lg w7020 service manual

1. INTRODUCTION

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1. INTRODUCTION

1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the

features of the phones.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (forexample, persons other than your company’s employees, agents, subcontractors, or personworking on your company’s behalf) can result in substantial additional charges for yourtelecommunications services. System users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System usersare responsible for programming and configuring the equipment to prevent unauthorized use. LGEdoes not warrant that this product is immune from the above case but will prevent unauthorized useof common-carrier telecommunication service of facilities accessed through or connected to it. LGEwill not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possiblycausing harm or interruption in service to the telephone network, it should disconnect telephoneservice until repair can be done. A telephone company may temporarily disconnect service as longas repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. Ifthese changes could reasonably be expected to affect the use of the phones or compatibility withthe network, the telephone company is required to give advanced written notice to the user,allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the LGE or its authorized agent.The user may not make any changes and/or repairs expect as specifically noted in this manual.Theref ore, note that unauthorized alternations or repair may affect the regulatory status of thesystem and may void any remaining warranty.

E. Notice of Radiated Emissions

The phones complies with rules regarding radiation and radio frequency emission as defined bylocal regulatory agencies. In accordance with these agencies, you may be required to provideinformation such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightlydifferent.

G. Interference and Attenuation

An the phones may interfere with sensitive laboratory equipment, medical equipment, etc.

Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Followinginformation is ESD handling:

Service personnel should ground themselves by using a wrist strap when exchange systemboards.

When repairs are made to a system board, they should spread the floor with anti-static matwhich is also grounded.

Use a suitable, grounded soldering iron.

Keep sensitive parts in these protective packages until these are used.

When returning system boards or parts like EEPROM to the factory, use the protectivepackage as described.

1. INTRODUCTION

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1. INTRODUCTION

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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current – Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milliwatt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

The phones GSM Phone

LGE Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

1. INTRODUCTION

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TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

2. PERFORMANCE

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2. PERFORMANCE

2.1 H/W Features

Item Feature Comment

Li-Polymer, 760mAh(820 mAh)

Standard Battery Size: 44 68.6 5.6 mm

Weight: 22 g

Extended Battery T.B.D.

AVG TCVR Current Min: 150mA(Pwr Level 19), Max: 300mA(Pwr Level 5)

Standby Current < 4.1 mA

Talk time Min : 2hr30min (2hr40min) @760(820)mAh

Max : 5hr(5hr20min)

Stand by time Up to 200 hours @820mAh

Charging time 2 hours

RX Sensitivity GSM, EGSM: -108 dBm, DCS: -107 dBm

TX output power GSM, EGSM: 33(32.5) dBm (Level 5)

DCS: 30(29.5) dBm (Level 0)

GPRS compatibility Class 10(This only applies to G7020)

SIM card type Plug-In SIM 3V/5V

Display Main : 65K Color-STN(128X160)

Sub : Mono(96X64)

Status Indicator : 7-color LED

Key Pad :

Status Indicator & KeyPad • 0 ~ 9, #, *, Navigation Key, Up/Down Side Key

• Side Key, Confirm Key, Record Key

• Send Key, END/PWR Key

ANT Fixed Type

EAR Phone Jack Ear-Mic connector

PC Synchronization Yes

Speech coding EFR/FR

Data and Fax Yes

Vibrator Yes

Speaker Yes

Voice Recording Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Hands-free kit, CLA, Data Kit

2.2 Technical Specification

2. PERFORMANCE

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Item Description Specification

GSM

TX: 890 + n 0.2 MHzRX: 935 + n 0.2 MHz (n = 1 ~ 124)

EGSM1 Frequency Band TX: 890 + (n - 1024) 0.2 MHz

RX: 935 + (n - 1024) 0.2 MHz (n = 975 ~ 1024)

DCSTX: 1710 + (n-512) 0.2 MHzRx: 1805 + (n-512) 0.2 MHz (n = 512 ~ 885)

2 Phase ErrorRMS < 5 degreesPeak < 20 degrees

3 Frequency Error < 0.1 ppm

GSM, EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

4 Power Level 12 19 dBm 3dB

DCS

Level Power Toler. Level Power Toler.



2 26 dBm 3dB 10 10 dBm 4dB






2. PERFORMANCE

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GSM, EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

5 Output RF Spectrum 6,000 -71(due to modulation)

DCS

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM, EGSM

Offset from Carrier (kHz) Max. (dBm)

400 -19

600 -21

1,200 -21

6 Output RF Spectrum 1,800 -24(due to switching transient)

GSM

Offset from Carrier (kHz) Max. (dBm)

400 -22

600 -24

1,200 -24

1,800 -27

7 Spurious EmissionsConduction, Emission StatusConduction, Emission Status

2. PERFORMANCE

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GSM, EGSM

8 Bit Error RatioBER (Class II) < 2.439% @-102 dBm

DCSBER (Class II) < 2.439% @-100 dBm

9 RX Level Report Accuracy 3 dB

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 2 -7

500 * -5

13 Receiving Response 1,000 0 -5

3,000 2 -5

3,400 2 -10

4,000 2

* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

16 Sending Distortion-20 30.7

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side tone Distortion Three stage distortion < 10%

18 System frequency (13 MHz) tolerance ≤ 2.5 ppm

2. PERFORMANCE

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19 32.768KHz tolerance ≤ 30 ppm

At least 80 dB under below conditions:20 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

21 Charge VoltageFast Charge : < 500 mA

Slow Charge: < 60 mA

Antenna Bar Number Power

5 -85 dBm ~

4 -90 dBm ~ -86 dBm

22 Antenna Display 3 -95 dBm ~ -91 dBm

2 -100 dBm ~ -96 dBm

1 -105 dBm ~ -101 dBm

0 ~ -105 dBm

Batter Bar Number Voltage

0 ~ 3.62 V

23 Battery Indicator 1 3.62 ~ 3.73 V

2 3.73 ~ 3.82 V

3 3.82 V ~

24 Low Voltage Warning3.5 0.03 V (Call)

3.62 0.03 V (Standby)

25 Forced shut down Voltage 3.35 0.03 V1 Li-Polymer Battery

26 Battery TypeStandard Voltage = 3.7 V

Battery full charge voltage = 4.2 V

Capacity: 760 mAh(820 mAh)

Switching-mode charger

27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz

Out put: 5.2 V, 600 mA

3. TECHNICAL BRIEF

3.1 ReceiverThe receiver part consists of a dual band(GSM & DCS) antenna switch, two RF SAW filters, aexternal dual RF VCO and a transceiver IC(TRF6150). All active circuits for a complete receiverchain with the exception of RF VCO are contained in the transceiver IC(TRF6150).

The TRF6150 chip set has direct conversion structure, so the received RF signal is directlyconverted to base band I and Q signal by the transceiver IC(IF frequency is 0 Hz), which containstwo LNAs and three direct conversion demodulators for E-GSM, DCS and PCS. The demodulated Iand Q signals pass two base band AGC amplifiers and a channel filter, which are on both I and Qsignal paths. The RF front-end circuit is shown Fig. 3-1.

Figure 3-1. RF front-end circuit.

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

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3.1.1 RF front end

RF front end consists of an antenna, a dual band antenna switch, two RF SAWs and two LNAs forE-GSM, DCS band, which are contained in the transceiver IC (TRF6150).

The RF received signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are input via theantenna or coaxial connector. An antenna matching circuit is between the antenna and theconnector.

