Lead-Free Soldering SystemReflow Oven, Flow Soldering Machine

Spray Fluxer

1 2

The new Cross-Nozzle reduces power & nitrogen consumption while decreasing warm-up time. SNR-GT series contribute to your environmental and energy solutions with powerful functionalities.

Nitrogen Ambient Reflow Oven for Lead-Free Soldering　　　　　 ECO-REFLOW SNR-GT Series　

■ ECO-REFLOW SNR-GT Series Standard Specification

［PAT.P］

Length

Dimensions Width

Height

Conveyor height

Conveyor speed

PCB Width

Length

PCB process clearance

Heat zones

Cooling unit

Power requirements

Weight

3,000mm 5,300mm 5,300mm 6,800mm

1,326mm 1,240mm 1,390mm 1,790mm

1,430mm 1,460mm 1,460mm 1,460mm

900±20mm

0.3〜1.6m/min.

50〜250mm 50〜400mm 50〜650mm

100〜400mm 100〜700mm

Topside:20mm／Bottomside:10mm

7zones Hotairblowers,8zones 10zones

Topandbottomcoldblastcooling,1zone 2zones

200VAC,90A,3-phase 200VAC,100A,3-phase 200VAC,150A,3-phase 200VAC,200A,3-phase

1,800kg 2,300kg 2,800kg 4,500kg

Spec. Model SNR-725GT SNR-825GT SNR-840GT SNR-1065GT

Equipped with the new Cross-NozzleHeating capability is improved, while reducing power consumption.

Power consumption at stable temperature

Quicker heater warm-up

Innovative heating structure delivers:・Reduced nitrogen consumption・Shortened warm-up time・Improved cooling capability (chiller not required)

■ Improved control display

■ Flux recovery unit

SNR-825GT Warm-up: 25 min.

Conventional Model Warm-up: 55 min.

■ Dual lane conveyor (Optional)

New flux recovery system realizes higher recovery rate and easier maintenance

Other highlights:・Intelligent-standby mode・Reflow profile measuring mode・Compatible with the KIC System

SNR-825GT

SNR-1065GT

© SMIC, 2011

Status Indicator

Exhaust Duct

Emergency Switch

Labyrinth

Curtain

Labyrinth

Curtain

Open & Close

Pneumatics

Cooling Zone

Nitrogen Ambient Oven

Bottom

Cooling

Unit

Reflow Zone

Pre-heating Zone

Open & Close

Pneumatics

PCB Width

Adjusting &

Warp

Prevention

Handle

Loading

Conveyor

Emergency SwitchPC

B

Microcomputer

Control Operation

PLC

Keyboard

Control Box

Flux Recovery

Unit

SNR-825GT

Temp.［℃］

Temp.［℃］

Time［min.］

300

250

200

150

100

50

0

300

250

200

150

100

50

010 20 30 40 50 60

Time［min.］10 20 30 40 50 60

Down by 30 min.50% ReductionTe

mp.［℃］

Temp.［℃］

Time［min.］

300

250

200

150

100

50

0

300

250

200

150

100

50

010 20 30 40 50 60

Time［min.］10 20 30 40 50 60

Down by 30 min.50% Reduction

Power Consumption［kW］

Time［min.］

30

20

10

030 60 90 120 150 180 210 240

Chiller unit in action

Power consumptionat stable temperature

＊Cooling fan running at maximum speed

Conventional model

8.7kW

SNR-725GT

■ Standard Configuration

・PLC/PCcontrol・Fluxrecoveryunit・Boardfalldetection・Boardcounter・Oxygenanalyzer・Intelligentstand-bymodeforenergysaving・Reflowprofilemeasuringmode・Individuallycontrolledblowingfan

■ Options

・PCBwarppreventionmechanism

・Automaticconveyorwidthadjust

・In-outfeeder

・Chillerunit

・Automaticoxygenconcentrationcontrol

・UPS

・Top-bottomlabyrinthcurtain

・ECO-modeoperation

・Traceability

・Conveyordirectionmadetoorder

6～9kw

↓↓

Electricity Nitrogen

34%Down

Warm-upTime

50%Down

30minN2

200L/min

↓↓

35%Down

★ For more information on ECO-REFLOW SNR Series, contact us. SMIC is a leading manufacturer of soldering materials with extensive experience and offers advanced Soldering SolutionTM.

