LCD TVSERVICE MANUAL

CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP81G

MODEL : 32LG80FR 32LG80FR-TA

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only

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CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ..........................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION .................................................................9

TROUBLE SHOOTING ............................................................................14

BLOCK DIAGRAM...................................................................................19

EXPLODED VIEW .................................................................................. 20

SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.

It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument'sexposed METALLIC PARTS

Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

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CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power

source before;a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.

2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of itsassemblies.

4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.

7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the

unit under test.2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.

4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).

7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.

8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within therange or 500F to 600F.

2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.

(500F to 600F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature

(500F to 600F)b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.

Removal1. Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the soldermelts.

2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.

Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and

solder it.3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as

possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.

Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit

board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as

possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit

board.3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.

Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.2. Securely crimp the leads of replacement component around

notch at stake top.3. Solder the connections.

CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).

1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.

1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.

LGE Internal Use OnlyCopyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

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1. Application rangeThis specification is applied to LP81G chassis.

2. Requirement for TestEach part is tested as below without special appointment.

(1) Temperature : 25 5C(77 9F), CST : 40 5C(2) Humidity : 65% 10%(3) Power : Standard input voltage (100-240V~, 50/60Hz)

* Standard Voltage of each products is marked by models.(4) Specification and performance of each parts are followed

each drawing and specif ication by part number inaccordance with BOM.

(5) The receiver must be operated for about 20 minutes priorto the adjustment.

3. Test method(1) Performance : LGE TV test method followed(2) Demanded other specification

Safety : CE, IEC SpecificationEMC : CE, IEC

SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.

4. Module SpecificationItem Specification Measurement Result Remark

Display Screen Device 32 wide Color Display Module Resolution : 1920 X 1080Aspect Ratio 16:9LCD Module 32 TFT WUXGA LCD 32 FHD MAKER : LPLOperating Environment 1) Temp. : 0 ~ 40 deg LGE SPEC

2) Humidity : 0 ~ 85%Storage Environment 1) Temp. : -20 ~ 60 deg

2) Humidity : 0 ~ 85 %Input Voltage 100-240V~, 50/60HzPower Consumption Power on (Blue) : LG80 Volume: 1/8 volume of sound distortion point

(32 FHD)St-By (Red) 1.0 W (All)

LCD Module Maker Inch (H) x (V) x (D) unit Remark(Maker : AUO, LPL) LPL(FHD) Outline Dimension 32 [with inverter]

Pixel Pitch 32Back Light 32

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5. Model Specification(NON EU)Remark

China(DK) Australia(BG)VHF/UHF C1~C62 C1~C75

CATV S1~S41 S2~S44

Rear 1EA, Side 1EA

Rear

Side (S-Video Priority)Rear

Rear

LG80

L/R Input

Side(1EA)

Specification

NON EU/ CHINA

PAL SECAM B/G/D/K, PAL I/II, NTSC-M

BAND PAL NTSC

VHF/UHF E2~C69 2~78

CATV S1~S47 1~71

Upper Heterodyne

PAL, SECAM, NTSC

PAL, SECAM, NTSC

PAL, SECAM, NTSC

Y/Cb/Cr, Y/ Pb/Pr

RGB-PC, S/W Upgrade

HDMI-DTV, Only PCM MODE

PC Audio, Component (2EA), AV (2EA)Divx, MP3, JPEG

Item

Market

Broadcasting system

Available Channel

Receiving system

Video Input (2EA)AV Output (1EA)S-Video Input (1EA)Component Input (2EA)RGB Input (1EA)HDMI Input (2EA)Audio Input (5EA)USB Input

6. Component Video Input (Y, PB, PR)Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz720*480 31.47 59.94 27.000 SDTV 480P

720*480 31.50 60.00 27.027 SDTV 480P

720*576 31.25 50.00 27.000 SDTV 576P 50Hz

1280*720 44.96 59.94 74.176 HDTV 720P

1280*720 45.00 60.00 74.250 HDTV 720P

1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

1920*1080 33.72 59.94 74.176 HDTV 1080I

1920*1080 33.75 60.00 74.25 HDTV 1080I

1920*1080 56.25 50 148.5 HDTV 1080P

1920*1080 67.432 59.94 148.350 HDTV 1080P

1920*1080 67.5 60.00 148.5 HDTV 1080P

Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark640*350 31.468 70.80 25.17 EGA

720*400 31.469 70.08 28.32 DOS

640*480 31.469 59.94 25.17 VESA(VGA)800*600 37.879 60.31 40 VESA(SVGA)