VC2 that are connected to 4-Input NOR Gate (U607) to switch either TX or RX path on. When theRX path is turned on, the received RF signal, which has passed through the dual band antennaswitch, is filtered by an appropriate RF SAW filter for better stop band rejection. The filtered RFsignal is amplified by an LNA integrated in the transceiver IC(TRF6150) and pass to a directconversion demodulator. This process is thecsame both GSM and DCS.

The logic and current is given below. Table 3-1.

Table 3-1. The logic and current

3.1.2 Demodulator and Baseband Processing

IF stage is not necessary in this system because the receiver is based on direct conversionarchitecture. So the RX LO frequency is the same as input radio frequency. The amplified signal atLNA stage passes to a direct conversion demodulator and is mixed down to generate I&Q BBsignals. The BB I&Q signals pass via two integrated baseband amplifiers with digitallyprogrammable gain and two fully integrated baseband channel filters to the baseband A/Dconverters which is contained in baseband chipset. Fig.3-2 shows RX path block diagram.

3.1.3 DC offset compensation

The transceiver IC(TRF6150) is based on direct-conversion architecture. This implies that aparasitic DC offset may appear at the output of the IQ demodulator. To reduce the static offset dueto components mismatch and LO self-mixing, the IC includes a hardware DC offset compensationcircuit on both I and Q base band paths. The transceiver IC uses a divider by 2 for LO generation inEGSM and a multiplier by 2 in DCS to minimize the DC offset generated by self mixing and the LOradiation. In addition, a quadrature demodulator gain mismatch calibration system is used to reducethe signal distortion.

VC1 VC2

GSM TX 2.7 V 0 V

DCS TX 0 V 2.7 V

GSM/DCS RX 0 V 0 V

Figure 3-2. RX path block diagram.

Table 3-2. Gain and Noise Figure of RX path.

Table 3-3. Total Gain and Noise Figure of RX path.

3. TECHNICAL BRIEF

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Ant. switch RF SAW Filter I,Q demodulator(LNA+Mixer)

Gain(dB)GSM -0.6 -2.5 26

DCS -0.7 -3.2 23

NF(dB)GSM 3

DCS 3.5

Total Gain Total Noise FigureGSM, EGSM 22.9 dB 7.2 dBDCS 19.1 dB 8.2 dB

3. TECHNICAL BRIEF

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3.2 SynthesizerThe TRF6150 includes two synthesizer parts. Two synthesizers consist of an IF synthesizer, whichis an integer-N synthesizer, and a RF synthesizer, which is a fractional-N synthesizer. The TRF6150is a transceiver IC suitable for GSM and DCS GPRS up to class 12 applications. So, synthesizersuse a number of techniques to improve lock time, making them well suited to GPRS.

The main fractional-N synthesizer (RF synthesizer), which includes a RF VCO with external tankcircuits, is necessary for both transmitting and receiving operation. The RF VCO works only whenthe transmitting operation is on. The main fractional-N synthesizer has frequency band from 1294MHz to 1356 MHz. Output frequency of the RF VCO is set by the factional number, prescaler andcounter. An buffer amplifier follows the RF VCO. The purpose of the buffer is to give reverseisolation and prevent any frequency pulling of the VCO when the transceiver is powered UP andDOWN.

A dual band external VCO, which uses the PLL block of the main fractional-N synthesizer, isnecessary for transmitting and receiving operation. The dual band means that it can support GSM,DCS frequency operation. For transmitting operation, the OPLL block of the TRF6150 directlymodulates the dual band external VCO with I and Q signals. For receiving operation, the externalVCO output frequency band is fr 90902 to 940MHz for DCS Rx and from 1850 to 1920MHz for GSMRx. The frequency of the signal from the external VCO is divided by 2 for GSM Rx and is doubled by2 for DCS Rx operation before entering into the direct conversion mixer.

The auxiliary integer-N synthesizer (IF synthesizer), which includes an IF VCO with external tankcircuits, is necessary for transmitting operation only. The IF VCO has a frequency band from 832MHz to 858 MHz. Output frequency of IF VCO is settled by prescaler and counter. The fractionalcounter in the RF synthesizer just differs from the IF synthesizer. The IF VCO is also followed by abuffer amplifier, which is to give reverse isolation and prevent any frequency pulling of the VCOwhen the transceiver is powered UP and DOWN.

A fixed reference frequency of 1.3MHz for Rx (or 2.6MHz for Tx) is generated by a reference dividerfrom the external applied 13 MHz crystal oscillator.

The phase frequency detector with charge pump provides programmable output current, whichcould drive the capability and the pulse width.

The counter and mode settings of the synthesizer in the TRF6150 are programmed via 3-wireinterface.

Table 3-4. 3-wire BUS of Synthesizer in the TRF6150

Pin Number DescriptionCLK 11 Serial clock input to the synthesizerDATA 12 Serial data input to the synthesizerEN 13 Input latches the serial data transferred to the synthesizer

Figure 3-3. Synthesizer internal Block Diagram.

3. TECHNICAL BRIEF

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The IF and RF output frequencies of the TRF6150 are set by programming the internal divider registers.The frequency setting equations of the IF and RF frequencies are as follows.

is the output frequency of the IF VCO (the auxiliary integer-N synthesizer) and is the outputfrequency of the RF VCO (the main fractional-N synthesizer). The frequency band of the RF VCO is from1294MHz to 1356 MHz, and the frequency band of the IF VCO is from 832MHz to 858Mhz, whichfrequency bands are for the transmitting operation only.

Figure 3-4. Synthesizer Circuit.

3. TECHNICAL BRIEF

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3.3 Transmitter The Transmitter part contains TRF6150 active parts, PAM, coupler, dual schottky diode and dualband VCO. The TRF6150 active parts consist of the vector modulator and offset phase-locked loopblock (OPLL) including down-converter, phase detector, and APC IC for power control. The VCOfeed the output frequencies into PAM and TRF6150 for Tx local frequency. The peak output powerof the PAM is controlled by means of a closed feedback loop. A dual band directional coupler isused to control the RF output from the PAM. The PAM outputs from the directional coupler pass tothe antenna connector via an integrated dual band antenna switch module.

Figure 3-5. Transmitter Block Diagram.

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

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3.3.1 Tx Modulator

The Tx I & Q signals from BB analog chipset are fed to the TRF6150 Tx modulator, where they aremodulated onto either a Tx of 880 MHz(for GSM-Tx) or 1710 MHz(for DCS-Tx) by the quadraturemixer inside the U604. The Tx LO signal(1294 – 1356 MHz, 426.4 MHz) is fed from the internalmain and aux.

VCO.

The modulator provides more than 40dBc of carrier and unwanted side-band rejection andproduces a GMSK modulated signal. The BB software is able to cancel out differential DC offsets inthe I/Q BB signals caused by imperfections in the D/A converters. The Tx-Modulator implements aquadrature modulator. The frequency input signal is split into two precise orthogonal carriers, whichare multiplied by the BB modulation signal IP/IN and QP/QN. It is used as reference signal for theOPLL.

Figure 3-6. TX IF Modulator and OPLL Circuit.

3.3.2 OPLL

The down converter contained inside of the TRF6150 (U604) mixes the Tx RF frequency with theRF VCO signal from the ENFVZ4L07(U600) to generate a feedback signal at 414.4MHz for GSM,EGSM and DCS operation. The feedback signal passes to one port of the phase detector.

The GMSK reference signal from the Tx IF modulator passes via a second limiter to the otherinput port of the phase detector. The phase detector generates an error current proportional to thephase difference between the feedback signal from the down-converter and the `reference’ signalfrom the Tx IF modulator. The error current is filtered by a second order low-pass filter to generatean output voltage, which depends on the GMSK modulation and the desired channel frequency.This voltage controls the transmit VCO such that the VCO output signal, centered on the correct RFchannel is frequency modulated with the original GMSK data.

