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TRANSCRIPT
LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91A
MODEL : 26LH20R 26LH20R-MA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM...................................................................................19
EXPLODED VIEW .................................................................................. 20
SVC. SHEET ...............................................................................................
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 4 -
CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 5 -
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 6 -
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification4.1 General Specification
1. Application rangeThis spec sheet is applied to LCD TV used LP91A chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC2) Relative Humidity : 65±10%3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed
each drawing and specif ication by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
- Safety: CE, IEC specification- EMC : CE, IEC
No Item Specification Measurement Remark
1 Screen Size 26” wide Color Display Module Resolution: 1366*768
2 Aspect Ratio 16:9
3 LCD Module 26” TFT WXGA LCD HD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 80 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
≤ 120 W 26” HD
7 LDC Module HD 626 x 373 x 44.1 with inverter
(Maker : LGD) 0.1405 x 0.4215
12 EEFL
Coating 3H
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 360 450 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 10
3. Color Coordinates White Wx Typ 0.279 Typ LGD 26”(HD)
Wy -0.03 0.292 +0.03 LC260WXN-SBA1
RED Xr 0.637
Yr 0.333
Green Xg 0.290
Yg 0.607
Blue Xb 0.145
Yb 0.061
4. Contrast ratio 700:1 1000:1 LGD 26”(HD)
5. Luminance Variation 1.3
- 7 - LGE Internal Use Only
5. Chroma& Brightness (Optical)5.1. LCD Module
the Color Coordinates check condition - 50cm from the surface, Full White Pattern- Picture mode Vivid
8. Component Video Input (Y, PB, PR)
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
- 8 - LGE Internal Use Only
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
9. RGB 9.1 Analog PC, RGB- DTV –NOT SUPPORT
10. HDMI Input 10.1 PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
10.2 DTV Mode
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz but display.
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
1) Gap between Front Frame /Back cover and Middle Cabinet2) Gap between Front Frame /Middle Cabinet
- 9 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
Top View
Back Cover
Front Frame
Middle Cabinet
"b
"b
Gap b between Front Frame (Back cover) and Middle Cabinet-> 0 † b † B (Side gap)
Gap a between Front Frame and Middle Cabine-> 0 † a † A (Side gap)
"b
"a
Gap a between Front Frame and Middle Cabine-> 0 † a † A (Left/ Right gap)
3) Gap between Back Cover and Side AV
Back ViewSide View
Side AV
Back Cover
Gap f between Back Cover and Side AV-> 0 † f † 1.0Gap g between Back Cover and Side AV-> 0 † g † 1.0
11. Mechical spec. No Item Min Typ Max Unit
1. C/ A + B/ C top gap 0.5 1 1.5 mm
2. C/ A + B/ C side gap 0.5 1 1.5 mm
3. C/ A + Deco Front gap( ONE SIDE). 0.8 1 1.2 mm
*Active area1. Active area of LCD PANEL is in bezel of cabinet2. Interval between active area and bezel
|A-B|< 2.0 mm ,|C-D|< 2.0 mmA:Interval between left of active area and bezelB:Interval between right of active area and bezelC:Interval between top of active area and bezelD:Interval between bottom of active area and beze
4)Gap between Back Cover and Side AV
- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
Side View "h"
Control Braket
Back Cover
Gap h between Back Cover and Control Bracket-> 0 † h † 0.8
C
B
D
AActive Area
Bezel
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 11 -
ADJUSTMENT INSTRUCTION
1. Application RangeThis specification sheet is applied to all of the LCD TV,LP91A/B/C/D chassis.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity ifthere is no specific designation.
4) The input voltage of the receiver must keep 100~220V,50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.
3. Adjustment items3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.
(2) ADC Calibration – RGB / Component(3) Input Tool-Option/Area option.(4) Check SW Version.
4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig
(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack
(2) Download steps1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened2) Click the “Connect” button and confirm “Dialog Box”
3) Click the “Config.” button and Change speed I2C Speedsetting : 350Khz~400Khz
4) Read and write bin file.Click “(1)Read” tab, and then load downloadfile(XXXX.bin) by clicking “Read”.
- LH20/ LH30
1
Filexxx.bin
1
Filexxx.bin
5) Click “(2)Auto” tab and set as below6) Click “(3)Run”.7) After downloading, you can see the “(4)Pass” message.
4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the ISB port.2) Automatically detect the SW Version.
-> S/W download process is executed automatically.3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Adjust tool/area option.Adjust tool/area option refer to the BOM.
4.3. Adjust tool/area option.Adjust tool/area option refer to the BOM.
4.4. EDID D/L methodRecommend that don’t connect HDMI and RGB(D-SUB) cablewhen downloading the EDID.If not possible, recommend that connect the MSPG equipment.There are two methods of downloading the edid data
4.4.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2seconds.
4.4.2. 2nd Method* Caution :
Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not bedownloaded well.
1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key(G)3) Press the right direction key(G) at Start.4) After about a few seconds, appear “OK”, then compele.
4.4.3. RS-232C command Method(1) Command : AE 00 10
* Caution Don’t connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of edid could befailed.
- 12 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
1
Filexxx.bin
4.4.4. EDID data(1) HD MODEL
<Analog(RGB): 128bytes>
<HDMI 1 : 256Bytes>
<HDMI 2 : 256Bytes>
4.5. ADC Calibration4.5.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is “0 0 0 0”.5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
4.5.2. ADC Calibration - RGB (Using External pattern)(1) Required Equipments
- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is “0 0 0 0”.5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
- 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
OK
OK
4.6. Input Tool-Option, Area Option.## TOOL Option, Area Option change and AC offBefore PCBA check, you have to change the Tool option,Area option and have to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
4.6.1. Profile: Must be changed the option value because being differentwith some setting value depend on module maker, inch andmarket
4.6.2. Equipment : adjustment remote control.
4.6.3. Adjustment methodThe input methods are same as other chassis.(Use IN-STARTKey on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)* Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value * Never push the IN-STOP KEY after completing the functioninspection.
4.7. Check SW Version(1) Method
1) Push In-star key on Adjust remote-controller.2) SW Version check
Check “SW VER : V3.xx” – LH20
5. White Balance adjstment5.1. Overview
(1) Purpose : Adjust the color temperature to reduce thedeviation of the module color temperature.
(2) Principle : To adjust the white balance without thesaturation, Fix the one of R/G/B gain to 192 (default data)and decrease the others.
(3) Adjustment mode : Three modes – Cool / Medium / Warm
5.2. Required Equipment(1) Remote controller for adjustment (2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV (ch:9)(should be used in the calibrated ch by CS-1000)
(3) Auto W/B adjustment instrument(only for Auto adjustment)
5.3. Connecting diagram of equipment formeasuring (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC Communication-WhiteBalance Mode.
(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)- Enter the white balance adjustment mode with aging
command (F3, 00, FF)* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance (for Manualadjustment)
(1) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push “Exit” key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter “0000” (Password)6) Select “3. W/B ADJUST”7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others11) When adjustment is completed, Enter “COPY ALL”.12) Exit adjustment mode using EXIT key on R/C.
- 14 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
* CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target
i) Decrease the R, G. 2. x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R
4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment
To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)
- 15 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
Coordinate Mode
x y Temp uv∆
Cool 0.276±0.002 0.283±0.002 11000K 0.000
Medium 0.285±0.002 0.293±0.002 9300K 0.000
Warm 0.313±0.002 0.329±0.002 6500K 0.003
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 16 -
TROUBLESHOOTING
No power(LED indicator off)
Check 24V, 12V, 5,2V of Power B/D
Check short of Main B/D or Change Power B/D
Pass
Check Output of IC1001, IC1003, IC1007
Check P307 Connector
Change LED Assy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assy
Change IC1002,, Q1003
Pass
Check short of IC1001,IC1003, IC1007
Fail
Re-soldering or Change defectpart of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED statusOn Display Unit
Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802Fail
Change Inverter ConnectorOr InverterFail
Pass
Fail
Pass
Change ModuleFail
Check LVDS Cable
Pass
Check Panel Link Cable Or Module
Change Panel Link CableOr Module
Check Inverter ConnectorOr Inverter
Pass
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 17 -
No Raster on PC Signal
Check Input source Cableand Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC100 Fail
Re-soldering or Change the defect part,Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/OutputOf J104 Fail
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source Cable And Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Check The Input/OutputOf JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source Cable And Jack
Pass
Check the Input/OutputOf JK301, JK302, JK303 Fail
Re-soldering or Change the defect part
Pass
Pass
Check the Input/OutputOf IC300, IC301, JK302 Fail
Re-soldering or Change the defect partCheck HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 18 -
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source Cable And Jack
Pass
Check Input source Cable And Jack
Pass
Check The Input/OutputOf JK101, JK201
Pass
Re-soldering or Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
Check The Input/OutputOf TU500
Pass
Re-soldering or Change the defect part
Pass
Fail
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
No Sound
Check The Input Sourse.