1024*768 48.363 60 65 VESA(XGA)1280*768 47.776 59.87 79.5 VESA(WXGA)1360*768 47.72 59.799 84.75 VESA(WXGA)1366*768 47.7 60 84.62 WXGA

1280*1024 63.668 59.895 109.00 SXGA Only FHD

1920*1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD

Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark720x400 31.468 70.08 28.32

640x480 31.469 59.94 25.17 VESA(VGA)800x600 37.879 60.31 40.00 VESA(SVGA)

1024x768 48.363 60.00 65.00 VESA(XGA)1280x768 47.776 59.87 79.5 VESA(WXGA)1360x768 47.72 59.799 84.62 VESA(WXGA)1366x768 47.7 60 84.62 WXGA

1280x1024 63.595 60.0 108.875 SXGA Only FHD

1920x1080 66.647 59.988 138.625 WUXGA Only FHD

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8. HDMI input (PC)- Spec. out but display correctly at only HDMI/DVI IN 1 via DVI to HDMI Cable

Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out but display720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz720*480 31.47 59.94 27 SDTV 480P

720*480 31.5 60 27.027 SDTV 480P

720*576 31.25 50 27 SDTV 576P

1280*720 44.96 59.94 74.176 HDTV 720P

1280*720 45 60 74.25 HDTV 720P

1280*720 37.5 50 74.25 HDTV 720P

1920*1080 28.125 50 74.25 HDTV 1080I

1920*1080 33.72 59.94 74.176 HDTV 1080I

1920*1080 33.75 60 74.25 HDTV 1080I

1920*1080 56.25 50 148.5 HDTV 1080P

1920*1080 67.432 59.94 148.350 HDTV 1080P

1920*1080 67.5 60.00 148.5 HDTV 1080P

1920*1080 27 24 74.25 HDTV 1080P

1920*1080 33.75 30 74.25 HDTV 1080P

9. HDMI input (DTV)

7. RGB Input (Analog PC, DTV-NOT SUPPORT)

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ADJUSTMENT INSTRUCTION1. Application Range

This spec. sheet is applied all of the 32 LCD TV, LP81Gchassis (HURRICANE 5-Modified) by manufacturing LG TVPlant all over the world.

2. Specification1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolationtransformer will help protect test instrument.

2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of

255C of temperature and 6510% of relative humidity ifthere is no specific designation.

4) The input voltage of the receiver must keep 100-220V,50/60Hz.

5) Before adjustment, execute Heat-Run for 15 minutes at RFno signal.

3. Mstar Main S/W program download3-1. Preliminary steps

(1) Download method 1 (PCB Assy)- HD

(2) Connect the download jig to D-sub jack

3-2. Download steps(1) Execute ISP Tool program in PC, then a main window will

be opened

(2) Click the connect button and confirm Dialog Box.

(3) Click the Config button and Change speedE2PROM Device setting : over the 350Khz

(4) Read and write bin fileClick (1)Read tab, and then load download file(XXXX.bin)by clicking Read.

(5).Click Auto(2) tab and set as below(6).click Run(3).(7).After downloading, check OK(4) message.

(1)

f i l ex x x .bin

f i l ex x x .bin

(4) .......... OK

)(3

(2)

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4. USB DOWNLOAD4-1. Preliminary steps

(1) Put the USB Stick to the USB socket

(2) Automatically detecting update file in USB Stick

(3) Select Start Button and press ok button(4) Updating is staring.

(5) After finish firmware update, The TV set reset detect theupdate file automatically.

5. Auto Color Balance(ADC)-RGB* Required Equipments

- Remote controller for adjustment- MSPG-925F Pattern Generator

5-1. Method of Auto RGB Color Balance(1) Convert to RGB PC in Input-source(2) Input the PC 1024x768 @ 60Hz 1/2 Black & White Pattern

into RGB.(MSPG-925F model:60, pattern:54)

(3) Adjust by commanding AUTO_COLOR_ADJUST(0xF1)0x00 0x02 instruction.

5-2. Confirmation(1) We confirm whether 0xF1 (offset), 0xF2 (gain) address of

EEPROM 0xBC is 0xAA or not.(2) If 0xF1, 0xF2 address of EEPROM 0xBC isnt 0xAA,

we adjust once more(3) We can confirm the ADC values from 0x00~0x05

addresses in a page 0xBC* Manual ADC process using Service Remocon. After enter

Service Mode by pushing ADJ key, execute Auto-RGB bypushing G key at Auto-RGB.

