laird technologies mmp
DESCRIPTION
April 2008. Laird Technologies MMP. The Laird Group PLC Overview. Founded in mid 1800’s Headquartered in London, UK Quoted on the London Stock Exchange (symbol LARD) and a member of the FTSE 250 index Employer of 10,000+ people in North America, Europe and Asia - PowerPoint PPT PresentationTRANSCRIPT
Laird Technologies MMP
April 2008
The Laird Group PLC Overview
• Founded in mid 1800’s
• Headquartered in London, UK
• Quoted on the London Stock Exchange (symbol LARD)
and a member of the FTSE 250 index
• Employer of 10,000+ people in North America, Europe and Asia
• 2006 revenue of approximately $1200 million
Laird Technologies
• Founded in mid 1990’s• Headquartered in St. Louis, Missouri, USA• Annual revenue almost $1B dollars• Over 10,000 employees globally in
engineering, manufacturing and sales• Industry Business Units:
– Handset
– Automotive
– Datacom
– I&I– Consumer
Worldwide Locations
50 sites around the world 10,000 employees
Not all sites are represented in this graphic. Some sites are close together
1996 1998 2000 20042002 2006
Magnes
Family Tree
The Laird Technologies Mission
“To be the leader in design and supply
of customized performance-critical
products for wireless and other
advanced electronics applications.”
Revenue Distribution
0%
25%
50%
75%
100%
2002 2003 2004 2005 2006
Asia
Europe
Americas
0%
25%
50%
75%
100%
2002 2003 2004 2005 2006
Asia
Europe
Americas
Revenue by Origin
Revenue by Destination
Handsets IT
Telecom Automotive/transport
Industrial Military/Aero/Security
Consumer Medical
Other
Revenue Splits - 2007
global solutions: local support
• Technology leadership in all products offered
• Direct support for global and large OEM programs
• Broad market coverage
• Broad product line within business units
• Local manufacturing and engineering
• Low cost producer of high volume products
• Add complementary product lines
Strategy
Core Competencies
• Bias for action – speed of response
• Global footprint
• Key customer access and relationships
• Broad product line to same customers
• Ability to bundle technology – “convergence products”
• RF design
• Identifying, buying, integrating niche segments of high margin, customized electronics components and systems
Serving a Diverse Range of Leading Global Companies
Topics Today
• MMP (Mobile Metal Products)
• Handset Products
• Technologies
• Manufacturing Sites
• Program Support Structure
MMP
• Mobile Metal Products– Board Level Shielding– Combo Products– Decorative / Visual Metals– MAP (Hinges)
Technical CharacteristicsBoard Level Shielding
Surface Mount Shield Options
• 2 Piece pre-assembled frame and cover (Tin Plate CRS not available as cover will
reflow to frame)
• 2 Piece system surface mount frame with manually installed cover
• Multi-Compartmental Shields replace multiple single shields
• 1 Piece Surface Mount Shields
– Formed and Drawn technologies
• 1 Piece Shield w/ Tear-Away Feature (EZ Peel / Pop-Top)
• Surface Mount Clips with BLS and MIP shield (EcE and TPE types)
Materials used for BLS
• Tin Plated Cold Rolled Steel (CRS) – Cheapest option
• Nickel Silver
• Stainless Steel Tin Plated
• Tin Plate Phos bronze
• ALL materials used are RoHs compliant
Cellular Handsets
• Board Interface contacts• Shielding of various
functions
EMI Product Portfolio• Surface Mount Contact (SMC) – Standard or Custom Designs
Standard Contacts
Packaged in Tape and Reel for Automatic
Placement on SMT Lines
FEA of Design
Custom Contacts Packaged in Tape and
Reel for Automatic Placement on SMT Lines
Custom Contacts
• Match system productivity to program size
• Implement Technologies that maximize yields
• In-line and In-Die secondary operations
• Technologies to reduce material usages
• Real-time Quality Assurance and Quality Control
• Match tool life to program size (15m to 100m)
BLS Manufacturing Technology Objectives-Deliver High Quality Parts at the Lowest Cost
System Approach
•Feeder•Press•Washer•Labeling•Inspection•Packaging
Other automated operations•Laser welding•Tapping•Pin insertion•Assembly
In-die and In-Line Assembly
In-die Assy.• 100-300 pieces/min.•High die Cost•Carbide technology•8-12 week tool lead-time•>98% yield•>50m die life
In-line Assy.• 100-180 pieces/min.•Low die cost•Modular•4 week tool lead-time•>96% yield•>15m die life
100% Automated Co-planarity Inspection
PEG AOI
Combo Products
• LT has the internal ability to produce complex metal stampings and insert molded parts.
