Organizer / Contact:ANSYS Germany GmbHBirkenweg 14 a64295 Darmstadt / GermanyT: +49 6151 3644-0F: +49 6151 3644-44www.ansys-germany.comworkshops-germany@ansys.com

Follow us on Twitter:#ASWC2016

ansys.com/aswcansys.com/aese-germany

Agenda

Munich – June 7-8, 2016

AwardsThe ASWC & AESE will close with a session in which awards will be presented in the following categories: ASWC

• Best Engine Simulation• Best Powertrain Simulation• Best Body and Chassis Simulation• Best eMobility and Autonomous Driving Simulation• Best Systems, HPC and Cloud Simulation• Best Automotive Simulation

AESE• Best Electronics Simulation

Conference Proceedings DownloadConference proceedings will be available for download on the ASWC and AESE websites after the conference:

www.ansys.com/aswcwww.ansys.com/aese

Congress VenueSheraton München Arabellapark HotelArabellastraße 581925 München / Germanyphone +49 89 92320www.sheratonarabellapark.com

Conference LanguagesThe conference languages will be English for the ASWC and English and German for the AESE. All lectures and presentations with English titles will be held in English, and those with German titles will largely use English slides (simultaneous translation will not be off ered).

Evening EventJoin our Networking Dinner on June 7, 2016 in a typical Bavarian Restaurant and “Biergarten” nearby the confer-ence venue. Binding registration for this social event is required during the conference registration process.

Keynote Speakers

Platinum Sponsors

Amazon Web Services (AWS) provides busi-nesses with a secure, reliable, low-cost, easy-to-scale, global IT infrastructure “in the cloud.” Hundreds of thousands of customers in 190 countries, rely on AWS for their infrastruc-ture needs, from running existing enterprise applications to building new applications in the cloud. The global AWS platform allows de-signers, engineers, and analysts from boutique studios to large enterprises to securely scale their business. aws.amazon.com

Hewlett Packard has been in the innovation business for more than 75 years. Our vast intellectual property portfolio and global re-search and development capabilities are part of an innovation roadmap designed to help or-ganizations of all sizes - from global enterpris-es to local startups - transition from traditional technology platforms to the IT systems of the future. Time to value defi nes success in today‘s global markets. You speed time to value by continu-ously delivering and optimizing apps and ser-vices for customers, partners and employees. Companies need to do four things well in order to survive and thrive in this idea economy: they must transform to a hybrid infrastruc-ture, protect the digital enterprise, empower the data driven organization and enable work-place productivity. hpe.com

Since its founding in 1968, Intel Corporation has grown into the world’s largest semicon-ductor company (based on revenue) establish-ing a heritage of innovation that continues to expand the reach and promise of computing while advancing the ways people work and live worldwide. Intel’s products and technologies are at the heart of computing and communication solu-tions that have become essential parts of busi-nesses, homes and schools around the world. The company’s products include microproces-sors, chipsets, other semiconductor products and software which are integral to computers, servers and infrastructure powering the Cloud, as well as consumer electronics, handheld de-vices and connected intelligent systems that include cars, shopping kiosks and bank ATMs. intel.de

Welcome

The World Automotive Simulation Congress & ANSYS Electronics Simulation Expo provide an unique opportunity to get an update on the latest simulation technologies and processes in the global automotive and electronics industry. We thank you for coming and look forward to spending time with you sharing information and ideas. MANFRED ADAMS

Brose

JIM CASHMANANSYS

FERDINANDO CANNIZZOFerrari

TOSH TAMBEAmazon Web Services

DR. DIRK LINSEBMW

STEPHAN GILLICHIntel

ERIC BANTEGNIEANSYS

DR. SANDEEP SOVANIANSYS

“Thank You for Your Support” to all our Sponsors!

PHILIPPE TRAUTMANNHewlett Packard Enterprise

ATSUSHI OGAWAHonda

JOACHIM NOACKZF TRW

DR. GRZEGROZ OMBACHQualcomm

Silver Sponsors

BETA CAE Systems S.A, is an engineering software company committed to the development of best-in-class CAE software systems that meet the requirements of all simulation disciplines. The company’s fl agship product, ANSA / μETA pre- & post-processing package, holds a worldwide leading position, in many sectors, including the automotive, railway vehicles, aerospace, motorsports, chemical processes engineering, energy, electronics, heavy machinery, power tools, and biomechanics. The company’s new solu-tion for Simulation Product Data and Resources Management, SPDRM, provides a simple, scalable, and intuitive way to capture, deploy, manage and improve CAE workfl ows. beta-cae.gr

CEI - founded in 1994 with Headquarters in Apex, NC, USA – has worldwide subsidiaries in Germany, China, India and Japan. CEI is the creator of EnSight, the leading software solution for visualizing, analyzing, and communicating data from complex mono- and multidisciplinary numerical simulations. It supports an extraordinary number of solver data formats. The open interface architec-ture allows for easy integration with any data format, and a Python API empowers users to customize the software to meet their specifi c needs. With support for parallel data processing and distributed graphics rendering, it is the leader in handling very large models. ensight.com

Fujitsu has been leading the HPC market for almost 40 years and off ers a comprehensive portfolio of computing products to meet wide-ranging HPC requirements: from x86-based CELSIUS workstations and PRIMERGY servers up to PRIMEHPC FX100, including storage systems, HPC middleware and integration services. An intuitive web based user interface – the Fujitsu HPC Gateway – low-ers entry barriers and makes HPC accessible to a much wider set of end-users. With cutting-edge hardware and a proven software stack users have at hand the most productive and coherent HPC workplace in the market today. fujitsu.com

modeFRONTIER is a multidisciplinary and multiobjective optimization platform capable of streamlining engineering process through innovative algorithms and integration with leading simulation software. In numerous industries, modeFRONTIER has become an essential tool to increase understanding of cost/performance factors and to reduce product development time. Over 250 international organizations have entrusted the best in class solution to design better and more effi cient products. For further information, please visit: modefrontier.com

Noesis Solutions is an engineering innovation partner to manufacturers in engineering-intense industries. Specialized in solutions that enable Objectives Driven Draft-to-Craft Engineering processes, its software products and services help customers adopt a targeted development strategy that resolves their toughest multi-disciplinary engineering challenges. This Engineer by Objectives strategy entails an automated approach that streamlines engineering processes to effi ciently manage the growing complexity of today’s engineering challenges. In addition, interactive design space visualization allows engineering teams to make informed decisions faster – empowering them to form & transform ideas into products that outsmart competition. noesissolutions.com

Open iT helps ANSYS users worldwide to optimize their engineering software licensing for the fastest time-to-market and maxi-mum ROI. As an ANSYS partner, Open iT software usage reports are a trusted source for enabling informed vendor-user business relationships. From single sites to globally dispersed organizations, from on-premise to cloud, Open iT TrueUse™ technology provides live dashboards, event alerts, chargeback for cost accounting, customizable reports for users, teams, projects, locations, vendors, and much more. Visit us at our booth to see what Open iT can do for you! openit.com

Sharc develops and provides revolutionary meshing and post-processing software for the most extreme CFD workfl ows. Using ad-vanced proprietary data formats, innovative rendering engines and unique meshing algorithms, Sharc is able to reduce time from CAD to visualisation by orders of magnitude using the extreme meshing software, Harpoon and the industry leading visualisation suite of software Periscope. Our technical staff provide customisation and tailoring of the software to customer specifi c require-ments, streamlining the engineering process even further. sharc.co.uk

Gold Sponsors

Global supercomputing leader Cray builds innovative systems and solutions enabling scientists and engineers in academia, gov-ernment and industry to meet existing and future simulation and analytics challenges. Leveraging 40 years of experience in developing and servicing the world’s most advanced supercomputers, Cray off ers a comprehensive portfolio of high performance computing, storage and data analytics solutions delivering unrivaled performance, effi ciency and scalability. Cray’s industry lead-ing technologies are available in confi gurations to meet every budget and need. Whatever your research question, Cray makes it easy to take advantage of high performance computing advancements. cray.com

Lenovo, the world’s number 1 PC provider (per IDC reports), produces the ThinkStation, ThinkPad and ThinkServer product lines. Lenovo ThinkStation Workstations and ThinkPad Mobile Workstation are highly-reliable and high-performance workstations, and are used by design engineers and analysis professionals worldwide. They are rapidly gaining in popularity with ANSYS customers. The Lenovo Performance Tuner has special settings to optimize our ThinkStation performance for ANSYS products. Lenovo pro-vides workstations to ANSYS for complete certifi cation testing and performs benchmark testing to use in guiding customers toward the optimal confi guration for your needs. More can be found at thinkworkstations.com

SGI off ers a solution that simplifi es high performance computing for CAE. SGI has created an easy to deploy, unifi ed hardware plat-form that addresses advanced CFD applications and workloads. It allows our customers to leverage their hardware investments by simplifying integration with existing infrastructures and maximizing the effi ciency of available licenses and IT personnel.sgi.com/manufacturing

Organizer / Contact:ANSYS Germany GmbHBirkenweg 14 a64295 Darmstadt / GermanyT: +49 6151 3644-0F: +49 6151 3644-44www.ansys-germany.comworkshops-germany@ansys.com

Follow us on Twitter:#ASWC2016

ansys.com/aswcansys.com/aese-germany

Agenda

Munich – June 7-8, 2016

AwardsThe ASWC & AESE will close with a session in which awards will be presented in the following categories: ASWC

• Best Engine Simulation• Best Powertrain Simulation• Best Body and Chassis Simulation• Best eMobility and Autonomous Driving Simulation• Best Systems, HPC and Cloud Simulation• Best Automotive Simulation

AESE• Best Electronics Simulation

Conference Proceedings DownloadConference proceedings will be available for download on the ASWC and AESE websites after the conference:

www.ansys.com/aswcwww.ansys.com/aese

Congress VenueSheraton München Arabellapark HotelArabellastraße 581925 München / Germanyphone +49 89 92320www.sheratonarabellapark.com

Conference LanguagesThe conference languages will be English for the ASWC and English and German for the AESE. All lectures and presentations with English titles will be held in English, and those with German titles will largely use English slides (simultaneous translation will not be off ered).

Evening EventJoin our Networking Dinner on June 7, 2016 in a typical Bavarian Restaurant and “Biergarten” nearby the confer-ence venue. Binding registration for this social event is required during the conference registration process.

Keynote Speakers

Platinum Sponsors

Amazon Web Services (AWS) provides busi-nesses with a secure, reliable, low-cost, easy-to-scale, global IT infrastructure “in the cloud.” Hundreds of thousands of customers in 190 countries, rely on AWS for their infrastruc-ture needs, from running existing enterprise applications to building new applications in the cloud. The global AWS platform allows de-signers, engineers, and analysts from boutique studios to large enterprises to securely scale their business. aws.amazon.com

Hewlett Packard has been in the innovation business for more than 75 years. Our vast intellectual property portfolio and global re-search and development capabilities are part of an innovation roadmap designed to help or-ganizations of all sizes - from global enterpris-es to local startups - transition from traditional technology platforms to the IT systems of the future. Time to value defi nes success in today‘s global markets. You speed time to value by continu-ously delivering and optimizing apps and ser-vices for customers, partners and employees. Companies need to do four things well in order to survive and thrive in this idea economy: they must transform to a hybrid infrastruc-ture, protect the digital enterprise, empower the data driven organization and enable work-place productivity. hpe.com

Since its founding in 1968, Intel Corporation has grown into the world’s largest semicon-ductor company (based on revenue) establish-ing a heritage of innovation that continues to expand the reach and promise of computing while advancing the ways people work and live worldwide. Intel’s products and technologies are at the heart of computing and communication solu-tions that have become essential parts of busi-nesses, homes and schools around the world. The company’s products include microproces-sors, chipsets, other semiconductor products and software which are integral to computers, servers and infrastructure powering the Cloud, as well as consumer electronics, handheld de-vices and connected intelligent systems that include cars, shopping kiosks and bank ATMs. intel.de

Welcome

The World Automotive Simulation Congress & ANSYS Electronics Simulation Expo provide an unique opportunity to get an update on the latest simulation technologies and processes in the global automotive and electronics industry. We thank you for coming and look forward to spending time with you sharing information and ideas. MANFRED ADAMS

Brose

JIM CASHMANANSYS

FERDINANDO CANNIZZOFerrari

TOSH TAMBEAmazon Web Services

DR. DIRK LINSEBMW

STEPHAN GILLICHIntel

ERIC BANTEGNIEANSYS

DR. SANDEEP SOVANIANSYS

“Thank You for Your Support” to all our Sponsors!

