lg 32lh20 servicemanual
DESCRIPTION
Service ManualTRANSCRIPT
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LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91A
MODEL : 32LH20R 32LH20R-LA/TA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING ............................................................................14
BLOCK DIAGRAM...................................................................................17
EXPLODED VIEW .................................................................................. 18
SVC. SHEET ...............................................................................................
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument'sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500F to 600F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500F to 600F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500F to 600F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification4.1. General Specification
1. Application rangeThis spec sheet is applied to LCD TV used LP91A chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature : 255C (779F), CST : 405C2) Relative Humidity : 6510%3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed
each drawing and specif ication by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
- Safety: CE, IEC specification- EMC : CE, IEC
No Item Specification Measurement Remark1 Screen Size 32 wide Color Display Module Resolution : 1366*7682 Aspect Ratio 16:93 LCD Module 32 TFT WXGA LCD4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 85 %5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %6 Input Voltage AC100-240V~, 50/60Hz
150 W 32 HD7 LDC Module HD 760 x 450 x 48 Unit : mm
(Maker : LGD) 0.17025 x 0.5107512 EEFL
Coating 3H
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- 7 - LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
No. Item Min. Typ. Max. Unit Maker Remark1. Luminance 400 500 cd/m2
(W/O PC mode)2. VIew angle (R/L, U/D) 178 / 178 degree LGD3. Color Coordinates White Wx Typ 0.279 Typ LGD 32(HD)
Wy -0.03 0.292 +0.03RED Xr 0.636
Yr 0.335Green Xg 0.291
Yg 0.613Blue Xb 0.146
Yb 0.0614. Contrast ratio 700:1 1000:15. Luminance Variation 1.3
5. Chroma& Brightness (Optical)5.1. LCD Module
the Color Coordinates check condition - 50cm from the surface, Full White Pattern- Picture mode Vivid
6. Component Video Input (Y, PB, PR)No Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz4 720* 480 31.47 59.94 27.000 SDTV 480P5 720* 480 31.50 60.00 27.027 SDTV 480P6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz7 1280* 720 44.96 59.94 74.176 HDTV 720P8 1280* 720 45.00 60.00 74.250 HDTV 720P9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,11 1920* 1080 33.72 59.94 74.176 HDTV 1080I12 1920* 1080 33.75 60.00 74.25 HDTV 1080I13 1920* 1080 56.25 50 148.5 HDTV 1080P14 1920* 1080 67.432 59.94 148.350 HDTV 1080P15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
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- 8 - LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
No Specification Proposed RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA2 720* 400 31.469 70.09 28.32 DOS3 640* 480 31.469 59.94 25.17 VESA( VGA)4 800* 600 37.879 60.317 40 VESA( SVGA)5 1024* 768 48.363 60.004 65 VESA( XGA)6 1280* 768 47.776 59.87 79.5 VESA( WXGA)7 1360* 768 47.72 59.799 84.75 VESA( WXGA)8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
7. RGB7.1. Analog PC, RGB- DTV NOT SUPPORT
8. HDMI Input8.1. PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark1 640 x 480 31.469 59.94 25.17 VESA( VGA)2 800 x 600 37.879 60.317 40.00 VESA( SVGA)3 1024 x 768 48.363 60.004 65.00 VESA( XGA)4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)5 1360 x 768 47.72 59.799 84.62 VESA( WXGA) 6 1366 x 768 47.7 60.00 84.62 WXGA7 1280 x 1024 63.595 60.00 108.875 SXGA8 1920 x 1080 66.647 59.988 138.625 WUXGA
8.2. DTV Mode
No Specification RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz 4 720 x 480 31.47 59.94 27 SDTV 480P5 720 x 480 31.5 60.00 27.027 SDTV 480P6 720 x 576 31.25 50.00 27 SDTV 576P7 1280 x 720 44.96 59.94 74.176 HDTV 720P8 1280 x 720 45 60.00 74.25 HDTV 720P9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P16 1920 x 1080 27 24.00 74.25 HDTV 1080P17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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ADJUSTMENT INSTRUCTION1. Application Range
This specification sheet is applied to all of the LCD TV,LP91A/B/C/D chassis.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25 5 C of temperature and 6510% of relative humidity ifthere is no specific designation.
4) The input voltage of the receiver must keep 100~220V,50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.
3. Adjustment items3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.(3) Download the EDID
- EDID datas are automatically download when adjustingthe Tool Option2
(4) ADC Calibration RGB / Component(4) Check SW Version.
3.2. SET assembly adjustment items(1) Input Area option(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Intelligent Sensor Inspection Guide(5) Preset CH information(6) Factoring Option Data input
4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig
(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack
(2) Download steps1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened2) Click the Connect button and confirm Dialog Box
3) Click the Config. button and Change speed I2C Speedsetting : 350Khz~400Khz
4) Read and write bin file.Click (1)Read tab, and then load downloadfile(XXXX.bin) by clicking Read.
- LH20/ LH30
1
Filexxx.bin
1
Filexxx.binFilexxx.bin
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5) Click (2)Auto tab and set as below6) Click (3)Run.7) After downloading, you can see the (4)Pass message.
4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the ISB port.2) Automatically detect the SW Version.
-> S/W download process is executed automatically.3) Show the message Copy the file from the Memory
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Input tool option.Adjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process- Area Option Input : Set Assembly Process
After Input Tool Option and AC offBefore PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because beingdifferent with some setting value depend onmodule maker, inch and market
(2) Equipment : adjustment remote control.
