultsManufacturing cost

Environmental conditionsOperatorD t t k

gNumber of units

Data networkManufacturing capacityProcess engineering


Process engineering

S lit i i l tSubdivision in Single Steps

Input Output

Split in single steps

S b assemblInput OutputSub-assembly manufacturing

Reflow paste print

SMD-Placement

Reflow-Soldering

SPC-Checkpaste-print Placement Soldering Check

THT- Final Wave-Placement InspectionSoldering


Detailed Process Map • Inspection results• Control loop info to

SMD/Screen printor line stop

•SPC•Solder paste height •Set up control data •Solder quality

Reflow paste-print

SMD-Placement

Reflow-Soldering

SPC-check

M Circuit boardN LP-marksM Solder pasteI Work instruction

M ComponentsC Placement programC BE post supplyI Work instructions

C Solder profile ProgramS Auxiliary materialN Maintenance conditionN Oven contamination


I Control filmI Control instructionsI Work instruction

N ModelN Temperature

I Work instructionsN PneumaticN Maintenance condition


THT- Final Wave-

•Placement quality •Solder wave parameter •Go / no go•Defect number•Defect sheet•Diagnosis

Placement inspectionSoldering

M ComponentsI Roy.- Program

I Solder parameterM Auxiliary material

I Inspection programN AdapterI Roy. Program

I Placement instructionN Training

M Auxiliary materialM Solder maskN Maintenance condition

N AdapterN Net work

Legend of the Inputs: M = Material, C = Controllable, N = Noise, I = Instruction


Legend of the Inputs: M Material, C Controllable, N Noise, I Instruction

Practical Exercise with the Catapult

King Louis has an strong interest to conquer the castle Frankenstein This castle is a strategic important point andFrankenstein. This castle is a strategic important point and gives his enemy King George currently the opportunity to control a part of King Louis kingdom.control a part of King Louis kingdom.

The master carpenter of King Louis has developed a new prototype of weapon a catapult The King wants to usenew prototype of weapon, a catapult. The King wants to use the catapult to take over castle Frankenstein in order to ensure independency and freedom.depe de cy d eedo .

Your assignment is to create a process map for the installation process and the launch process The King willinstallation process and the launch process. The King will specify later where the catapult has to be set up in relation to the castle. The condition may change from day to day, so that y g y y,the shooting distance to the castle will vary as well.

( Time frame: 30 minutes followed by a team presentation)


( Time frame: 30 minutes, followed by a team presentation)

Practical Application

Pizza Service:Pizza Service:

Develop a top level diagram from the order entry up p p g y pto the delivery at the door of the customer. For one of the process steps create a detailed map with inputs and outputs

For your own project:y p j

Start to develop a process map for you own project and use this for the next team meetingand use this for the next team meeting


Summary

• Different techniques for process mapping

Th l f i th DMAIC l• The role of process maps in the DMAIC cycle

• Construction of top-level maps and detailed wall p pdiagrams

• Examples of the different techniques• Examples of the different techniques

• Practical use of the tool


Appendix

and further examples of process maps


Reduction of Cycle Times – Process Analysis

Definition:• A step is value adding if:• A step is value adding if:

– the customer recognizes the value– the product changes, ande p oduc c a ges, a d– when it is done the first time

• A step is waste if:– it needs more than the minimum of equipment, material, parts,

d k ti th t i b l t f lspace and work time that is absolute necessary for value adding.

• A step is needed / necessary if:– it is required due to law, a regulation or a contractq , g– it is required for health, safety and environment or for ethical

reasons



Calculation of time demand for goal setting

+ Transport between departmentsW i i i

None

+ Waiting time+ Sorting+ Storage+ I tim

e

valueadding

+ Inspection+ Checks+ Admission+ Filingcl

e ti

m

+ Filing+ Corrections / Rework

tal

cyc

+ Writing+ Production+ A l i

Value

Tot

3R l ti X+ Analysis+ Assembly

= Raw cycle time

adding= Goal

3Raw cycle time X


Raw cycle time


“What is the reason for a break?” – Analysis on the wall chart

Answer the following questions to identify areas where process time can be shortened.

Non value addingWhich activities are not value adding?gWhich activities could be eliminated?Which activities could be combined?Which activities could be replaced by more simple ones?

Long rows: More activities at the same time?Long rows: More activities at the same time?Were are long chains of tasks in the process map?Which key tasks can be started before previous activities are completed?Which key tasks can be started before previous activities are completed?Which activities can be started earlier than currently assumed?