PHILIPPE TRAUTMANNHewlett Packard Enterprise

ATSUSHI OGAWAHonda

JOACHIM NOACKZF TRW

DR. GRZEGROZ OMBACHQualcomm

Silver Sponsors

BETA CAE Systems S.A, is an engineering software company committed to the development of best-in-class CAE software systems that meet the requirements of all simulation disciplines. The company’s fl agship product, ANSA / μETA pre- & post-processing package, holds a worldwide leading position, in many sectors, including the automotive, railway vehicles, aerospace, motorsports, chemical processes engineering, energy, electronics, heavy machinery, power tools, and biomechanics. The company’s new solu-tion for Simulation Product Data and Resources Management, SPDRM, provides a simple, scalable, and intuitive way to capture, deploy, manage and improve CAE workfl ows. beta-cae.gr

CEI - founded in 1994 with Headquarters in Apex, NC, USA – has worldwide subsidiaries in Germany, China, India and Japan. CEI is the creator of EnSight, the leading software solution for visualizing, analyzing, and communicating data from complex mono- and multidisciplinary numerical simulations. It supports an extraordinary number of solver data formats. The open interface architec-ture allows for easy integration with any data format, and a Python API empowers users to customize the software to meet their specifi c needs. With support for parallel data processing and distributed graphics rendering, it is the leader in handling very large models. ensight.com

Fujitsu has been leading the HPC market for almost 40 years and off ers a comprehensive portfolio of computing products to meet wide-ranging HPC requirements: from x86-based CELSIUS workstations and PRIMERGY servers up to PRIMEHPC FX100, including storage systems, HPC middleware and integration services. An intuitive web based user interface – the Fujitsu HPC Gateway – low-ers entry barriers and makes HPC accessible to a much wider set of end-users. With cutting-edge hardware and a proven software stack users have at hand the most productive and coherent HPC workplace in the market today. fujitsu.com

modeFRONTIER is a multidisciplinary and multiobjective optimization platform capable of streamlining engineering process through innovative algorithms and integration with leading simulation software. In numerous industries, modeFRONTIER has become an essential tool to increase understanding of cost/performance factors and to reduce product development time. Over 250 international organizations have entrusted the best in class solution to design better and more effi cient products. For further information, please visit: modefrontier.com

Noesis Solutions is an engineering innovation partner to manufacturers in engineering-intense industries. Specialized in solutions that enable Objectives Driven Draft-to-Craft Engineering processes, its software products and services help customers adopt a targeted development strategy that resolves their toughest multi-disciplinary engineering challenges. This Engineer by Objectives strategy entails an automated approach that streamlines engineering processes to effi ciently manage the growing complexity of today’s engineering challenges. In addition, interactive design space visualization allows engineering teams to make informed decisions faster – empowering them to form & transform ideas into products that outsmart competition. noesissolutions.com

Open iT helps ANSYS users worldwide to optimize their engineering software licensing for the fastest time-to-market and maxi-mum ROI. As an ANSYS partner, Open iT software usage reports are a trusted source for enabling informed vendor-user business relationships. From single sites to globally dispersed organizations, from on-premise to cloud, Open iT TrueUse™ technology provides live dashboards, event alerts, chargeback for cost accounting, customizable reports for users, teams, projects, locations, vendors, and much more. Visit us at our booth to see what Open iT can do for you! openit.com

Sharc develops and provides revolutionary meshing and post-processing software for the most extreme CFD workfl ows. Using ad-vanced proprietary data formats, innovative rendering engines and unique meshing algorithms, Sharc is able to reduce time from CAD to visualisation by orders of magnitude using the extreme meshing software, Harpoon and the industry leading visualisation suite of software Periscope. Our technical staff provide customisation and tailoring of the software to customer specifi c require-ments, streamlining the engineering process even further. sharc.co.uk

Gold Sponsors

Global supercomputing leader Cray builds innovative systems and solutions enabling scientists and engineers in academia, gov-ernment and industry to meet existing and future simulation and analytics challenges. Leveraging 40 years of experience in developing and servicing the world’s most advanced supercomputers, Cray off ers a comprehensive portfolio of high performance computing, storage and data analytics solutions delivering unrivaled performance, effi ciency and scalability. Cray’s industry lead-ing technologies are available in confi gurations to meet every budget and need. Whatever your research question, Cray makes it easy to take advantage of high performance computing advancements. cray.com

Lenovo, the world’s number 1 PC provider (per IDC reports), produces the ThinkStation, ThinkPad and ThinkServer product lines. Lenovo ThinkStation Workstations and ThinkPad Mobile Workstation are highly-reliable and high-performance workstations, and are used by design engineers and analysis professionals worldwide. They are rapidly gaining in popularity with ANSYS customers. The Lenovo Performance Tuner has special settings to optimize our ThinkStation performance for ANSYS products. Lenovo pro-vides workstations to ANSYS for complete certifi cation testing and performs benchmark testing to use in guiding customers toward the optimal confi guration for your needs. More can be found at thinkworkstations.com

SGI off ers a solution that simplifi es high performance computing for CAE. SGI has created an easy to deploy, unifi ed hardware plat-form that addresses advanced CFD applications and workloads. It allows our customers to leverage their hardware investments by simplifying integration with existing infrastructures and maximizing the effi ciency of available licenses and IT personnel.sgi.com/manufacturing

Organizer / Contact:ANSYS Germany GmbHBirkenweg 14 a64295 Darmstadt / GermanyT: +49 6151 3644-0F: +49 6151 3644-44www.ansys-germany.comworkshops-germany@ansys.com

Follow us on Twitter:#ASWC2016

ansys.com/aswcansys.com/aese-germany

Agenda

Munich – June 7-8, 2016

AwardsThe ASWC & AESE will close with a session in which awards will be presented in the following categories: ASWC

• Best Engine Simulation• Best Powertrain Simulation• Best Body and Chassis Simulation• Best eMobility and Autonomous Driving Simulation• Best Systems, HPC and Cloud Simulation• Best Automotive Simulation

AESE• Best Electronics Simulation

Conference Proceedings DownloadConference proceedings will be available for download on the ASWC and AESE websites after the conference:

www.ansys.com/aswcwww.ansys.com/aese

Congress VenueSheraton München Arabellapark HotelArabellastraße 581925 München / Germanyphone +49 89 92320www.sheratonarabellapark.com

Conference LanguagesThe conference languages will be English for the ASWC and English and German for the AESE. All lectures and presentations with English titles will be held in English, and those with German titles will largely use English slides (simultaneous translation will not be off ered).

Evening EventJoin our Networking Dinner on June 7, 2016 in a typical Bavarian Restaurant and “Biergarten” nearby the confer-ence venue. Binding registration for this social event is required during the conference registration process.

Keynote Speakers

Platinum Sponsors

Amazon Web Services (AWS) provides busi-nesses with a secure, reliable, low-cost, easy-to-scale, global IT infrastructure “in the cloud.” Hundreds of thousands of customers in 190 countries, rely on AWS for their infrastruc-ture needs, from running existing enterprise applications to building new applications in the cloud. The global AWS platform allows de-signers, engineers, and analysts from boutique studios to large enterprises to securely scale their business. aws.amazon.com

Hewlett Packard has been in the innovation business for more than 75 years. Our vast intellectual property portfolio and global re-search and development capabilities are part of an innovation roadmap designed to help or-ganizations of all sizes - from global enterpris-es to local startups - transition from traditional technology platforms to the IT systems of the future. Time to value defi nes success in today‘s global markets. You speed time to value by continu-ously delivering and optimizing apps and ser-vices for customers, partners and employees. Companies need to do four things well in order to survive and thrive in this idea economy: they must transform to a hybrid infrastruc-ture, protect the digital enterprise, empower the data driven organization and enable work-place productivity. hpe.com

Since its founding in 1968, Intel Corporation has grown into the world’s largest semicon-ductor company (based on revenue) establish-ing a heritage of innovation that continues to expand the reach and promise of computing while advancing the ways people work and live worldwide. Intel’s products and technologies are at the heart of computing and communication solu-tions that have become essential parts of busi-nesses, homes and schools around the world. The company’s products include microproces-sors, chipsets, other semiconductor products and software which are integral to computers, servers and infrastructure powering the Cloud, as well as consumer electronics, handheld de-vices and connected intelligent systems that include cars, shopping kiosks and bank ATMs. intel.de

Welcome

The World Automotive Simulation Congress & ANSYS Electronics Simulation Expo provide an unique opportunity to get an update on the latest simulation technologies and processes in the global automotive and electronics industry. We thank you for coming and look forward to spending time with you sharing information and ideas. MANFRED ADAMS

Brose

JIM CASHMANANSYS

FERDINANDO CANNIZZOFerrari

TOSH TAMBEAmazon Web Services

DR. DIRK LINSEBMW

STEPHAN GILLICHIntel

ERIC BANTEGNIEANSYS

DR. SANDEEP SOVANIANSYS

“Thank You for Your Support” to all our Sponsors!

PHILIPPE TRAUTMANNHewlett Packard Enterprise

ATSUSHI OGAWAHonda

JOACHIM NOACKZF TRW

DR. GRZEGROZ OMBACHQualcomm

Silver Sponsors

BETA CAE Systems S.A, is an engineering software company committed to the development of best-in-class CAE software systems that meet the requirements of all simulation disciplines. The company’s fl agship product, ANSA / μETA pre- & post-processing package, holds a worldwide leading position, in many sectors, including the automotive, railway vehicles, aerospace, motorsports, chemical processes engineering, energy, electronics, heavy machinery, power tools, and biomechanics. The company’s new solu-tion for Simulation Product Data and Resources Management, SPDRM, provides a simple, scalable, and intuitive way to capture, deploy, manage and improve CAE workfl ows. beta-cae.gr

CEI - founded in 1994 with Headquarters in Apex, NC, USA – has worldwide subsidiaries in Germany, China, India and Japan. CEI is the creator of EnSight, the leading software solution for visualizing, analyzing, and communicating data from complex mono- and multidisciplinary numerical simulations. It supports an extraordinary number of solver data formats. The open interface architec-ture allows for easy integration with any data format, and a Python API empowers users to customize the software to meet their specifi c needs. With support for parallel data processing and distributed graphics rendering, it is the leader in handling very large models. ensight.com

Fujitsu has been leading the HPC market for almost 40 years and off ers a comprehensive portfolio of computing products to meet wide-ranging HPC requirements: from x86-based CELSIUS workstations and PRIMERGY servers up to PRIMEHPC FX100, including storage systems, HPC middleware and integration services. An intuitive web based user interface – the Fujitsu HPC Gateway – low-ers entry barriers and makes HPC accessible to a much wider set of end-users. With cutting-edge hardware and a proven software stack users have at hand the most productive and coherent HPC workplace in the market today. fujitsu.com

modeFRONTIER is a multidisciplinary and multiobjective optimization platform capable of streamlining engineering process through innovative algorithms and integration with leading simulation software. In numerous industries, modeFRONTIER has become an essential tool to increase understanding of cost/performance factors and to reduce product development time. Over 250 international organizations have entrusted the best in class solution to design better and more effi cient products. For further information, please visit: modefrontier.com

Noesis Solutions is an engineering innovation partner to manufacturers in engineering-intense industries. Specialized in solutions that enable Objectives Driven Draft-to-Craft Engineering processes, its software products and services help customers adopt a targeted development strategy that resolves their toughest multi-disciplinary engineering challenges. This Engineer by Objectives strategy entails an automated approach that streamlines engineering processes to effi ciently manage the growing complexity of today’s engineering challenges. In addition, interactive design space visualization allows engineering teams to make informed decisions faster – empowering them to form & transform ideas into products that outsmart competition. noesissolutions.com