6. Auto Color Balance(ADC)-Component6-1. Method of Auto Component Color Balance

(Component Gain/ Offset Adjustment)(1) Convert to Component in Input-source(2) Input the Component (Which has 720p@60Hz YPbPr

signal : 100% Color Bar into Component. (MSPG-925FModel: 217/ Pattern: 65 )

(3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)0x00 0x02 instruction

6-2. Confirmation(1) We confirm whether 0xF3 (offset), 0xF4 (gain) address of

EEPROM 0xBC is 0xAA or not.(2) If 0xF3, 0xF4 address of EEPROM 0xBC isnt 0xAA,

we adjust once more.(3) We can confirm the ADC values from 0x06~0x0B

adresses in a page 0xBC.* Manual ADC process using Service Remocon. After enter

Service Mode by pushing ADJ key, execute Auto-RGB bypushing G key at Auto-RGB

Before PCBA check, you have to change the Tool option, Areaoption and have to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)

7. Input Tool Option, Area Option(1) Equipment : adjustment remote control.(2) Profile : Must be changed the option value because being

different with some setting value depend onmodule maker, inch and market.

(3) Adjustment methodThe input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)* Refer to Job Expression of each main chassis assy

(EBTxxxxxxxx) for Option value

* Never push the IN-STOP KEY after completing the functioninspection.

** After TOOL Option/ Area Option change, you have to ACoff/oon (Plug out and in)

Before PCBA check , you have to change the Tool opition,Area option and have to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)

8. Check S/W version, USB Version8-1. Method

(1) Push In-start key on Adjust remote-control.(2) Check MainV3.xx USB V3.xx

9. EDID (The Extended Display Identification Data )/DDC (Display Data Channel) download

* CautionUse the proper signal cable for EDID Download

9-1. EDID DOWNLOAD* Caution:

- Never connect HDMI & D-SUB Cable at the same time.- Use the proper cables below for EDID Writing

* EDID Data

9-2. EDID DATA - LP81G Model

/ The data is same without Physical address

-> Physical address(F) : HDMI 1 -> 10, HDMI 2 -> 20

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ItemManufacturer IDVersionRevision

ConditionGSMDigital : 1Digital : 3

Data1E6D0103

For HDMI EDIDFor RGB EDID

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- Detail EDID Options are below (A, B, C, D, E, F) A. Product IDB. Serial No: Controlled on production lineC. Month, Year: Controlled on production line:

ex) Monthly: 09 09Year: 2007 -> 11

D. Model Name(Hex):

E. Checksum: Changeable by total EDID data

10. HDCP SETTING(High-Bandwidth Digital Contents Protection)

(1) Connect D-sub Signal Cable to D-Sub Jack(2) Input HDCP key with HDCP-key- in-program(3) HDCP Key value is stored on EEPROM(AT24C64) which

is From 0x80 addresses of 0xA0 page(4) AC off/ on and on HDCP button of MSPG925 and confirm

whether picture is displayed or not of using MSPG925(5) HDCP Key value is different among the sets.* Before HDCP Download, you have to Set th Configurationthat CMD delay. -> Configuration -> Option -> I2C(16 ByteWrite : 20ms, 128 Byte Read : 20ms, Read CMD Byte : 0.5ms,I2C Clock : 45KHz

11. Adjustment of White Balance(1) Purpose : Adjust the color temperature to reduce the

deviation of the module color temperature.

(2) Principle : To adjust the white balance without thesaturation, Fix the one of R/G/B gain to C0 anddecrease the others.

(3) Adjustment mode : Two modes of Cool and Warm(Medium data is automatically calibrated by the Cool data)

(4) Required Equipment1) Remote controller for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product,

(Should be used in the calibrated ch by CS-1000 (CH9)3) Auto W/B adjustment instrument(only for Auto

adjustment)

11-1. Connecting diagram of equipment formeasuring(For automatic adjustment)

(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-

run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition

of Heat-run (Maintain after AC off/on in status of Heat-runpattern display)

(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on in

status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off

command(F3 00 00) from adjustment equipment- Need to transmit the aging off command to TV set after

finishing the adjustment.- Check DDC adjust mode release by exit key and release

DDC adjust mode

(3) Enter the adjust mode of white balance- Enter the white balance adjustment mode with aging

command(F3, 00, FF)

* Luminance min value is 200cd/m2 in the cool mode (For LCD)

11-2. Adjustment of White Balance(for Manual adjustment)

(1) Adjustment mode : Two modes (Cool and Warm)(Medium data is automatically calibrated by the Cool data)

(2) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000(LCD : CH9, PDP : CH10)

(3) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.