The center frequency of the transmit VCO is offset from the RF VCO frequency by 414.4MHz forGSM ,EGSM and DCS operation.

3.3.3 Power Amplifier

The PF08122B (U601) is Dual band power amplifier for EGSM (880 to 915 MHz) and DCS (1710 to1785 MHz). The efficiency of module is the 55% at 35 dBm for E-GSM and the 50% at 32.5 dBm forDCS for 3.5 V nominal battery use.

This module should be operated under the GSM burst pulse. To avoid permanent degradation, CWoperation should not be applied. To avoid the oscillation at no input power, before the input is cutoff, the control voltage Vapc should be control to less than 0.5 V. We have to improve thermalresistance, the through holes should be layouted as many as possible on PCB under the module.And to get good stability, all the GND terminals and the metal cap should be soldered to groundplane of PCB.

Figure 3-7. Power Amplifier and its Control Part Circuits.

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

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3.3.4 PA Circuit and Control

The power amplifier control circuit ensures that the RF signal is regulated to the required limits ofoperation. RF power is controlled by driving the power control pins of power amplifier and sensing.The resultant RF output power via a directional coupler (N600). The RF sense voltage is peakdetected using an schottky diode of BAT15-099(D600). This detected voltage is compared to theDAC voltage in the TRF6150 to control the output power.

An internal input signal (PA_LEVEL) from CALYPSO, digital BB chipset, (U200) is applied to theAPC IC in TRF6150 during the PA_ON mode and a directional coupler near the antenna feeds aportion of the RF output signal back to the APC IC and peak detector converts this signal to a lowfrequency feedback signal that balances the amplifier when this signal equal to the RAMP inputsignal level.

3.4 13 MHz ClockThe 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated CrystalOscillator), which oscillates at a frequency of 13 MHz.The 13MHz clock is used within the Synthesizer block of the TRF6150, BB Analog chip-set(NAUCICA_CS), and Digital (CALYPSO). The inverter IC, SN74AHC1GU04 buffer the output toNAUCICA_CS and CALYPSO.

Figure 3-8. VCTCXO Circuit.

3.5 Power Supplies and Control SignalsThree Regulators are integrated in the TRF6150 to provide DC power to the RF blocks (RegulatorR1, R2 R3). The Regulator R1 is used to provide DC power to the receiver, the transmitter and thePA control loop of the TRF6150. The Regulator R2 is used to provide DC power to the DC offsetcompensation circuit, the auxiliary synthesizer, the main synthesizer and VCOs. The Regulator R3is used for the external Rx/Tx VCO. An external regulator is used to provide DC power to theVCTCXO(U605).

Table 3-5. Regulator Specification

Figure 3-9. External Regulator Circuit.

3. TECHNICAL BRIEF

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Regulator Voltage Powers Enable SignalRegulator R1, R2, R3 Receiver, Transmitter,

(These are all integrated 2.8 V 0.1 V Synthesizers, VCOsin the TRF6150)

ADP3330_2V85 (U605) 2.85 V 0.5 V VCTXO RF_ENA, XO_ENA

3. TECHNICAL BRIEF

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3.6 Digital Baseband (DBB) Processor

Figure 3-10. Top level block diagram of the Calypso G2(HERCROM400G2).

3.6.1 General Description

CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone.This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro-Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bitSRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOSgates.

The chip will fully support the Full-Rate, Enhanced Full-Rate and Half-Rate speech coding.

CALYPSO implements all features for the structural test of the logic (full-SCAN, BIST, PMT, JTAG

boundary-SCAN).

3.6.2 Block Description

CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEAbus standard as interface with their associated application peripherals.

CALYPSO is composed from the following blocks:

• ARM7TDMIE : ARM7TDMI CPU core

• DSP subchip

• ARM peripherals:

General purpose peripherals• ARM Memory Interface for external RAM, Flash or ROM• 4 Mbit Static RAM with write-buffer

Application peripherals• ARM General purposes I/O with keyboard interface and two PWM modulation signals• UART 16C750 interface (UART_IRDA) with

- IRDA control capabilities (SIR)- Software flow control (UART mode).

• UART 16C750 interface (UART_MODEM) with

- hardware flow protocol (DCD, CTS/RTS)- autobaud function

• SIM Interface.

• TPU(Time Processing Unit) : Processing for GSM time base

• TSP(Time Serial Port) : GSM data interface with RF and ABB

Memory Interface : External/Internal Memory Interface

nCS0 : FLASH1, 16bit access, 3 wait state

nCS1 : FLAHS2, 16bit access, 3 wait state

nCS2 : Ext SRAM, 16bit access, 3 wait state

nCS3 : Main LCD, Sub LCD, MIDI IC addressing, 8bit access, 3 wait state ( See Fig 3-2 )

nCS6 : Int SRAM, 32bit access, 0 wait state

* Calypso internal 39MHz machine � 3wait state is necessary for the 80ns access because of 25nsmachine cycle. (25*4 = 100ns)

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

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Figure 3-6. Decoding Section Block Diagram

3.6.3 External Devices connected to memory interface

Table 3-6. External Device Spec connected to memory interface

3.6.4 RF Interface (TPU, TSP block)

Calypso uses this interface to control Nausica_CS(ABB Processor) and Clara(RF Processor) withGSM Time Base

Table 3-7. RF Interface Specification

Interface SPECMaker Write

Device Name Access Access ReadTime Time

FLASH 1 TH50VPF5683BASB Toshiba 80ns 80nsFLASH 2 TC58FVB641FT/XB Toshiba 80ns 80nsSRAM TH50VPF5683BASB Toshiba 70ns 70nsMAIN LCD S6B0023/S6B0018 SDI TBD TBDSUB LCD KS0723 SDI 60ns 60nsMelody IC YMU762 Yamaha 50ns 80ns

TSP (Time Serial Port)

Resource Interconnection DescriptionTSPDO ABB & RF main Chip Control Data

TSPEN0 ABB ABB Control Data Enable Signal

TSPEN1 RF main Chip RF Control Data Enable Signal

TPU (Time Processing Unit) Parallel PortTSPACT00 RESET_RF RF main Chip Reset Signal

TSPACT05 PA_ON Power Amp ON signal

3.6.5 SIM interface

SIM interface scheme is shown in (Fig. 3-12).

SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pumpin ABB enables 3V/5V SIM operation

Table 3-8. SIM Interface

Figure 3-12. SIM Interface

3.6.6 UART Interface

The phones has two UART Drivers as follow :

- UART1 : Hardware Flow Control / Fax&Data Modem

- UART2 : Handsfree Control / SW trace or IrDA Modem

Table 3-9. UART Interface Specification

3. TECHNICAL BRIEF

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SIM (Interface between DBB and ABB)SIM_RST SIM card async/sync reset

SIM_PWCTRL SIM card power activation

SIM_IO SIM card bidirectional data line

SIM_CLK SIM card reference clock

UART MODEM(UART1)Resource Name Note

TX_MODEM TXD Transmit Data

RX_MODEM RXD Receive Data

CTS_MODEM CTS Clear To Send

RTS_MODEM RTS Request To Send

GPIO 3 DSR Data Set Ready

GPIO 2 DCD Data Carrier Detect

UART IRDA(UART2)TXIR_IRDA TXIR_IRDA Infra-Red Transmit Pulse

TX_IRDA TX Transmit Data(UART2)

RXIR_IRDA RXIR_IRDA Infra-Red Receive Pulse

RX_IRDA RX Receive Data(UART2)

SD_IRDA SD_IRDA IRDA transceiver ShutDown Mode

3. TECHNICAL BRIEF

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3.6.7 GPIO map

In total 16 allowable resources, the phones is using 13 resources except 3 resources dedicated toSIM and Memory. the phones GPIO(General Purpose Input/Output) Map, describing application,I/O state, and enable level, is shown in below table.