• Molding can be TPE or EcE
• Combo (MCS) Drawn Frames with Molding [TPE or Conductive Silicone]
Simulation of Draw Forming
Drawn Part
Molded Part
Location CapabilitiesLocation Primary activities/productsSchaumburg, IL BLS Combo Deco Development, Prototype and Project Management
Liberec, Czech Republic BLS Manufacturing and all other LT products
Tianjin, China Board level shielding and Combo (Overmold) products
Shanghai, China Board level shielding and Contacts Manufacturing
San Jose, CA Business Development , BLS and other EMI
Stockholm, Sweden Business Development for EU, Prototype
Shenzhen, China Business Development for Decorative Metals, BLS and metal stampings
Chennai, India BLS Production only
Reynosa, Mexico BLS Production* 2009 Mass Production
San Jose, CA (Business Development)
Chicago, IL. (Business Development) Stockholm, Sweden
(Business Development)Liberec, Czech Republic (Manufacturing)
Tianjin, China (Manufacturing BLS and Combo)
Shanghai, China (Business Development, Manufacturing)
Chennai, India (BLS Manufacturing)
Shenzhen, China (Business Development, Manufacturing Decorative Metals)
Reynosa, Mexico
DECORATIVE METALS
What is a decorative metal?
• Exterior metals to a customer application.
• Typically has a class 1 finish.
• May be plated, colored, etch, etc.
• Provides ASTHETIC appeal to end customer product
• Can also be an enclosure for the application
Areas of Technology Development
Metal Bases• SS stamping/drawing• Al stamping/drawing• Electroforming• Ti stamping/drawing• Die casting• Extrusions
Decorative Finishing Technologies• Laser decoration• Electro-polish• Anodizing• Diamond cutting• Plasma Vapor Deposition of metals
and finishes• Electro-deposition• Chrome, Gold, other platings• Painting• Ni/Cr free coatings
ALL Possible either internal or through supply
Core Tech.Stainless Steel
AluminumTitanium
Mg Die-cast
Laser decoration
Electro deposition
PVDMAM
Polishing
Anodizing
Electro-polish
KeyLT- CurrentLT - Vendor LT- Planned 2008
Painting
Core Decoration Tech.
Mesh formingDiamond cutting
Hairline brush
Simple Decoration
Gold plating
Chrome plating
Photo Etch
Silver plating
Laser welding
Teflon coating
Visual Metals
Sand Blast
PVD
Painting AnodizingPainting
Visual Metal & Hinge Market Roadmap1H08
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New Clean Room Layout for Decorative Metals (LT- Shenzhen)
Pain
ting
Line 1
Process: Al 6061 , stamping, polishing, anodizing, bright surface cutting.
Process: SUS304 BA, stamping, electro polishing, selective Hairline.
Process: SUS304 BA, stamping, polishing, Hairline, PVD, Laser marking.
Process: SUS304 BA, stamping, electro polishing, selective Hairline.
Process: SUS304 BA, stamping, 3 coatings, soft touch.
Decorative Metals
• Laser Coloring on Stainless Steel
Decorative Metals
• Complex Forming
• Electro Polishing
Additional “colors”
Process: Sus304 BA, stamping, polishing, PVD (Black, Silver, golden)
Decorative Metals
• LCD Flip Retainer• Part is:
– Stamped from stainless steel– Electro polished– Selectively colored electro
coated (selectivity allows for surface conductivity of grounding finger).
back side
Mg die casting + Passivation + Cu plating + Powder coating
Mg die casting + Passivation + Cu plating + bright Cr plating + PVD
Mg die casting + Passivation + Cu plating + dull Cr plating + PVD
Speaker mesh
Wire mesh plus Chrome plating
Photo Etching, secondary forming, electro polishing
Speaker Details
Speaker mesh
Wire mesh plus Chrome plating
SIM Tray
Stamping + ED coating + laser etching
Camera Bezel
Process: SUS316L,stamping, Photo Etching, stamping, electro polishing, Etch.
Display Bezel
Process: Sus304 BA, stamping, polishing, PVD (Black), Laser.
MAP (Hinges)
MAP
• Mechanical Actuated Products– Hinges provides handheld devices the ability to
fold, rotate or slide to allow access to screens or keypads. These capabilities are key aspects to allow these devices to become smaller now and in the future
• MAP comes from 2007 Acquisition of M2Sys, a Korean company.
Locations
R&D Hinges
R&D
Questions