★ Design and specifications are subject to change without notice for improvements of system performance.

250m/mW.

PCBSpace-Saver

650m/mW.

PCBHigh

Capacity

3 4

New Air Reflow Oven for Lead-Free SolderingECO-Reflow SAR-825GT

Small N2 Reflow Oven for Lead-Free SolderingECO-Reflow SNR-615

New N2 Reflow Oven for Micro-ball Bumpingon Substrate and 300mm Wafer SNR-1346MB

Cleanroom Compatible Reflow Oven for SemiconductorCX-430

The SNR Series, with the best thermal efficiency in the industry, offers a combined heating system with far infrared

and hot air convection.

An advanced compact reflow oven for semiconductor packaging, hybrid components, and solder formation of SMT assemblies.

World-class thermal efficiency and the first automatic flux recovery system in the industry.

State of the art reflow oven for wafer-level solder bumpingand face-down mounting of bare chip.

© SMIC, 2011

■ Features:Far infrared ray panel heaters and convection blow heating system achieve a minimized ΔT.

Individual heater temperature settings provide high degree of freedom in a trapezoidal profile settingTop and bottom heating system offers high degree of reproducibility in reflow profile.

Air tight muffle structure furnace features 100 ppm or less oxygen concentration.Low nitrogen consumption of 100 ppm at 200 liter/min attainable in every zone. (Component's height is under 10 mm)

New flux recovery mechanism at heating zone［Option］Recovered flux is automatically collected after an operation is completed.

Energy-saving design.Highly efficient adiabatic structures reduce electric power consumption.

Suitable for high temp. reflow（max. 350℃）

■ SNR-625 Standard Specification

● Dimensions 2,670mm（L）x1,100mm（W）x1,340mm（H） ● PCB Width:50to150mm,Length:100to300mm

● Conveyor speed 0.1to1.0m/min.（Variable） ● PCB process clearance Topside:10mm,Bottomside:5mm

● Conveyor height 900±20mm ● Operating control PLC/PCcontrol

● Heat zones Farinfraredpanelheatersandhotairconvectiveblowersusedincombination（6heatingzones）

● Weight 1,500kg（Approx.）

● Cooling unit Top-and-bottomblastcoolingbynitrogengas● Options

Customer-specifiedcolor,automaticwidthadjuster,fluxautomaticrecoverymechanism,oxygenautomaticconcentrationcontrol,andothers.● Power requirement 200VAC,43kW,3-phase

★ Please call us for further details and technical information. As a leading manufacturer of soldering flux and soldering related materials, we would be pleased to provide ad-vanced solutions in soldering technology. Design and specifications of system and equipment are subject to change without notice.

■ SAR-825GT Standard Specification

● Dimensions 3,800mm(L)×1,290mm(W)×1,460mm(H)

● Conveyor height 900±20mm

● PCB Width:50to250mm,Length:100to400mm

● PCB process clearance Topside:35mm,Bottomside:25mm

● Heat zones Hotairconvectionheating,8zones

● Cooling unit 2top-and-2bottombycrossflowfans

● Power requirement 200VAC,100A,3-phase

● Weight 1,900kg[PAT.P]

Lined up loader and unloader

■ CX-430 Standard Specification

● Cleanness level Class1000(0.5μm)

●Nitrogen gas consumption

250ℓ/min.(Oxygenconcentrationinsidefurnace:20ppmorlessduringcontinuouswaferinput)

● Heater system 4zones8panels(1,500mmlength)Radiantheater:4.85kw×4(upper5,lower3)AC200V(AC100V)

● Power supply AC200V,50/60Hz,3phase,24kw,100A

● Control system PIDcontrol,Individualcontrolofeachheater(32surfacesintotal)

● Applicable wafer size φ200mm,φ300mm(compatiblewithφ150mm,althoughtemp.isnotguaranteed)