Table 3-10. GPIO Map Table

3.7 Analog Baseband (ABB) Processor

3.7.1 General Description

Nausica CS is Analog Baseband (ABB)Chip supports GSM900, DCS1800, GPRS Class 10 with

Digital Basband Chip(Calypso G2) Nausica_CS processes GSM modulation/demodulation andpower management operations.

Block Description

- Audio Signal Processing & Interface- Baseband in-phase(I), quadrature(Q) Signal Processing- RF interface with DBB (time serial port)- Supply voltage regulation- Battery charging control- Switch ON/OFF- 3V/5V SIM card Interface- 4 internal & 5external ADC channels

I/O # Application I/O Resource Inactive ActiveState State State

I/O (0) FOLDER I GPIO HIGH LOW(Open) (Closed)

I/O (1) MELODY_INT I GPIO HIGH LOW

I/O(2) DCD O GPIO LOW HIGH

I/O (3) DSR I GPIO HIGH LOW

I/O (4) Sub_backlight O GPIO LOW HIGH

I/O (5) SIM_PWCTL O SIM

I/O (6) Jack_Detect O GPIO LOW HIGH

I/O (7) LCD_RESET O GPIO HIGH LOW

I/O (8) SPK_EN O GPIO LOW HIGH

I/O (9) MELODY_RESET O GPIO HIGH LOW

I/O (10) SUB_LED1 O GPIO LOW HIGH



I/O (13) HANDSFREE I GPIO HIGH LOW

I/O (14) NBHE O MEMORY

I/O (15) NBLE O MEMORY

3.7.2 Audio Signal Processing & Interface

Audio signal processing is divided Uplink path and downlink path..

The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signaland then transmit it to DBB Chip. This transmitted signal is reformed to fit in GSM Frame format anddelivered to RF Chip. MICBIAS is 2.5Vlevel.

The downlink path amplifies the signal from DBB chip and outputs it to Receiver(or Speaker).

Figure 3-13. Audio Interface Block Diagram

3.7.3 Baseband Codec(BBC)

Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL).

BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) com-ponent and quadrature(Q) component with burst data from DBB. This modulated signal istransmitted through RF section via air.

BDL process is opposite procedure of BUL. Namely, it performs GMSK demodulation with inputanalog I&Q signal from RF section, and then transmit it to DSP of DBB chip with 270KHz data ratethrough BSP.

Figure 3-14. Baseband Codec Block Diagram

3. TECHNICAL BRIEF

- 28 -

3. TECHNICAL BRIEF

- 29 -

3.7.4 Voltage Regulation(VREG)

There are 5 LDO(Low Drop Output) regulators in ABB chip.

The output of these 5 LDOs are as following table. (Figure 3-6) shows the power supply relatedblocks of DBB/ABB and their interfaces in the phones.

Figure 3-15. Power Supply Scheme

Table 3-11. LDO Output Table

3.7.5 ADC Channels

ABB ADC block is composed of 4 internal ADC(Analog to Digital Converter) channels and 5external ADC channel. This block operates charging process and other related process by readingbattery voltage and other analog values.

Output Voltage Usage

VR1 1.8V Digital Core of DBB

VR1B 2.0V Digital Core of ABB

VR2 2.9V Memory Interface of DBB

VR2B 2.9V Digital I/Os of DBB & ABB

VR3 2.9V Analog Block

Table 3-12. ADC Channel Spec

3.7.6 Charging

Charging block in ABB processes charging operation by using VBAT, ICHG value through ADCchannel. Battery Block Indication and SPEC of the phones is as follow.

Figure 3-16. Battery Block Indication

1. Charging method : CC-CV2. Charger detect voltage : 4.0V3. Charging time : 2h4. Icon stop current : 100mA5. Charging current : 420mA6. CV voltage : 4.2V7. Cutoff current : 40mA8. Full charge indication current (icon stop current) : 100mA9. Recharge voltage : 4.16V10. Low battery alarm

a. Idle : 3.62Vb. Dedicated : 3.50V

11. Low battery alarm interval :a. Idle : 3minb. Dedicated:1min

12. Switch-off voltage : 3.35V13. Charging temperature adc range

a. ~ -2°C : not charging operation.b. -2°C ~ 47°C : charging.c. 47°C ~ : not charging operation.

3. TECHNICAL BRIEF

- 30 -

ADC 9 channels

Resource Name

VCHG VCHG

VBAT VBAT Charging Management

ICHG ICHG

VBACKUP VBACKUP Backup Battery

ADCIN1 Not Use

ADCIN2 BATT_Themister Battery Detect

ADCIN3 RADIO_TEMP Temperature Sensing

ADCIN4/TSCXP Hook_Detect HOOK_DETECT

ADCIN5/TSCYP Not Use

3. TECHNICAL BRIEF

- 31 -

3.7.7 Switch ON/OFF

The phones Power State : Defined 4cases as follow

- Power-ON : mobile is powered by main battery or backup battery.- Power-OFF : mobile isn’t any battery.- Switch-ON : mobile powered and waken up from switch-off state.- Switch-OFF : mobile is powered to maintain only the permanent function(ULPD).

To enter into Switch-ON state, one of following 4 condition is satisfied.

- PWR-ON : pushed after a debouncing time of 30ms.- ON_REMOTE : After debouncing, when a falling edgeis detected on RPWON pin.- IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin.- CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG.

3.7.8 Memories

• 64Mbit/32Mbit Flash/SRAM MCP + 64Mbit Flash� 128Mbit Flash + 32Mbit SRAM

• 16 bit parallel data bus

• ADD01 ~ ADD22

3.7.9 Display & FPC Interface

LCD module include:

LCD module is connected to main board with 32 pin FPC and connected to Speaker, Receiver,Vibrator with 8 pin FPC connector.

FPC Interface Between LCD module and Speaker, Receiver, Vibrator

FPC Interface Between LCD module and main board

Main LCD 128 160 65K Color STN LCD

Sub LCD 96 64 mono FSTN LCD

Main LCD Backlight White LED illumination and AC/DC converter Module

Sub LCD Backlight EL Backlight

7 color Indicator LED KOHA HL006-W11

Table 3-13. FPC Interface Spec

3. TECHNICAL BRIEF

- 32 -

Pin # NAME Category Description

1 VDD3.0V PWR Driver IC power supply

2 /CS Main Driver Chip Select

3 A(1) Instruction/Data Identification(RS)

4 D0

5 D1

6 D2MAIN7 D3INTERFACE Data BUS

8 D4

9 D5

10 D6

11 D7

12 /WR Main Driver Write Enable

13 /RES Main & Sub LCD driver Reset

14 VSS GND Ground

15 LED_EN BACKLIGHTMain LCD backlight Enable(Enable High)

16 VBACKUP PWR Backup Battery

17 I_LED1 BACKLIGHT Indicator LED Enable 1(Enable High)



20 EL_EN BACKLIGHTSub LCD EL backlight Enable(Enable High)

21 VBAT PWR VBAT for White LED operation

22 SUB_CS Sub Interface Sub LCD Chip Select1 (Low Enable)

23 CS2(A2) (Parallel) Sub LCD Chip Select2 (High Enable)

24 VSS1 GND Ground

25 VBAT1 PWR VBAT for White LED operation

26 MOTOR VIBRATOR Vibrator Enable

27 REC(-) Receiver Negative

28 REC(+)AUDIO

Receiver Positive

29 SPK(-) Speaker Negative

30 SPK(+) Speaker Positive

3. TECHNICAL BRIEF

- 33 -

3.7.10 KeyPad Switching & Scanning

Table 3-14. Keypad Map

DBB supports 25 Keymap and Switch-ON Key is directly connected to ABB(see Figure 3-17).