Check The Input/OutputOf IC600.
Re-soldering or Change the defect part.Fail
Pass
Pass
Check The Speaker. Change Speaker.Fail
Check The Speaker Wire.
Pass
Change The Source Input.Fail
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
- 19-
BL
OC
K D
IAG
RA
M
RGB_PC
PC_Audio
TV(RF)
COMP1
HDMI1HDMI2
RS232
TX
232C DriverST3232C
Tx/ Rx : 15Vpp
PC_R/ G/ B/ HS/ VS
PC_Audio_L/ R :700mVrms
MNT_OUT: 1Vpp
SIDE_V :1Vpp
SIDE_L/ SIDE_R :500mVrms
DDR2(512MB)
L_SPK_OUT R_SPK_OUT
EEPROM24C02
Comp1_L/ R :500mVrms
TUNER
AV1_VIN: 1Vpp
AV11_LIN/ RIN :500mVrms
PWMNTP3100L
MNT_OUT
MNT_LOUT/ ROUT: 500mVrms
AV2(Side AV)
MAIN SCALER
TXD / RXD : 5V Dig ital
COMP1_Y/ Pb/ Pr: 1/ 0.7Vpp
COMP2_Y/ Pb/ Pr: 1/0.7Vpp
IRHDMI_DATA_1HDMI_DATA_2
HDMI1_SCL/ SDA
OUT_E_TX_CLK
OUT_E_TX_EOUT_E_TX_D
OUT_E_TX_COUT_E_TX_BOUT_E_TX_A
TU_MAIN
S I F
COMP1_Y/ Pb/ Pr 1/ 0.7Vpp
AV1_VIN
PC_Audio_L/ R
COMP1_LIN/ RIN
L_CHR_CH
LV
DS
co
nn
ec
tor
TU_MAINSUB_SCL SDA
EEPROM24C02
EEPROM24C02
SIF
AV1_LIN/ RIN
MNT_L/ R OUT
AV1
MNT_OUT
Comp2_L/ R :500mVrms
COMP2_Y/ Pb/ : 1/ 0.7Vpp
COMP2_LIN/ RIN
COMP2
OUT_O_TX_CLK
OUT_O_TX_EOUT_O_TX_D
OUT_O_TX_COUT_O_TX_BOUT_O_TX_A
PC_R/ G/ B/ HS/ VS
HDM 2_SCL/ SDA
PC_SCL/ SDA
MNT_VOUT
AV2_VIN
AV2_LIN/ RIN
IIS_OUT
USB USB_DN/ PN
AUDIOAMP
HDMI3_SCL/ SDAEEPROM24C02
HDMI_DATA_3
TMDSTMDS
TMDSHDMI3
USBFor D/ L
EEPROM(256K)
Serial Flash(8MByte)
RGB_PC
PC_Audio
TV(RF)
COMP1
HDMI1HDMI2
RS232
TX
232C DriverST3232C
–
PC_R/ G/ B/ HS/ VS
PC_Audio_L/ R :700mVrms
MNT_OUT: 1Vpp
SIDE_V :1Vpp
SIDE_L/ SIDE_R :500mVrms
DDR2(512MB)
EEPROM24C02
Comp1_L/ R :500mVrms
TUNER
AV1_VIN: 1Vpp
AV11_LIN/ RIN :500mVrms
PWMNTP3100L
MNT_OUT
MNT_LOUT/ ROUT: 500mVrms
AV2(Side AV)
MAIN SCALER
TXD / RXD : 5V Dig ital
COMP1_Y/ Pb/ Pr: 1/ 0.7Vpp
COMP2_Y/ Pb/ Pr: 1/0.7Vpp
HDMI_DATA_1HDMI_DATA_2
_
OUT_E_TX_CLK–
OUT_E_TX_ –OUT_E_TX_ –
OUT_E_TX_C–OUT_E_TX_B–OUT_E_TX_A–
TU_MAIN
S I F
COMP1_Y/ Pb/ P : 1/ 0.7Vpp
AV1_VIN
PC_Audio_L/ R
COMP1_LIN/ RIN
L_CHR_CH
LV
DS
co
nn
ec
tor
TU_MAIN/
EEPROM24C02
EEPROM24C02
SIF
AV1_LIN/ RIN
MNT_L/ R OUT
AV1
MNT_OUT
Comp2_L/ R :500mVrms
COMP2_Y/ Pb/Pr 1/ 0.7Vpp
COMP2_LIN/ RIN
COMP2
OUT_O_TX_C –
OUT_O_TX_E–OUT_O_TX_D–
OUT_O_TX_C–OUT_O_TX_B–OUT_O_TX_A–
PC_R/ G/ B/ HS/ VS
PC_SCL/ SDAPC_SCL/ SDA
MNT_VOUT
AV2_VIN
AV2_LIN/ RIN
IIS_OUT
USB USB_DN/ PN
AUDIOAMP
HDMI3_SCL/ SDAHDMI3_SCL/ SDAEEPROM24C02
HDMI_DATA_3
TMDSTMDS
TMDSHDMI3
USBFor D/ L
EEPROM(256K)
Serial Flash(8MByte)
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
- 20-
300
200
200T
200N
800
804
540
803
805
400
900
510
310
500
120
121
802
801550
530
EX
PL
OD
ED
VIE
W
Many electrical and m
echanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schem
atic Diagram
and EX
PLO
DE
D V
IEW
. It is e
ssen
tial th
at th
ese
spe
cial sa
fety p
arts sh
ou
ld b
e re
pla
ced
with
the
sam
e co
mp
on
en
ts as
recomm
ended in this manual to prevent X
-RA
DIA
TIO
N, S
hock, Fire, or other H
azards. D
o not modify the original design w
ithout permission of m
anufacturer.
IMP
OR
TA
NT
SA
FE
TY
NO
TIC
E
A2LV1
A10
MULTI_PW_SW
10R859
56AR81
2
SUB_SDA
HPD_
MST
_3
+1.8V_DDR
COMP2_PB
RT1C3904-T112Q802
EBC
DDR2_DQM0
100
R82
5
0.047uFC828
KEY1
RL_O
N
MX25L6405DMI-12GIC802
3 NC_1
2 VCC
4 NC_2
1 HOLD
6 NC_4
5 NC_3
7 CS
8 SO/SIO1 9WP/ACC
10GND
11NC_5
12NC_6
13NC_7
14NC_8
15SI.SIO0
16SCLK
0.01uFC864
0.1u
FC
882
I2S_
SCK
TMDS2_RX2-0.1uFC833
I2S_
MCL
K
USB_
DN
100R882
MAIN_SIF
PC_G
100
R80
24
33R844
10R
801
HDM
I3_S
IDE
0.047uFC830
PANE
L_ST
ATUS
TMDS2_RX0+
MNT_VOUT_T
TMDS
3_RX
0+
0.1uFC842
SW_RESET
RXD
0 .01uFC858
TMDS2_RX2+
+3.3V_MULTI_MST
0.1u
FC
813
12M
HzX8
01
10R874
1MR83
9
4 .7uFC812
RL_ON
M_SD
A
DDC_
SDA3
+3.3V_MULTI_MST
+3.3V_MST
MUTE_LINE
EEP_SCL
E-DI
M
SIDE_RIN
10R862
56AR805
DDR2_DQM1
10R
848
HDM
I3_S
IDE
EEP_
SCL
CEC_
C
10uFC866
0.01uFC860
47R834
56AR81
3
TMDS
3_RX
1+
SYS_
RESE
T
SPI_
CZ
I2S_
SDO
0.1uFC815
22KR842
TMDS2_RXC+
DDC_
SCL1
0.047uFC837
POW
ER_S
W
47R832
TMDS2_RXC-
+5VST_MST
0.1uFC848
56AR810
10R
841
HDM
I3_S
IDE
0.1uFC838
+1.2V_VDDC_MST
+3.3V_MULTI_MSTJTP-1127WEMSW800
1
243
MNT_L_AMP
0.1uFC811
MNT_VOUT
DDR2
_CAS
Z
PANEL_ON
1000pFC835
0.1uFC849
PC_B
TMDS
3_RX
2+
+3.3V_MULTI_MST
0.047uFC829
DDC_
SCL3
DDR2
_BA1
DISP_EN/VAVS_ON
DDR2
_RAS
Z
DDR2_D[0-15]
TMDS
3_RX
0-
10R854
COMP2_Y
33AR81
8
0.047uFC832
PC_A
UD_L
PC_V
S
CVBS