(4) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing POWER

ON key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)

2) Push Exit key.3) Change to the AV mode by remote control.(Push front-

AV or Input key)4) Input external pattern(85% white pattern)5) Push the ADJ key two times (entering White Balance

mode)6) Stick the sensor to the center of the screen and select

each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C.

7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.8) Adjust two modes (Cool and Warm)

(Fix the one of R/G/B and change the others)9) When adjustment is completed, Exit adjustment mode

using EXIT key on R/C.

Model name Model Name(HEX)LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20

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* CASEFirst adjust the coordinate far away from the target value(x, y).

(1) x, y > target1) Decrease the R, G.

(2) x, y < target1) First decrease the B gain, 2) Decrease the one of the others.

- In case of decreasing the x, decreasing the R : fix G- In case of decreasing the y, decreasing the G : fix R

(3) x > target , y < target1) First decrease B, so make y a little more than the

target.2) Adjust x value by decreasing the R

(4) x < target , y > target1) First decrease B, so make x a little more than the

target.2) Adjust x value by decreasing the G

- Standard color coordinate and temperature when using theCA100+ or CA210 equipment

Mode Color coordinate Temp uvX Y

Cool 0.2760.002 0.2830.002 11,000K 0.000Warm 0.3130.002 0.3290.002 6,500K 0.003

LGE Internal Use OnlyCopyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 14 -

TROUBLESHOOTING1. No power

(1) Symptom1) It is not discharged minutely from module.2) Light does not come into the front LED.

(2) Check process

Plug in the power cord.No

Yes

Is plug in powercord inserted?

Connect the cable to SC100No

Yes

Are the line filter andPSU connected?

Replace the fuse.No

Yes

Is the fuse of PSUnormal? (F101)

Connect a cable P1100.

After all cables connect is removed to PSU, theAC voltage marking is authorized on manual.When ST-BY 5V is not operated. replace PSU.

No

Yes

Is it connectedthat PSU and P1100

in Main B/D?

LGE Internal Use OnlyCopyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 15 -

2. No Raster

(1) Symptom1) No OSD and image occur at screen. 2) It maintains the condition where the front LED is green.

(2) Check process

3. Unusual display from RF mode

Check the LCD Module

Replace thePower board.

Doesminute discharge

at Module?Is the inverter

/ VaVs on?

Is output the normalityLow/High voltage exceptStand-by 5V?

Yes

No No

Is the link cablenormal?

Yes

Is the IC801soutput normal?

Reconnect Panel line cable.(HD : P403, FHD : P402)

No

Replace the VSC.No

Yes

Check the power.

Isvideo output of the

Tuner normal? (CheckTU500_Pin13)

Is theinput voltage

normal?(CheckPin3)

Is the I2C communication normal?(Check Pin9, Pin10)

Yes

No Yes

Is the LVDSCable connected?

well

Yes

Change the IC(IC801)

Cable inserts well.No

No

Check the Tuner.

No

Block A

LGE Internal Use OnlyCopyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 16 -

4. Unusual display from rear AV mode.

Yes

Is video input ofthe A/V Jack normal?

(Check R8044)Check the input source.

Same as Block A.

No

5. Unusual display from Side AV model.

Yes

Is video input ofthe Side A/V Jack normal?

(Check R8043)Check the input source.

Same as Block A.

No

6. Unusual display from Side S-Video mode.

Yes

Is video input ofthe S-Video Jack normal?

(Check R8041/42)Check the input source.

Same as Block A.

No

LGE Internal Use OnlyCopyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 17 -

7. Unusual display from component 1 mode

Yes

Is videoinput of the Com1

Jack normal? (CheckR8011/12/13)

Check the input source.

Change IC801.

No

8. Unusual display from component 2 model

Yes

Is videoinput of the Com2

Jack normal? (CheckR8030/32/33)

Check the input source.

Change IC801.

No

9. Unusual display from RGB model

Yes

Is videoinput of the Com2

Jack normal? (CheckR8035/37/39)

Check the input source.

Change IC801.

No

- 18 - LGE Internal Use OnlyCopyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

Set on speakerin menu.

Download the EDID data..

Check the signal afterIC600 refer to circuitdiagram.

No No

No

Check the Tuner In/Out.No

No

Check the Speakercable.

No

Replace IC600.No

Replace IC801.No

Yes

Yes

All input(mode)is no sound.