Figure 3-17. Keypad Scanning Scheme

KBC0 KBC1 KBC2 KBC3 KBC4

KBR0 [ ] [ ] [ ] [ ] [CFM]

KBR1 [1] [2] [3] [F4] [Voice Memo]

KBR2 [4] [5] [6] [F1] [Vol Up]

KBR3 [7] [8] [9] 1[F2] [Vol Down]

KBR4 [*] [0] [#] [SEND] [F3]

3.7.11 Audio

Figure 3-18. Audio Section Scheme

UplinkThe microphone is soldered to the main PCB. The uplink signal is passed to MICIP and MICIN pinsof Nausica_CS. The MICBIAS voltage is supplied from Nausica_CS(dedicated mode only) throughswitching IC(U404) and R401. The MICBIAS voltage path is switchable by control the U404.

When the headset is inserted, U400 outputs 2.8V high state and it’s input of U404(#1) and Calypso(Jack_Detect). On detecting this 2.8V output, Calypso makes Nausica_CS switches the micamplifier path from main to auxiliary. In addition, this 2.8V output applied to U404(#1) and U404switches the MICBIAS voltage path from main mic to headset mic through D401 and R419.

Figure 3-19. Uplink Path

3. TECHNICAL BRIEF

- 34 -

DownlinkThe downlink signal is passed from EARP and EARN pins of Nausica_CS. When the headset isinserted and Calypso detects ‘Jack_Detect’ signal(output of U400), Calypso makes Nausica_CSswitches the downlink path from ‘EARP’ and ‘EARN’ to ‘AUXOP’ and ‘AUXON’.

Figure 3-20. Downlink Path

Speaker PhoneIn speakerphone mode, Calypso makes ‘SPK_EN’ to 2.8V and EARP signal is passed to speakerthrough MIDI IC(U403).

3.7.12 KeyPad and Main LCD back-light Illumination

There are 19 Deep Blue LEDs in Main Board and 3 LEDs in LCD module for KeyPad Back-light and

Main LCD Back-light respectively, which are driven by ‘KEYLIGHT’ line from Calypso.

Figure 3-21. KeyPad and Main LCD Back-light Scheme

3. TECHNICAL BRIEF

- 35 -

3. TECHNICAL BRIEF

- 36 -

3.7.13 Sub_LCD EL Illumination

In Sub-LCD EL illumination, there is an EL driver in FPCB Board, which is driven bySUB_BACKLIGHT line from Calypso(GPIO4).

Figure 3-22. Sub-LCD EL Illumination

3.7.14 Indicator Illumination

Indicator LED control circuit can make 7 colors using multi-color LED. Multi-color LED consists ofRed LED, Green LED and Blue LED. The combination of these LEDs makes 7 colors

Figure 3-23. Indicator LED Illuination

In the case of power off mode(ON_OFF=Low), if TA is inserted, R509 is connected to VCHG and

I_LED1(Red LED) is turned-on. In other cases(ON_OFF=High), Multi-color LED is controlled bySUB_LED1, SUB_LED2 and SUB_LED3 signal of Calypso

4. SERVICE S/W AND CALIBRATION

- 37 -


4.1 Service S/W

4.1.1 Overview

This service S/W is used for Calibration and Standalone test.

4.1.2 Hardware and software environment

- More than 486 computer

- 16Mbyte RAM

- Remained more than 10Mbyte in Hard Disk Memory

- Under Microsoft windows 98 or more than

4.1.3 Software installation

Unzip the phones service software provided where folder you want there are some files extracted inthat folder. Start Setup.exe in Service software setup folder. RampTable.dat, default transmitramping table, and rf_original_L300.epm, default calibration data, are located in window systemfolder so that these files are loaded automatically, if you execute LaputaService.exe.

4.1.4 Common Properties of Service Software

When you execute this program, you’ll see the below user interface window titled

LAPUTA_Service Tool in figure 4-1. The LAPUTA_Service Tool has five main frames.

Figure 4-1. LAPUTA Service Tool


- 38 -

A. Target system frameThis is for initializing the target phone. When you use this program to test the phones, you haveto initialize target at first. To initialize target phone, select target (the phones is default) and COMport used at your computer and then click the Initialize button. If target initializing is endedsuccessfully, the box in red below the initialize button will turn into green.

B. Rx AGC Test frameAt this part, you can control receiver path of target phone.

- Serving Freq. Setting (TCH)

You can set TCH of phone. The number means ARFCN of Traffic channel. You can change thevalue by clicking arrow button by one step or just entering the number directly.

- Beacon Freq. Setting (BCH)

You can set BCH of phone. The number means ARFCN of base station broadcasting channel.

- AGC Value Setting

You can set AGC gain of phone. The number means gain of AGC amplifier in Rx path.

- Power Measurement

The number means channel index according to pre-defined ARFCN. There are 12 pre-definedARFCNs within Rx band. 4 ARFCNs are for GSM and others for DCS. Clicking arrow button tochange number, you can see TCH and BCH ARFCN changed automatically.

PM window displays the power level measured in baseband chip. PM value is useful tocalculate the received absolute power. The unit of PM is dBd.

- PM Start

You can measure Rx power that target received from test equipment. When you click thisbutton the result of power measurement displayed at PM blank in Power Measurement frame.You can measure PM for all 12-channel indexes by changing Number and clicking PM Start.

- Calculate

You have to do this work after measuring PM for all 12-channel indexes. When you click thisbutton, service software calculate the calibration data from measured 12 PM data.

- Standalone

This button makes target operate in Rx mode continuously. Target will be operated under thecondition that you set. During continuous receiving mode, label of Standalone button ischanged to Stop. If you want stop receiving mode operating, click this button one more.


- 39 -

C. Tx APC Test frameAt this part, you can control transmit path of target phone.

- Serving Freq. Setting (TCH)

You can set TCH of phone. The number means ARFCN of Traffic channel.

- Beacon Freq. Setting (BCH)

You can set BCH of phone. The number means ARFCN of base station broadcasting channel.

- Power Level Setting

First, you have to choose operating mode (GSM or DCS) according to TCH and BCH frequencythat you selected before. Then select the Level and adjust the DAC value. Level meansGSM/DCS output power level. Usable range is 5 to 19 for GSM, 0 to 15 for DCS. DAC value isa factor to determine output power. Its variable range is 0 to 1023.

- Uplink Normal Burst test

You can also control the traffic slot number be using by changing TCS value. Because GSMhas 8-time slot, TCS value varies 0 to 7. Patten is to select data format that is transmitted. Youcan send all data 0, or 1 or repeating of 1010. But it is good to you to using the default valuebecause data format doesn’t affect to RF characteristics.

- Test

Transmitting is started when you click this button. During Transmitting, label of Test button ischanged to Stop. If you want stop transmitting, click this button one more.

D. RF Parameter Download frame- Saving epm file into Flash

When you have a epm file, contains calibrated data, and you want to download into targetFlash, check Flash and click File Download button. Then you can see RF parameters Savewindow. Select epm file you want to save into Flash then click Open. During saving file intoFlash, The statement bar indicating download process is displayed under the RF ParameterDownload frame. As successfully ending download, information box will be appeared. Click Ok.

