Semiconductor Manufacturing and Processing

2

1950 1955 1960 1975 1980 1985 1990 1995 2000 2001 2002 2003 2004 2005 2006

2006

19523 Amp power Transistor

1960Si-Base Transistor

197916-Bit Processor MC68000

1975MC6800 is first microprocessor used in automotive application

198432-Bit Processor MC68020

1989MC68302 Communications Processor

Late 1980’sDevelopment of the first surface micromachined inertial sensors for the automotive airbag

1991PowerPC® (1) Alliance

1994First PowerPC® (1) MPC601

1991Company becomes leading supplier of automotive embedded processors

1998First PowerQUICC II communications processor (MPC8260)

2001MPC7455 SOI Volume Production

2003Low-K Volume Production

2003First single core modem: MXC. “Smartphone-on –a-postage stamp”

2003The pressure sensor portfolio expands with the tire pressure monitor sensor with capacitive technology to save power

200460 millionth applications processor for portable multimedia devices

2005First PowerQUICC communications processor with QUICC Engine (MPC8360E)

Building on a 50+ Year Heritage of Innovation

1995MPC860 PowerQUICC™

2005i.MX31 processor for mobile multimedia entertainment

2006MC9RS08KA2Ultra-low end MCU with RS08 core

2006MSC8144 multicore DSP targeting wireless and wireline infrastructure

2006Industry’s First Commercial MRAM

Product

Semiconductor Manufacturing In A Nutshell

3

1. Silicon

2. Wafer4. Product

3. Chip

Semiconductor Manufacturing Process Steps

4

The Semiconductor Manufacturing Supply Chain Data Flow

5

Equipment MES

Inventory Logistics

PlanningSales

Finance

Yield!

6

Data Analysis for Yield Improvement – Wafer Maps

Single Wafer

Multiple Wafer

A single wafer map represents 100’s to 1,000’s of data points; a multiple wafer map can represent 1,000’s to 100,000’s of data points.

Very high performance graphical data visualization …

The IC Market• The semiconductor industry is approaching $300B/yr in sales

Transportation 8%

Consumer Electronics16%

Communications24%

Computers42%

Industrial8%

Military2%

Courtesy of Dr. Bill Flounders, UC Berkeley Microlab

IC Technology AdvancementImprovements in IC performance and cost have been enabled by the steady miniaturization of the transistor

Better Performance/Cost

Market Growth

2000 2005 2010 2015 20201

10

100

GA

TE

LE

NG

TH

(n

m)

YEAR

LOW POWER

HIGH PERFORMANCE

International Technology Roadmap for Semiconductors

Transistor Scaling

Investment

SMIC’s Fab 4 (Beijing, China)

Photo by L.R. Huang, DigiTimes

PITCH

YEAR: 2004 2007 2010 2013 2016

HALF-PITCH: 90nm 65nm 45nm 32nm 22nm

The Nanometer Size Scale

Carbon nanotube

MOSFET

• Goal: Mass fabrication (i.e. simultaneous fabrication) of many IC “chips” on each wafer, each containing millions or billions of transistors

• Approach: Form thin films of semiconductors, metals, and insulators over an entire wafer, and pattern each layer with a process much like printing (lithography).

IC Fabrication

Planar processing consists of a sequence of additive and subtractive steps with lateral patterning

oxidation

deposition

ion implantation

etching lithography

• DEPOSITION of a thin film

• LITHOGRAPHY– Coat with a protective layer– Selectively expose the protective layer– Develop the protective layer

• ETCH to selectively remove the thin film

• Strip (etch) the protective layer

Planar Processing(patented by Fairchild Semiconductor in 1959: J. A. Hoerni, US Patent 3,064,167)

Courtesy of Dr. Bill Flounders, UC Berkeley Microlab

Deposition/growth

Etch

Epitaxy

Anneal

CMP

Ion Implantation

Test

CD SEMMetrology

DefectDetection

Lithography

Mask Pattern Generation

Bare SiliconWafer

ProcessedWafer

Overview of IC Process Steps

Courtesy of Dr. Bill Flounders, UC Berkeley Microlab

G

S D

Si classical

multi-gateG

S DSi

G

high-k gate dielectric

metallic gate

strained Si

Lg (nm): 50 40 30 20 10

MOSFET Scaling Scenario• Advanced structures will enable Si MOSFET scaling to Lg <10 nm

forward body biasing

The End is Not the Limit !

Information technology

pervasive

embedded

human-centered

solving societal-scale problems

Philips

Innovations in process technology, materials, and device design will sustain the Si revolution

Lower Power,Lower Cost

Market Growth

Technology, Device & CircuitInnovations,

Heterogeneous Integration

Investment

Acknowledgement:

Mark Weiser

UbiComp (>1 computers per person)

today

SALE

S($

)/YR

TIME

PCs (1 person/computer)

Mainframes (>1 persons per computer)

Transportation

Health

careDisaster response

Energy

Environment

Sensatex

Information technology will be

pervasive

embedded

human-centered

for better quality-of-life