Only HDMI isno sound.

Is the speakercable normal?

Is the speakeron it menu?

Yes

Only AV/COM2/PCinput is no sound.

Is the output ofIC600 normal?

Yes

Yes

Only RF is no sound.

Yes

Is IC801 operatednormality?

Yes

Replace IC601.

Replace Main B/D.

NoIs IC601/IC603operatednormality?

Yes

10. No Sound(1) Symptom

1) LED is green2) Screen display but sound is not output.

(2) Check process

LGE Internal Use OnlyCopyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 19 -

AV1

in

Side

AV in

(AV2

in)

Com

p1 in

Com

p2 in

RG

B in

(D/L)

AV o

ut

CVBS

IN

Y/Pb

/Pr I

N

R/G

/B/H

S/VS

IN

CVBS

IN

LIN

E O

UT

LIN

E IN

LIN

E_M

UTE

RF

(Tun

er)

PC A

udio

in

DIS

PLAY

MO

DULE

EDID

NVM

HD

MI1

HD

MI2

USB

DD

R M

EM

SERI

ALFL

ASH

NTP

3000

AD

igita

lAu

dio

AMP

MAI

N N

VM

MC7

4HC4

066

Audi

o SW

LM32

4X4

AM

P

BD20

41Pr

otec

t IC

EDID

NVM

DD

C/HD

P/CE

C

TMD

S(HD

MI in

)

DD

C/HP

D/CE

CTM

DS(

HDMI

in)

USB(

AV I/O

, Data

I/O)

+5V

PAR

T_I2

C

SW_R

ESET

I2S

OUT

LVD

S

MPE

G R

X/TX

MPE

G R

ESET

I2S

IN65

6 IN

DD

C

DD

C

AUDI

O_S

WLI

NE

INLI

NE

IN

LIN

E IN

Y/Pb

/Pr I

NLI

NE

IN

Y/C

IN

LIN

E IN

EDID

NVM

RO

M_I

2C

DSU

B_DD

C

x0.5

5

x0.5

5

x0.5

5

x0.5

5S_

VIDE

O_D

ETLI

NE_

MUT

E

LIN

E O

UT

CVBS

OUT

x4

x0.5

5LI

NE

INCV

BS IN

SIF

IN

TUNE

R_I2

C

PAR

T_I2

C

NTP

3000

AD

igita

lAu

dio

AMP

Mid

Cent

er

Mid

Woo

fer

32"

: 2E

A42

":

1EA

LGE6

891D

D

LGE6

991D

D

Mot

or

Mot

orO

P Am

p

OP

Amp

Lim

it S/

W

4lin

es2Lin

es

Zora

nVA

DD

IS-9

66XD

MPE

G D

ecod

er

DD

R M

EMSE

RIAL

FLAS

H

Tw Tw

BLOCK DIAGRAM

- 20 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes

300

122

123

200

510 5

11

500

125

806

802

804

801

530

803

821

540 52

1

121 1

20

900

910

550

805

400

420

43041

0

200T 20

0N

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

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IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

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ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