(3). Adjustment method- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)
Refer to Job Expression of each main chassis assy(EBTxxxxxxxx) for Option value Caution : Dont Press IN-STOP key after completing thefunction inspection.
4.3. EDID D/L methodRecommend that dont connect HDMI and RGB(D-SUB) cablewhen downloading the EDID.If not possible, recommend that connect the MSPG equipment.There are two methods of downloading the edid data
4.3.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2seconds.
4.3.2. 2nd Method* Caution :
Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not bedownloaded well.
1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key(G)3) Press the right direction key(G) at Start.4) After about a few seconds, appear OK, then compele.
4.3.3. RS-232C command Method(1) Command : AE 00 10
* Caution Dont connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of edid could befailed.
- 10 - LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
1
Filexxx.bin
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4.3.4. EDID data(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
4.4. ADC Calibration4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : Component by using D/E
(CH +/-) and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
4.4.2. ADC Calibration - RGB (Using External pattern)(1) Required Equipments
- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : RGB by using D/E(CH +/-)
and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
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OK
OK
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4.5. Check SW Version(1) Method
1) Push In-star key on Adjust remote-controller.2) SW Version check
Check SW VER : V3.xx LH70
5. PCB assembly adjustment method5.1. Input Area-Option
(1) Profile : Must be changed the Area option value becausebeing different of each Countrys Language andsignal Condition.
(2) Equipment : adjustment remote control.(3) Adjustment method
- The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.)
Refer to Job Expression of each main chassis assy(EBTxxxxxxxx) for Option value.
* White Balance Adjustment- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)and decrease the others.
- Adjustment mode : Three modes Cool / Medium / Warm- Required Equipment
1) Remote controller for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV( ch : 9 ),(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
5.2. Adjustment of White Balance: (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC Communication-White Balance Mode.
(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)- Enter the white balance adjustment mode with aging
command (F3, 00, FF)* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance(for Manual adjustment)(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.(3) For manual adjustment, it is also possible by the following
sequence.1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push Exit key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter 0000 (Password)6) Select 3. W/B ADJUST7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others11) When adjustment is completed, Enter COPY ALL.12) Exit adjustment mode using EXIT key on R/C.
- 12 - LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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* CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target
i) Decrease the R, G. 2. x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R
4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment
To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)
- 13 - LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Coordinate Mode
x y Temp uv
Cool 0.2760.002 0.2830.002 11,000K 0.000Medium 0.2850.002 0.2930.002 9,300K 0.000Warm 0.3130.002 0.3290.002 6,500K 0.003
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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TROUBLESHOOTING
No power(LED indicator off)
Check 24V, 12V, 5,2V of Power B/D
Check short of Main B/D or Change Power B/D
Pass
Check Output of IC1001, IC1003, IC1007
Check P307 Connector
Change LED Assy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assy
Change IC1002,, Q1003
Pass
Check short of IC1001,IC1003, IC1007
Fail
Re-soldering or Change defectpart of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED statusOn Display Unit Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802Fail
Change Inverter ConnectorOr InverterFail
Pass
Fail
Pass
Change ModuleFail
Check LVDS Cable
Pass
Check Panel Link Cable Or Module
Change Panel Link CableOr Module
Check Inverter ConnectorOr Inverter
Pass
-
LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
No Raster on PC Signal
Check Input source Cableand Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC100 Fail
Re-soldering or Change the defect part,Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/OutputOf J104 Fail
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source Cable And Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Check The Input/OutputOf JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source Cable And Jack
Pass
Check the Input/OutputOf JK301, JK302, JK303 Fail
Re-soldering or Change the defect part
Pass
Pass
Check the Input/OutputOf IC300, IC301, JK302 Fail
Re-soldering or Change the defect partCheck HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
-
LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
No Sound
Check The Input Sourse.
Check The Input/OutputOf IC600.
Re-soldering or Change the defect part.Fail
Pass
Pass
Check The Speaker. Change Speaker.Fail
Check The Speaker Wire.