_LIN
SPI_DI
402R807READY
0.1u
FC
883
DDR2
_BA0
EEP_SCL
10R
820
HDM
I3_S
IDE
0 .01uFC859
+3.3V_MULTI_MST
DDR2_DQS0M
SIDE_LIN
SIDE_V
0.047uFC831
0.01uFC803
TMDS2_RX1+
+1.8V_DDR
DDC_
SDA1
SUB_SCL
DSUB
_SDA
10R890
100R881
CAT24WC08W-TIC803
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
DDR2
_CKE
+12V_AUDIO
SPI_
CLK
+3.3V_MULTI_MST
DDR2_DQS1M
0.01uFC807
KDS181D803
USB_
DP
+3.3V_MST
100
R80
25
+3.3V_MULTI_MST
56AR809
I-DIM
SPI_CZ
0.1u
FC
808
0.1uFC804
56R
852IR
0.01uFC841
EEP_
SDA
DDR2_A[0-12]
+3.3V_MULTI_MST
10R
822
HDM
I3_S
IDE
CVBS_VIN
10R851
DDR2_DQS1P
10R
823
HDM
I3_S
IDE
TMDS
3_RX
C-
MNT_VOUT_T
TMDS2_RX0-
+3.3V_MULTI_MST
DDR2_DQS0P
10R
821
HDM
I3_S
IDE
10R869
47R837
DDR2_MCLKZ
DDR2
_WEZ
TXD
56AR806
0.047uFC834
EEP_SDA
TMDS1_RXC+
24LC256-I/SMIC801
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
COM
P2_R
M_S
CL
+3.3V_MULTI_MST
PC_H
S
TMDS1_RX2-
0.01uFC850
+3.3V_MULTI_MST
TMDS
3_RX
C+
47uF25VC870
+3.3V_MULTI_MST
470R835
10R891
KDS181D802
TV_MAIN
1000
pFC
818
COMP2_PR
RT1C3904-T112Q804
NON 19_22"
E BC
0.1uFC867
22KR845
100
R80
26
TMDS
3_RX
1-
P_24V_SMALL_15V
0.01
uFC
840
2.2uFC861
HPD_MST_1
10R873
10R880
SPI_DO
PC_A
UD_R
0.01uFC810
56AR81
4
+1.2V_VDDC_MST
100
R80
23
TMDS2_RX1-
DDC_
SCL2
10R858
10R892
TMDS1_RX1+
10R871
TMDS1_RX2+
EEP_SDA
56AR80
0
10R
805
HDM
I3_S
IDE
KDS181D801
DDR2
_ODT
TMDS1_RXC-
SPI_
DI
I2S_
WS
DDR2_MCLK
0.047uFC826
TMDS1_RX0-
10R872
MNT_R_AMP
10R879
HPD_MST_2
0.1uFC853
0.01uFC839
DSUB
_SCL
0 .01uFC865
COM
P2_L
10uF
16V
C80
9
+1.8V_DDR
0.01uFC862
+1.2V_VDDC_MST
TMDS1_RX1-
4.7u
FC
820
100
R82
4
100
R82
9
KEY2
56AR81
5
TMDS1_RX0+
0.01uFC857
CVBS
_RIN
2.2uFC856
0.1uFC869
+5VST_MST
0.1uFC814
PC_R
SPI_CLK
33R843
0.1u
FC
844
10R856
TMDS
3_RX
2-
0.01
uFC
876
DDC_
SDA2
SPI_
DO
P_12V_SMALL_15V
+5VST_MSTPOWER_DET
POW
ER_D
ET
RT1C3904-T112Q803
E
B
C
+5VST_MST
SYS_RESET
100
R80
12
0 .01uFC877
0.01uFC878
0.01uFC879
TXD
RXD 0.
1uF
C86
3
ISA1530AC1Q800
EBC
ISA1530AC1Q801
E BC
2.2uF16VC8000
READY
+3.3V_MULTI_MST
0R
806
0R
870
S_VIDEO_DET
SIDE_YSIDE_C
DDC_WP
OPC_EN
4.7KR877
4.7KR8004
4.7KR817
470R809
47
R8041
220R808
68R810
0
R800READY
0
R8001
390R840
47R814
47R81647R81847R838
47R833
47R836
470R803
47R80447R81547R89747R802
47R83147R85747R830
47R87547R876
100R846100R847
10
0R
80
39
HD
MI3
_S
IDE
10
0R
80
40
HD
MI3
_S
IDE
4.7K R863
4.7K R864
100R8042
1KR8038
1KR8018
4.7KR8654.7KR866
1KR
867
1KR
868
100
R80
2110
0R
8022
100
R85
0
100
R84
910
0R
895
0RE
ADY
R80
170
READ
YR
8016
0R
8033
READ
Y
0R
8034
0R
8035
10KR8020
10KR8003
0.047uFC8000.047uFC801
0.047uFC827
0.047uFC8250.047uFC8470.047uFC845
0.047uFC843
0.047uFC836
0.1uFC868
1000pFC846
1KR884READY
1KR889
1KR811READY
1KR883
4.7KR8028
4.7KR8027
22R812
22R813
0.1uFC819
0.1uFC8060.1uFC805
4.7KNon_Small_FHD
R8010-*2
4.7KSmall_FHD
R8010-*1
4.7KSmall_HD
R896
4.7KApollo
R8010-*3
4.7KSmall_FHD
R896-*1
4.7KNon_Small_HD
R8011-*1
4.7KNon_Small_HD
R896-*2
4.7KApollo
R8011-*24.7K
Apollo
R898-*1
4.7KNon_Small_FHDR898
4.7K100Hz
R8011-*3 4.7K100Hz
R898-*2
4.7K R8011
Small_FHD
4.7K R8010
Small_HD
22R8005
22R8006
0R
826
0R
8274 .7uF
10V
C871
READY
120-ohmL800
12
0-o
hm
L8
01
120-ohmL802
2.2u
FC
823
2.2u
FC
824
2.2u
FC
821
2.2u
FC
873
2.2u
FC
822
2.2u
FC
874
2.2u
FC
802
2.2u
FC
875
MST99A88ML(MATRIX BASIC)
IC800
1 RXBCKN2 RXBCKP3 RXB0N4 RXB0P5 HOTPLUGB6 RXB1N7 RXB1P8 AVDD_33_19 RXB2N10 RXB2P11 RXACKN12 RXACKP13 RXA0N14 RXA0P15 AVDD_33_216 RXA1N17 RXA1P18 GND_119 RXA2N20 RXA2P21 HOTPLUGA22 REXT23 VCLAMP24 REFP25 REFM26 BIN1P27 SOGIN128 GIN1P29 RIN1P30 BINM31 BIN0P32 GINM33 GIN0P34 SOGIN035 RINM36 RIN0P37 AVDD_33_338 GND_239 BIN2P40 GIN2P41 SOGIN242 RIN2P43 CVBS644 CVBS545 CVBS446 CVBS347 CVBS248 CVBS149 VCOM150 CVBS051 VCOM052 AVDD_33_453 CVBSOUT54 GND_355 SIF0P56 SIF0M57 VDDC_158 AUL559 AUR560 AUVRM61 AUOUTL262 AUOUTR263 AUOUTL164 AUOUTR1
65AU
L066
AUR0
67AU
L168
AUR1
69AU
L270
AUR2
71AU
L372
AUR3
73AU
COM
74AU
L475
AUR4
76GN
D_4
77AU
VRP
78AU
VAG
79AV
DD_A
U80
GND_
581
VDDC
_282
DDCA
_CK
83DD
CA_D
A84
DDCD
A_CK
85DD
CDA_
DA86
DDCD
B_CK
87DD
CDB_
DA88
GPI
O20
89VD
DP_1
90VD
DC_3
91UA
RT2_
RX92
UART
2_TX
93DD
CDC_
CK94
RXCC
KN95
RXCC
KP96
DDCD
C_DA
97RX
C0N
98RX
C0P
99GN
D_6
100
RXC1
N10
1RX
C1P
102
AVDD
_DM
103
RXC2
N10
4RX
C2P
105
HOTP
LUGC
106
USB1
_DM
107
USB1
_DP
108
SCK
109
SDI
110