Open iT helps ANSYS users worldwide to optimize their engineering software licensing for the fastest time-to-market and maxi-mum ROI. As an ANSYS partner, Open iT software usage reports are a trusted source for enabling informed vendor-user business relationships. From single sites to globally dispersed organizations, from on-premise to cloud, Open iT TrueUse™ technology provides live dashboards, event alerts, chargeback for cost accounting, customizable reports for users, teams, projects, locations, vendors, and much more. Visit us at our booth to see what Open iT can do for you! openit.com

Sharc develops and provides revolutionary meshing and post-processing software for the most extreme CFD workfl ows. Using ad-vanced proprietary data formats, innovative rendering engines and unique meshing algorithms, Sharc is able to reduce time from CAD to visualisation by orders of magnitude using the extreme meshing software, Harpoon and the industry leading visualisation suite of software Periscope. Our technical staff provide customisation and tailoring of the software to customer specifi c require-ments, streamlining the engineering process even further. sharc.co.uk

Gold Sponsors

Global supercomputing leader Cray builds innovative systems and solutions enabling scientists and engineers in academia, gov-ernment and industry to meet existing and future simulation and analytics challenges. Leveraging 40 years of experience in developing and servicing the world’s most advanced supercomputers, Cray off ers a comprehensive portfolio of high performance computing, storage and data analytics solutions delivering unrivaled performance, effi ciency and scalability. Cray’s industry lead-ing technologies are available in confi gurations to meet every budget and need. Whatever your research question, Cray makes it easy to take advantage of high performance computing advancements. cray.com

Lenovo, the world’s number 1 PC provider (per IDC reports), produces the ThinkStation, ThinkPad and ThinkServer product lines. Lenovo ThinkStation Workstations and ThinkPad Mobile Workstation are highly-reliable and high-performance workstations, and are used by design engineers and analysis professionals worldwide. They are rapidly gaining in popularity with ANSYS customers. The Lenovo Performance Tuner has special settings to optimize our ThinkStation performance for ANSYS products. Lenovo pro-vides workstations to ANSYS for complete certifi cation testing and performs benchmark testing to use in guiding customers toward the optimal confi guration for your needs. More can be found at thinkworkstations.com

SGI off ers a solution that simplifi es high performance computing for CAE. SGI has created an easy to deploy, unifi ed hardware plat-form that addresses advanced CFD applications and workloads. It allows our customers to leverage their hardware investments by simplifying integration with existing infrastructures and maximizing the effi ciency of available licenses and IT personnel.sgi.com/manufacturing

HPC & Cloud Computing Powertrain: Lightweighting

Body & Chassis: Wind Noise

Manufacturing Systems & Software: Embedded Software

Workshop 1 Workshop 2

Room: Asam ISession Chair: Wim Slagter

Room: Cuvillies IISession Chair: T. Yugov

Room: Cuvillies ISession Chair: A. Khondge

Room: Asam IISession Chair: L. Foley

Room: HollSession Chair: X. Fornari

Room: KlenzePresented in English Language

Room: HollPresented in German Language

13:30 – 14:00 A. Clarich (Esteco)Highly-effi cient design optimization for automotive applications

F. Franchini (Enginsoft)Structural and material optimization of BorgWarner tensioner arms

M. Oswald (ANSYS)Deterministic aero-vibro acoustics for wind noise prediction

D. Grossi (Meta Systems)Effi cient workfl ow for EMC and thermal model-ing of a high-power battery charger for electric vehicle

L. Johnson (ANSYS)Simulation of ADAS and autonomous vehicle systems

M. Laudien (ANSYS) Simulation of complex coupled antenna systems for communication and radar: effi cient solutions for modeling and calculation

A. Focho, A. Mzoughi (ANSYS)Effi zienter Entwurf komplexer elektronischer Systeme für Automobil- und IoT-Anwen-dungen mittels elektromagnetischer und thermischer Simulation

14:00 – 14:30 T. Tambe (Amazon Web Services)Reaching scale with cloud for automotive CAE simulation

P. Kestel (University of Erlangen)Assistance system for automated and knowledge-based setup and evaluation of design-accompanying fi nite element analyses

K. Nusser (University of Erlangen-Nürnberg)A fl uid-structure interaction scheme for prediction of fl ow-induced low frequency buff eting noise – Part 1: Flow simulation

M. Ellis (Johnson Matthey Battery Systems)Developing a CAE workfl ow for perfor-mance automotive battery systems: Managing know-ledge fl ow in a multi-physics environment

(Deutsches Zentrumfür Luft- und Raumfahrt – DLR)Unifying control and verifi cation for autono-mous driving development

14:30 – 15:00 W. Gentzsch (Uber Cloud)CFD simulations in the cloud, on demand, in novel software containers

D. Vickerman (GRM Consulting)Advanced simulation methods for light-weighting within a passenger car powertrain

J. Rejlek (Virtual Vehicle) A detached fl uid–structure interaction scheme for prediction of fl ow-induced, low frequency, buff eting noise — Part 2: numerical workfl ow

R. Reinelt (ANSYS)Recent advances in PEM fuel cell simulation methods

M. Kopp (ANSYS)Autonomous vehicle radar: Improving radar performance with simulation

15:30 – 15:45 Keynote — Stephan Gillich, Director Technical Computing GTM EMEA, Intel – “Fuel your insight to democratize simulation driven design”

15:45 – 16:15 Keynote — Eric Bantegnie, VP of Systems and Software Business Unit, ANSYS – “Using lessons learned from aerospace and railways in electronics, software and system development of autonomous vehicles”

16:15 – 16:45 Award Ceremony – Thomas Zanzinger, Area Director for Germany, Austria & Nordics, ANSYS

16:45 – 17:45 Farewell Coff ee & Soft Drinks in Exhibition Area

DAY 1 . JUNE 7 . TUESDAY

Opening Plenary Session – Room: Cuvillies I & II

9:00 – 9:15 Welcome Address – Dr. Sandeep Sovani, Director of Global Automotive Industry, ANSYS – “Simulating Smart, Effi cient Vehicles”

9:15 – 9:45 Keynote — Jim Cashman, CEO, ANSYS – “Engineering the Internet of Things”

9:45 – 10:15 Keynote — Dr. Grzegroz Ombach, VP of Engineering, Qualcomm – “Wireless Electric Vehicle Charging as an Example of Breakthrough Innovation”

10:15 – 10:45 Keynote — Manfred Adams, VP of Development, Brose Group – “The Virtual Product – Still a Vision?”

10:45 – 11:15 Keynote — Ferdinando Cannizzo, Head of Powertrain Electrifi cation, Ferrari – “Driving Innovation Through Simulation in Ferrari”

11:15 – 11:30 Keynote — Tosh Tambe, Amazon Web Services – “Race to Optimal Design”

11:30 – 11:45 Keynote — Philippe Trautmann, Hewlett Packard Enterprise – “Achieving Extreme Performance with HPC for Big Data Innovation”

AUTOMOTIVE SIMULATION WORLD CONGRESS ANSYS ELECTRONICS SIMULATION EXPO

Engine: Fuel Injection

Powertrain: Intake & Exhaust

Body & Chassis: Brakes & PD Pumps eMobility: Motors & Generators

Electronics: Thermal-Structural Reliability

Antenna Design for IoT applications

Power and Thermal Management for Complex Chips, Packages and IC

Room: Asam ISession Chair: P. Mandloi

Room: Cuvillies IISession Chair: R. Reinelt

Room: Cuvillies ISession Chair: A. Khondge

Room: Asam IISession Chair: G. Prillwitz

Room: Eff ner ISession Chair: O. Haedrich

Room: Eff ner IISession Chair: M. Laudien

Room: HollSession Chair: S. Muff

13:00 – 13:30 L. Foley (ANSYS)Comprehensive multi-physics simulations of cavitating and non-cavitating high pressure Diesel injectors

F. Hartmann (TU Freiberg)Investigation of the engine intake fl ow using high-resolved LES

S. Weiland (ZF-TRW)Effi cient CAE-tools and processes to support brake-squeal counter measure development

D. Dinulovic (Würth Elektronik) Development of an electromagnetic energy harvesting generator

U. Lautenschlager (Continental) Optimal design of automotive multimedia systems

Keynote - P. Whale (Iotic Labs) Why isn‘t the Internet of Things more like the internet and how to fi x it

13:30 – 14:00 M. Gavaises (City Univ of London) Flow and cavitation in Diesel fuel injector nozzles

A. Matyas (Continental)Dynamical pressure shock simulation in the silencer

J. Lee (Hyundai Motor Co)Experimental validation of CAE and implementation of additional factors for brake squeal simulation

M. Stokmaier (Dynardo) Sensitivity analysis and optimization of an electric motor

D. Kraetschmer (Bosch) Simulation concept for the virtual assessment of the transient electro-thermal behaviour of PCB-based ECUs

M. Kopp (ANSYS) Simulation of installed antenna performance on large structures

M. Schmitt (ANSYS) Solutions for Electronics Systems/IoT Elec-tronics (Signal, Power, Thermal, Structural)

14:00 – 14:30 J. Shi (Delphi)Simulation methodology for advance Diesel injection and combustion development

S. Engeda (BMW) Infl uence of maldistribution on the cumulative emission of a three-way-converter

M. Sielemann (Modelon) Systems engineering solutions: Antilock braking system example

O. Haedrich (ANSYS) Fast transient electromagnetic fi eld simulation with time decomposition

T. Iberer (CADFEM)Coupled electrical, thermal and mechanical reliability investigations for power electronic assemblies

C. Roemelsberger (CADFEM)Designing better dual band antennas for IoT and other applications

M. Panagopoulou (Infi neon)A Simulation approach for modeling the thermal behavior of chip, package, PCB and system

14:30 – 15:00 W. Sander (Bosch)CFD simulation of the hydraulic pressure analyzer (HDA) and validation of the measurement approach based on a common-rail injector

S. Meyer (FES Fanrzeugentwicklung Sachsen) Multiphase CFD-analysis for fi lling of auto-motive SCR tank systems as basis for design optimization

D. Davies (D2H Engineering)Accelerated and validated brake cooling development using CAE tools

M. Brueck (EMMotive)Integral approach for simulation-driven development of electric traction motors in automotive applications

R. Jaschke (Helmut Schmidt Univ)In-rush current from LED lamps can destroy switches

N. Koch (Audi)Challenges in radar sensor vehicle integration

E. Blanc (ANSYS)Reducing Power Noise and improving reliability for high performance System on a Chip from early design stage to Signoff

15:00 – 15:30 Break, Exhibition, Networking

11:45 – 13:00 Lunch, Exhibition, Networking

08:00 – 9:00 Registration

Automotive Simulation World Congress + ANSYS Electronics Simulation Expo June 7, 2016

Engine: In-Cylinder

Powertrain: Seals

Body & Chassis: Aerodynamics

eMobility:Electric Drives

Electronics: Power Electronics

RF and Microwave Design for IoT Chip Package System (SI, PI, EMC)

Room: Asam ISession Chair: W. Bauer

Room: Cuvillies IISession Chair: T. Yugov

Room: Cuvillies ISession Chair: T. Virdung

Room: Asam IISession Chair: L. Voss

Room: Eff ner ISession Chair: O. Haedrich

Room: Eff ner IISession Chair: M. Laudien

Room: HollSession Chair: S. Muff

15:30 – 16:00 E. Meeks (ANSYS)Internal combustion engine simulation strategies

R. Siber (Adam Opel)How simulation leads to compact damper fi lter boxes

N. Sykes (Red Bull Racing) Aerodynamic development and CFD workfl ow optimisation

J. Goss (Motor Design Ltd)Effi ciency map and drive cycle simulation for PMSMs

F. Niedermeier (BMW)Analysis and optimization of inductive charging systems for electromobility

M. Kopp (ANSYS)60 GHz wireless comms systems

G. Capello (U-Blox)Thermal gradients in a cellular module for 2G/3G cellular communications

16:00 – 16:30 L. Schaefer (BMW) Lagrangian spark ignition model accounting for spark-channel dynamics, diff usion and detailed chemical kinetics

Q. Ye (FhG-IPA)Numerical simulation of seam sealing processes

C. Feichtinger (KTM) Automated workfl ow for the drag reduction of racing motorcycles

J. Weis (Schaeffl er)Cooling of Electric drive systems — how CFD simulation supports product development

H. Edel (Ing Büro Edel) Comparison between simulation and mea-surement of transformer and inductor losses (Presented in German Language)

T. DeVarco (SGI) Speeding electro-magnetic simulation of single chips to complete module laminate assemblies at Qorvo(R)

(ANSYS) Solving package and printed circuit board converter power and delivery EMI challenges

16:30 – 17:00 L. Foley (ANSYS)Internal combustion engine design and optimization

H. Inoue (Eagle Industry, Japan)Sealing for pumps and turbos: Simula-tion-driven development of next-generation mechanical seals

C. Ribes (PSA)Aerodynamic loads on a passenger car crossing a truck

H. Steinhart (Steinbeis Transferzentrum für Leistungselektronik)Interpretation and design of an electric drive for a motocross bike (Presented in German Language)

F. Larisch (Webasto) Multidisciplinary simulation based design of a high-effi ciency, high-voltage heater for battery electric and plug-in hybrid vehicles.