Pass
Change The Source Input.Fail
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source Cable And Jack
Pass
Check Input source Cable And Jack
Pass
Check The Input/OutputOf JK101, JK201
Pass
Re-soldering or Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
Check The Input/OutputOf TU500
Pass
Re-soldering or Change the defect part
Pass
Fail
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
-
LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 17 -
BLOCK DIAGRAM
RG
B_
PC
PC_
Audi
o
TV (RF)
CO
MP1
HD
MI1
HD
MI2
RS2
32
TX
232C
D
rive
rST
3232
CTx
/Rx
:
15Vp
p
PC_
R/G
/B/H
S/VS
PC_
Au
dio
_L/
R :7
00m
Vrm
s
MN
T_O
UT:
1Vp
p
SID
E_V
:1Vp
p
SID
E_L/
SID
E_R
:500m
Vrm
s
DD
R2(
512M
B)
L_SP
K_O
UT
R_
SPK_
OU
T
EEPR
OM
24C
02
Com
p1_
L/R
:500m
Vrm
s
TUN
ER
AV1
_VI
N:
1Vpp
AV1
1_LI
N/R
IN :5
00m
Vrm
s
PWM
NTP
3100
L
MN
T_O
UT
MN
T_LO
UT/
RO
UT:
500m
Vrm
s
AV2
(Sid
e A
V)
MAI
N SC
ALER
TXD
/R
XD : 5
V D
igita
l
CO
MP1
_Y/
Pb/P
r: 1/
0.7V
ppC
OM
P2_
Y/Pb
/Pr: 1/
0.7V
pp
IR HD
MI_
DAT
A_1
HD
MI_
DAT
A_2
HD
MI1
_SC
L/SD
A
OU
T_E_
TX_
CLK
OU
T_E_
TX_
EO
UT_
E_TX
_D
OU
T_E_
TX_
CO
UT_
E_TX
_B
OU
T_E_
TX_
ATU
_M
AIN
S I F
CO
MP1
_Y/
Pb/P
r 1/
0.7V
pp
AV1
_VI
N
PC_
Au
dio
_L/
R
CO
MP1
_LI
N/R
IN
L_C
HR
_CH
LVDSconnector
TU_
MA
INSU
B_
SCL
SDA
EEPR
OM
24C
02
EEPR
OM
24C
02
SIF
AV1
_LI
N/R
IN
MN
T_L/
R O
UT
AV1
MN
T_O
UT
Com
p2_
L/R
:500m
Vrm
s
CO
MP2
_Y/
Pb/
:1/
0.7V
pp
CO
MP2
_LI
N/R
IN
CO
MP2
OU
T_O
_TX
_C
LK
OU
T_O
_TX
_E
OU
T_O
_TX
_D
OU
T_O
_TX
_C
OU
T_O
_TX
_B
OU
T_O
_TX
_A
PC_
R/G
/B/H
S/VS
HD
M2_
SCL/
SDA
PC_
SCL/
SDA
MN
T_VO
UT
AV2
_VI
NA
V2_
LIN
/RIN
IIS_
OU
T
USB
USB
_D
N/P
N
AUD
IOAM
P
HD
MI3
_SC
L/SD
AEE
PRO
M24
C02
HD
MI_
DAT
A_3
TMD
STM
DS
TMD
SH
DM
I3
USB
For
D/L
EEPR
OM
(256
K)
Seria
l Fla
sh
(8M
Byt
e)
RG
B_
PC
PC_
Audi
o
TV (RF)
CO
MP1
HD
MI1
HD
MI2
RS2
32
TX
232C
D
rive
rST
3232
C
PC_
R/G
/B/H
S/VS
PC_
Au
dio
_L/
R :7
00m
Vrm
s
MN
T_O
UT:
1Vp
p
SID
E_V
:1Vp
p
SID
E_L/
SID
E_R
:500m
Vrm
s
DD
R2(
512M
B)
EEPR
OM
24C
02
Com
p1_
L/R
:500m
Vrm
s
TUN
ER
AV1
_VI
N:
1Vpp
AV1
1_LI
N/R
IN :5
00m
Vrm
s
PWM
NTP
3100
L
MN
T_O
UT
MN
T_LO
UT/
RO
UT:
500m
Vrm
s
AV2
(Sid
e A
V)
MAI
N SC
ALER
TXD
/R
XD : 5
V D
igita
l
CO
MP1
_Y/
Pb/P
r: 1/
0.7V
ppC
OM
P2_
Y/Pb
/Pr: 1/
0.7V
pp
HD
MI_
DAT
A_1
HD
MI_
DAT
A_2
_
OU
T_E_
TX_
CLK
OU
T_E_
TX_
O
UT_
E_TX
_
OU
T_E_
TX_
C
OU
T_E_
TX_
B
OU
T_E_
TX_
A
TU_
MA
IN
S I F
CO
MP1
_Y/
Pb/P
:1/
0.7V
pp
AV1
_VI
N
PC_
Au
dio
_L/
R
CO
MP1
_LI
N/R
IN
L_C
HR
_CH
LVDSconnector
TU_
MA
IN/
EEPR
OM
24C
02
EEPR
OM
24C
02
SIF
AV1
_LI
N/R
IN
MN
T_L/
R O
UT
AV1
MN
T_O
UT
Com
p2_
L/R
:500m
Vrm
s
CO
MP2
_Y/
Pb/P
r1/
0.7V
pp
CO
MP2
_LI
N/R
IN
CO
MP2
OU
T_O
_TX
_C
OU
T_O
_TX
_E
OU
T_O
_TX
_D
OU
T_O
_TX
_C
OU
T_O
_TX
_B
OU
T_O
_TX
_A
PC_
R/G
/B/H
S/VS
PC_
SCL/
SDA
PC_
SCL/
SDA
MN
T_VO
UT
AV2
_VI
NA
V2_
LIN
/RIN
IIS_
OU
T
USB
USB
_D
N/P
N
AUD
IOAM
P
HD
MI3
_SC
L/SD
AH
DM
I3_
SCL/
SDA
EEPR
OM
24C
02H
DM
I_D
ATA_
3
TMD
STM
DS
TMD
SH
DM
I3
USB
For
D/L
EEPR
OM
(256
K)
Seria
l Fla
sh
(8M
Byt
e)
-
- 18 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
300
200
801
802
803
804
805
806
520
530
540
550
400
900
120
510
500
320
200T
200N
310
LV1
A2A1
0
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
-
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATUR
ES IM
PORT
ANT
FOR
PRO
TECT
ION
FRO
M X
-RAD
IATI
ON.