SDO
111
SCZ
112
PWM0
113
PWM1
114
PWM2
115
PWM3
116
LVA4
P11
7LV
A4M
118
LVA3
P11
9LV
A3M
120
LVAC
KP12
1LV
ACKM
122
LVA2
P12
3LV
A2M
124
LVA1
P12
5LV
A1M
126
LVA0
P12
7LV
A0M
128
VDDP
_2 129LVB4P130LVB4M131LVB3P132LVB3M133LVBCKP134LVBCKM135LVB2P136LVB2M137LVB1P138LVB1M139LVB0P140LVB0M141AVDD_LPLL142GND_7143VDDC_4144GPIO150/I2C_OUT_MUTE145GPIO151/I2C_OUT_SD2146GPIO152/I2C_OUT_SD3147GND_8148GPIO51149GPIO52150GPIO53151GPIO54152GPIO55153GPIO56154GPIO57155GPIO58156VDDP_3157VDDC_5158B_MDATA[4]159B_MDATA[3]160GND_9161B_MDATA[1]162B_MDATA[6]163AVDD_DDR_1164B_MDATA[11]165B_MDATA[12]166GND_10167B_MDATA[9]168B_MDATA[14]169AVDD_DDR_2170B_DDR2_DQM[1]171B_DDR2_DQM[0]172GND_11173B_DDR2_DQS[0]174B_DDR2_DQSB[0]175AVDD_DDR_3176VDDP_4177GND_12178B_DDR2_DQS[1]179B_DDR2_DQSB[1]180AVDD_DDR_4181B_MDATA[15]182B_MDATA[8]183GND_13184B_MDATA[10]185B_MDATA[13]186AVDD_DDR_5187B_MDATA[7]188B_MDATA[0]189B_MDATA[2]190B_MDATA[5]191B_MCLK192B_MCLKZ
193
GND_
1419
4AV
DD_M
EMPL
L19
5MV
REF
196
A_OD
T19
7A_
RASZ
198
A_CA
SZ19
9A_
MAD
R[0]
200
A_M
ADR[
2]20
1A_
MAD
R[4]
202
GND_
1520
3A_
MAD
R[6]
204
A_M
ADR[
8]20
5A_
MAD
R[11
]20
6A_
WEZ
207
A_BA
DR[1
]20
8A_
BADR
[0]
209
A_M
ADR[
1]21
0A_
MAD
R[10
]21
1AV
DD_D
DR_6
212
A_M
ADR[
5]21
3A_
MAD
R[9]
214
A_M
ADR[
12]
215
A_M
ADR[
7]21
6A_
MAD
R[3]
217
A_MC
LKE
218
VDDC
_621
9I2
S_IN
_WS/
GPI
O67
220
I2S_
IN_B
CK/
GPI
O68
221
I2S_
IN_S
D22
2I2S
_OUT
_MCK
223
I2S_
OUT
_WS
224
VDDP
_522
5GN
D_16
226
VDDC
_722
7I2
S_O
UT_B
CK22
8I2
S_O
UT_S
D22
9SP
DIFO
230
UART
2_RX
/I2CM
_SDA
231
UART
2_TX
/I2CM
_SCK
232
UART
1_RX
/GPI
O86
233
UART
1_TX
/GPI
O87
234
GND_
1723
5GN
D_18
236
USB0
_DM
237
USB0
_DP
238
SAR0
239
SAR1
240
SAR2
241
SAR3
242
AVDD
_MPL
L24
3XO
UT24
4XI
N24
5G
PIO
134
246
GPI
O13
524
7G
PIO
138
248
GPI
O13
924
9G
PIO
140
250
IRIN
251
HSYN
C025
2VS
YNC0
253
HSYN
C125
4VS
YNC1
255
CEC
256
HWRE
SET
LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]IC800-*1
1RXBCKN
2RXBCKP
3RXB0N
4RXB0P
5HOTPLUGB
6RXB1N
7RXB1P
8AVDD_33_1
9RXB2N
10RXB2P
11RXACKN
12RXACKP
13RXA0N
14RXA0P
15AVDD_33_2
16RXA1N
17RXA1P
18GND_1
19RXA2N
20RXA2P
21HOTPLUGA
22REXT
23VCLAMP
24REFP
25REFM
26BIN1P
27SOGIN1
28GIN1P
29RIN1P
30BINM
31BIN0P
32GINM
33GIN0P
34SOGIN0
35RINM
36RIN0P
37AVDD_33_3
38GND_2
39BIN2P
40GIN2P
41SOGIN2
42RIN2P
43CVBS6
44CVBS5
45CVBS4
46CVBS3
47CVBS2
48CVBS1
49VCOM1
50CVBS0
51VCOM0
52AVDD_33_4
53CVBSOUT
54GND_3
55SIF0P
56SIF0M
57VDDC_1
58AUL5
59AUR5
60AUVRM
61AUOUTL2
62AUOUTR2
63AUOUTL1
64AUOUTR1
65
AU
L0
66
AU
R0
67
AU
L1
68
AU
R1
69
AU
L2
70
AU
R2
71
AU
L3
72
AU
R3
73
AUCO
M
74
AU
L4
75
AU
R4
76
GN
D_4
77
AU
VR
P
78
AU
VAG
79
AVD
D_A
U
80
GN
D_5
81
VD
DC
_2
82
DD
CA_C
K
83
DD
CA_D
A
84
DD
CD
A_C
K
85
DD
CD
A_D
A
86
DD
CD
B_C
K
87
DD
CD
B_D
A
88
GP
IO2
0
89
VD
DP
_1
90
VD
DC
_3
91
UA
RT2_R
X
92
UA
RT2_TX
93
DD
CD
C_C
K
94
RXC
CKN
95
RX
CC
KP
96
DD
CD
C_D
A
97
RX
C0N
98
RX
C0P
99
GN
D_6
10
0R
XC
1N
10
1R
XC
1P
10
2AVD
D_D
M
10
3R
XC
2N
10
4R
XC
2P
10
5H
OTP
LUG
C
10
6U
SB
1_D
M
10
7U
SB
1_D
P
10
8S
CK
10
9S
DI
11
0S
DO
11
1S
CZ
11
2PW
M0
11
3PW
M1
11
4PW
M2
11
5PW
M3
11
6LV
A4P
11
7LV
A4M
11
8LV
A3P
11
9LV
A3M
12
0LV
AC
KP
12
1LV
AC
KM
12
2LV
A2P
12
3LV
A2M
12
4LV
A1P
12
5LV
A1M
12
6LV
A0P
12
7LV
A0M
12
8V
DD
P_2
129 LVB4P130 LVB4M131 LVB3P132 LVB3M133 LVBCKP134 LVBCKM135 LVB2P136 LVB2M137 LVB1P138 LVB1M139 LVB0P140 LVB0M141 AVDD_LPLL142 GND_7143 VDDC_4144 GPIO150/I2C_OUT_MUTE145 GPIO151/I2C_OUT_SD2146 GPIO152/I2C_OUT_SD3147 GND_8148 GPIO51149 GPIO52150 GPIO53151 GPIO54152 GPIO55153 GPIO56154 GPIO57155 GPIO58156 VDDP_3157 VDDC_5158 B_MDATA[4]159 B_MDATA[3]160 GND_9161 B_MDATA[1]162 B_MDATA[6]163 AVDD_DDR_1164 B_MDATA[11]165 B_MDATA[12]166 GND_10167 B_MDATA[9]168 B_MDATA[14]169 AVDD_DDR_2170 B_DDR2_DQM[1]171 B_DDR2_DQM[0]172 GND_11173 B_DDR2_DQS[0]174 B_DDR2_DQSB[0]175 AVDD_DDR_3176 VDDP_4177 GND_12178 B_DDR2_DQS[1]179 B_DDR2_DQSB[1]180 AVDD_DDR_4181 B_MDATA[15]182 B_MDATA[8]183 GND_13184 B_MDATA[10]185 B_MDATA[13]186 AVDD_DDR_5187 B_MDATA[7]188 B_MDATA[0]189 B_MDATA[2]190 B_MDATA[5]191 B_MCLK192 B_MCLKZ1
93
GN
D_14
19
4AVD
D_M
EM
PLL
19
5M
VR
EF
19
6A
_OD
T1
97
A_R
AS
Z1
98
A_C
AS
Z1
99
A_M
AD
R[0
]2
00
A_M
AD
R[2
]2
01
A_M
AD
R[4
]2
02
GN
D_15
20
3A
_M
AD
R[6
]2
04
A_M
AD
R[8
]2
05
A_M
AD
R[1
1]
20
6A_W
EZ
20
7A
_B
AD
R[1