A. Michel (ANSYS) Antennas and wireless devices interferenc-es simulations within a vehicle

A. Levanto (Infi neon) Customized adoption of HPC GUI for a non-uniform LSF cluster

17:00 – 17:30 D. Hain (TU Freiberg)Investigation of soot formation processes in DISI engines using ethanol-based fuels

A. Tlili (Cyclam)Optimization of an o-ring-like elastomer for static sealing in engine cooling system

P. Ekman (Linkopings Univ) Evaluation of the stress blended eddy simulation model for external aerodynamics applications

M. Hanke (CADFEM) NVH analysis of drives

T. DeVarco (SGI) Maximizing electromagnetic computation throughput

M. Laudien (ANSYS)Product update: HFSS

S. Muff (ANSYS) Product update: SI-PI

17:30 – 18:30 Exhibition and Networking

18:30 – 21:30 Bavarian Dinner and Networking

DAY 2 . JUNE 8 . WEDNESDAY

Opening Plenary Session – Room: Cuvillies I & II

8:30 – 9:00 Keynote — Dirk Linse, BMW – “The BMW Vision and Strategy in Engine Simulation”

9:00 – 9:30 Keynote — Joachim Noack, Chief Engineer CAE, Global Lead CAE Braking, ZF TRW – “Product Development Strategies in the Era of Globalization and Vehicle Electrifi cation”

9:30 – 10:00 Keynote — Atsushi Ogawa, Head of Aerodynamics and Thermal Management, Honda R&D Japan – “CFD History at Honda and Future Prospects”

AUTOMOTIVE SIMULATION WORLD CONGRESS ANSYS ELECTRONICS SIMULATION EXPO

Engine: Turbocharging

Powertrain: Cooling & Lubrication

Body & Chassis: Aero Optimization

eMobility: Power Sources

Systems & Software: System Simulation

Workshop 1 Workshop 2

Room: Asam ISession Chair: W. Bauer

Room: Cuvillies IISession Chair: P. Mandloi

Room: Cuvillies ISession Chair: A. Wade

Room: Asam IISession Chair: M. Oswald

Room: HollSession Chair: L. Johnson

Room: KlenzePresented in German Language

Room: HollPresented in English Language

10:30 – 11:00 M. Kainz (ANSYS)An integrated design proecss for turbochargers

A. Boemer (Deutz)Effi cient simulation of boiling eff ects at engine cooling jackets

F. Menter (ANSYS)SBES Turbulence Models

T. Vibrans (VW)Inductive heating of shaped blanks for hot stamping of car body parts

L. Johnson (ANSYS)Multidomain multifi delity system simulation of electrifi ed vehicle systems

M. Laudien (ANSYS) Simulation komplexer verkoppelter Antenennsysteme für Kommunikation und Radar: effi ziente Lösungen zur Modellierung und zur Berechnung

A. Focho, A. Mzoughi (ANSYS) Effi cient design fl ow for electromagnetic and thermal simulation of complex electronic systems developing automotive and IoT applications11:00 – 11:30 R. Wildhofer (BMW)

Fluid–structure interaction in the exhaust system of turbocharged petrol engines

P. Illg (John Deere)CFD investigation of rotating gears in oil

C. Harley (Wirth Research)Truck aerodynamics optimisation – realised

M. Kellermeyer (CADFEM)Topology optimization for additive manufacturing using a wheel-rim example

H. Tummescheit (Modelon)Executable requirements to the rescue: Using Modelica and FMI to evaluate requirements compliance early in the system design

11:30 – 12:00 V. Boxberger (TU Berlin)Analysis of diff erent transient simulation methods for the numerical computation of a radial exhaust gas turbine

C. Lynch (Code Product Solutions)Combining CFD, FEA and scripting for effi cient oil vane pump integrity assessment

T. Virdung (ANSYS)Total vehicle simulation of the Volvo S80

R. Maia (CaetanoBus)Complete bus-body simulation

X. Fornari (ANSYS)Ensuring safety with ISO26262 and AUTOSAR compliant embedded software and auto-code generation

12:00 – 12:30 T. Czapka (VW)Numerical investigation of casing treatment for compressor map enhancement

P. Mandloi (ANSYS)Over 10x speed-up of engine cooling simula-tions with Reduced Order Models (ROMs)

J. Brunberg (Volvo Cars)Duct optimization

T. Optiz (VW)Coating dislocation by fast heating for press hardening in automotive context

J. Bayani (Tesla Motors)Automotive system virtual prototyping and design for reliability

12:30 – 13:30 Lunch, Exhibition, Networking

15:00 – 15:30 Break, Exhibition, Networking

10:00– 10:30 Break, Exhibition, Networking

7:30 – 8:30 Registration

Automotive Simulation World Congress + ANSYS Electronics Simulation Expo June 8, 2016

Closing Plenary Session – Room: Cuvillies I & II

HPC & Cloud Computing Powertrain: Lightweighting

Body & Chassis: Wind Noise

Manufacturing Systems & Software: Embedded Software

Workshop 1 Workshop 2

Room: Asam ISession Chair: Wim Slagter

Room: Cuvillies IISession Chair: T. Yugov

Room: Cuvillies ISession Chair: A. Khondge

Room: Asam IISession Chair: L. Foley

Room: HollSession Chair: X. Fornari

Room: KlenzePresented in English Language

Room: HollPresented in German Language

13:30 – 14:00 A. Clarich (Esteco)Highly-effi cient design optimization for automotive applications

F. Franchini (Enginsoft)Structural and material optimization of BorgWarner tensioner arms

M. Oswald (ANSYS)Deterministic aero-vibro acoustics for wind noise prediction

D. Grossi (Meta Systems)Effi cient workfl ow for EMC and thermal model-ing of a high-power battery charger for electric vehicle

L. Johnson (ANSYS)Simulation of ADAS and autonomous vehicle systems

M. Laudien (ANSYS) Simulation of complex coupled antenna systems for communication and radar: effi cient solutions for modeling and calculation

A. Focho, A. Mzoughi (ANSYS)Effi zienter Entwurf komplexer elektronischer Systeme für Automobil- und IoT-Anwen-dungen mittels elektromagnetischer und thermischer Simulation

14:00 – 14:30 T. Tambe (Amazon Web Services)Reaching scale with cloud for automotive CAE simulation

P. Kestel (University of Erlangen)Assistance system for automated and knowledge-based setup and evaluation of design-accompanying fi nite element analyses

K. Nusser (University of Erlangen-Nürnberg)A fl uid-structure interaction scheme for prediction of fl ow-induced low frequency buff eting noise – Part 1: Flow simulation

M. Ellis (Johnson Matthey Battery Systems)Developing a CAE workfl ow for perfor-mance automotive battery systems: Managing know-ledge fl ow in a multi-physics environment

(Deutsches Zentrumfür Luft- und Raumfahrt – DLR)Unifying control and verifi cation for autono-mous driving development

14:30 – 15:00 W. Gentzsch (Uber Cloud)CFD simulations in the cloud, on demand, in novel software containers

D. Vickerman (GRM Consulting)Advanced simulation methods for light-weighting within a passenger car powertrain

J. Rejlek (Virtual Vehicle) A detached fl uid–structure interaction scheme for prediction of fl ow-induced, low frequency, buff eting noise — Part 2: numerical workfl ow

R. Reinelt (ANSYS)Recent advances in PEM fuel cell simulation methods

M. Kopp (ANSYS)Autonomous vehicle radar: Improving radar performance with simulation

15:30 – 15:45 Keynote — Stephan Gillich, Director Technical Computing GTM EMEA, Intel – “Fuel your insight to democratize simulation driven design”

15:45 – 16:15 Keynote — Eric Bantegnie, VP of Systems and Software Business Unit, ANSYS – “Using lessons learned from aerospace and railways in electronics, software and system development of autonomous vehicles”

16:15 – 16:45 Award Ceremony – Thomas Zanzinger, Area Director for Germany, Austria & Nordics, ANSYS

16:45 – 17:45 Farewell Coff ee & Soft Drinks in Exhibition Area

DAY 1 . JUNE 7 . TUESDAY

Opening Plenary Session – Room: Cuvillies I & II

9:00 – 9:15 Welcome Address – Dr. Sandeep Sovani, Director of Global Automotive Industry, ANSYS – “Simulating Smart, Effi cient Vehicles”

9:15 – 9:45 Keynote — Jim Cashman, CEO, ANSYS – “Engineering the Internet of Things”

9:45 – 10:15 Keynote — Dr. Grzegroz Ombach, VP of Engineering, Qualcomm – “Wireless Electric Vehicle Charging as an Example of Breakthrough Innovation”

10:15 – 10:45 Keynote — Manfred Adams, VP of Development, Brose Group – “The Virtual Product – Still a Vision?”

10:45 – 11:15 Keynote — Ferdinando Cannizzo, Head of Powertrain Electrifi cation, Ferrari – “Driving Innovation Through Simulation in Ferrari”

11:15 – 11:30 Keynote — Tosh Tambe, Amazon Web Services – “Race to Optimal Design”

11:30 – 11:45 Keynote — Philippe Trautmann, Hewlett Packard Enterprise – “Achieving Extreme Performance with HPC for Big Data Innovation”

AUTOMOTIVE SIMULATION WORLD CONGRESS ANSYS ELECTRONICS SIMULATION EXPO

Engine: Fuel Injection

Powertrain: Intake & Exhaust

Body & Chassis: Brakes & PD Pumps eMobility: Motors & Generators

Electronics: Thermal-Structural Reliability

Antenna Design for IoT applications

Power and Thermal Management for Complex Chips, Packages and IC

Room: Asam ISession Chair: P. Mandloi

Room: Cuvillies IISession Chair: R. Reinelt

Room: Cuvillies ISession Chair: A. Khondge

Room: Asam IISession Chair: G. Prillwitz

Room: Eff ner ISession Chair: O. Haedrich

Room: Eff ner IISession Chair: M. Laudien

Room: HollSession Chair: S. Muff

13:00 – 13:30 L. Foley (ANSYS)Comprehensive multi-physics simulations of cavitating and non-cavitating high pressure Diesel injectors

F. Hartmann (TU Freiberg)Investigation of the engine intake fl ow using high-resolved LES

S. Weiland (ZF-TRW)Effi cient CAE-tools and processes to support brake-squeal counter measure development

D. Dinulovic (Würth Elektronik) Development of an electromagnetic energy harvesting generator

U. Lautenschlager (Continental) Optimal design of automotive multimedia systems

Keynote - P. Whale (Iotic Labs) Why isn‘t the Internet of Things more like the internet and how to fi x it

13:30 – 14:00 M. Gavaises (City Univ of London) Flow and cavitation in Diesel fuel injector nozzles

A. Matyas (Continental)Dynamical pressure shock simulation in the silencer

J. Lee (Hyundai Motor Co)Experimental validation of CAE and implementation of additional factors for brake squeal simulation

M. Stokmaier (Dynardo) Sensitivity analysis and optimization of an electric motor

D. Kraetschmer (Bosch) Simulation concept for the virtual assessment of the transient electro-thermal behaviour of PCB-based ECUs

M. Kopp (ANSYS) Simulation of installed antenna performance on large structures

M. Schmitt (ANSYS) Solutions for Electronics Systems/IoT Elec-tronics (Signal, Power, Thermal, Structural)

14:00 – 14:30 J. Shi (Delphi)Simulation methodology for advance Diesel injection and combustion development