- Saving Cal. Data to Flash

After Rx or Tx calibration, you can save the calibration results into Flash and epm file. CheckFlash and click Calib Save button. Then you can see RF parameters Save window. Write thefile name and click Save button.

E. User Command and Results frameWhenever you click button or make some event in service software, every ordered event isdisplayed in this frame. You can also see calibration results here.

F. Ramp Shape buttonThis button is for burst shape table. But it is deactivated in service software.


- 40 -

4.2 Calibration

4.2.1 Overview

All tuning operations of the phone are carried out using the service software. The service softwareturns the phone into the locals mode, in which the phone can be outwardly controlled via the testJig.The calibration values of the phone reside on the Flash. The contents of the Flash can be read bythe service software and saved as a file. This is advisable when there is need to retain thatinformation, e.g. in view of replacement of the circuit. The program also enables writing the defaultparameters on the Flash, in which case all calibration steps should be carried out. The servicesoftware can’t control the equipment, so only manual calibration process is possible.

4.2.2 Equipment List

Table 4-1. Calibration Equipment List.

Equipment for Calibration Type / Model BrandWireless Communication HP8960,HP8922, CMU200, any other call equipmenTest Set

RS-232 Cable and Test JIG

RF Cable

Power

Service SW (LAPUTA)

Test SIM Card

PC(for Software Installation) Pentium II class above 300MHz


- 41 -

4.2.3 Equipment Setup

Figure 4-2. Calibration Equipment Setup

+ -

+

-

- 42 -


4.2.4 Calibration Steps

A. RX CalibrationIn order for the RSSI measurements to be within the GSM specifications, some calibration isnecessary. Also, due to AGC implementation, some AGC specific constants need calibration. Intotal, three calibrations are required per receive band, AGC calibration, channel compensationand temperature compensation. Of these, temperature compensation is not needed inreplacement of the circuit. In AGC calibration the reference power fed into the phone viapermanent antenna connector is –74dBm. In channel compensation, the channel numbers in Rxband are;

E-GSM band : 0, 40, 124, 975, and 1023.

DCS band : 512, 574, 636, 700, 760, 822 and 885.

- Procedure

a) Initialize phone by clicking Initialize button.

b) Set the GSM test equipment CW mode and BCH and TCH of GSM test equipment ‘0’, samewith phone.

c) Set the power of GSM test equipment ‘–74dBm’.

d) Click the PM Start button, then the value, received power by phone, is displayed in PMmeasurement window at service software.

e) Change the BCH and TCH of phone by clicking the Number button and set the channel(BCH & TCH) of equipment to be same.

f) Click the PM Start button.

g) Repeat above procedure until the displayed number in Power Measurement window is 12.

h) Click the Calculate button, then the service software calculate the channel compensationparameters.

i) Saving updated calibration data into phone by clicking Calib Saving button.

NOTE

If the calibration does not done for all channels, 5 channels for EGSM900 and 7 channels forDCS1800, the service software reports, “Please execute after measuring the PM”.

B. TX CalibrationIn order for the Tx power to be within the GSM specifications for each Tx level, some calibrationis necessary. In total, four calibrations are required per transmit band, power calibration, channelcompensation, temperature compensation and low voltage compensation. Of these, temperaturecompensation and low voltage compensation are not needed in replacement of the circuit andchannel compensation is not needed because the transmit power is in GSM specification withenough margin.In power compensation, the channel numbers used in Tx band are;

E-GSM band : 62.

DCS band : 699.

And the target powers in dBm for each power level are;

- 43 -

Table 4-2. Tx targer powers

-Procedure

a) Initialize phone by clicking Initialize button.

b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause youhave to match test equipment’s BCH and TCH ARFCN with this value. For each power level,adjust the DAC value to get target power and click Test button. Then you can see the outputpower displayed on test equipment.

c) Saving updated calibration data into phone by clicking Calib Saving button.


Power level GSM DCS

0 29

1 28

2 26

3 24

4 22

5 32 20

6 31 18

7 29 16

8 27 14

9 25 12

10 23 10

11 21 8

12 19 7

13 17 6

14 15 5

15 13 4

16 11

17 9

18 7

19 6

4.2.5 Test JIG Operation

Table 4-3. JIG Power

Table 4-4. JIG DIP Switch

Table 4-5. LED Description

- Operation1) Connect the RS232 Serial Cable between COM port of notebook and MON port of test JIG in

general.

2) Set the Power Supply 4.0V. Also DC adapter may be used.

3) Set the 3rd of DIP SW ON state. In case of DC adapter, set 4th ON state.

4) Press the Phone power key. If the Remote Power On is used, switch the 1st of Dip Switch ON.


- 44 -

Description

Power Supply Usually 4.0 V

DC Adaptor 9.5V, 500mA

Switch Number Name Description

Switch 1 RPWRON In ON state, phone is awaked.

Switch 2 HF_DETECT Turn on for AUDIO TEST.

Switch 3 Power Supply Power is provided for phone from Power Supply.

Switch 4 D.C power Power is provided for phone from DC adaptor.

LED Number Name Description

LED 1 POWER Power is provided for Test Jig

LED 2 CHARGER Indicate charging state of the Phone Battery with TravelCharger.

LED 3 UART IRDA Indicate date transfer state through the UART IRDA.

LED 4 UART MODEM Indicate date transfer state through the UART MODEM.

- 45 -

5. DOWNLOAD

5. DOWNLOAD

5.1 Download Setup

5.1.1 Download Equipment

1) Data Kit

2) Desktop or Notebook PC

3) Download Monitor Program

4) The phones mobile phone

+ -

5.2 Download Procedure

5.2.1 General Purpose

This document gives a guideline for upgrading software of the phones using UART port.

5.2.2 Download Environment

In order to download software of the phones, the following working environments should beprepared: the phones Data Link Kit, DK-10G that is connected to COM1 or COM2 serial port in theDesktop or Notebook PC.

The phones Data Kit Download Monitor Program that is copied to Desktop PC or Notebook PC.

Target SW* downloaded to the phones mobile phone.

Note : Target SW* means any necessary software to be downloaded to the mobile phone.

- 46 -

Warning

You must use the Data Link Kit(DK-10G) and UART Download Monitor program that are providedfrom LGE. Otherwise downloading process won’t properly

5. DOWNLOAD

5. DOWNLOAD

- 47 -

5.2.3 Download Procedure

A. Unzip the phones UART Download monitor program(monitor 663.zip) in PC.

B. Execute monitor663.exe. And then select the “Target” Menu shown in Figure 5-1. Then, choose“Connect” in the Target Menu.

Figure 5-1.

C. A table will be displayed as shown in Figure 5-2. Then press the arrow-button and choose acorrect serial port. And press “OK” button.

Figure 5-2.

- 48 -

5. DOWNLOAD

D. As the following window shown in Figure 5-3. is displayed, connect the phones Phone to DataLink Kit, DK-10G and power on the phones. If the connection is succeeded, the following screenwill show the contents as shown in Figure 5-4.

Figure 5-3.

Figure 5-4.

5. DOWNLOAD

- 49 -

E. Click on “Flash” on the top menu and select “Get type” item as shown in Figure 5-4. and select“Erase and Program Appli Only+Boot” item as shown in Figure 5-5.

Figure 5-5.

F. Finally choose the target SW that you want to download. And then you can see the followingwindow in Figure 5-6.

Figure 5-6.