● Conveyor height 900±20mm

● Conveyor system WalkingbeamWidth:150to300mm,Accessheight10mm

● Cooling section N2gassprayingmethod,375mm

● Dimensions Totallength:3,000mm,Width:1,300mm,Height:1,260mm

■ SNR-1346MB Standard Specification

● Heat zones 13heatingzones,2coolingzones

● Oxygen concentration Below100ppminallzones

● Works dimensionSubstrate:460mm(W)×500mm(L)Siliconwafer:300mm(carrieroperationavailable)

● Heating system Farinfraredandhotairconvection

● Dimensions 6,820mm(L)×1,440mm(W)×1,390mm(H)

● Additional functionsFluxrecoverysystem(heatingzone),on-boardchillingunit,conveyordustprotection

■ Features:For 300mm wafer-bump reflow

Ensures class 1000 cleanliness level by using non-dust, walking beam conveyor system

Individual far infrared radiation heating minimizes ΔT of wafer (5ºC or less)

Applicable to high temp. and lead-free solders with flexible temp. setting (4 heating zones and 1 cooling zone).

Built-in flux recovery system in compact body

5 6

SPF Automatic Flow Soldering MachineECOPASCAL SPF2 Series

The latest stable pressure flow soldering machine is most suitable for high quality lead-free soldering Leading-edge of lead-free soldering technology allows uniform pressure for long lasting operation.High flow pressure provides sufficient solder in through-holes of multilayer boards and significantly reduces missing solders and bridges.

■ ECOPASCAL SPF2-300（SPF2-400）Standard Specification

★ For more information on ECOPASCAL, contact us. SMIC is a leading manufacturer of soldering materials with extensive experience and offers advanced Soldering SolutionTM.★ Design and specifications are subject to change without notice for improvements of system performance.

[PAT.P]

Elimination of stabilizing plate

allows low maintenance

UniformflowrateStablePressurePump

6

7

8

9

10

1 2 3 4 5

Conventional solder pot

SPF

Time（H）

Flow wave height（mm）

■ Comparison of 2nd flow wave height in continuous operation

No clogging with oxides, keeping up a stabilized flow wave.Eliminating a use of stabilizing plate enables smooth and stable wave for best soldering process with easy maintenance.

Full-open-body for easy maintenance.Vertical adjustment of the conveyer rail provides flexibility and allows easy cleaning of the pot without removal.

When lowered When raised

■ N2 ambient optional unit（SPF2-400N）

PLC / PC operation touch panelStandard touch panel operation allows changing among Japanese, English, or Chinese.

New lineup of 4 models for 300m/m, 350m/m, 400m/m, and 24 inches PCB widths.

On-Pallet flow soldering is also available.Flow height can be easily set and maintained at 15m/m or above.

Optional upper preheater enables more sufficient heating.

■ PCB carrier, soldering pallet

Suitable for high thermal capacity devices allowing sufficient heat supply for soldering. Flow height can be easily set and maintained at 15mm or above.

Capability for high grade nitrogen ambient flow soldering.New N2 full chamber system from preheating to cooling zone is also available.

⃝ Dimensions 4,340mm（L）×1,330mm（W）×1,560mm（H） ⃝ Board dimensions 50（100）（W）×100（L）mmto300（400）（W）×350（450）（L）mm

⃝ ConveyerAnglesetting：5°

Variableconveyorwidthbymanualoperation

⃝ Controller PLC/PCcontrolledtouchpanel

⃝ Weight 1,800kg（approx.）solderincluded

⃝ Conveyor height 780mm ⃝ Power requirement 3-phase200V32.5kw

⃝ Preheater Farinfraredrayspanelheaters（5kW×4）

⃝ Option

Upperpreheatingunit,Chillerunit,

PCBWarppreventionblade,Automaticsolderfeeding,

Highwavenozzle⃝ Solder bathHeaters:0.95kW×12,Anti-splashheater

（0.4kW）,Solder（M705E,390Kg）

© SMIC, 2011

Exhaust Duct

Loading Conveyer

Unloading

Convey

er

Operation LCD Panel

Double Wave Solder Pot

Solder Pot Drawer

PCB Rapid Cooling FanConveyer R

ail

PCB Width Adjusting

Handle

Preheater Cover

Emergency

Switch

Emergency

Switch

Status Indicator

Exhaust Duct

SPF2-400

7 8

■ Features:Uses a newly developed special nozzle which enables highly efficient application.