S. Engeda (BMW) Infl uence of maldistribution on the cumulative emission of a three-way-converter

M. Sielemann (Modelon) Systems engineering solutions: Antilock braking system example

O. Haedrich (ANSYS) Fast transient electromagnetic fi eld simulation with time decomposition

T. Iberer (CADFEM)Coupled electrical, thermal and mechanical reliability investigations for power electronic assemblies

C. Roemelsberger (CADFEM)Designing better dual band antennas for IoT and other applications

M. Panagopoulou (Infi neon)A Simulation approach for modeling the thermal behavior of chip, package, PCB and system

14:30 – 15:00 W. Sander (Bosch)CFD simulation of the hydraulic pressure analyzer (HDA) and validation of the measurement approach based on a common-rail injector

S. Meyer (FES Fanrzeugentwicklung Sachsen) Multiphase CFD-analysis for fi lling of auto-motive SCR tank systems as basis for design optimization

D. Davies (D2H Engineering)Accelerated and validated brake cooling development using CAE tools

M. Brueck (EMMotive)Integral approach for simulation-driven development of electric traction motors in automotive applications

R. Jaschke (Helmut Schmidt Univ)In-rush current from LED lamps can destroy switches

N. Koch (Audi)Challenges in radar sensor vehicle integration

E. Blanc (ANSYS)Reducing Power Noise and improving reliability for high performance System on a Chip from early design stage to Signoff

15:00 – 15:30 Break, Exhibition, Networking

11:45 – 13:00 Lunch, Exhibition, Networking

08:00 – 9:00 Registration

Automotive Simulation World Congress + ANSYS Electronics Simulation Expo June 7, 2016

Engine: In-Cylinder

Powertrain: Seals

Body & Chassis: Aerodynamics

eMobility:Electric Drives

Electronics: Power Electronics

RF and Microwave Design for IoT Chip Package System (SI, PI, EMC)

Room: Asam ISession Chair: W. Bauer

Room: Cuvillies IISession Chair: T. Yugov

Room: Cuvillies ISession Chair: T. Virdung

Room: Asam IISession Chair: L. Voss

Room: Eff ner ISession Chair: O. Haedrich

Room: Eff ner IISession Chair: M. Laudien

Room: HollSession Chair: S. Muff

15:30 – 16:00 E. Meeks (ANSYS)Internal combustion engine simulation strategies

R. Siber (Adam Opel)How simulation leads to compact damper fi lter boxes

N. Sykes (Red Bull Racing) Aerodynamic development and CFD workfl ow optimisation

J. Goss (Motor Design Ltd)Effi ciency map and drive cycle simulation for PMSMs

F. Niedermeier (BMW)Analysis and optimization of inductive charging systems for electromobility

M. Kopp (ANSYS)60 GHz wireless comms systems

G. Capello (U-Blox)Thermal gradients in a cellular module for 2G/3G cellular communications

16:00 – 16:30 L. Schaefer (BMW) Lagrangian spark ignition model accounting for spark-channel dynamics, diff usion and detailed chemical kinetics

Q. Ye (FhG-IPA)Numerical simulation of seam sealing processes

C. Feichtinger (KTM) Automated workfl ow for the drag reduction of racing motorcycles

J. Weis (Schaeffl er)Cooling of Electric drive systems — how CFD simulation supports product development

H. Edel (Ing Büro Edel) Comparison between simulation and mea-surement of transformer and inductor losses (Presented in German Language)

T. DeVarco (SGI) Speeding electro-magnetic simulation of single chips to complete module laminate assemblies at Qorvo(R)

(ANSYS) Solving package and printed circuit board converter power and delivery EMI challenges

16:30 – 17:00 L. Foley (ANSYS)Internal combustion engine design and optimization

H. Inoue (Eagle Industry, Japan)Sealing for pumps and turbos: Simula-tion-driven development of next-generation mechanical seals

C. Ribes (PSA)Aerodynamic loads on a passenger car crossing a truck

H. Steinhart (Steinbeis Transferzentrum für Leistungselektronik)Interpretation and design of an electric drive for a motocross bike (Presented in German Language)

F. Larisch (Webasto) Multidisciplinary simulation based design of a high-effi ciency, high-voltage heater for battery electric and plug-in hybrid vehicles.

A. Michel (ANSYS) Antennas and wireless devices interferenc-es simulations within a vehicle

A. Levanto (Infi neon) Customized adoption of HPC GUI for a non-uniform LSF cluster

17:00 – 17:30 D. Hain (TU Freiberg)Investigation of soot formation processes in DISI engines using ethanol-based fuels

A. Tlili (Cyclam)Optimization of an o-ring-like elastomer for static sealing in engine cooling system

P. Ekman (Linkopings Univ) Evaluation of the stress blended eddy simulation model for external aerodynamics applications

M. Hanke (CADFEM) NVH analysis of drives

T. DeVarco (SGI) Maximizing electromagnetic computation throughput

M. Laudien (ANSYS)Product update: HFSS

S. Muff (ANSYS) Product update: SI-PI

17:30 – 18:30 Exhibition and Networking

18:30 – 21:30 Bavarian Dinner and Networking

DAY 2 . JUNE 8 . WEDNESDAY

Opening Plenary Session – Room: Cuvillies I & II

8:30 – 9:00 Keynote — Dirk Linse, BMW – “The BMW Vision and Strategy in Engine Simulation”

9:00 – 9:30 Keynote — Joachim Noack, Chief Engineer CAE, Global Lead CAE Braking, ZF TRW – “Product Development Strategies in the Era of Globalization and Vehicle Electrifi cation”

9:30 – 10:00 Keynote — Atsushi Ogawa, Head of Aerodynamics and Thermal Management, Honda R&D Japan – “CFD History at Honda and Future Prospects”

AUTOMOTIVE SIMULATION WORLD CONGRESS ANSYS ELECTRONICS SIMULATION EXPO

Engine: Turbocharging

Powertrain: Cooling & Lubrication

Body & Chassis: Aero Optimization

eMobility: Power Sources

Systems & Software: System Simulation

Workshop 1 Workshop 2

Room: Asam ISession Chair: W. Bauer

Room: Cuvillies IISession Chair: P. Mandloi

Room: Cuvillies ISession Chair: A. Wade

Room: Asam IISession Chair: M. Oswald

Room: HollSession Chair: L. Johnson

Room: KlenzePresented in German Language

Room: HollPresented in English Language

10:30 – 11:00 M. Kainz (ANSYS)An integrated design proecss for turbochargers

A. Boemer (Deutz)Effi cient simulation of boiling eff ects at engine cooling jackets

F. Menter (ANSYS)SBES Turbulence Models

T. Vibrans (VW)Inductive heating of shaped blanks for hot stamping of car body parts

L. Johnson (ANSYS)Multidomain multifi delity system simulation of electrifi ed vehicle systems

M. Laudien (ANSYS) Simulation komplexer verkoppelter Antenennsysteme für Kommunikation und Radar: effi ziente Lösungen zur Modellierung und zur Berechnung

A. Focho, A. Mzoughi (ANSYS) Effi cient design fl ow for electromagnetic and thermal simulation of complex electronic systems developing automotive and IoT applications11:00 – 11:30 R. Wildhofer (BMW)

Fluid–structure interaction in the exhaust system of turbocharged petrol engines

P. Illg (John Deere)CFD investigation of rotating gears in oil

C. Harley (Wirth Research)Truck aerodynamics optimisation – realised

M. Kellermeyer (CADFEM)Topology optimization for additive manufacturing using a wheel-rim example

H. Tummescheit (Modelon)Executable requirements to the rescue: Using Modelica and FMI to evaluate requirements compliance early in the system design

11:30 – 12:00 V. Boxberger (TU Berlin)Analysis of diff erent transient simulation methods for the numerical computation of a radial exhaust gas turbine

C. Lynch (Code Product Solutions)Combining CFD, FEA and scripting for effi cient oil vane pump integrity assessment

T. Virdung (ANSYS)Total vehicle simulation of the Volvo S80

R. Maia (CaetanoBus)Complete bus-body simulation

X. Fornari (ANSYS)Ensuring safety with ISO26262 and AUTOSAR compliant embedded software and auto-code generation

12:00 – 12:30 T. Czapka (VW)Numerical investigation of casing treatment for compressor map enhancement

P. Mandloi (ANSYS)Over 10x speed-up of engine cooling simula-tions with Reduced Order Models (ROMs)

J. Brunberg (Volvo Cars)Duct optimization

T. Optiz (VW)Coating dislocation by fast heating for press hardening in automotive context

J. Bayani (Tesla Motors)Automotive system virtual prototyping and design for reliability

12:30 – 13:30 Lunch, Exhibition, Networking

15:00 – 15:30 Break, Exhibition, Networking

10:00– 10:30 Break, Exhibition, Networking

7:30 – 8:30 Registration

Automotive Simulation World Congress + ANSYS Electronics Simulation Expo June 8, 2016

Closing Plenary Session – Room: Cuvillies I & II

HPC & Cloud Computing Powertrain: Lightweighting

Body & Chassis: Wind Noise

Manufacturing Systems & Software: Embedded Software

Workshop 1 Workshop 2

Room: Asam ISession Chair: Wim Slagter

Room: Cuvillies IISession Chair: T. Yugov

Room: Cuvillies ISession Chair: A. Khondge

Room: Asam IISession Chair: L. Foley

Room: HollSession Chair: X. Fornari

Room: KlenzePresented in English Language

Room: HollPresented in German Language

13:30 – 14:00 A. Clarich (Esteco)Highly-effi cient design optimization for automotive applications

F. Franchini (Enginsoft)Structural and material optimization of BorgWarner tensioner arms

M. Oswald (ANSYS)Deterministic aero-vibro acoustics for wind noise prediction

D. Grossi (Meta Systems)Effi cient workfl ow for EMC and thermal model-ing of a high-power battery charger for electric vehicle

L. Johnson (ANSYS)Simulation of ADAS and autonomous vehicle systems

M. Laudien (ANSYS) Simulation of complex coupled antenna systems for communication and radar: effi cient solutions for modeling and calculation

A. Focho, A. Mzoughi (ANSYS)Effi zienter Entwurf komplexer elektronischer Systeme für Automobil- und IoT-Anwen-dungen mittels elektromagnetischer und thermischer Simulation

14:00 – 14:30 T. Tambe (Amazon Web Services)Reaching scale with cloud for automotive CAE simulation

P. Kestel (University of Erlangen)Assistance system for automated and knowledge-based setup and evaluation of design-accompanying fi nite element analyses

K. Nusser (University of Erlangen-Nürnberg)A fl uid-structure interaction scheme for prediction of fl ow-induced low frequency buff eting noise – Part 1: Flow simulation

M. Ellis (Johnson Matthey Battery Systems)Developing a CAE workfl ow for perfor-mance automotive battery systems: Managing know-ledge fl ow in a multi-physics environment

(Deutsches Zentrumfür Luft- und Raumfahrt – DLR)Unifying control and verifi cation for autono-mous driving development

14:30 – 15:00 W. Gentzsch (Uber Cloud)CFD simulations in the cloud, on demand, in novel software containers

D. Vickerman (GRM Consulting)Advanced simulation methods for light-weighting within a passenger car powertrain

J. Rejlek (Virtual Vehicle) A detached fl uid–structure interaction scheme for prediction of fl ow-induced, low frequency, buff eting noise — Part 2: numerical workfl ow

R. Reinelt (ANSYS)Recent advances in PEM fuel cell simulation methods

M. Kopp (ANSYS)Autonomous vehicle radar: Improving radar performance with simulation

15:30 – 15:45 Keynote — Stephan Gillich, Director Technical Computing GTM EMEA, Intel – “Fuel your insight to democratize simulation driven design”

15:45 – 16:15 Keynote — Eric Bantegnie, VP of Systems and Software Business Unit, ANSYS – “Using lessons learned from aerospace and railways in electronics, software and system development of autonomous vehicles”

16:15 – 16:45 Award Ceremony – Thomas Zanzinger, Area Director for Germany, Austria & Nordics, ANSYS

16:45 – 17:45 Farewell Coff ee & Soft Drinks in Exhibition Area

DAY 1 . JUNE 7 . TUESDAY

Opening Plenary Session – Room: Cuvillies I & II

9:00 – 9:15 Welcome Address – Dr. Sandeep Sovani, Director of Global Automotive Industry, ANSYS – “Simulating Smart, Effi cient Vehicles”

9:15 – 9:45 Keynote — Jim Cashman, CEO, ANSYS – “Engineering the Internet of Things”

9:45 – 10:15 Keynote — Dr. Grzegroz Ombach, VP of Engineering, Qualcomm – “Wireless Electric Vehicle Charging as an Example of Breakthrough Innovation”

10:15 – 10:45 Keynote — Manfred Adams, VP of Development, Brose Group – “The Virtual Product – Still a Vision?”