5. DOWNLOAD

- 50 -

G. If the downloading procedure is succeeded, then the following window is shown.

Figure 5-7.

6. TROUBLE SHOOTING

- 51 -

6. TROUBLE SHOOTINGFigure 6-1. shows a measurement set-up.

Figure 6-1. Measurement set-up

6. TROUBLE SHOOTING

- 52 -

6.1 Rx Trouble (EGSM)

6.2 Rx Trouble (DCS)

6. TROUBLE SHOOTING

- 53 -

6. TROUBLE SHOOTING

- 54 -

6.3 Tx Trouble

1111

U200 : CALYPSO(BB Digital Main Chip)

U201 : NAUSICA CS(BB Analog Main Chip)

U601 : PAM (PF08122B)

U604 : RF Main Chip (TRF6150)

U600 : TXVCO (ENFVZ4LO7)

U603 : Antenna S/W(SHS-M090B)

N600 : Directional coupler(LDC15D 190A0007A)

D600 : Shottky Diode(BAT 15-099)

6. TROUBLE SHOOTING

- 55 -

111

6.4 Voice Function TroubleA. Receiver

B. Speaker

6. TROUBLE SHOOTING

- 56 -

C. Microphone

6. TROUBLE SHOOTING

- 57 -

6.5 Display Function TroubleA. LCD

6. TROUBLE SHOOTING

- 58 -

6. TROUBLE SHOOTING

- 59 -

B. Indicator LED

6. TROUBLE SHOOTING

- 60 -

6.6 Other Function TroubleA. Vibrator

6. TROUBLE SHOOTING

- 61 -

B. Charger

7. STAND ALONE TEST AND TEST POINTS

7.1 Testing Set-up

7.1.1 Received RF Level and Checks

This section shows the typical RF levels expected throughout the receiver path. A block diagramshowing the locations of the RF measurement points and levels is shown in Figure 7-3.

Receiver Testing Set-upTo check the receiver the following conditions have to be set:

1. On a signal generator or a GSM/DCS test box, output a CW signal of amplitude = -60 dBm ateither: 947.4 MHz (CH62) when testing the GSM RX path or 1842. 6 MHz (CH699) when testingthe DCS RX path.

2. Set the DC power supply to 4.0 V.

Note: All RF values shown are only intended as a guide figure and may differ from readings takenwith other test equipment and leads. Lead and connector losses should always be taken intoaccount when performing such RF measurements.

Testing ReceiverUsing a suitable high frequency probe measure the RF levels at the relevant points shown in Figure 7-2. and compares your measurements with those shown in the diagram. If there are anymajor difference between the readings taken and those indicated then further investigation of thatparticular point will be required. It will also be necessary to ensure that all the following powersupplies and signals are present which control this part of the receiver circuit:

1. The Control Signal of Antenna switch (see Figure 7-9,10,11 )

2. Vreg 1,2,3 (see Figure 7-7 )

3. 2V85_VCTCXO (see Figure 7-8)

4. 13MHz(see Figure 7-12)

5. CLK, DATA, EN (see Figure 7-13)

6. RX IP, IN, QP, QN (see Figure 7-16,19)

7. Vtune(see Figure 7-17,18)


- 62 -

7.1.2 Transmitted RF Level and Checks

This section shows the typical RF levels expected throughout the transmitter path. A block diagramshowing the locations of the RF measurement points and levels is shown in Figure 7-5.

Transmitter Testing Set-upTo check the transmitter the following conditions have to be set:

1. Configure the testing equipments as Figure equipment setup.

2. Set the GSM/DCS test equipment to be stand-alone mode (asynchronous mode).

3. Set the BCH and TCH ARFCN ‘62’ for EGSM900 or ‘700’ for DCS1800 on GSM/DCS testequipment.

4. Set the DC power supply 4.0volts.

5. Initialize target on service software.

6. Set TCH and BCH value to be same with GSM/DCS test equipment on service software.

7. Select GSM or DCS mode on service software.

8. Set DAC ‘600’ for EGSM900 or ‘700’ for DCS1800 on service software.

9. Click Test.

Note: All RF values shown are only intended as a guide figure and may differ from readings takenwith other test equipment and leads. Lead and connector losses should always be taken intoaccount when performing such RF measurements.

Testing TransmitterUsing a suitable high frequency probe measure the RF levels at the relevant points shown in Fig. 7-4 and compare your measurements with those shown in the diagram. If there are any majordifference between the readings taken and those indicated then further investigation of thatparticular point will be required. It will also be necessary to ensure that all the following powersupplies and signals are present which control this part of the transmitter circuit:

1. The Control Signal of Antenna Switch(see Figure 7-9, 10, 11)

2. Vreg 1,2,3 (see Figure. 7-7)

3. 2V85_VTCXO (see Figure. 7-8)

4. 13 MHz (see Figure. 7-12)

5. PA_ON, PA_LEVEL, Vapc (see Figure. 7-14)

6. TX IP, IN, QP, QN (see Figure. 7-15)


- 63 -

7.2 Testing Points

7.2.1 RF components (Component Side)

Figure 7-1. RF components (Component Side).

Table 7-1. RF components


Reference Reference

U604 RF main chipset U600 Dual RF VCO

U603 Antenna Switch U606 VCTCXO

U601 PAM U602 Balun

N600 Coupler BPF601 GSM RF SAW Filter

U607 NOR Gate BPF600 DCS RF SAW Filter

U629 Inverter SW600 Mobile Switch

U605 LDO D600 Dual Schottky Diode

D601 Varactor Diode D602 Varactor Diode

- 64 -

U604

U600

U601

SW600

N600 D600

D601

U605

U606

U629

D602

U603

U607

BPF600

BPF601

U602


- 65 -

7.2.2 Test point of Rx Levels

Figure 7-2. Test point of Rx Levels.

1

6

4

3

2

5

2


- 66 -

GS

M:

CH

.62,

-60

dB

mD

CS

: C

H.6

99, -

60d

Bm

Fig

ure

7-3

. Rec

eive

r R

F L

evel

s

7.2.3 Test point of TX Levels

Figure 7-4. Test point of TX Levels.


- 67 -

6

12

11

1, 7

2, 8

13 5

4

10

9

3


- 68 -

GS

M:

Pw

r L

vI 5

, Ch

.62,

-32

dB

mD

CS

: P

wr

LvI

0, C

h.7

00, -

29d

Bm

Fig

ure

7-5

. Tra

nsm

itte

r R

F L

evel

s


- 69 -

7.2.4 Control signal test points

Figure 7-6. Control signal test points

VC1

VC2

VAPC

LB_SW

HB_SW

TXRX_SW

PA_LEVEL PA_ON CLK, DATA, EN

Vtune

Vtune

I / Q

Regulator 2V85

13MHz

Figure 7-7. 2V85_Vreg 1, 2, 3 Output

Figure 7-8. 2V85_VCTCXO Supply Voltage


- 70 -


- 71 -

Figure 7-9. Antenna S/W control voltage in EGSM_TX

Figure 7-10. Antenna S/W control voltage in DCS_TX

VC1VC1VC1

VC2VC2VC2

Figure 7-11. Antenna S/W control voltage in RX

Figure 7-12. 13MHz Clock


- 72 -

VC1VC1VC1

VC2VC2VC2


- 73 -

Figure 7-13. CLK, DATA, EN

Figure 7-14. PA_ON, PA_LEVEL, VAPC (GSM Tx Level=7)

CLKCLKCLK

DATADATADATA

ENENEN

Figure 7-15. Tx I / Q Signal

Figure 7-16. Rx I / Q Signal


- 74 -


- 75 -

Figure 7-17. PA_ON, Vtune (U600 pin 13, GSM 1CH)

Figure 7-18. PA_ON, Vtune (U600 pin 13, DCS 512CH)

Figure 7-19. RX I/Q Signal(Extended)


- 76 -

8. DISASSEMBLY INSTRUCTION1. Remove the battery and screws.

Figure 8-1. Removing Screws

8. DISASSEMBLY INSTRUCTION

- 77 -

1

2


- 78 -

2. Use a thin plastic sheet to slide and open the gap between front and rear covers, and detachthem carefully with both hands.