FILR
E AN
D E
LECT
RICA
L SH
OCK
HAZ
ARDS
, WHE
N SE
RVIC
ING
IF IS
ES
SENT
IAL
THAT
ONL
Y M
ANUF
ATUR
ES S
PECF
IED
PART
S BE
USE
D FO
RTH
E CR
ITIC
AL C
OM
PONE
NTS
IN T
HE
SYM
BOL
MAR
K O
F TH
E SC
HEM
ETIC
.
CVBS
_LIN
MUTE
_LIN
EAU
DIO_
R
SD05
ZD10
0
100u
F16
VC1
02
SD05
ZD10
3
SD05
ZD10
5
MNT_
ROUT
CVBS
_VIN
SPK_
R+_H
OTEL
RT1C
3904
-T11
2Q1
00E
BC
SPK_
R-_H
OTEL
CVBS
_RIN
SD05
ZD10
4
10uF
16V
C101
MUTE
_LIN
E
SD05
ZD10
1
SD05
ZD10
2
MNT_
LOUT
RT1C
3904
-T11
2Q1
01E
BC
MNT_
VOUT
10uF
16V
C100
30V
NON_
HOTE
L_OP
TD1
02
30V
NON_
HOTE
L_OP
TD1
03
30V
D101
30V
ADUC
30S0
3010
L_AM
ODIO
DE
D100
30V
D104
30V
D105
COMP
2_Y
COMP
2_PB
COMP
2_PR
COMP
2_L
COMP
2_R
S_VI
DEO_
DET
SIDE
_Y
SIDE
_C
+3.3V
_MUL
TI_M
ST
OPT
REA
DY
C10
4
30V
D10630V
D107
SD05
ZD10
6
SD05
ZD10
7
PS
J01
4-0
1JK
101
S-V
IDE
O
GN
D6
1
C-L
UG
1
2C
-LU
G2
30-
SP
RIN
G
4C
-LU
G3
5C
-LU
G4
SHIE
LD
7
75R1
02
0HO
TEL_
OPT
R103
0HO
TEL_
OPT
R105
0NO
N_HO
TEL_
OPT
R106
0HO
TEL_
OPT
R101
75R109
75R108
75R107
220K
R104
12K
R118
12K
R117
12K
R119
12K
R120
10K
R113
10K
R115
10K
R116
220K
R100
220K
R111
220K
R112
75R110
75R122
S-V
IDE
O
75R121
S-V
IDE
O
10K
R12
3
100p
FRE
ADY
C103
10K
R114
PPJ2
26-0
1JK
100
9A[GN
]1P_C
AN4A
[GN]O-
SPRIN
G_A
3A[GN
]CONT
ACT_A
9B[BL
]1P_C
AN8B
[BL]C-
LUG_
A9C
[RD]1P
_CAN
_18C
[RD]C-
LUG_
A9D
[WH]1
P_CAN
8D[W
H]C-LU
G_A_
19E
[RD]1P
_CAN
_24E
[RD]O
-SPRIN
G_A_
13E
[RD]CO
NTAC
T_A_1
9F[YL
]2P_C
AN4F
[YL]O-
SPRIN
G_A
3F[YL
]CONT
ACT_A
9G[W
H]2P_C
AN8G
[WH]C
-LUG_
A_2
9H[RD
]2P_C
AN4H
[RD]O
-SPRIN
G_A_
23H
[RD]CO
NTAC
T_A_2
5J
[YL]
O-S
PRIN
G_B
6J
[YL]
CON
TACT
_B
7K[W
H]C
-LU
G_B
5L[R
D]O
-SPR
ING
_B
6L[R
D]C
ON
TACT
_B
1 9
20
08
/12
/16
INP
UT
1
MS
TA
R N
-EU
EAX
5685
6904
H6
LCD
MER
CURY
PO
P N
OIS
E
MNT_OUT
COMPONENT1
PO
P N
OIS
E
AV1
COM
PON
ENT1
, AV
1, M
NT_
OU
T[JA
CK PA
CK T
YPE
D] : J
K100
S-V
IDE
O(C
hin
a M
od
el)
INP
UT
1 : C
OM
PO
NE
NT
1, S
-VID
EO
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
-
USB_
DN
USB_
DP
THE
SYM
BOL
MAR
K OF
THI
S SCH
EMET
IC D
IAGR
AM IN
CORP
ORAT
ESSP
ECIA
L FE
ATUR
ES IM
PORT
ANT
FOR
PROT
ECTI
ON FR
OM X
-RAD
IATI
ON.
FILR
E AN
D EL
ECTR
ICAL
SHOC
K HA
ZARD
S, W
HEN
SERV
ICIN
G IF
IS
ESSE
NTIA
L THA
T ONL
Y M
ANUF
ATUR
ES SP
ECFI
ED PA
RTS B
E USE
D FO
RTH
E CR
ITIC
AL C
OMPO
NENT
S IN
THE
SYM
BOL
MAR
K OF
THE
SCHE
MET
IC.