]2
08
A_B
AD
R[0
]2
09
A_M
AD
R[1
]2
10
A_M
AD
R[1
0]
21
1A
VD
D_D
DR
_62
12
A_M
AD
R[5
]2
13
A_M
AD
R[9
]2
14
A_M
AD
R[1
2]
21
5A
_M
AD
R[7
]2
16
A_M
AD
R[3
]2
17
A_M
CLK
E2
18
VD
DC
_6
21
9I2
S_
IN_
WS
/GP
IO6
72
20
I2S
_IN
_B
CK
/GP
IO6
82
21
I2S
_IN
_S
D2
22
I2S
_O
UT
_M
CK
22
3I2
S_O
UT
_W
S2
24
VD
DP
_5
22
5G
ND
_16
22
6V
DD
C_7
22
7I2
S_O
UT
_B
CK
22
8I2
S_O
UT
_S
D2
29
SP
DIF
O2
30
UA
RT
2_R
X/I2
CM
_S
DA
23
1U
AR
T2_T
X/I2C
M_S
CK
23
2U
AR
T1_R
X/G
PIO
86
23
3U
AR
T1_T
X/G
PIO
87
23
4G
ND
_17
23
5G
ND
_18
23
6U
SB
0_D
M2
37
US
B0_D
P2
38
SA
R0
23
9S
AR
12
40
SA
R2
24
1S
AR
32
42
AVD
D_M
PLL
24
3XO
UT
24
4X
IN2
45
GP
IO1
34
24
6G
PIO
13
52
47
GP
IO1
38
24
8G
PIO
13
92
49
GP
IO1
40
25
0IR
IN2
51
HS
YN
C0
25
2V
SY
NC
02
53
HS
YN
C1
25
4V
SY
NC
12
55
CE
C2
56
HW
RESET
3.3KR819
DSUB
_SDA
LED_
R
RT1C3904-T112Q805
READY
EBC
DDC_WP10K
R828
READY
4.7KR878
4.7KR893
1KR861
0
R8037NON 19_22"
0R
894
0R
899
2K
R886
150R8851KR860
10KR8000
33KR8007NON 19_22"
10KR855
1K
R853
100R888
33KR887
20KR8036
19_22_26"
20pF
C81
7 20pF
C81
6
DDR2
_A[2
]
DDR2_D[1]
DDR2
_A[6
]
GN
D
DDR2_D[5]
DDR2
_A[1
0]
DDR2_D[0]
DDR2_D[10]
DDR2
_A[1
2]
DDR2_D[14]
DDR2
_A[0
]
DDR2_D[6]
DDR2
_A[5
]
DDR2_D[3]
DDR2
_A[4
]
DDR2_D[4]
DDR2_D[12]
DDR2
_A[9
]
DDR2_D[11]
DDR2
_A[8
]
DDR2_D[8]
DDR2_D[7]
DDR2_D[15]
DDR2_D[9]
DDR2
_A[3
]
DDR2_D[13]
DDR2
_A[1
1]
DDR2_D[2]
DDR2
_A[1
]
DDR2
_A[7
]
TXCE4-TXCE4+TXCE3-TXCE3+
TXCLKE-TXCLKE+
TXCE2-TXCE2+TXCE1-TXCE1+TXCE0-TXCE0+
TXCO4-TXCO4+TXCO3-TXCO3+
TXCLKO-TXCLKO+
TXCO2-TXCO2+TXCO1-TXCO1+TXCO0-TXCO0+
I2S_OUT
HDMI_3
EEPROM
HDM
I_1
[MODE SELECTION]
HDM
I_2
C804/C805/C806:Close to IC a s c l o s e a s p o s s i b l e
GAIN X 4
RESET
Clo
se t
o IC
wit
h w
idth
tra
ce
C l o s e t o I C a s c l o s e a s p o s s i b l e
HDCP EEPROM
USB
PART
SERIAL FLASH 64M
S-VIDEO
4.7K X4.7K
4.7K
X4.7K
R8010
X
R898
Non Small FHD
4.7K
X 4.7K
Small HD
*H/W OPTION
4.7K
4.7K 4.7K
100HZ
4.7K4.7K4.7K
Apollo
Non Small HD
R8011
X
X
X
4.7KX
R896
X
Small FHD (27)
4.7K
X
** Sma l l HD : 19 /22 /26 Inch** Non Small FHD : Normal(non 100Hz) FHD Model
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SCH
EMATIC
DIA
GR
AM
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
MS
TAR
+1.8V_DDR
DDR2_A[0-12]
DDR2_BA0
DDR2_BA1
DDR2_MCLKDDR2_MCLKZDDR2_CKE
DDR2_ODT
DDR2_RASZDDR2_CASZDDR2_WEZ
DDR2_DQS0PDDR2_DQS1P
DDR2_DQM0DDR2_DQM1
DDR2_DQS0MDDR2_DQS1M
+1.8V_DDR
+1.8V_DDR
DDR2_D[0-15]
1000pFC905
V_REF
56
R900
56R901
56
R902
56R903
56
R904
56R905
0.01uFC904
0.01uF50V
C900
0.01uFC901
0.01uFC902
0.01uFC903
0.01uFC906
0.01uFC907
0.01uFC908
0.01uFC909
0.01uFC910
0.01uFC911
0.01uFC912
0.01uFC913
0.01uFC914
0.01uFC915
0.01uFC916
0.01uFC917
+1.8V_DDR
150R906
READY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
V_REF
0.1uF50V
C918
HYB18TC512160B2F-2.5
IC900
J2VREF
J8CK
H2 VSSQ2
B7UDQS
N8A4
P8A8
L1NC4
L2BA0
R8NC3
K7RAS
F8 VSSQ3
F3LDM
P3A9
M3A1
N3A5
K8CK
R3NC5
L3BA1
J7VSSDL
L7CAS
F2 VSSQ4
B3UDM
M2A10/AP
K2CKE
R7NC6
M7A2
N7A6
M8A0
J1VDDL
K3WE
E8LDQS
P7A11
K9ODT
A2NC1
N2A3
P2A7
H8 VSSQ1
F7LDQS
A8UDQS
R2A12
L8CS
E2NC2
E7 VSSQ5D8 VSSQ6D2 VSSQ7A7 VSSQ8B8 VSSQ9B2 VSSQ10
P9 VSS1N1 VSS2J3 VSS3E3 VSS4A3 VSS5
G9 VDDQ1G7 VDDQ2G3 VDDQ3G1 VDDQ4E9 VDDQ5C9 VDDQ6C7 VDDQ7C3 VDDQ8C1 VDDQ9A9 VDDQ10
R1 VDD1M9 VDD2J9 VDD3E1 VDD4A1 VDD5
B9 DQ15B1 DQ14D9 DQ13D1 DQ12D3 DQ11D7 DQ10C2 DQ9C8 DQ8F9 DQ7F1 DQ6H9 DQ5H1 DQ4H3 DQ3H7 DQ2G2 DQ1G8 DQ0
10uF10V
C919
1K
R9
07
1K
R9
08
DDR2_A[0]
DDR2_A[12]
DDR2_A[11]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_D[0-15]
DDR2_D[0]
DDR2_D[1]
DDR2_D[2]
DDR2_D[3]
DDR2_D[4]
DDR2_D[5]
DDR2_D[6]
DDR2_D[7]
DDR2_D[8]
DDR2_D[9]
DDR2_D[10]
DDR2_D[11]
DDR2_D[12]
DDR2_D[13]
DDR2_D[14]
DDR2_D[15]
DDR2 MEMORY
Close to DDR2 IC
Close to DDR2 IC
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
DD
R2
47uF 25VC1002
10KR1003NON 19_22"
0.01uFC1007
DISP_EN/VAVS_ON
0.01uFC1046
RL_ON
SAM2333D1002
0.01uFC1008
2SC3875SQ1000
NON 19_22"
1 23
0.01uFC1011
0.01uFC1021
2SC3875SQ10021 2
3
100R1044-*1PWM_DIM
10KR1047
E-DIM
I-DIM
4.7KR1054NON SHARP 32&52",AUO PANEL_STATUS
33KR1065
NON 19_22"
1uF25VC1056
33KR1049
10KR1048RT1C3904-T112Q1001
E
BC
0.01uFC1010
0.1uFC1005
100uF16VC1009
POWER_SW
10KR1002
SI4925BDYEBK32753101
Q1003
3S2
2G1
4G2
1S1
5 D2_1
6 D2_2
7 D1_1
8 D1_2
RT1C3904-T112Q1004
E
B
C