Uses a new nozzle which enables stable application free of clogging. Easy maintenance because of the use of an automatic mechanism for cleaning nozzles and pipes.

Incorporates an automatic cleaning system for the conveyer chain to ensure stick-free and smooth conveyance.

Provides upper and lower exhaust fans which prevent return shower and other problems.

Includes a color LCD touch panel to display various data in real-time such as filter dirt, consumed/applied flux volume, and substrate movement.

Easy flux control and stable feeding of high solid content flux by the metering pump.

Static Pressure Flow Soldering SystemSOLZEUS MPF Series

Advanced Static Pressure Flow (CSPF) System Ideal forSelective Soldering of Specially Shaped Parts [PAT.]

■ Features:Useful for soldering by nozzles of various sizes and shapes.

Ideal for post-mounting of double-sized PCB.

Ideal for soldering substrates with large parts mounted on their bottom surface.

Useful for soldering substrates after assembly.

Useful for soldering long lead connectors.

Soldering condition is programmable via touch panel.

Automatically operated by reading data in memory.

Spec.　　　　Model MPF-2003ST● Dimensions (mm) 3,070L×1,200W×1,650H● Conveyor height 900H±20(mm)● Fluxer XYAxisProgrammable

● PreheaterHotAirBlow：6kW

（Option：TopandBottomsidesHalogenHeater）

● Solder bath

ContinuousstaticpressureflowsystemHeater：1.2kW×9Anti-splashheater：0.8KwSoldercapacity：ECOSOLDER　M705E500Kg

● Board dimensions 80W×80L－ 250W×330Lmm● Controller Sequentialcontrol（Omron）● Power requirement 3-PhaseAC200V19kVA● Weight（Solder included） 2,000Kg（Approx．）● Options PressuretypeFluxer,CoolingUnit,etc.

■ SOLZEUS Series: Typical specification

★ For more information on SOLZEUS Series, contact us. SMIC is a leading manufacturer of soldering materials with extensive experience and offers advanced Soldering SolutionTM.★ Design and specifications are subject to change without notice for improvements of system performance.

MPF-2003ST

■ Rotating-carrier typeMPF-2007ST

X-Y programmable fluxer

Flux curing unit

Simple nozzle setting in solder bath

© SMIC, 2011© SMIC, 2011

New Spray Fluxer for VOC-Free FluxSSF2-400

The newly improved spray fluxer to meet RoHS regulations for Lead-Free Flow Soldering

Solder recycling system efficiently separates solder from the oxide as amount of solder dross increases with lead-free applications.Specially formulated sesame seed (E-Sesame) is mixed with the dross, then after heating and agitation, solder is separated from oxide. The recovered solder is then cast in a simple mold to make bar solder for reuse.

■ SSF2-400 Standard Specification

⃝ Dimensions Length:1,350mmWidth:1,305mmHeight:1,378mm ⃝ Exhaust duct Singlesiroccofan

⃝ PCB Width:100to400mmLength:50to400mm ⃝ Flux solution 1.0L,automaticsupplywithsensor

⃝ Effective coating width 50to400mm ⃝ Filter Squarefilters

⃝ Spray nozzle Twoliquidmixingsystemwithclogging-freemechanism ⃝ Chain cleaning unit Quantitativecirculationwithsensor

⃝ Conveyer speed 0.5to2.0m/min.(Variable) ⃝ Air pressure 0.5MPa

⃝ Operation / Control SequentialcontrolandcolorLCDtouchpanel ⃝ Power (max.) 200VAC,3-Phase,1.6KVA

★ For improvement, modification will be implemented without prior notice.