SIDE
_LIN
SIDE_
RIN
5.6
BZ
D20
3
SIDE_
V
PP
J21
8-0
1JK
201
5C[RD
]CONT
ACT
2C[RD
]U_CA
N
4C[RD
]O_S
PRIN
G2B
[WH]U
_CAN
3B[W
H]C_LU
G2A
[YL]U_
CAN
5A[YL
]CONT
ACT
4A[Y
L]O_S
PRIN
G5
.6B
ZD
202
USB DOWN STREAM
KJA-UB-4-0004
SID
E_U
SB
JK20
4
1 2 3 4
5
IR_O
UT
+3.3V
_MST
TXD
4.7K
R204
ST32
32CD
RIC
200
3C1
-
2V+
4C2
+
1C1
+
6V-
5C2
-
7T2
OUT
8R2
IN9
R2OU
T
10T2
IN
11T1
IN
12R1
OUT
13R1
IN
14T1
OUT
15GN
D
16VC
C
4.7K
R205
RXD
KCN-
DS-1
-008
8JK
200
1 2 3 4 5
6 7 8 9 10
+3.3V
_MST
+5VS
T_MS
T
6630
TGA0
04K
KCN-
DS-1-
0089
JK20
2
1RE
D
2GR
EEN
3BL
UE
4GN
D_1
5DD
C_GN
D
6RE
D_GN
D
7GR
EEN_
GND
8BL
UE_G
ND
9NC
10SY
NC_G
ND
11GN
D_2
12DD
C_DA
TA
13H_
SYNC
14V_
SYNC
15DD
C_CL
OCK
16SH
ILED
SD05
ZD20
0
DSUB
_SDA P
C_VS
SD05
ZD20
1
ENKMC2837-T112
D211
A
AC
C
PC_B
ENKMC2837-T112
D210
A
AC
C
PEJ0
24-0
1JK
203
6BT_
TERM
INAL
2
8SH
IELD_
PLAT
E
7BB_
TERM
INAL
2
5T_
SPRI
NG
4R_
SPRI
NG
7AB_
TERM
INAL
1
6AT_
TERM
INAL
1
3E_
SPRI
NG
DSUB
_SDAPC_A
UD_R
PC_G
DSUB
_SCL
CA
T24
C02
WI-
GT
3IC
20
1
3A
2
2A
1
4V
SS
1A
0
5SD
A
6SC
L
7W
P
8V
CC
ENKMC2837-T112
D212
A
AC
C
DDC_
WP
PC_H
S
PC_A
UD_L
+5V_
MULT
I
DSUB
_SCL
PC_R
CDS3
C30G
TH30
VD2
02 CDS3
C30G
TH30
VD2
03
ADUC
30S0
3010
L_AM
ODIO
DE
30V
D200
ADUC
30S0
3010
L_AM
ODIO
DE
30V
D201
30V
D206
30V
D205
ADUC
30S0
3010
L_AM
ODIO
DE
30V
D204
ADUC
30S0
3010
L_AM
ODIO
DE 30
VD2
09
30V
D20
8
REA
DY
30V
D20
7
REA
DY
USB_
DL_N
USB_
DL_P
0
REA
R_U
SBR
229
0
REA
R_U
SB
R23
0
USB DOWN STREAM
UB01123-4HHS-4F
JK20
5R
EAR
_USB
1 2 3 4
5
0.1u
FC2
03
0.1u
FC2
00
0.1u
FC2
01 0.1u
FC2
02
0.0
1u
FC
205
0.1
uF
C20
40
.1u
FC
206
0.1
uF
C20
7
100
R202
100
R203
75R227
220K
R223
REA
DY
220K
R222
REA
DY
12KR2
26
12K
R228
75R211
75R212
75R213
4.7KR214
4.7K
R215
220K
R231 220K
R232
10K
R233
10K
R234
12K
R235
12K
R236
4.7K
R220
4.7KR2
21
100
R216
100
R217
100
R218
0.1u
FOC
P_RE
ADY
C208
MIC
2009
YM6-T
R OC
P_RE
ADY
IC20
2
3EN
ABLE
2GN
D
4FA
ULT/
1VI
N6
VOUT
5IL
IMIT
10uF
OCP_
READ
YC2
09
120O
HMOC
P_RE
ADY
L200
+5V_
USB
1K OCP_
READ
Y
R209
4.7K
OCP_
READ
YR2
10
0No
n_OC
PR2
37
10uF
6.3V
C210
USB_
DL_N
USB_
DL_P
68R20
7
68R20
8
68pF
C21
3
68pF
C21
1
4.7K
R219
REA
DY
0R20
0
0R20
1
500
L201
22
0uF
16V
C21
2
100
uF16
VC
214
KD
S226
D21
3
OC
P_R
EAD
Y
AA
CC
510
OCP_
READ
YR2
38
160
OCP_
READ
YR2
06
10K
R224
10K
R225IR_O
UT
2 9
INP
UT
2
MS
TA
R N
-EU
20
08
/12
/16
INP
UT
2 :
PC
,RS
-23
2C
,SID
E A
V,U
SB
US
B
EAX
5685
6904
H6
LCD
MER
CURY
Its
pos
sibe
l to
27~4
7ohm
**
1
A D
esi
gn
SID
E A
V
RS-2
32C
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EM)
PC ED
ID
PC PC SO
UND
Pin
to
Pin
wit
hE
AN
4343
9401
Clo
se t
o S
IDE
_U
SB
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
-
TMDS
3_RX
2-
+5V_
HDMI
_2
TMDS
3_RX
C-
HPD_
MST
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3_RX
0+
TMDS
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2-
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C-TM
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C-
TMDS
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1+
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HDMI
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MULT
I
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HDMI
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2+
TMDS
2_RX
0-
TMDS
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1-
TMDS
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TMDS
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HDMI
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MULT
I+5
V_HD
MI_3
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0-
TMDS
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C+
HPD_
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DDC_
SDA2
DDC_
SCL2
DDC_
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DDC_
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JP3
04
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05
JP3
01
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02
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03
2SC3
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100
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SE
MS
T H
PD
H6
LCD
MER
CURY
EAX5
6856
904
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
-
TXCE
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XCO3
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XCO4
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47pF
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R430
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FC4
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ON
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22_2
6"
KEY1
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1
120o
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6"
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0
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1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51
52
FF
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1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
31
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HDR4
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TXCO
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EAX
5685
6904
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LCD
MER
CURY
LV
DS
,CT
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MS
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00
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Ex
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al V
BR
PA
NE
L W
AF
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IR
(19
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(19
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HD
(19
/22
")
IR
(No
n 1
9/2
2/2
6)
CO
NT
RO
L K
EY
(Non 1
9/2
2/2
6)
*8B
IT(F
HD):2
2/27"
HD
(26
/32
/37
/42
/47
")
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
-
MAI
N_SIF
0.01
uFC5
01
M_SD
A
27pF
C500
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TUNE
R
TV_M
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M_SC
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THE
SYM
BOL
MAR
K OF
THI
S SCH
EMET
IC D
IAGR
AM IN
CORP
ORAT
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ECIA
L FE
ATUR
ES IM
PORT
ANT
FOR
PROT
ECTI
ON FR
OM X
-RAD
IATI
ON.