Another Format (Example)KPIVs Process Step KPOVs

Input type Major Step Sub-process Output

SBS noise Evaluate Incoming Materials Material Characteristics:g granular size noise Softening Point

PenetrationCoal Tar noiseOil noiseFill iFiller noiseFire Retardants noiseStandard formula SOP

Material characteristics SOP Formula Preparation Lab blendpSoftening PointViscosityPenetration

Historic data SOP % Coal Tar% Other ingredients% Other ingredients

Prepare Production Batch Sampleprocedure SOP Zero the tank Softening Point

ViscositySOP Clean transfer lines/filters Penetration

Tank temp. process Set tank temperatureFormula SOP Add Coal tarFormula SOP Add oil275-300 RPM Controllable Agitate275 300 RPM Controllable AgitateMotor horsepower ControllableFormula SOP Add SBS1 1/2 hours mix Controllable Add stabilizers1 hour mix Controllable Add fillers


holding time Controllable Transfer to holding tank

Example, Wall Chart

NO

PAXARRIVE

AIRPORT

TICKET AGENT

WRITE UPBAG TAG

ATTACH TAG TO

BAG

TAG STUBTO

PAX

CHECK BAG?

BAG TOCONVEYOR

SORTBAG BY FLIGHT

YES

BAG TAG

NO

YES

LOAD CART

FLIGHT ACTIVITY

ANDARRIVAL

LOADAIRCRAFT

BAGS TOAIRCRAFT

BAGSON

PROPER CART

SORTBAGS IN

AIRCRAFTHOLD

LEAVEON

PLANE?

NO

CART TOBAGGAGE

PAX TO BAGGAGE BAG &

YESHAPPYBAGGAGE

PICK UPBAGGAGE

PICK UP

BAG &PAX

MATCH?

HAPPYCUSTOMER

NO

FILE CLAIM

PAXLEAVE

AIRPORT


Wall Chart with Inputs and Outputs

Bag on ConveyorPax Gets Tag

Tag Attached to BagTag Written UpOutputs (y’s)

...PAXARRIVE

AIRPORT

TICKET AGENT

WRITE UPBAG TAG

ATTACH TAG TO

BAG

TAG STUBTO

PAX

CHECK BAG?

BAG TOCONVEYOR

YES

Ticket AgentTagBagPenFlight NumberP

Ticket AgentTagBag

Ticket AgentTag StubPassengerTip Money

Ticket AgentTagged BagConveyorInputs (x’s)

Passenger


Create a Functional Process Map

• The top level diagram is the foundation

• Select a team

• Team tasks:Team tasks:

– Collection of all process steps (Hint: Post It‘s),

Grouping in accordance to functions– Grouping in accordance to functions,

– What is running parallel or what depends on each other,

– Collection of inputs and outputs for each step,

– What are the min - max times for each step,

– Important: all rework loops have to be included

• After completion a practical check is neededp p

• Get feedback from others involved in the process


Example: Functional Process Map

EN

GE

R (

PA

X)

CHECKBAG?

NO

FLYING

PAXARRIVES @

TICKET

PAXARRIVES @

DEPART.

PAXARRIVES @

DESTINATION

PAXDEPARTS

PA

SS

E

YES

WRITE UP

COUNTERCOUNTER GATEDESTINATIONDESTINATION AIRPORT

TIC

KE

T A

GE

NT

WRITE UPBAG TAG

ATTACH TAG TO BAG

GIVE BAG TAG STUB

FILECLAIM

T

DL

ER

IRP

OR

T

TO PAXPUT BAG ONCONVEYOR

SORT BAGS BY DRIVE CART TO

BA

GG

AG

E H

AN

D@

DE

PA

RT

UR

E A

I SORT BAGS BY FLIGHT NO.

PLACE BAGS ON CART


LOAD LUGGAGEON PLANE

FLYING

BAG & PAX

MATCH?BAG

ARRIVES @NEXT

BAG ONA

AIRPLANE

YESNO

@A

ND

LE

RA

IRP

OR

T

ON CART ON PLANEFLYING

STOPAIRPLANE

BA

GG

AG

E H

A@

AR

RIV

AL

A

SORTLUGGAGE

IN HOLD OFAIRPLANE

PLACE ON PROPER CART FOR CONNECTING FLIGHT

CONTINUING FLIGHT SEND TO TERMINAL

TERMINATION FLT.

CONNECTING FLIGHT


javier garcia - verdugo sanchez - six sigma training - w1 process maps

Engineering