■ Separation EfficiencyAppox. 90% of solder recycle recovery rate

■ SDS2-5N Standard Specification

⃝ Dimensions [mm] Height:1,000Length:800Width:650

⃝ Weight 130kg

⃝ Power capacity AC100V,1,200W,15A

Lead-Free Solder Recycle MachineSDS2-5N

■ Recycling Process

Place drossinto tool Heat Put sesame into

molten solder Mix

Recycled Solder

Discharge

Noseparation

ECO SOLDER M7052.0

0

［kg］

1.81.61.41.21.00.80.60.40.2

Separationby mixing

Mix withsesami

Recycled SolderSolder Dross

9 10

Lead-Free Solders

Product　　Item Thickness Adhesivetype

Strippingstrength

Tackiness（※1） Afterheating Afterheatinganddelayedtesting

E-260 150μ Acrylbond ≧4N ≧3N（※2） ≧6N（※3）E-300P 80μ Acrylbond ≧2N ≧3N（※4） ≧5N（※5）

※1）InaccordancewithJIS-Z-0237AdhesiveTape,AdhesiveSheetstandardtestingmethod.　※2）Testafterpastingsampletapeonawatersolublepre-fluxedboard（rollerpressure2kg,4strokes）andapplicationoffluxheatedfor20minat100℃（samplesizeandstrippingconditionsinaccordancewithJIS-Z-0237）．※3）Conditionsas※2andanadditional20mindelaybeforetesting　※4）Testafterpastingsampletapeonawatersolublepre-fluxedboard（rollerpressure2kg,4strokes）andapplicationoffluxheatedfor5minat120℃and5mindelaybeforetesting（samplesizeandstrippingconditionsinaccordancewithJIS-Z-0237）．※5）conditionsas※4but20mindelaybeforetesting.

Product　　Item Basetape/thickness Tensilestrength（※6）Elongation（※6） HeatandFire

retardantPunctureResistance

E-260 Flatpapertape120μ 88N/10mm 10% － －

E-300P Polyimidefilm25μ 64N/10mm 66% ULstandardV-0 400kV/mm※6）Longitudinaldata

Features 　Item E-260 E-300P

Width（※1） 5〜300mm 10〜150mm

Standardlength 30m/roll 20m/roll

Packaging（※2） 300mm÷productwidth

150÷productwidth

※1） Pleaseinquireforotherwidths（dimensions）．※2） e.g.30rolls/cartonforE-260（width:10mm） Pleaseinquirefortapewidths＜5mm.

E-260E-300P

ECO MASKING TAPE

After intensive material research, SMIC have developed a series of tapes ideally meeting the stringent requirements of the circuit board manufacturing process.

❶ The solder experts’ choice in masking technologya. E-260 is a flat paper based masking tape for flow soldering

processes.b. Also available is the E-300P, a polyimide film tape with supe-

rior heat resisting properties for use with reflow soldering.

❷ Features Specification

Acryl based adhesive not interfering with solderability of sol-dered with sufficient heat resistance.The E-260 Masking Tape does not detach even under extreme Flow soldering conditions applying flux 0,5ml/sec, conveyor charging speed 0.5m/min, pre-heat temp. 130℃, solder bath temp. 260℃. Yet removing it after soldering will not leave any adhesive residue. And E-300P MT will not leave any residue even after reflow peak temps of 275℃, charging at 0.5m/min, pre-heat 130〜170℃/1min.

※These are reference data. Actual results depend on working conditions board pre flux type, size, components and heat capacity.

Environment friendly materialOur ECO masking tape products are well within RoHS 6 limits do not contain any pollutants like man-made organic Fluoride compounds such as PFOS or PFOA and thus can be used without any concerns.