FILR
E AN
D EL
ECTR
ICAL
SHOC
K HA
ZARD
S, W
HEN
SERV
ICIN
G IF
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NTIA
L THA
T ONL
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ECFI
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9
MS
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H6
LCD
MER
CURY
EAX5
6856
904
Ne
ar t
he
pin
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
-
0.1u
FC6
44
0.1u
FC6
37
M_SDA
1000
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26
0.01
uFC6
13
330u
F35
VC6
12
THE
SYM
BOL
MAR
K OF
THI
S SCH
EMET
IC D
IAGR
AM IN
CORP
ORAT
ESSP
ECIA
L FE
ATUR
ES IM
PORT
ANT
FOR
PROT
ECTI
ON FR
OM X
-RAD
IATI
ON.
FILR
E AN
D EL
ECTR
ICAL
SHOC
K HA
ZARD
S, W
HEN
SERV
ICIN
G IF
IS
ESSE
NTIA
L THA
T ONL
Y M
ANUF
ATUR
ES SP
ECFI
ED PA
RTS B
E USE
D FO
RTH
E CR
ITIC
AL C
OMPO
NENT
S IN
THE
SYM
BOL
MAR
K OF
THE
SCHE
MET
IC.
SPK_
L-SP
K_R+
+1.8V
_DVD
D
SPK_
R-
SMA
W25
0-04
P60
0
1 2 3 4SP
K_L+
+1.8V
_AVD
D
+1
.8V
I2S_M
CLK
I2S_SDO
I2S_WS
I2S_SCK
390p
FC6
19
390p
FC6
21
390p
FC6
30
390p
FC6
34
1uF
C608
1uF
C618
1uF
C624
1uF
C614
0.1u
F50
VC6
07
10uF
35V
C64
2R
EAD
Y
+12
V_A
UD
IO
MNT
_R_A
MP
+12
V_A
UD
IO
RT
1C39
04-T
112
Q60
0
E
B
C
RT
1C39
04-T
112
Q60
1
E
B
C
MNT
_L_A
MP
0.01
uFC6
35
MNT
_ROU
T
+12
V_A
UD
IO
LM32
4D
IC60
1
3IN
PUT1
+
2IN
PUT1
-
4VC
C
1OU
T1
6IN
PUT2
-
5IN
PUT2
+
7OU
T28
OUT3
9IN
PUT3
-10
INPU
T3+
11GN
D
12IN
PUT4
+
13IN
PUT4
-14
OUT4
6800
pFC
628
6800
pFC
627
MNT
_LOU
T
AUDI
O_R
SPK_
R-_H
OTEL
SPK_
R+_H
OTEL
1250
5WR-
09A0
0HO
TEL_
OPT
P601
1 2 3 4 5 6 7 8 9
10
0.1u
FHO
TEL_
OPT
C636
+16V
_NTP
RT1C
3904
-T11
2HO
TEL_
OPT
Q602
E
BC
AMP_
MUTE
_HOT
EL
+3.3V
_MUL
TI_MS
T SW_R
ESET
10uF
16V
C600
10uF
16V
C604
10uF
16V
C609
3.3
R604
12R608
12R611
12R610
12R638
4.7K
R663
4.7K
R623
3.3
R626
3.3
R625
100
R601
3.3K
R600
100 R676
100
R677
100 R678
100
R602
100
R603
0
R656
HOTEL_OPT
0R6
73
12R658
12R653
12R621
12R654
4.7K
R628
4.7K
R667
3.3
R671
3.3
R635
1KR60
7
10K
NO
N_H
OTE
L_O
PT
R613
12K
HO
TEL_
OPT
R613
-* 5.6K
R614
5.6K
R615
10K
NO
N_H
OTE
L_O
PT
R616
12K
HO
TEL_
OPT
R616
-*
1KR
609
4.7
KR
606
200
HOTE
L_OP
TR6
12
10K
HOTE
L_OP
TR6
17
0HO
TEL_
OPT
R620 0
HO
TEL_
OPT
R619
4.7
KR
605
33pF
C631
33pF
C633
0.1u
FC6
20 0.1u
FC6
22
6.8K
R618
6.8K
R622
NTP-
3100
LIC
600
1BS
T1A
2VD
R1A
3RE
SET
4AD
5DV
SS_1
6VS
S_IO
7CL
K_I
8VD
D_IO
9DG
ND_P
LL
10AG
ND_P
LL
11LF
M
12AV
DD_P
LL
13DV
DD_P
LL
14TE
ST0
15
DVSS_2
16
DVDD
17
SDATA
18
WCK
19
BCK
20
SDA
21
SCL
22
MONITOR_0
23
MONITOR_1
24
MONITOR_2
25
FAULT
26
VDR2B
27
BST2B
28
PGND2B_1
29PG
ND2B
_2
30OU
T2B_
1