10KR1068
1.6KR1069
22KR1070 1uF
C1048
0.01uFC1053
0CMO 32,42,47,57R1045
0CMO 32,42,47
R1039
0CMO 57"R1040
0NON CMO 32,42,47,57R1043
0CMO 57"
R1041
0R1064
0NON (CMO 32,42,47,57, SHARP 32")
R1023
0SHARP 52",AUO
R1053
0NON CMO 57"R1001
0CMO 32,42,47,57R1014
0R1042
1.2KR1005
P_12V_SMALL_15V
P_5V
P_5V
P_12V_SMALL_15V
+16V_NTP
+12V_AUDIO
+5VST_MST
P_12V_SMALL_15V
+5VST_MST +3.3V_MST
+5V_USB
+5V_TUNER
+5V_+12V_LCD
+5V_MULTI
P_5V
+5V_MULTI
P_5V P_12V_SMALL_15V
P_5V
+5VST_MST +5V_MULTI
PANEL_ON
0.1uF50V
C1001
10uF16VC1052
10uF 16VC1019
10uF16V
C1003
1/4
W
0 5%R1
07
4
19
_2
2"
SMAW200-11
P1002
19_22"
115V
215V
3GND
4GND
55V
65V
7NC
8NC
9Inverter_ON
10PWM_Dim
11A.Dim
P_5V
P_24V_SMALL_15V
P_12V_SMALL_15V
P_24V_SMALL_15V
P_24V_SMALL_15V
OPC_OUT
0
READY
R1077
10K19_22"R1065-*1
MP2212DNIC1006
3IN
2GND
4BS
1FB
5 VCC
6 SW_1
7 SW_2
8 EN/SYNC
+5V_MULTI
10R1056READY
0.1uF50V
C1024
READY
10KR1059
NON 19_22"
100uF16V
C1026
5.6KR1058
30KR1057
S2A 50V
19_22"D1001
10uF25V
C103010uF25V
C1031
10uF16V
C100010uF16V
C1020
+1.2V_VDDC_MST
0R1073
0.1uFC1054
+3.3V_MULTI_MST
100uF16VC1028
+1.8V_DDR
+1.8V
+5V_MULTI
AP2121N-3.3TRE1
IC1007
1
GND
2 VOUT3VIN 0.1uF16V
C1014
BD9130EFJ-E2IC1001
3ITH
2VCC
4GND
1ADJ
5PGND
6SW
7PVCC
8EN
10KR1006
1/1
0W
2K
1%R1
00
9
1/1
0W
3.3K1%
R1010
10uF10V
C1016
10uF6.3V
C10220.1uF50V
C10150.1uF50V
C1023
12KR1008
560pF50V
C10122200pF50V
C1055
READY
3 . 3R1078
READY
10uF16V
C1004
10uF16V
C1013
10KR1079
AZ1085S-3.3TR/E1IC1003
1ADJ/GND
2 OUTPUT3INPUT
10uF16V
C1017
10uF16V
C1018
AP1117EG-13
IC1002
1
ADJ/GND
2 OUT3IN
1KR1044DC_DIM
1KR1076
OPC_DISABLE
1KR1075
OPC_ENABLE
0R1013
2.2KR1050
2.2KR1051
2.2KR1052
68uF35V
C1006
0
R1012
NON 19_22"
3.6uHL1009
CIC21J501NEEAM58113401
L1000
CIC21J501NEL1008
FW20020-24SP1000
NON_19_22_26"
19NC
14 12V
95.2V
4 GND
18 24V
1312V
8 5.2V
3GND
1724V
12 GND
75.2V
2 Power ON
16 GND
11GND
6 GND
1NC
20 Inver te r ON
15GND
10 5.2V
5GND
21A.Dim 22 Er ro r Ou t
23NC 24 PWM Dim
1205%
R1004
561%
R1007
10KR101719_22"
2SC3875SQ1005
19_22"
1 23
RL_ON
+5V_MULTI
10R101519_22"
4.7KR101619_22"
120-ohm
L1001
120-ohm19/22"(HD)/22"(FHD)/32"(Sharp)
L1005120-ohm
26/27/32(LPL) /37 /42 /47 /52"
L1006
0LCML00003B
MLB-201209-0120P-N2L1007
MLB-201209-0120P-N2L1010
MLB-201209-0120P-N2
120-ohm
L1012
MLB-201209-0120P-N2
120-ohm
L1013
1uF 25VC1035
0.1uF16V
C1025
0.47uF25V C1043
NON SHARP 52",AUO
2.2uF 16VC1045
DC_DIM
2.2uF 16VC1044
3KR1046
FM20020-24P1001
26"
19NC
14 12V
95.2V
4 GND
18 24V
1312V
8 5.2V
3GND
1724V
12 GND
75.2V
2 Power ON
16 GND
11GND
6 GND
1NC
20 Inver te r ON
15GND
10 5.2V
5GND
21A.Dim 22 Er ro r Ou t
23NC 24 PWM Dim
25
.
2.2uHL1002
10KR1020
2KR1018
NON 19_22"1K
OPC_DISABLE
R1021 1KOPC_ENABLE
R1022
68uF35V
C1027
READY
10R1024
0.1uF50V
C1029
+5V_MULTI
0
R1011
560pF50V
C1032
2.2KR1000NON 19_22"
1uF 25VREADY
C1034
1uF 25VREADY
C1036
1uF 25VREADY
C1037
1uF 25VREADY
C1038
0.1uF50V
C1033
LED Block
**5V_MULTI->3.3V->1.2V
**Switch 12V:P12V **Switch 5V:5V_MULTI -> 1.8V
*SHARP32":DC DIMMING
**DC-DC CONVERTER 12V->5V_TUNER/USB
OUT:5V
*ST 5V->3.3V
**OPC_ENABLE : USE LGD Module
MAX 300mA
MAX 3A
OUT:1.27V
NTP,AUDIO DSP
DDR2, Vref
V0 = 0 .8* (1+(R2/R1) )
MAX 2A
MAX 3A
R1
R2
MAX 1A
OUT:3.3V
R1
R2
V0 = 0 .8* (1+(R1/R2) )
V0 = 1 .25*(1+(R2/R1))
R1
R2
OUT:1.85V
Smal l (19_22")
Close to Q1003
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
PO
WE
R
0.1uFC644
0.1uFC637
M_S
DA1000pFC606
22000pFC616
22000pFC623+1.8V_DVDD
1000pF50V
C651
0.47uFC632
MULTI_PW_SW
0.1uFC605
+1.8V_DVDD
0.1uFC615
0.1uFC629
AMP_
MUT
E_HO
TEL
+3.3V_MULTI_MST
0.1uFC643
DA-8580
EAP38319001
L6072S
1S 1F
2F
0.1uFC617
0.1uFC602
0.01uFC647
SPK_R+
M_S
CL
0 .1uFC610
DA-8580
EAP38319001
L6032S
1S 1F
2F
22000pFC611
SPK_L+
+1.8V_AVDD
SPK_L-
0.1uFC669
+16V_NTP
+16V_NTP
SPK_R-
100pFC601
22000pFC625
+1.8V_AVDD
0.01uFC672
0.01uFC648
1000pFC603
SW_RESET
0.47uFC673
0.01uFC671
0.1uFC626
0.01uFC613
330uF35VC612
SPK_L-
SPK_R+
+1.8V_DVDD
SPK_R-
SMAW250-04
P600
1
2
3
4SPK_L+
+1.8V_AVDD
+1.8V
I2S_MCLK
I2S_
SDO
I2S_
WS
I2S_
SCK
390pFC619
390pFC621
390pFC630
390pFC634
1uFC608
1uFC618
1uFC624
1uFC614
0.1uF50V
C607
10uF35V
C642READY
+12V_AUDIO
MNT_R_AMP
+12V_AUDIO
RT1C3904-T112Q600
E
B
C
RT1C3904-T112Q601
E
B
C
MNT_L_AMP
0.01uFC635
MNT_ROUT
+12V_AUDIO
LM324D
IC601
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