❸ Data sheet Product specification

Material specification

❹ Product Specification

■ ECO SOLDER Products Guide

ItemAlloy composition

（wt%）Temp.（℃）

Solidus line / Peak[1]/ Liquidus

line

FormRemarks

Bar Wire Flux Cored Ball Paste

M-series Soliduslinetemp.200to250℃

M705 Sn-3.0Ag-0.5Cu 217 219 220 ● ● ● ● ● ※1

M31 Sn-3.5Ag-0.75Cu 218 219 219 ● ● ● ● ● ※1

M35 Sn-0.7Cu-0.3Ag 217 219 227 ● ● ● ● ● ※2

M771 Sn-1.0Ag-0.7Cu 217 219 224 ● ● ● ● ● ※2

M10 Sn-5.0Sb 240 243 243 ● ● ● ● ●

M20 Sn-0.75Cu 227 229 229 ● ● ● ● ●

M24E Sn-0.70Cu-0.03Ni-P 228 230 230 ● ● ● ※3

M30 Sn-3.5Ag 221 223 223 ● ● ● ● ●

M34 Sn-1.0 Ag-0.5Cu 217 219 227 ● ● ● ● ●

M37 Sn-4.0Ag-0.9Cu 217 219 230 ● ● ● ● ※4

M42 Sn-2.0Ag-0.75Cu-3.0Bi 207 214 218 ● ●

M52 Sn-1.0Ag-0.1Cu-0.05In-0.02Ni 218 219 228 ●

M707 Sn-2.0Ag-0.5Cu 217 218 223 ● ● ● ● ●

M714 Sn-3.8Ag-0.7Cu 217 219 225 ● ● ● ● ●

M715 Sn-3.9Ag-0.6Cu 217 219 226 ● ● ● ● ●

M716 Sn-3.5Ag-0.5Bi-8.0 In 197 208 214 ● ● ※5

M731 Sn-3.9Ag-0.6Cu-3.0Sb 221 224 226 ●

DY Alloy Sn-1.2Ag-4.0Cu 217 225 353 ● ●

M709 Sn-0.5Ag-6.0Cu 217 226 378 ● ● － － －

M33 Sn-2.0Ag-6.0Cu 217 219 380 ● ●

L-series Soliduslinetemp.under200℃

L11 Sn-8.0Zn-3.0Bi 190 197 197 ●

L20 Sn-58Bi 139 141 141 ● ● ●

L23 Sn-57Bi-1.0Ag 138 140 204 ● ● ● ※6［1］Peaktemp.：Max.endothermicreactionpointonDSCcurve.

■ JIS Z 3282、ISO9453　Chemical composition of lead-free solders

ClassSymbol SMIC

Item

Chemical composition mass％

1 2 Sn Pb Sb Bi Cu Au In Ag Al As Cd Fe Ni Zn

Sn96.5Ag3Cu0.5

Sn96.5Ag3Cu0.5

A30C5 M705 Remainder 0.10max0.10max

0.10max

0.3

〜

0.7

0.05max

0.10max

2.8

〜

3.2

0.001max

0.03max

0.002max

0.02max

0.01max

0.001max

※SMIC'slead-freealloysareproducedimpuritylessthan0.05%.

■ Lead-Free flux cored ECO SOLDER: Specification and Features

Lead-Free ECO SOLDER developed by SMIC offers high soldering reliability compared with the Sn-Pb series solder of the past and is available in a wide product lineup according to the required soldering temperature.

E series（antioxident type）and auto-matic feeding type for solder bath are also available.

Product availability may be limited for certain alloy compositions. Please select the appropriate product from the ECO SOLDER Products Guide at right.

※1： USPATNo.5527628※2： LowAgcontentalloyonJEITA'S recommendations.※3： JPPATNo.3622788 Sn-CuAlloyforanti-shrinkagecavity※4： Alloyforanti-shrinkagecavity※5： JPPATNo.3040929

※6： JPPATNo.3347512,USPATNo.5320272

Flux Cored SolderECO SOLDER NEOSuperior WettabilityECO SOLDER NEO further improves workability over conventional solder. Faster soldering is achieved by refining flux fluidity for rapid initial wetting. Low solder and flux spattering make rework easier, while light yellow residue contributes to better appearance.

ECO SOLDER RMA08High reliability and clear finishECO SOLDER RMA08 is a highly reliable resin flux cored solder that complies with the former U.S.A. standard, QQ-S-571. It exhibits less solder ball spattering, transparent and colorless finish. The flux exhibits corrosion resistance and high insulation characteristics.

ECO SOLDER HVPExcellent heat-resistant flux coredNewly improved heat resistant flux cored solder for P.C.B. exposed long time to high-temperature. Very good solderability for the parts of high heat capacity and slide-soldering over a wide temperature range at 300℃ to 400℃ （approx.），restraint solder ball or flux spattering. Transparent and clear finish makes good appearance after soldering.

ECO SOLDER MLBDeveloped for the non-contactHeating process（Laser/Light Beam）, MLB wire has excellent soldering characteristics while reducing flux splatter and lense contamination issues. A clear color residue resistant to thermal cycle cracking remains post-soldering.