10:45 – 11:15 Keynote — Ferdinando Cannizzo, Head of Powertrain Electrifi cation, Ferrari – “Driving Innovation Through Simulation in Ferrari”

11:15 – 11:30 Keynote — Tosh Tambe, Amazon Web Services – “Race to Optimal Design”

11:30 – 11:45 Keynote — Philippe Trautmann, Hewlett Packard Enterprise – “Achieving Extreme Performance with HPC for Big Data Innovation”

AUTOMOTIVE SIMULATION WORLD CONGRESS ANSYS ELECTRONICS SIMULATION EXPO

Engine: Fuel Injection

Powertrain: Intake & Exhaust

Body & Chassis: Brakes & PD Pumps eMobility: Motors & Generators

Electronics: Thermal-Structural Reliability

Antenna Design for IoT applications

Power and Thermal Management for Complex Chips, Packages and IC

Room: Asam ISession Chair: P. Mandloi

Room: Cuvillies IISession Chair: R. Reinelt

Room: Cuvillies ISession Chair: A. Khondge

Room: Asam IISession Chair: G. Prillwitz

Room: Eff ner ISession Chair: O. Haedrich

Room: Eff ner IISession Chair: M. Laudien

Room: HollSession Chair: S. Muff

13:00 – 13:30 L. Foley (ANSYS)Comprehensive multi-physics simulations of cavitating and non-cavitating high pressure Diesel injectors

F. Hartmann (TU Freiberg)Investigation of the engine intake fl ow using high-resolved LES

S. Weiland (ZF-TRW)Effi cient CAE-tools and processes to support brake-squeal counter measure development

D. Dinulovic (Würth Elektronik) Development of an electromagnetic energy harvesting generator

U. Lautenschlager (Continental) Optimal design of automotive multimedia systems

Keynote - P. Whale (Iotic Labs) Why isn‘t the Internet of Things more like the internet and how to fi x it

13:30 – 14:00 M. Gavaises (City Univ of London) Flow and cavitation in Diesel fuel injector nozzles

A. Matyas (Continental)Dynamical pressure shock simulation in the silencer

J. Lee (Hyundai Motor Co)Experimental validation of CAE and implementation of additional factors for brake squeal simulation

M. Stokmaier (Dynardo) Sensitivity analysis and optimization of an electric motor

D. Kraetschmer (Bosch) Simulation concept for the virtual assessment of the transient electro-thermal behaviour of PCB-based ECUs

M. Kopp (ANSYS) Simulation of installed antenna performance on large structures

M. Schmitt (ANSYS) Solutions for Electronics Systems/IoT Elec-tronics (Signal, Power, Thermal, Structural)

14:00 – 14:30 J. Shi (Delphi)Simulation methodology for advance Diesel injection and combustion development

S. Engeda (BMW) Infl uence of maldistribution on the cumulative emission of a three-way-converter

M. Sielemann (Modelon) Systems engineering solutions: Antilock braking system example

O. Haedrich (ANSYS) Fast transient electromagnetic fi eld simulation with time decomposition

T. Iberer (CADFEM)Coupled electrical, thermal and mechanical reliability investigations for power electronic assemblies

C. Roemelsberger (CADFEM)Designing better dual band antennas for IoT and other applications

M. Panagopoulou (Infi neon)A Simulation approach for modeling the thermal behavior of chip, package, PCB and system

14:30 – 15:00 W. Sander (Bosch)CFD simulation of the hydraulic pressure analyzer (HDA) and validation of the measurement approach based on a common-rail injector

S. Meyer (FES Fanrzeugentwicklung Sachsen) Multiphase CFD-analysis for fi lling of auto-motive SCR tank systems as basis for design optimization

D. Davies (D2H Engineering)Accelerated and validated brake cooling development using CAE tools

M. Brueck (EMMotive)Integral approach for simulation-driven development of electric traction motors in automotive applications

R. Jaschke (Helmut Schmidt Univ)In-rush current from LED lamps can destroy switches

N. Koch (Audi)Challenges in radar sensor vehicle integration

E. Blanc (ANSYS)Reducing Power Noise and improving reliability for high performance System on a Chip from early design stage to Signoff

15:00 – 15:30 Break, Exhibition, Networking

11:45 – 13:00 Lunch, Exhibition, Networking

08:00 – 9:00 Registration

Automotive Simulation World Congress + ANSYS Electronics Simulation Expo June 7, 2016

Engine: In-Cylinder

Powertrain: Seals

Body & Chassis: Aerodynamics

eMobility:Electric Drives

Electronics: Power Electronics

RF and Microwave Design for IoT Chip Package System (SI, PI, EMC)

Room: Asam ISession Chair: W. Bauer

Room: Cuvillies IISession Chair: T. Yugov

Room: Cuvillies ISession Chair: T. Virdung

Room: Asam IISession Chair: L. Voss

Room: Eff ner ISession Chair: O. Haedrich

Room: Eff ner IISession Chair: M. Laudien

Room: HollSession Chair: S. Muff

15:30 – 16:00 E. Meeks (ANSYS)Internal combustion engine simulation strategies

R. Siber (Adam Opel)How simulation leads to compact damper fi lter boxes

N. Sykes (Red Bull Racing) Aerodynamic development and CFD workfl ow optimisation

J. Goss (Motor Design Ltd)Effi ciency map and drive cycle simulation for PMSMs

F. Niedermeier (BMW)Analysis and optimization of inductive charging systems for electromobility

M. Kopp (ANSYS)60 GHz wireless comms systems

G. Capello (U-Blox)Thermal gradients in a cellular module for 2G/3G cellular communications

16:00 – 16:30 L. Schaefer (BMW) Lagrangian spark ignition model accounting for spark-channel dynamics, diff usion and detailed chemical kinetics

Q. Ye (FhG-IPA)Numerical simulation of seam sealing processes

C. Feichtinger (KTM) Automated workfl ow for the drag reduction of racing motorcycles

J. Weis (Schaeffl er)Cooling of Electric drive systems — how CFD simulation supports product development

H. Edel (Ing Büro Edel) Comparison between simulation and mea-surement of transformer and inductor losses (Presented in German Language)

T. DeVarco (SGI) Speeding electro-magnetic simulation of single chips to complete module laminate assemblies at Qorvo(R)

(ANSYS) Solving package and printed circuit board converter power and delivery EMI challenges

16:30 – 17:00 L. Foley (ANSYS)Internal combustion engine design and optimization

H. Inoue (Eagle Industry, Japan)Sealing for pumps and turbos: Simula-tion-driven development of next-generation mechanical seals

C. Ribes (PSA)Aerodynamic loads on a passenger car crossing a truck

H. Steinhart (Steinbeis Transferzentrum für Leistungselektronik)Interpretation and design of an electric drive for a motocross bike (Presented in German Language)

F. Larisch (Webasto) Multidisciplinary simulation based design of a high-effi ciency, high-voltage heater for battery electric and plug-in hybrid vehicles.

A. Michel (ANSYS) Antennas and wireless devices interferenc-es simulations within a vehicle

A. Levanto (Infi neon) Customized adoption of HPC GUI for a non-uniform LSF cluster

17:00 – 17:30 D. Hain (TU Freiberg)Investigation of soot formation processes in DISI engines using ethanol-based fuels

A. Tlili (Cyclam)Optimization of an o-ring-like elastomer for static sealing in engine cooling system

P. Ekman (Linkopings Univ) Evaluation of the stress blended eddy simulation model for external aerodynamics applications

M. Hanke (CADFEM) NVH analysis of drives

T. DeVarco (SGI) Maximizing electromagnetic computation throughput

M. Laudien (ANSYS)Product update: HFSS

S. Muff (ANSYS) Product update: SI-PI

17:30 – 18:30 Exhibition and Networking

18:30 – 21:30 Bavarian Dinner and Networking

DAY 2 . JUNE 8 . WEDNESDAY

Opening Plenary Session – Room: Cuvillies I & II

8:30 – 9:00 Keynote — Dirk Linse, BMW – “The BMW Vision and Strategy in Engine Simulation”

9:00 – 9:30 Keynote — Joachim Noack, Chief Engineer CAE, Global Lead CAE Braking, ZF TRW – “Product Development Strategies in the Era of Globalization and Vehicle Electrifi cation”

9:30 – 10:00 Keynote — Atsushi Ogawa, Head of Aerodynamics and Thermal Management, Honda R&D Japan – “CFD History at Honda and Future Prospects”

AUTOMOTIVE SIMULATION WORLD CONGRESS ANSYS ELECTRONICS SIMULATION EXPO

Engine: Turbocharging

Powertrain: Cooling & Lubrication

Body & Chassis: Aero Optimization

eMobility: Power Sources

Systems & Software: System Simulation

Workshop 1 Workshop 2

Room: Asam ISession Chair: W. Bauer

Room: Cuvillies IISession Chair: P. Mandloi

Room: Cuvillies ISession Chair: A. Wade

Room: Asam IISession Chair: M. Oswald

Room: HollSession Chair: L. Johnson

Room: KlenzePresented in German Language

Room: HollPresented in English Language

10:30 – 11:00 M. Kainz (ANSYS)An integrated design proecss for turbochargers

A. Boemer (Deutz)Effi cient simulation of boiling eff ects at engine cooling jackets

F. Menter (ANSYS)SBES Turbulence Models

T. Vibrans (VW)Inductive heating of shaped blanks for hot stamping of car body parts

L. Johnson (ANSYS)Multidomain multifi delity system simulation of electrifi ed vehicle systems

M. Laudien (ANSYS) Simulation komplexer verkoppelter Antenennsysteme für Kommunikation und Radar: effi ziente Lösungen zur Modellierung und zur Berechnung

A. Focho, A. Mzoughi (ANSYS) Effi cient design fl ow for electromagnetic and thermal simulation of complex electronic systems developing automotive and IoT applications11:00 – 11:30 R. Wildhofer (BMW)

Fluid–structure interaction in the exhaust system of turbocharged petrol engines

P. Illg (John Deere)CFD investigation of rotating gears in oil

C. Harley (Wirth Research)Truck aerodynamics optimisation – realised

M. Kellermeyer (CADFEM)Topology optimization for additive manufacturing using a wheel-rim example

H. Tummescheit (Modelon)Executable requirements to the rescue: Using Modelica and FMI to evaluate requirements compliance early in the system design

11:30 – 12:00 V. Boxberger (TU Berlin)Analysis of diff erent transient simulation methods for the numerical computation of a radial exhaust gas turbine

C. Lynch (Code Product Solutions)Combining CFD, FEA and scripting for effi cient oil vane pump integrity assessment

T. Virdung (ANSYS)Total vehicle simulation of the Volvo S80

R. Maia (CaetanoBus)Complete bus-body simulation

X. Fornari (ANSYS)Ensuring safety with ISO26262 and AUTOSAR compliant embedded software and auto-code generation

12:00 – 12:30 T. Czapka (VW)Numerical investigation of casing treatment for compressor map enhancement

P. Mandloi (ANSYS)Over 10x speed-up of engine cooling simula-tions with Reduced Order Models (ROMs)

J. Brunberg (Volvo Cars)Duct optimization

T. Optiz (VW)Coating dislocation by fast heating for press hardening in automotive context

J. Bayani (Tesla Motors)Automotive system virtual prototyping and design for reliability

12:30 – 13:30 Lunch, Exhibition, Networking

15:00 – 15:30 Break, Exhibition, Networking

10:00– 10:30 Break, Exhibition, Networking

7:30 – 8:30 Registration

Automotive Simulation World Congress + ANSYS Electronics Simulation Expo June 8, 2016