6800pFC628
6800pFC627
MNT_LOUT
AUDIO_R
SPK_R-_HOTEL
SPK_R+_HOTEL
12505WR-09A00
HOTEL_OPT
P601
1
2
3
4
5
6
7
8
9
10
0.1uFHOTEL_OPT
C636
+16V_NTP
RT1C3904-T112HOTEL_OPT
Q602
E
BC
AMP_MUTE_HOTEL
+3.3V_MULTI_MST
SW_RESET
10uF16V
C600
10uF16V
C604
10uF16VC609
3 . 3R604
12R608
12R611
12R610
12R638
4.7KR663
4.7KR623
3 . 3R626
3 . 3R625
100R601
3.3KR600
10
0R
67
6
10
0R
67
7
10
0R
67
8
100R602
100R603 0
R65
6HO
TEL_
OPT
0R673
12R658
12R653
12R621
12R654
4.7KR628
4.7KR667
3 . 3R671
3 . 3R635
1KR607
10KNON_HOTEL_OPT
R613
12KHOTEL_OPT
R613-*
5.6KR614
5.6KR615
10KNON_HOTEL_OPT
R616
12KHOTEL_OPT
R616-*
1KR609
4.7KR606
200HOTEL_OPTR612
10KHOTEL_OPT
R617
0HOTEL_OPTR620
0HOTEL_OPT
R619
4.7KR605 33pFC631
33pFC633
0.1uFC620
0.1uFC622
6.8KR618
6.8KR622
NTP-3100LIC600
1BST1A
2VDR1A
3RESET
4AD
5DVSS_1
6VSS_IO
7CLK_I
8VDD_IO
9DGND_PLL
10AGND_PLL
11LFM
12AVDD_PLL
13DVDD_PLL
14TEST0
15DV
SS_2
16DV
DD
17SD
ATA
18W
CK
19BC
K
20SD
A
21SC
L
22M
ONIT
OR_0
23M
ONIT
OR_1
24M
ONIT
OR_2
25FA
ULT
26VD
R2B
27BS
T2B
28PG
ND2B
_1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_2
32 PVDD2B_1
33 PVDD2B_2
34 PVDD2A_1
35 PVDD2A_2
36 OUT2A_1
37 OUT2A_2
38 PGND2A_1
39 PGND2A_2
40 BST2A
41 VDR2A
42 NC
43VD
R1B
44BS
T1B
45PG
ND1B
_1
46PG
ND1B
_2
47O
UT1B
_1
48O
UT1B
_2
49PV
DD1B
_1
50PV
DD1B
_2
51PV
DD1A
_1
52PV
DD1A
_2
53O
UT1A
_1
54O
UT1A
_2
55PG
ND1A
_1
56PG
ND1A
_2
MLB-201209-0120P-N20LCML00003B
120-ohmL605
MLB-201209-0120P-N2
0LCML00003B
120-ohmL606
33pF50V
C638
READY
33pF50V
C639
READY
+3.3V_MST
10KR630
RT1C3904-T112Q603
E
BC
10KR629
MULTI_PW_SW0
R627READY
0
R624READY
22KR631READY
SPK_L-
Main AMP
AMP :GAIN X 4
Chinese Hote l Opt ion
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
AU
DI
MAIN_SIF
0.01uFC501
M_SDA
27pFC500
+5V_TUNER
TV_MAIN
M_SCL
+5V_TUNER
C504
READY
27pFC502
10uHL502
READY
82pFC507
READY
10uF16V
C508
120-ohmL500
READY
ISA1530AC1Q502
E
BC
TAFT-H203F
TU500-*1
NTSC_TUNER
14NC_5
13V-OUT
5RF_AGC
12NC_4
11MOPLL_AS
2GND_1
19NC_8
18NC_7
10SCL
4NC_2
1NC_1
17NC_6
9SDA
8GND_2
3+B[5V]
16SIF-OUT
7NC_3
6TP[3.3V_OPT]
15A-OUT
21
SHIELD
20NC_9
TAFT-Z203DTU500
PAL_TUNER
14 NC_5
13 V-OUT
5 RF_AGC
12 NC_4
11 MOPLL_AS
2 GND_1
19 NC_8
18 NC_7
10 SCL
4 NC_2
1 NC_1
17 NC_6
9 SDA
8 GND_2
3 +B[5V]
16 SIF-OUT
7 NC_3
6 TP[3.3V_OPT]
15 A-OUT
21
SHIELD
20 NC_9
4.7KR502
220R506
220R507
100uF16VC505
100uF16VC509
100uF16VC506
120-ohmL501
47R504
47R505
0.1uF50V
C503
0
L501-*1
0 Ohm
Near the p in
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
TU
NE
R
TMDS3_RX2-
+5V_HDMI_2
TMDS3_RXC-
HPD_MST_2
TMDS3_RX0+
TMDS2_RX2-
CECTMDS2_RXC-
TMDS2_RXC+
TMDS1_RXC-
TMDS2_RX0+
TMDS3_RX0-
TMDS3_RX1+
TMDS3_RXC+
+5V_HDMI_2
HPD_MST_1
CEC
TMDS1_RX2+
TMDS2_RX1+
+5V_MULTI
+5V_HDMI_1
TMDS3_RX2+
TMDS2_RX0-
TMDS1_RX1-
TMDS2_RX1-
TMDS1_RX2-
+5V_HDMI_3
TMDS3_RX1-
+5V_MULTI+5V_HDMI_3
+5V_MULTI+5V_HDMI_1
TMDS1_RX0-
TMDS1_RX1+
CEC
TMDS1_RX0+
TMDS2_RX2+
TMDS1_RXC+
HPD_MST_3
DDC_SDA2DDC_SCL2
DDC_SDA1DDC_SCL1
DDC_SDA3DDC_SCL3
JP304
JP305
JP301
JP300
JP302
JP303
2SC3875S
RT1C3904-T112
Q301
E
B
C
2SC3875SRT1C3904-T112
Q300
E
B
C
2SC3875S
RT1C3904-T112
Q302
E
B
C
KJA-ET-0-0032 JK303
14 NC
13 CEC
5 DATA1_SHIELD
20
JACK_GND
12 CLK-
11 CLK_SHIELD
2 DATA2_SHIELD
19 HPD
18+5V_POWER
10 CLK+
4 DATA1+
1 DATA2+
17DDC/CEC_GND
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16 SDA
7 DATA0+
6 DATA1-
15 SCL
KDS184SD300A
1
C
A2
KDS184SD301A
1
C
A2
KDS184SD302A
1
C
A2
CAT24C02WI-GT3IC301
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
CAT24C02WI-GT3IC302
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
CAT24C02WI-GT3IC300
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
DDC_WP DDC_WP
DDC_WP BSS83CEC_READYQ303
SBD
G CEC
+3.3V_MST
CEC_C
CDS3C30GTH30V CEC_READY
D304
MMBD301LT1G30VCEC_READY
D303
10KR301
1KR303
0.01uFC300
10KR300
1KR302
100R329
1KR314
10KR312
68KCEC_READY
R315
0R313
100R317
100R318100R305
100R304
0.01uFC301
100R331
100R306
100R307
0.01uFC302
100R327
10KR308
10KR310
10KR309
10KR311
10KR319
10KR320
QJ41193-CFEE1-7FJK301
1 DATA2+
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
10 CLK+11
12
13
14
15
16
17
18
19
20JACK_GND
21 .
22
QJ41193-CFEE1-7FJK302
1 DATA2+
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
10 CLK+11
12
13
14
15
16
17
18
19
20JACK_GND
21 .