31OU
T2B_
2
32PV
DD2B
_1
33PV
DD2B
_2
34PV
DD2A
_1
35PV
DD2A
_2
36OU
T2A_
1
37OU
T2A_
2
38PG
ND2A
_1
39PG
ND2A
_2
40BS
T2A
41VD
R2A
42NC
43
VDR1B
44
BST1B
45
PGND1B_1
46
PGND1B_2
47
OUT1B_1
48
OUT1B_2
49
PVDD1B_1
50
PVDD1B_2
51
PVDD1A_1
52
PVDD1A_2
53
OUT1A_1
54
OUT1A_2
55
PGND1A_1
56
PGND1A_2
MLB
-201
209-
0120
P-N2
0LCM
L000
03B
120-
ohm
L605
MLB
-201
209-
0120
P-N2
0LCM
L000
03B
120-
ohm
L606
33pF
50V
C63
8
REA
DY
33pF
50V
C63
9
REA
DY
+3.3V
_MST
10K
R630 RT
1C39
04-T
112
Q603
E
BC
10K
R629
MULT
I_PW
_SW
0R6
27R
EAD
Y0R6
24R
EAD
Y
22K
R631
REA
DY
SP
K_L
-
H6
LCD
MER
CURY
EAX
5685
6904
AU
DIO
MS
TA
R N
-EU
20
08
/12
/16
6
9
Main
AM
P
AMP :
GAIN
X 4
Chin
ese
Hote
l Opt
ion
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
-
THE
SYM
BOL
MAR
K OF
THI
S SCH
EMET
IC D
IAGR
AM IN
CORP
ORAT
ESSP
ECIA
L FE
ATUR
ES IM
PORT
ANT
FOR
PROT
ECTI
ON FR
OM X
-RAD
IATI
ON.
FILR
E AN
D EL
ECTR
ICAL
SHOC
K HA
ZARD
S, W
HEN
SERV
ICIN
G IF
IS
ESSE
NTIA
L THA
T ONL
Y M
ANUF
ATUR
ES SP
ECFI
ED PA
RTS B
E USE
D FO
RTH
E CR
ITIC
AL C
OMPO
NENT
S IN
THE
SYM
BOL
MAR
K OF
THE
SCHE
MET
IC.
MULT
I_PW
_SW
10R8
59
56
AR812
SUB_
SDA
HPD_MST_3
+1.8V
_DDR
COMP
2_PB
RT1C
3904
-T11
2Q8
02E
BC
DDR2
_DQM
0
100 R825
0.04
7uF
C828
KEY1
RL_ON
MX2
5L64
05DM
I-12G
IC80
2
3NC
_1
2VC
C
4NC
_2
1HO
LD
6NC
_4
5NC
_3
7CS
8SO
/SIO
19
WP/A
CC
10GN
D
11NC
_5
12NC
_6
13NC
_7
14NC
_8
15SI
.SIO
016
SCLK
0.01
uFC8
64
0.1uF C882
I2S_SCK
TMDS
2_RX
2-0.
1uF
C833
I2S_MCLK
USB_DN
100
R882
MAI
N_SIFPC_G
100 R8024
33R8
44
10 R801
HDMI3_SIDE
0.04
7uF
C830
PANEL_STATUS
TMDS
2_RX0
+
MNT_
VOUT
_T
TMDS3_RX0+
0.1u
FC8
42
SW_R
ESET
RXD
0.01
uFC8
58
TMDS
2_RX2
+
+3.3V
_MUL
TI_M
ST
0.1uF C813
12MHz
X801
10R8
74
1M
R839
4.7u
FC8
12
RL_O
N
M_SDA
DDC_SDA3
+3.3V
_MUL
TI_M
ST
+3.3V
_MST
MUTE
_LIN
E
EEP_
SCL
E-DIM
SIDE_
RIN
10R8
62
56AR80
5 DDR2
_DQM
1
10 R848
HDMI3_SIDE
EEP_SCL
CEC_C
10uF
C86
6
0.01
uFC8
60
47R8
34
56
AR813
TMDS3_RX1+
SYS_RESET
SPI_CZ
I2S_SDO
0.1u
FC8
15
22K
R842T
MDS2_
RXC+
DDC_SCL1
0.04
7uF
C837
POWER_SW
47R8
32
TMDS
2_RXC
-
+5VS
T_MS
T
0.1u
FC8
48
56AR81
0
10 R841
HDMI3_SIDE
0.1u
FC8
38
+1.2V
_VDD
C_MS
T
+3.3V
_MUL
TI_M
STJT
P-11
27W
EMSW
800
1
2 4
3
MNT_
L_AM
P
0.1
uF
C81
1
MNT_
VOUT
DDR2_CASZ
PANE
L_ON
1000
pFC8
35
0.1u
FC8
49
PC_B
TMDS3_RX2+
+3.3V
_MUL
TI_M
ST
0.04
7uF
C829
DDC_SCL3
DDR2_BA1
DISP
_EN/
VAVS
_ON
DDR2_RASZ
DDR2
_D[0-
15]
TMDS3_RX0-
10R8
54
COMP
2_Y
33
AR818
0.04
7uF
C832
PC_AUD_L
PC_VS
CVBS_LIN
SPI_
DI
402
R807 R
EADY
0.1uF C883
DDR2_BA0
EEP_
SCL
10 R820
HDMI3_SIDE
0.01
uFC8
59
+3.3V
_MUL
TI_M
ST
DDR2
_DQS0
M
SIDE
_LIN
SIDE_
V0.
