lecture 15 - university of texas at...
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ChE 384T / 323
Lecture 15Chemical Engineering for Micro/Nano Fabrication
ChE 384T / 323 W. Hinsberg, IBM
Polymer Permability
ChE 384T / 323 W.D. Hinsberg, et.al. IBM, Almaden
ChE 384T / 323
ChE 384T / 323
ChE 384T / 323
ChE 384T / 323
ChE 384T / 323 Hiroshi Ito, IBM
Thermogravimetric analysis
ChE 384T / 323
ChE 384T / 323
Effects of filtered air (top) and 10ppb NMP (bottom) on positive images printed in the meta- (left) and para- (right) P(HOST-co-BOCST) resists.
ChE 384T / 323
ChE 384T / 323
The “Family”
ChE 384T / 323
ESCAP
• Acrylic reduces solubility of NMP
• Acrylic ester more thermally stable than the t-butyl carbonate
• Enables post apply bake Temp > Tg
• Bake > Tg decreases permeance
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OO
Hiroshi Ito
ChE 384T / 323
IBM Mainframe Circuit Board
one of 20 layers printed circuit board that contained nearly a
mile of wire interconnections used in IBM Mainframes.
ChE 384T / 323
SU-8 Negative Resist
ChE 384T / 323
IBM CGR Negative Resist
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OH
PAG
ChE 384T / 323
ChE 384T / 323
ChE 384T / 323
Entergris, Inc
Air purification system