22
56KCEC_READY
R316
OPTION
SW_HPD : USE SW HPD (Default)
MST_HPD : USE MST HPD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
HD
MI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CVBS_LIN
MUTE_LINE
AUDIO_R
SD05ZD100
100uF16V C102
SD05ZD103
SD05ZD105
MNT_ROUT
CVBS_VIN
SPK_R+_HOTEL
RT1C3904-T112Q100
EBC
SPK_R-_HOTEL
CVBS_RIN
SD05ZD104
10uF16V C101
MUTE_LINE
SD05ZD101
SD05ZD102
MNT_LOUT
RT1C3904-T112Q101 E
BC
MNT_VOUT
10uF16V C10030VNON_HOTEL_OPT
D102
30VNON_HOTEL_OPT
D103
30VD101
30VADUC30S03010L_AMODIODE D100
30VD104
30VD105
COMP2_Y
COMP2_PB
COMP2_PR
COMP2_L
COMP2_R
S_VIDEO_DET
SIDE_Y
SIDE_C
+3.3V_MULTI_MST
OPTREADY
C104
30VD106
30VD107
SD05ZD106
SD05ZD107
PSJ014-01JK101
S-VIDEO
GND6
1
C-LUG1
2C-LUG2
30-SPRING
4C-LUG3
5 C-LUG4
SHIELD7
75R102
0HOTEL_OPTR103
0HOTEL_OPTR105
0NON_HOTEL_OPTR106
0HOTEL_OPTR101
75R109
75R108
75R107
220KR104
12KR118
12KR117
12KR119
12KR120
10KR113
10KR115
10KR116
220KR100
220KR111
220KR112
75R110
75R122
S-VIDEO
75R121
S-VIDEO
10KR123
100pFREADY
C103
10KR114
PPJ226-01JK100
9A [GN]1P_CAN
4A [GN]O-SPRING_A
3A [GN]CONTACT_A
9B [BL]1P_CAN
8B [BL]C-LUG_A
9C [RD]1P_CAN_1
8C [RD]C-LUG_A
9D [WH]1P_CAN
8D [WH]C-LUG_A_1
9E[RD]1P_CAN_2
4E[RD]O-SPRING_A_1
3E [RD]CONTACT_A_1
9F [YL]2P_CAN
4F [YL]O-SPRING_A
3F [YL]CONTACT_A
9G [WH]2P_CAN
8G [WH]C-LUG_A_2
9H [RD]2P_CAN
4H [RD]O-SPRING_A_2
3H [RD]CONTACT_A_2
5J[YL]O-SPRING_B
6J[YL]CONTACT_B
7K[WH]C-LUG_B
5L[RD]O-SPRING_B
6L[RD]CONTACT_B
POP NOISE
MNT
_OUT
COM
PONENT1
POP NOISE
AV1
COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100
S-VIDEO(China Model)
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
INP
UT
1
USB_DN
USB_DP
SIDE_LIN
SIDE_RIN
5.6BZD203
SIDE_V
PPJ218-01
JK201
5C[RD]CONTACT
2C[RD]U_CAN
4C[RD]O_SPRING
2B[WH]U_CAN
3B[WH]C_LUG
2A[YL]U_CAN
5A[YL]CONTACT
4A[YL]O_SPRING5.6BZD202
US
B D
OW
N S
TR
EA
M
KJA-
UB-
4-00
04
SIDE_USB
JK204
12
34
5
IR_OUT
+3.3V_MST
TXD
4.7KR204
ST3232CDRIC200
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7T2OUT
8R2IN 9 R2OUT
10 T2IN
11 T1IN
12 R1OUT
13 R1IN
14 T1OUT
15 GND
16 VCC
4.7KR205
RXD
KCN-DS-1-0088JK200
1
2
3
4
5
6
7
8
9
10
+3.3V_MST
+5VST_MST
6630TGA004K
KCN-DS-1-0089
JK202
1RED
2GREEN
3BLUE
4GND_1
5DDC_GND
6 RED_GND
7 GREEN_GND
8 BLUE_GND
9 NC
10 SYNC_GND
11GND_2
12 DDC_DATA
13 H_SYNC
14 V_SYNC
15 DDC_CLOCK
16 SHILED
SD05ZD200
DSUB_SDA
PC_VSSD05ZD201
EN
KM
C2837-T
112
D2
11A
AC
C
PC_B
EN
KM
C2837-T
112
D2
10A
AC
C
PEJ024-01JK203
6B T_TERMINAL2
8 SHIELD_PLATE
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3 E_SPRING
DSUB_SDA
PC_AUD_R
PC_G
DSUB_SCL
CAT24C02WI-GT3IC201
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
EN
KM
C2837-T
112
D2
12A
AC
C
DDC_WP
PC_HS
PC_AUD_L
+5V_MULTI
DSUB_SCL
PC_R
CDS3C30GTH30VD202
CDS3C30GTH30V
D203
ADUC30S03010L_AMODIODE 30V
D200
ADUC30S03010L_AMODIODE 30V
D201
30VD206
30VD205
ADUC30S03010L_AMODIODE 30VD204
ADUC30S03010L_AMODIODE 30V
D209
30VD208
READY30V
D207
READY
USB_DL_N
USB_DL_P
0
REAR_USBR229
0
REAR_USB
R230
US
B D
OW
N S
TR
EA
M
UB
01
12
3-4
HH
S-4
F
JK205REAR_USB
12
34
5
0 .1uFC203
0.1uFC200
0.1uFC201
0.1uFC202
0.01uFC205
0.1uFC204
0.1uFC206
0.1uFC207
100R202
100R203
75R227
220KR223
READY
220KR222
READY
12KR226
12KR228
75R211
75R212
75R213
4.7KR214
4.7KR215
220KR231
220KR232
10K
R233
10K
R234
12KR235
12KR236
4.7KR220
4.7KR221
100R216
100R217
100R218
0.1uFOCP_READY
C208
MIC2009YM6-TR OCP_READYIC202
3ENABLE
2GND
4 FAULT/
1VIN6 VOUT
5 ILIMIT10uFOCP_READY
C209
120OHMOCP_READY
L200
+5V_USB
1KOCP_READY
R209
4.7KOCP_READY
R210
0Non_OCP
R237
10uF6.3VC210
USB_DL_N
USB_DL_P
68R207
68R208
68pFC213
68pFC211
4.7KR219
READY
0
R200
0
R201
500L201
220uF16VC212
100uF16VC214
KDS226D213
OCP_READY
AAC
C
510OCP_READY
R238
160
OCP_READYR206
10KR224
10KR225
IR_OUT
USB
I t ’ s p o s s i b e l t o 2 7 ~ 4 7 o h m
** 1A Des ign
SIDE AV
RS-232C (CI ITEM)
PC EDID
PC
PC SOUND
P i n t o P i n w i t hEAN43439401
Close to SIDE_USB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
INP
UT
2
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
47pFC403
22IR-OUTR430
470pFC404NON_19_22_26"
KEY1
ZD401
120ohmL406NON_19_22_26"
ZD402
+5VST_MST
ZD400
500-ohmL410NON_19_22_26"
IR_OUT
+3.3V_MULTI_MST
10KIR-OUT
R429
2SC3052Q405
IR-OUTE
BC
500-ohmL411NON_19_22_26" SUB_SCL
120ohmL402
KEY2
2SC3052Q404
IR-OUTEB
C
+5VST_MST
IR
SUB_SDA
0.1uFC408NON_19_22_26"
+3.3V_MST
+5VST_MST
0.1uFC411NON_19_22_26"
470pFC412
NON_19_22_26"
120ohmL403NON_19_22_26"
+3.3V_MULTI_MST
+3.3V_MULTI_MST
+5V_+12V_LCD
0.1uFC407 READY
47uF16V
C406
0.1uF16VC414 NON_19_22_26"
+3.3V_MST
KEY2
100pF50V
C40119_22_26"
KEY1
100pF50V
C40019_22_26"
+5V_+12V_LCD
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
+5V_+12V_LCD
+3.3V_MULTI_MST
OPC_EN
E-DIM
OPC_OUT
100pF50V
C405
19_22_26"
SUB_SCL
100pF50V
C402
19_22_26"
12507WS-12L
P400
NON_19_22_26"
1SCL
2SDA
3GND
4KEY1
5KEY2
65V_ST
7GND
8WARM_ST(LED_R_BIG)
9IR
10GND
11ST_3.3V(LED_B)
12POWER_ON(LED_R_SMALL)
13
.
P40519_22_26"
1KEY1
2KEY2
3GND
45V_ST
5GND
6IR
7LED_B
8LED_R
9
.BG1608B121F
L40019_22_26"
BG1608B121FL401
19_22_26"
BG1608B121FL408
19_22_26"
BG1608B121FL405
19_22_26"
4.7KR420
4.7KR421
10KIR-OUT
R427
10KIR-OUTR428
47KIR-OUT
R426
0R417
NON_19_22_26"
0R400
READY
0
R403
NON_19_22_26"
0R413READY
0R402
8B IT o r 52 sha rp
4.7K10BIT
R401
4.7KJEIDA
R407
0R424VESA100R409
READY
0READYR405
0
OPC_ENABLE
R412
470R435
OPC_ENABLE
SMAW200-03
P40419_22_26"
1KEY1
2KEY2
3GND
120-ohmL404
120-ohmL407NON_19_22_26"
TF05-51S
P401
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
FF10001-30
P402
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
SMW200-28CP403
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
LED_R
+3.3V_MST
RT1C3904-T112Q400
OPC_ENABLE
EBC 1K
R411
OPC_ENABLE
10KR404
19_22_26"
2SC3052Q401
19_22_26"E
BC
+3.3V_MULTI_MST
10KR410
19_22_26"
10KR414
19_22_26"
2SC3052Q402
19_22_26"E
BC
+3.3V_MST
10KR41519_22_26"
4.7KR40619_22_26"
0READY
R416
0READY
R418
0NON 22/27" FHD
R419
0NON 22/27" FHD
R422
0NON 22/27" FHD
R423
0NON 22/27" FHD
R431
0NON 22/27" FHD
R425
TXCO3+
TXCE1+
TXCO1+
TXCE1-
TXCLKO+
TXCO2-
TXCO2+
TXCO1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
TXCE4+
TXCE4-
TXCO3-
TXCO4+
TXCO4-
TXCLKO-
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
TXCE0-
TXCE0+
TXCO0+
TXCO0-
FHD
X
R4024.7K10BIT(FHD) X
8BIT(HD)X
X0
X
3 2 s h a r p
R401
00
X5 2 s h a r p8BIT(FHD)
CONTROL KEY
OPC_EABLE
OPC_OUTPUT
External VBR
PANEL WAFER
IR(19/22/26")
(19/22/26")
HD(19/22")
IR(Non 19/22/26)CONTROL KEY(Non 19/22/26)
*8BIT(FHD):22/27"
HD(26/32/37/42/47")
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright LG
Electronics. Inc. A
ll right reserved. O
nly for training and service purposesLG
E Internal U
se Only
LVD
S/ C
TR
KE
Y
Feb., 2009Printed in KoreaP/NO : MFL60021514