047u
FC8
31
0.01
uFC8
03
TMDS
2_RX1
+
+1.8V
_DDR
DDC_SDA1
SUB_
SCL
DSUB_SDA
10R8
90
100
R881
CAT2
4WC0
8W-T
IC80
3
3A
2
2A
1
4V
SS
1A
0
5SD
A
6SC
L
7W
P
8V
CC
DDR2_CKE
+12V
_AUD
IO
SPI_CLK
+3.3V
_MUL
TI_M
ST
DDR2
_DQS1
M
0.01
uFC8
07
KDS1
81D8
03
USB_DP
+3.3V
_MST
100 R8025
+3.3V
_MUL
TI_M
ST
56AR80
9
I-DIM
SPI_C
Z
0.1uF C808
0.1u
FC8
04
56 R852
IR
0.01
uFC8
41
EEP_SDA
DDR2
_A[0-
12]
+3.3V
_MUL
TI_M
ST 10 R822HDMI3_SIDE
CVBS
_VIN
10R8
51
DDR2
_DQS
1P
10 R823
HDMI3_SIDE
TMDS3_RXC-
MNT_
VOUT
_T
TMDS
2_RX
0-
+3.3V
_MUL
TI_M
ST
DDR2
_DQS
0P
10 R821
HDMI3_SIDE
10R8
69
47R8
37
DDR2
_MCL
KZ
DDR2_WEZ
TXD
56AR80
6
0.04
7uF
C834
EEP_
SDA
TMDS
1_RXC
+
24LC
256-
I/SM
IC80
1
3A
2
2A
1
4V
SS
1A
0
5SD
A
6SC
L
7W
P
8V
CC
COMP2_R
M_SCL
+3.3V
_MUL
TI_M
ST
PC_HS
TMDS
1_RX
2-
0.01
uFC8
50
+3.3V
_MUL
TI_M
ST
TMDS3_RXC+
47uF
25V
C870
+3.3V
_MUL
TI_M
ST
470
R835
10R8
91
KDS1
81D8
02
TV_M
AIN
1000pF C818
COMP
2_PR
RT1C
3904
-T11
2Q8
04N
ON
19_
22"
EB
C
0.1
uF
C86
7
22K
R845
100 R8026
TMDS3_RX1-
P_24
V_SM
ALL_
15V
0.01uF C840
2.2u
FC8
61
HPD_
MST_
1
10R8
73
10R8
80
SPI_D
O
PC_AUD_R
0.01
uFC8
10
56
AR814
+1.2V
_VDD
C_MS
T
100 R8023
TMDS
2_RX
1-
DDC_SCL2
10R8
58
10R8
92
TMDS
1_RX1
+
10R8
71
TMDS
1_RX2
+
EEP_
SDA
56
AR800
10 R805
HDMI3_SIDE
KDS1
81D8
01
DDR2_ODT
TMDS
1_RXC
-
SPI_DI
I2S_WS
DDR2
_MCL
K
0.04
7uF
C826
TMDS
1_RX
0-
10R8
72
MNT_
R_AM
P
10R8
79
HPD_
MST_
2
0.1u
FC8
53
0.01
uFC8
39
DSUB_SCL
0.01
uFC8
65
COMP2_L
10uF16V C809
+1.8V
_DDR
0.01
uFC8
62
+1.2V
_VDD
C_MS
T
TMDS
1_RX
1-
4.7uF C820
100 R824
100 R829
KEY2
56
AR815
TMDS
1_RX0
+
0.01
uFC8
57
CVBS_RIN
2.2u
FC8
56
0.1u
FC8
69
+5VS
T_MS
T
0.1u
FC8
14
PC_R
SPI_C
LK
33R8
43
0.1uF C844
10R8
56
TMDS3_RX2-
0.01uF C876
DDC_SDA2
SPI_DO
P_12
V_SM
ALL_
15V
+5VS
T_MS
TPO
WER
_DET
POWER_DET
RT
1C39
04-T
112
Q80
3
E
B
C
+5VS
T_MS
T
SYS_
RESE
T
100 R8012
0.01
uFC8
770.
01uF
C878
0.01
uFC8
79
TXD
RXD
0.1uF C863
ISA1
530A
C1Q8
00E
BC
ISA1
530A
C1Q8
01E
BC
2.2
uF
16V
C80
00R
EAD
Y
+3.3V
_MUL
TI_M
ST
0
R806
0 R870
S_VI
DEO_
DET
SIDE_
YSID
E_C
DDC_
WP