laser equipment for microprocessing · 2015-12-10 · laser equipment for microprocessing, thomas...
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![Page 1: LASER EQUIPMENT FOR MICROPROCESSING · 2015-12-10 · LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer Confidential 04.11.2015 CTI Project BFH, CSEM and TRUMPF – Focus on brittle-rigid](https://reader034.vdocuments.net/reader034/viewer/2022042021/5e7868dd789323619c661753/html5/thumbnails/1.jpg)
LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
TRUMPF Maschinen AG
■ Confidential
Thomas Bewer
Burgdorf, 04.11.2015
LASER EQUIPMENT FOR
MICROPROCESSING
Appolo Workshop
Head of Advanced Development
1
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015 2
Different laser work stations with pico and femto second
lasers available.
Inspection of part quality with high precision measurement
systems possible.
Laser application lab in Baar
Service:
Supporting the development of your USP laser application at
Baar
DXF assisted contour inspection
shown: tolerance ± 2 µm (green within tolerance)
3D Depth profile measurement
incl. measurement of surface roughness
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Flexible platform for micromachining
3
TruLaser Cell 2000
Prozess-orientated and -
optimized controls and
programming
Intelligent and patened
change concept of the
optic tray (<15min)
Granite construction
for high precision
Free choice of optics,
optional with vision-
system
Isolated
Prozess chamber
Flexible workholder
High precision
X-Y-Table
Integrated laser source and
extraction system
All from one source
Free choice of TRUMPFs
ps and fs lasers
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Examples of possible configurations
4
Exchangable optic tray offers a broad choice of optics
Fixed optic
Ideal for fine cutting
Parallel fixed optics*
Ideal for parallel processing with fixed
optics at higher laser power
* schematic
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
xy table has an accuracy of +-1 micron
5
High precision cutting
Tolerance band ± 2 micron – green within tolerance
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Examples of possible configurations
6
Exchangable optic tray offers a broad choice of optics
Fixed optics
Ideal for fine cutting
Scanner & fixed optics
Ideal for fast change between
scanner & fixed optics,
Wobble-processes
Parallel scanner*
Ideal for parallel processing with
scanner optics at higher laser power
Parallel fixed optics*
Ideal for parallel processing with
fixed optics at higher laser power
Scanner
Ideal for ablation processes,
but also for cuting and drilling * schematic
![Page 7: LASER EQUIPMENT FOR MICROPROCESSING · 2015-12-10 · LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer Confidential 04.11.2015 CTI Project BFH, CSEM and TRUMPF – Focus on brittle-rigid](https://reader034.vdocuments.net/reader034/viewer/2022042021/5e7868dd789323619c661753/html5/thumbnails/7.jpg)
LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Examples of possible configurations
7
Exchangable optic tray offers a broad choice of optics
For drilling and cutting with
highest demands regarding
taper angle
„Non Standard“ Optics
Trepanning optic
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
CTI Project BFH, CSEM and TRUMPF – Focus on brittle-rigid materials Sapphire, Si, Si3N4
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Trepanning optics
Kerf angles of 90 +-0.4° were achieved
Models were developed that can
predict kerf angles and curf width
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Examples of possible configurations
9
Exchangable optic tray offers a broad choice of optics
For drilling and cutting with
highest demands regarding
taper angle
„Non Standard“ Optics
Fast cutting of
transparent materials
Top Cleave optic
Trepanning optic
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Fast cutting of transparent materials
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Top Cleave
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Single pass modification
by elongated beam shape
Selective etching
Separation
Process benefits
from beam shaping
Selective Laser Etching of Elongated Modifications
Corning Gorilla ®
Not strengthened
Thickness 500µm
Thickness 700µm
Strengthened
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Single pass modification
by elongated beam shape
Selective etching
Separation
Process benefits
from beam shaping
Selective Laser Etching of Elongated Modifications
Corning Gorilla ®
Not strengthened
Thickness 500µm Fused silica
Corning Gorilla®
Not strengthened
Thickness 550 µm
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015
Flexible platform for micromachining processes
TruLaser Cell 2000
more to come …
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LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer ■ Confidential 04.11.2015 04.11.2015 LASER EQUIPMENT FOR MICROPROCESSING, Thomas Bewer
TRUMPF Maschinen AG
Thomas Bewer Head of Advanced Development
+41 41 769-6176
YOUR CONTACT
■ Confidential 14