Closing Plenary Session – Room: Cuvillies I & II

HPC & Cloud Computing Powertrain: Lightweighting

Body & Chassis: Wind Noise

Manufacturing Systems & Software: Embedded Software

Workshop 1 Workshop 2

Room: Asam ISession Chair: Wim Slagter

Room: Cuvillies IISession Chair: T. Yugov

Room: Cuvillies ISession Chair: A. Khondge

Room: Asam IISession Chair: L. Foley

Room: HollSession Chair: X. Fornari

Room: KlenzePresented in English Language

Room: HollPresented in German Language

13:30 – 14:00 A. Clarich (Esteco)Highly-effi cient design optimization for automotive applications

F. Franchini (Enginsoft)Structural and material optimization of BorgWarner tensioner arms

M. Oswald (ANSYS)Deterministic aero-vibro acoustics for wind noise prediction

D. Grossi (Meta Systems)Effi cient workfl ow for EMC and thermal model-ing of a high-power battery charger for electric vehicle

L. Johnson (ANSYS)Simulation of ADAS and autonomous vehicle systems

M. Laudien (ANSYS) Simulation of complex coupled antenna systems for communication and radar: effi cient solutions for modeling and calculation

A. Focho, A. Mzoughi (ANSYS)Effi zienter Entwurf komplexer elektronischer Systeme für Automobil- und IoT-Anwen-dungen mittels elektromagnetischer und thermischer Simulation

14:00 – 14:30 T. Tambe (Amazon Web Services)Reaching scale with cloud for automotive CAE simulation

P. Kestel (University of Erlangen)Assistance system for automated and knowledge-based setup and evaluation of design-accompanying fi nite element analyses

K. Nusser (University of Erlangen-Nürnberg)A fl uid-structure interaction scheme for prediction of fl ow-induced low frequency buff eting noise – Part 1: Flow simulation

M. Ellis (Johnson Matthey Battery Systems)Developing a CAE workfl ow for perfor-mance automotive battery systems: Managing know-ledge fl ow in a multi-physics environment

(Deutsches Zentrumfür Luft- und Raumfahrt – DLR)Unifying control and verifi cation for autono-mous driving development

14:30 – 15:00 W. Gentzsch (Uber Cloud)CFD simulations in the cloud, on demand, in novel software containers

D. Vickerman (GRM Consulting)Advanced simulation methods for light-weighting within a passenger car powertrain

J. Rejlek (Virtual Vehicle) A detached fl uid–structure interaction scheme for prediction of fl ow-induced, low frequency, buff eting noise — Part 2: numerical workfl ow

R. Reinelt (ANSYS)Recent advances in PEM fuel cell simulation methods

M. Kopp (ANSYS)Autonomous vehicle radar: Improving radar performance with simulation

15:30 – 15:45 Keynote — Stephan Gillich, Director Technical Computing GTM EMEA, Intel – “Fuel your insight to democratize simulation driven design”

15:45 – 16:15 Keynote — Eric Bantegnie, VP of Systems and Software Business Unit, ANSYS – “Using lessons learned from aerospace and railways in electronics, software and system development of autonomous vehicles”

16:15 – 16:45 Award Ceremony – Thomas Zanzinger, Area Director for Germany, Austria & Nordics, ANSYS

16:45 – 17:45 Farewell Coff ee & Soft Drinks in Exhibition Area

DAY 1 . JUNE 7 . TUESDAY

Opening Plenary Session – Room: Cuvillies I & II

9:00 – 9:15 Welcome Address – Dr. Sandeep Sovani, Director of Global Automotive Industry, ANSYS – “Simulating Smart, Effi cient Vehicles”

9:15 – 9:45 Keynote — Jim Cashman, CEO, ANSYS – “Engineering the Internet of Things”

9:45 – 10:15 Keynote — Dr. Grzegroz Ombach, VP of Engineering, Qualcomm – “Wireless Electric Vehicle Charging as an Example of Breakthrough Innovation”

10:15 – 10:45 Keynote — Manfred Adams, VP of Development, Brose Group – “The Virtual Product – Still a Vision?”

10:45 – 11:15 Keynote — Ferdinando Cannizzo, Head of Powertrain Electrifi cation, Ferrari – “Driving Innovation Through Simulation in Ferrari”

11:15 – 11:30 Keynote — Tosh Tambe, Amazon Web Services – “Race to Optimal Design”

11:30 – 11:45 Keynote — Philippe Trautmann, Hewlett Packard Enterprise – “Achieving Extreme Performance with HPC for Big Data Innovation”

AUTOMOTIVE SIMULATION WORLD CONGRESS ANSYS ELECTRONICS SIMULATION EXPO

Engine: Fuel Injection

Powertrain: Intake & Exhaust

Body & Chassis: Brakes & PD Pumps eMobility: Motors & Generators

Electronics: Thermal-Structural Reliability

Antenna Design for IoT applications

Power and Thermal Management for Complex Chips, Packages and IC

Room: Asam ISession Chair: P. Mandloi

Room: Cuvillies IISession Chair: R. Reinelt

Room: Cuvillies ISession Chair: A. Khondge

Room: Asam IISession Chair: G. Prillwitz

Room: Eff ner ISession Chair: O. Haedrich

Room: Eff ner IISession Chair: M. Laudien

Room: HollSession Chair: S. Muff

13:00 – 13:30 L. Foley (ANSYS)Comprehensive multi-physics simulations of cavitating and non-cavitating high pressure Diesel injectors

F. Hartmann (TU Freiberg)Investigation of the engine intake fl ow using high-resolved LES

S. Weiland (ZF-TRW)Effi cient CAE-tools and processes to support brake-squeal counter measure development

D. Dinulovic (Würth Elektronik) Development of an electromagnetic energy harvesting generator

U. Lautenschlager (Continental) Optimal design of automotive multimedia systems

Keynote - P. Whale (Iotic Labs) Why isn‘t the Internet of Things more like the internet and how to fi x it

13:30 – 14:00 M. Gavaises (City Univ of London) Flow and cavitation in Diesel fuel injector nozzles

A. Matyas (Continental)Dynamical pressure shock simulation in the silencer

J. Lee (Hyundai Motor Co)Experimental validation of CAE and implementation of additional factors for brake squeal simulation

M. Stokmaier (Dynardo) Sensitivity analysis and optimization of an electric motor

D. Kraetschmer (Bosch) Simulation concept for the virtual assessment of the transient electro-thermal behaviour of PCB-based ECUs

M. Kopp (ANSYS) Simulation of installed antenna performance on large structures

M. Schmitt (ANSYS) Solutions for Electronics Systems/IoT Elec-tronics (Signal, Power, Thermal, Structural)

14:00 – 14:30 J. Shi (Delphi)Simulation methodology for advance Diesel injection and combustion development

S. Engeda (BMW) Infl uence of maldistribution on the cumulative emission of a three-way-converter

M. Sielemann (Modelon) Systems engineering solutions: Antilock braking system example

O. Haedrich (ANSYS) Fast transient electromagnetic fi eld simulation with time decomposition

T. Iberer (CADFEM)Coupled electrical, thermal and mechanical reliability investigations for power electronic assemblies

C. Roemelsberger (CADFEM)Designing better dual band antennas for IoT and other applications

M. Panagopoulou (Infi neon)A Simulation approach for modeling the thermal behavior of chip, package, PCB and system

14:30 – 15:00 W. Sander (Bosch)CFD simulation of the hydraulic pressure analyzer (HDA) and validation of the measurement approach based on a common-rail injector

S. Meyer (FES Fanrzeugentwicklung Sachsen) Multiphase CFD-analysis for fi lling of auto-motive SCR tank systems as basis for design optimization

D. Davies (D2H Engineering)Accelerated and validated brake cooling development using CAE tools

M. Brueck (EMMotive)Integral approach for simulation-driven development of electric traction motors in automotive applications

R. Jaschke (Helmut Schmidt Univ)In-rush current from LED lamps can destroy switches

N. Koch (Audi)Challenges in radar sensor vehicle integration

E. Blanc (ANSYS)Reducing Power Noise and improving reliability for high performance System on a Chip from early design stage to Signoff

15:00 – 15:30 Break, Exhibition, Networking

11:45 – 13:00 Lunch, Exhibition, Networking

08:00 – 9:00 Registration

Automotive Simulation World Congress + ANSYS Electronics Simulation Expo June 7, 2016

Engine: In-Cylinder

Powertrain: Seals

Body & Chassis: Aerodynamics

eMobility:Electric Drives

Electronics: Power Electronics

RF and Microwave Design for IoT Chip Package System (SI, PI, EMC)

Room: Asam ISession Chair: W. Bauer

Room: Cuvillies IISession Chair: T. Yugov

Room: Cuvillies ISession Chair: T. Virdung

Room: Asam IISession Chair: L. Voss

Room: Eff ner ISession Chair: O. Haedrich

Room: Eff ner IISession Chair: M. Laudien

Room: HollSession Chair: S. Muff

15:30 – 16:00 E. Meeks (ANSYS)Internal combustion engine simulation strategies

R. Siber (Adam Opel)How simulation leads to compact damper fi lter boxes

N. Sykes (Red Bull Racing) Aerodynamic development and CFD workfl ow optimisation

J. Goss (Motor Design Ltd)Effi ciency map and drive cycle simulation for PMSMs

F. Niedermeier (BMW)Analysis and optimization of inductive charging systems for electromobility

M. Kopp (ANSYS)60 GHz wireless comms systems

G. Capello (U-Blox)Thermal gradients in a cellular module for 2G/3G cellular communications

16:00 – 16:30 L. Schaefer (BMW) Lagrangian spark ignition model accounting for spark-channel dynamics, diff usion and detailed chemical kinetics

Q. Ye (FhG-IPA)Numerical simulation of seam sealing processes

C. Feichtinger (KTM) Automated workfl ow for the drag reduction of racing motorcycles

J. Weis (Schaeffl er)Cooling of Electric drive systems — how CFD simulation supports product development

H. Edel (Ing Büro Edel) Comparison between simulation and mea-surement of transformer and inductor losses (Presented in German Language)

T. DeVarco (SGI) Speeding electro-magnetic simulation of single chips to complete module laminate assemblies at Qorvo(R)

(ANSYS) Solving package and printed circuit board converter power and delivery EMI challenges

16:30 – 17:00 L. Foley (ANSYS)Internal combustion engine design and optimization

H. Inoue (Eagle Industry, Japan)Sealing for pumps and turbos: Simula-tion-driven development of next-generation mechanical seals

C. Ribes (PSA)Aerodynamic loads on a passenger car crossing a truck

H. Steinhart (Steinbeis Transferzentrum für Leistungselektronik)Interpretation and design of an electric drive for a motocross bike (Presented in German Language)

F. Larisch (Webasto) Multidisciplinary simulation based design of a high-effi ciency, high-voltage heater for battery electric and plug-in hybrid vehicles.

