lecture 05
TRANSCRIPT
EE141© Digital Integrated Circuits2nd Manufacturing1
PackagingPackaging
EE141© Digital Integrated Circuits2nd Manufacturing2
Packaging RequirementsPackaging Requirements
Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal Economical: Cheap
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Bonding TechniquesBonding Techniques
Lead Frame
Substrate
Die
Pad
Wire Bonding
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Tape-Automated Bonding (TAB)Tape-Automated Bonding (TAB)
(a) Polymer Tape with imprinted
(b) Die attachment using solder bumps.
wiring pattern.
Substrate
Die
Solder BumpFilm + Pattern
Sprockethole
Polymer film
Leadframe
Testpads
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Flip-Chip BondingFlip-Chip Bonding
Solder bumps
Substrate
Die
Interconnect
layers
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Package-to-Board InterconnectPackage-to-Board Interconnect
(a) Through-Hole Mounting (b) Surface Mount
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Package TypesPackage Types
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Package ParametersPackage Parameters
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Multi-Chip ModulesMulti-Chip Modules
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MCM ArchitectureMCM Architecture
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MCM technologies