Factor　

Products ECO SOLDERRMA08

ECO SOLDERMLB

ECO SOLDERNEO

ECO SOLDERHVP

Alloy Pleasereferto theECOSOLDER ProductsGuideon page1.

Wire diameter φ0.3to2.0mm

Flux content 3%,4% 3%,4% 3%,4% 4%

Halide content 0.10%orless 0.10%orless 0.44% 0.44%

Insulation resistance 1×1011Ωover 1×1011Ωover 1×1011Ωover 1×1010Ωover

Spreadability 77%（M705） 75%（M705） 79%（M705） 79%（M705）

Feature Clearfinishandhighreliability

Non-contactheating

Excellentworkability

Excellentheat-resistantflux

*Lessthan0.3dia.areavailableonrequest.

■ Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan TEL: (81) 3-3888-5151, FAX: (81) 3-3870-3032http://www.senju-m.co.jp/

■ Sales Offices:Hanamaki, Akita, Sendai, Kohriyama, Hokuriku, Suwa, Nagoya, Osaka, Hiroshima, Fukuoka, Oita and Miyazaki

■ Plants: Tochigi, Saitama, Tokyo and Hyogo

■ Laboratories: Tochigi, Tokyo

Overseas Affiliates

Europe■ Senju Metal Europe GmbH Frankfurt, Germany TEL. (49) 69-2980150 Praha, Czech TEL. (420) 257-289-500■ Senju Manufacturing (Europe) Ltd. Bucks, England TEL. (44) 1494-526-000■ Senju Metal (Italia) s.r.l. Vicenza, Italy TEL. (39) 0444-380789

North & South America■ Senju America Inc. Great Neck, New York, USA TEL. (1) 516-829-5488■ Senju Comtek Corp. Campbell, California, USA TEL. (1) 408-963-5300 Chicago, Illinois, USA TEL. (1) 847-549-5690 San Diego, California, USA TEL. (1) 858-268-2437 Guadalajara, Mexico TEL. (52) 33-3770-2314■ Senju Comtek do Brazil Ltda. Campinas, SP, Brazil TEL. (55) 19-3254-2572

Asia■ Senju (Malaysia) Sdn. Bhd. Selangor, Malaysia TEL. (60) 3-5191 22 27■ Senju Trading (M) Sdn. Bhd. Selangor, Malaysia TEL. (60) 3-5191 66 70■ Senju (Thailand) Co., Ltd. Bangkok, Thailand TEL. (66) 2-633-8585■ Senju Solder (Phils) Inc. Rozario, Cavite, Philippines TEL. (63) 46-437-2720■ Senju Metal (Hong Kong) Limited. Kowloon, Hong Kong TEL. (852) 23 76 33 19 Shenzhen, P.R. China TEL. (86) 755-2518-1171■ Senju Solnet Metal Co., Ltd. Shatin, N.T. Hong Kong TEL. (852) 26 82-2235■ Senju Metal (Huizhou) Co., Ltd. Huizhou, P.R. China TEL. (86) 752-252-2605■ Beijing Senju Electronic Materials Co., Ltd. Beijing, P.R. China TEL. (86) 10-5924-2990 Dalian, P.R. China TEL. (86) 411-8764-9298■ Senju Metal (Shanghai) Co., Ltd. Shanghai, P.R. China TEL. (86) 21-6235-0178 Suzhou, P.R. China TEL. (86) 752-252-2605■ Senju Metal (Tianjin) Co., Ltd. Tianjin, P.R. China TEL. (86) 22-8396-3569■ Senju Metal Korea Co., Ltd. Gyeonggi-do, Korea TEL. (82) 31-323-4347■ Senju Metal Industry Co., Ltd. Korea Branch Gyeonggi-do, Korea TEL. (82) 31-8005-5557■ Senju Metal Industry Co., Ltd. Taiwan Branch Kaohsiung, Taiwan, R.O.C. TEL. (886) 7-3985-201■ Senju Metal Industry Co., Ltd. Kaohsiung Branch Kaohsiung, Taiwan, R.O.C. TEL. (886) 7-8152-878

2013-01-WEB AQDPrinted in Japan