220K

R133

75R121

75R111

SD05

D105

220K

R108

COMP

1_R

COMP

1_Pb

PC_A

UD_R

CDS3

C05G

TA5.6

VD1

22

COMP

1_Y

SD05

D117

75R123

5.6V

D103

COMP

2_Pr

CDS3

C05G

TA5.6

VD1

23

PPJ2

09-0

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ACT

2A[GN

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AN

3A[GN

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2B[BL

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AN

5B[BL

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G_L

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AN1

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G_L

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AN

5D[W

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G_L

2E[RD

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AN2

4E[RD

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ACT

3E[RD

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RING

SD05

D106

5.6V

D104

COMP

2_L

220K

R119

COMP

1_Pr

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24E

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T3E

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SPRIN

G

SD05

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1000

-ohm

L100

PC_A

UD_L

COMP

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SD05

D118

1000

-ohm

L101

SD05

D107

COMP

2_Y

75R109

5.6V

D115

5.6V

D116

10K

R136

10K

R143

10K

R144

12K

R142

12K

R145

12K

R137

10K

R134

12K

R135

10K

R138

10K

R140

12K

R139

12K

R141

68R1

14

DSUB

_SCL

75R116

CDS3

C30G

TH30V

D112

DSUB

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STCD

S3C3

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VD1

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100

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MULT

I

75R1

17

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0.1u

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PC_G

CDS3

C30G

TH30

VD1

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0.1u

FC1

02

75R118

4.7K

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68R1

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0.1u

FC1

01

PC_R

PC_B

PC_V

S

68pF

C103

PC_H

S

0.1u

FC1

05

4.7KR113

68pF

C104

CDS3

C30G

TH30VD1

13

100

R124

ENKMC2837-T112

D109

A

AC

C

ENKMC2837-T112

D111

A

AC

C

ENKMC2837-T112

D108

A

AC

C

PEJ0

24-0

1JK

102

6BT_

TERM

INAL

2

8SH

IELD_

PLAT

E

7BB_

TERM

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2

5T_

SPRI

NG

4R_

SPRI

NG

7AB_

TERM

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1

6AT_

TERM

INAL

1

3E_

SPRI

NG

4.7KR1

274.

7KR1

26

6630

TGA0

04K

KCN-

DS-1-

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JK10

4

1RE

D

2GR

EEN

3BL

UE

4GN

D_1

5DD

C_GN

D

6RE

D_GN

D

7GR

EEN_

GND

8BL

UE_G

ND

9NC

10SY

NC_G

ND

11GN

D_2

12DD

C_DA

TA

13H_

SYNC

14V_

SYNC

15DD

C_CL

OCK

16SH

ILED

AT24

C02B

N-10

SU-1.

8

IC10

0

3A2

2A1

4GN

D

1A0

5SD

A

6SC

L

7WP

8VC

C

100

0pF

REA

DY

C11

3

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6

100

0pF

REA

DY

C11

4

0R14

7

100

0pF

REA

DY

C11

5

0R14

8

100

0pF

REA

DY

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6

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CO

MP

ON

EN

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SD

C 1

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k

PC

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11

20

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1

INP

UT

1 :

CO

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1/2

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G80

PC

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MC

2837-S

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S226009A

A (K

DS

22

6)

EA

X50659401

MS

TA

R L

P81G

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

-RAD

IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

ES SP

ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

220K

R212

0R21

0

1KR2

37M

NT_R

OUT

1KR2

36

5.6V

D209

MUT

E_LIN

E

10uF 16V

C209

470K

R230

CVBS

_LIN

OPT

C20

7

100u

F16

V

C206

SD05

D201

MNT

_LOU

T

CVBS

_RIN

10uF

16V

C208

10K

R228

5.6V

D204

75R208

220K

R209

CVBS

_VIN

470K

R229

75R2

27

5.6V

D202

MNT

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T

5.6V

D208

12K

R219

12K

R221

10K

R218

10K

R220

5.6V

D216

220K

R244

SIDE

_RIN

75R241

SD05

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SIDE

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5.6V

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SIDE

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SIDE

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SD05

D217 SD

05D2

18

S_VI

DEO_

DET

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12K

R248 12

KR2

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10K

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10K

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20

08

/02

/20

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

-RAD

IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

ES SP

ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

1KR319

+5V_

HDMI

_2

HDM

I1_C-

HDM

I1_0-

HPD_

MST

_2

HDM

I1_C+

CEC_

C

CEC

HDM

I1_5V

_DET

10K

R300

HDM

I1_0+

+3.3V

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TI_M

ST

1KR310

CEC

HDM

I1_1-

HDM

I1_2-

HDM

I2_5V

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ST

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CL

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NC

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DD

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.

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.

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20

08

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Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

THE

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MAR

K OF

THI

S SCH

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IC D

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Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

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11

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LG80

EA

X50659401

MS

TA

R L

P81G

Ne

ar t

he

pin

2008

/02/

20

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

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AL C

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PWM_3B/PWM_HP2

23

PWM_3A/PWM_HP1

24

PROTECT

25

FAULT

26

VDR2B

27

BST2B

28

PGND2B_1

29PG

ND2B

_2

30OU

T2B_

1

31OU

T2B_

2

32PV

DD2B

_1

33PV

DD2B

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34PV

DD2A

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35PV

DD2A

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36OU

T2A_

1

37OU

T2A_

2

38PG

ND2A

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39PG

ND2A

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40BS

T2A

41VD

R2A

42NC

_2

43

VDR1B

44

BST1B

45

PGND1B_1

46

PGND1B_2

47

OUT1B_1

48

OUT1B_2

49

PVDD1B_1

50

PVDD1B_2

51

PVDD1A_1

52

PVDD1A_2

53

OUT1A_1

54

OUT1A_2

55

PGND1A_1

56

PGND1A_2

10uF

16V

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L613

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L618

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36NC1

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41VSS2

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45DQ10

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