A. Michel (ANSYS) Antennas and wireless devices interferenc-es simulations within a vehicle

A. Levanto (Infi neon) Customized adoption of HPC GUI for a non-uniform LSF cluster

17:00 – 17:30 D. Hain (TU Freiberg)Investigation of soot formation processes in DISI engines using ethanol-based fuels

A. Tlili (Cyclam)Optimization of an o-ring-like elastomer for static sealing in engine cooling system

P. Ekman (Linkopings Univ) Evaluation of the stress blended eddy simulation model for external aerodynamics applications

M. Hanke (CADFEM) NVH analysis of drives

T. DeVarco (SGI) Maximizing electromagnetic computation throughput

M. Laudien (ANSYS)Product update: HFSS

S. Muff (ANSYS) Product update: SI-PI

17:30 – 18:30 Exhibition and Networking

18:30 – 21:30 Bavarian Dinner and Networking

DAY 2 . JUNE 8 . WEDNESDAY

Opening Plenary Session – Room: Cuvillies I & II

8:30 – 9:00 Keynote — Dirk Linse, BMW – “The BMW Vision and Strategy in Engine Simulation”

9:00 – 9:30 Keynote — Joachim Noack, Chief Engineer CAE, Global Lead CAE Braking, ZF TRW – “Product Development Strategies in the Era of Globalization and Vehicle Electrifi cation”

9:30 – 10:00 Keynote — Atsushi Ogawa, Head of Aerodynamics and Thermal Management, Honda R&D Japan – “CFD History at Honda and Future Prospects”

AUTOMOTIVE SIMULATION WORLD CONGRESS ANSYS ELECTRONICS SIMULATION EXPO

Engine: Turbocharging

Powertrain: Cooling & Lubrication

Body & Chassis: Aero Optimization

eMobility: Power Sources

Systems & Software: System Simulation

Workshop 1 Workshop 2

Room: Asam ISession Chair: W. Bauer

Room: Cuvillies IISession Chair: P. Mandloi

Room: Cuvillies ISession Chair: A. Wade

Room: Asam IISession Chair: M. Oswald

Room: HollSession Chair: L. Johnson

Room: KlenzePresented in German Language

Room: HollPresented in English Language

10:30 – 11:00 M. Kainz (ANSYS)An integrated design proecss for turbochargers

A. Boemer (Deutz)Effi cient simulation of boiling eff ects at engine cooling jackets

F. Menter (ANSYS)SBES Turbulence Models

T. Vibrans (VW)Inductive heating of shaped blanks for hot stamping of car body parts

L. Johnson (ANSYS)Multidomain multifi delity system simulation of electrifi ed vehicle systems

M. Laudien (ANSYS) Simulation komplexer verkoppelter Antenennsysteme für Kommunikation und Radar: effi ziente Lösungen zur Modellierung und zur Berechnung

A. Focho, A. Mzoughi (ANSYS) Effi cient design fl ow for electromagnetic and thermal simulation of complex electronic systems developing automotive and IoT applications11:00 – 11:30 R. Wildhofer (BMW)

Fluid–structure interaction in the exhaust system of turbocharged petrol engines

P. Illg (John Deere)CFD investigation of rotating gears in oil

C. Harley (Wirth Research)Truck aerodynamics optimisation – realised

M. Kellermeyer (CADFEM)Topology optimization for additive manufacturing using a wheel-rim example

H. Tummescheit (Modelon)Executable requirements to the rescue: Using Modelica and FMI to evaluate requirements compliance early in the system design

11:30 – 12:00 V. Boxberger (TU Berlin)Analysis of diff erent transient simulation methods for the numerical computation of a radial exhaust gas turbine

C. Lynch (Code Product Solutions)Combining CFD, FEA and scripting for effi cient oil vane pump integrity assessment

T. Virdung (ANSYS)Total vehicle simulation of the Volvo S80

R. Maia (CaetanoBus)Complete bus-body simulation

X. Fornari (ANSYS)Ensuring safety with ISO26262 and AUTOSAR compliant embedded software and auto-code generation

12:00 – 12:30 T. Czapka (VW)Numerical investigation of casing treatment for compressor map enhancement

P. Mandloi (ANSYS)Over 10x speed-up of engine cooling simula-tions with Reduced Order Models (ROMs)

J. Brunberg (Volvo Cars)Duct optimization

T. Optiz (VW)Coating dislocation by fast heating for press hardening in automotive context

J. Bayani (Tesla Motors)Automotive system virtual prototyping and design for reliability

12:30 – 13:30 Lunch, Exhibition, Networking

15:00 – 15:30 Break, Exhibition, Networking

10:00– 10:30 Break, Exhibition, Networking

7:30 – 8:30 Registration

Automotive Simulation World Congress + ANSYS Electronics Simulation Expo June 8, 2016

Closing Plenary Session – Room: Cuvillies I & II

Organizer / Contact:ANSYS Germany GmbHBirkenweg 14 a64295 Darmstadt / GermanyT: +49 6151 3644-0F: +49 6151 3644-44www.ansys-germany.comworkshops-germany@ansys.com

Follow us on Twitter:#ASWC2016

ansys.com/aswcansys.com/aese-germany

Agenda

Munich – June 7-8, 2016

AwardsThe ASWC & AESE will close with a session in which awards will be presented in the following categories: ASWC

• Best Engine Simulation• Best Powertrain Simulation• Best Body and Chassis Simulation• Best eMobility and Autonomous Driving Simulation• Best Systems, HPC and Cloud Simulation• Best Automotive Simulation

AESE• Best Electronics Simulation

Conference Proceedings DownloadConference proceedings will be available for download on the ASWC and AESE websites after the conference:

www.ansys.com/aswcwww.ansys.com/aese

Congress VenueSheraton München Arabellapark HotelArabellastraße 581925 München / Germanyphone +49 89 92320www.sheratonarabellapark.com

Conference LanguagesThe conference languages will be English for the ASWC and English and German for the AESE. All lectures and presentations with English titles will be held in English, and those with German titles will largely use English slides (simultaneous translation will not be off ered).

Evening EventJoin our Networking Dinner on June 7, 2016 in a typical Bavarian Restaurant and “Biergarten” nearby the confer-ence venue. Binding registration for this social event is required during the conference registration process.

Keynote Speakers

Platinum Sponsors

Amazon Web Services (AWS) provides busi-nesses with a secure, reliable, low-cost, easy-to-scale, global IT infrastructure “in the cloud.” Hundreds of thousands of customers in 190 countries, rely on AWS for their infrastruc-ture needs, from running existing enterprise applications to building new applications in the cloud. The global AWS platform allows de-signers, engineers, and analysts from boutique studios to large enterprises to securely scale their business. aws.amazon.com

Hewlett Packard has been in the innovation business for more than 75 years. Our vast intellectual property portfolio and global re-search and development capabilities are part of an innovation roadmap designed to help or-ganizations of all sizes - from global enterpris-es to local startups - transition from traditional technology platforms to the IT systems of the future. Time to value defi nes success in today‘s global markets. You speed time to value by continu-ously delivering and optimizing apps and ser-vices for customers, partners and employees. Companies need to do four things well in order to survive and thrive in this idea economy: they must transform to a hybrid infrastruc-ture, protect the digital enterprise, empower the data driven organization and enable work-place productivity. hpe.com

Since its founding in 1968, Intel Corporation has grown into the world’s largest semicon-ductor company (based on revenue) establish-ing a heritage of innovation that continues to expand the reach and promise of computing while advancing the ways people work and live worldwide. Intel’s products and technologies are at the heart of computing and communication solu-tions that have become essential parts of busi-nesses, homes and schools around the world. The company’s products include microproces-sors, chipsets, other semiconductor products and software which are integral to computers, servers and infrastructure powering the Cloud, as well as consumer electronics, handheld de-vices and connected intelligent systems that include cars, shopping kiosks and bank ATMs. intel.de

Welcome

The World Automotive Simulation Congress & ANSYS Electronics Simulation Expo provide an unique opportunity to get an update on the latest simulation technologies and processes in the global automotive and electronics industry. We thank you for coming and look forward to spending time with you sharing information and ideas. MANFRED ADAMS

Brose

JIM CASHMANANSYS

FERDINANDO CANNIZZOFerrari

TOSH TAMBEAmazon Web Services

DR. DIRK LINSEBMW

STEPHAN GILLICHIntel

ERIC BANTEGNIEANSYS

DR. SANDEEP SOVANIANSYS

“Thank You for Your Support” to all our Sponsors!

PHILIPPE TRAUTMANNHewlett Packard Enterprise

ATSUSHI OGAWAHonda

JOACHIM NOACKZF TRW

DR. GRZEGROZ OMBACHQualcomm

Silver Sponsors

BETA CAE Systems S.A, is an engineering software company committed to the development of best-in-class CAE software systems that meet the requirements of all simulation disciplines. The company’s fl agship product, ANSA / μETA pre- & post-processing package, holds a worldwide leading position, in many sectors, including the automotive, railway vehicles, aerospace, motorsports, chemical processes engineering, energy, electronics, heavy machinery, power tools, and biomechanics. The company’s new solu-tion for Simulation Product Data and Resources Management, SPDRM, provides a simple, scalable, and intuitive way to capture, deploy, manage and improve CAE workfl ows. beta-cae.gr

CEI - founded in 1994 with Headquarters in Apex, NC, USA – has worldwide subsidiaries in Germany, China, India and Japan. CEI is the creator of EnSight, the leading software solution for visualizing, analyzing, and communicating data from complex mono- and multidisciplinary numerical simulations. It supports an extraordinary number of solver data formats. The open interface architec-ture allows for easy integration with any data format, and a Python API empowers users to customize the software to meet their specifi c needs. With support for parallel data processing and distributed graphics rendering, it is the leader in handling very large models. ensight.com

Fujitsu has been leading the HPC market for almost 40 years and off ers a comprehensive portfolio of computing products to meet wide-ranging HPC requirements: from x86-based CELSIUS workstations and PRIMERGY servers up to PRIMEHPC FX100, including storage systems, HPC middleware and integration services. An intuitive web based user interface – the Fujitsu HPC Gateway – low-ers entry barriers and makes HPC accessible to a much wider set of end-users. With cutting-edge hardware and a proven software stack users have at hand the most productive and coherent HPC workplace in the market today. fujitsu.com

modeFRONTIER is a multidisciplinary and multiobjective optimization platform capable of streamlining engineering process through innovative algorithms and integration with leading simulation software. In numerous industries, modeFRONTIER has become an essential tool to increase understanding of cost/performance factors and to reduce product development time. Over 250 international organizations have entrusted the best in class solution to design better and more effi cient products. For further information, please visit: modefrontier.com

Noesis Solutions is an engineering innovation partner to manufacturers in engineering-intense industries. Specialized in solutions that enable Objectives Driven Draft-to-Craft Engineering processes, its software products and services help customers adopt a targeted development strategy that resolves their toughest multi-disciplinary engineering challenges. This Engineer by Objectives strategy entails an automated approach that streamlines engineering processes to effi ciently manage the growing complexity of today’s engineering challenges. In addition, interactive design space visualization allows engineering teams to make informed decisions faster – empowering them to form & transform ideas into products that outsmart competition. noesissolutions.com

Open iT helps ANSYS users worldwide to optimize their engineering software licensing for the fastest time-to-market and maxi-mum ROI. As an ANSYS partner, Open iT software usage reports are a trusted source for enabling informed vendor-user business relationships. From single sites to globally dispersed organizations, from on-premise to cloud, Open iT TrueUse™ technology provides live dashboards, event alerts, chargeback for cost accounting, customizable reports for users, teams, projects, locations, vendors, and much more. Visit us at our booth to see what Open iT can do for you! openit.com

Sharc develops and provides revolutionary meshing and post-processing software for the most extreme CFD workfl ows. Using ad-vanced proprietary data formats, innovative rendering engines and unique meshing algorithms, Sharc is able to reduce time from CAD to visualisation by orders of magnitude using the extreme meshing software, Harpoon and the industry leading visualisation suite of software Periscope. Our technical staff provide customisation and tailoring of the software to customer specifi c require-ments, streamlining the engineering process even further. sharc.co.uk

Gold Sponsors

Global supercomputing leader Cray builds innovative systems and solutions enabling scientists and engineers in academia, gov-ernment and industry to meet existing and future simulation and analytics challenges. Leveraging 40 years of experience in developing and servicing the world’s most advanced supercomputers, Cray off ers a comprehensive portfolio of high performance computing, storage and data analytics solutions delivering unrivaled performance, effi ciency and scalability. Cray’s industry lead-ing technologies are available in confi gurations to meet every budget and need. Whatever your research question, Cray makes it easy to take advantage of high performance computing advancements. cray.com

Lenovo, the world’s number 1 PC provider (per IDC reports), produces the ThinkStation, ThinkPad and ThinkServer product lines. Lenovo ThinkStation Workstations and ThinkPad Mobile Workstation are highly-reliable and high-performance workstations, and are used by design engineers and analysis professionals worldwide. They are rapidly gaining in popularity with ANSYS customers. The Lenovo Performance Tuner has special settings to optimize our ThinkStation performance for ANSYS products. Lenovo pro-vides workstations to ANSYS for complete certifi cation testing and performs benchmark testing to use in guiding customers toward the optimal confi guration for your needs. More can be found at thinkworkstations.com

SGI off ers a solution that simplifi es high performance computing for CAE. SGI has created an easy to deploy, unifi ed hardware plat-form that addresses advanced CFD applications and workloads. It allows our customers to leverage their hardware investments by simplifying integration with existing infrastructures and maximizing the effi ciency of available licenses and IT personnel.sgi.com/manufacturing