3. Then carefully remove the rear cover from the hooks as shown in Figure 8-2.

Figure 8-2. Disassembling covers

4. Unlock the PCB and remove other components as shown in Figure 8-3.

Figure 8-3. Unlocking and removing the PCB

2

1

1

2


- 79 -

5. Firstly, insert one side of FPCB carefully into the slot.Then place the PCB under the hook 1 first and push the other end of PCB under the hook 2

Figure 8-4. Assembly of PCB with the cover

2

1


- 80 -

6. Remove the antenna and use a sharp awl to push away the antenna-bushing.

Figure 8-5. Removing antenna-bushing

1

2

3


- 81 -

7. Use a tweezers to remove the battery locker.

Figure 8-6. Removing battery locker

8. When removing the side button from the main front, please see the insert-nut next to the buttonand carefully remove it.

Figure 8-7. Removing a side button

1

12

3

Insert-nut


- 82 -

9. Push away the hinge to remove the folder.

Figure 8-8. Removing Folder

10. Remove the hinge, and detach screw caps by using a pin.

Figure 8-9. Removing hinge and screws


- 83 -

11. Use a thin plastic sheet to slide and open the gap between the folders.Then detach them carefully with both hands.

Figure 8-10. Disassembling Folders

12. Finally detach the rest components as shown in Figure 8-11.

Figure 8-11. Disassembly of the rest components


- 84 -

9. BLOCK DIAGRAM

- 85 -

9. BLOCK DIAGRAM

9.1 Main BoardThe phones is made up of two PCBs. In lower part of the folder, there is a main board. And in theupper part of the folder, there is a FPCB. Below you can see the block diagram of both PCBs.

Figure 9-1. Main Block diagram.

9. BLOCK DIAGRAM

- 86 -

9.2 FPCB

Figure 9-2. FPCB Block diagram.

9.3 RF

Figure 9-3. RF Block diagram

9. BLOCK DIAGRAM

- 87 -

- 89 -

10. CIRCUIT DIAGRAM

10.1 BB Circuit

(A2)

(D/I)

4

D.S.JUNG

62 3 4

B

A

6

DCD

02.04.11

02.04.11

F

N.S.KIM

LGElectronics Inc

Date

A

7

1 2 3

BASEBAND INTERFACE

Sign & Name

Designer

C

D

B

Name

7

Checked

F

8

1

DrawingNo.

Sheet/Sheets

1/6

A_case

issue

E

5

C

Model

D

8

Approved

Drawing

Notice NO. Data Name

L

(REC_N)

Section

5

E

R12110K

VR2B

47pC107

HS

P11

0

HS

P10

7

R10410K

VBACKUP

R1230R

HS

P10

6D100

CRS08

R1160.2R(1%)

(2012)

HS

P11

8

HS

P11

6

C10547p

12

9B3

7 GND

3 O0

O16

11O2

O3 8

VCC 14

HS

P12

6

MC74VHC126

U102

1 A0

A14

13A2

A3 10

B02

5 B1

B2

24VSS1

13_RES

12_WR

C108

47p

I_LED11718

I_LED219

I_LED3

15LED_EN

MAIN_CS2

MOTOR26

REC+2827

REC-

30SPK+

29SPK-

SUB_CS22

16VBACKUP

21VBAT

VBAT125

1VDD_3.0V

VSS14

J102LG_LCD_CON_30P

A03

CS223

D04

D15

D26

D37

D48

D59

D610

D711

20EL_EN

47RR110 MNR0412345678

HS

P10

2

HS

P11

7

C10122n

HS

P12

9

HS

P12

2 HS

P12

7

C10010u/16V

HS

P11

3

V101

P0402FC12C

VR2B

R10120K

VR2B

NC7SZ32U103

1

2

3

4

5

R1240R

P0402FC12C

V100

VR2B

VBAT

TXTXD

14

5VCHG1VCHG2

4

HS

P10

0

HS

P10

9

3

27 2625

19GND1GND2

12

HANDSFREE2

POWER_ON6

16

RTS20

RX1013

RXD

TCK87

TDI

11TDO

9TMS

15

78

J101

LG-IO_CONN_24P

1AUXGND

AUXI24

17AUXONAUXOP

18

BATT12221

BATT2

23CTS

DSR

1 2

3

4

5

6

10KMNR04R103

12

34

56

HS

P12

0

HS

P10

3

VBAT_2

Q100NDC652P

12345678

R108 4.7R

1M

R114

SN74HC1GU04DCKRU101

2

3

4

5

n.mR113 MNR04

10KR118

0RR119

100n/16VC109

0RR120

HS

P10

8

(2012)

HS

P11

2

HS

P11

4

HS

P12

1

VR2B

BLM15AG121PN1L104

GN

D

IO7

2R

ST

VC

C1

VP

P6

HS

P12

8

R109220R

BLM15AG121PN1L119

LG_AMP_SIM

J100

CLK

3

5

BLM15AG121PN1L113

BLM15AG121PN1L115

BLM15AG121PN1L117

R1150R

HS

P11

9

HS

P11

1

20KR100

HS

P10

4 HS

P51

2

L111

L190 BLM15AG121PN1

VCC_EXT

VCHG

R1170R

BLM15AG121PN1L110

VR2B

BLM15AG121PN1

150pC103

BLM15AG121PN1L108

P04

02F

C12

C

RN1307Q101

GN

D

IN

OU

T

BLM15AG121PN1L106

C110

(1608)1uF

V10

2

R12210K

4.7RR107

HS

P13

7

HS

P51

4

VBAT

100RR105

BLM15AG121PN1L124

L120 BLM15AG121PN1

HS

P13

4

L118 BLM15AG121PN1

C10647p

L114 BLM15AG121PN1

VBAT

L116 BLM15AG121PN1

HS

P10

1

L100BLM15AG100PN1

(2012)

BLM15AG100PN1L102

2345678

C10410u

R111

HS

P51

3

47R MNR04R106

1

L112 BLM15AG121PN1

L103 BLM15AG121PN1

1K

8

L105 BLM15AG121PN1

L107 BLM15AG121PN1

L109 BLM15AG121PN1

R10233K

MNR04R112 47R1234567

HS

P11

5

HS

P10

5 HS

P13

3H

SP

135

HS

P13

6

HS

P13

1H

SP

130

MIDI_CS

SUB_CS

BATT_TEMP

HS

P13

2

_WR

A(1)

A(0)

SPKP

MAIN_CS

SUB_CSA(2)

RPWRON

FOLDER

ON_OFF

VCHG

_CS3

A(2)

A(3)

MAIN_CS

D(0:7)

LCD_RESET

MAIN_BACKLIGHT

I_LED1I_LED2I_LED3

SUB_BACKLIGHT

MOTOREARN

REC_PSPKN

D(0)D(1)D(2)D(3)D(4)D(5)D(6)D(7)

DCD

RTS

RX

TDI

TMS

TXD

PCM_SYNC

PCM_RX

AUX_IN

ICTL

HANDSFREE

SIM_CLKSIM_RST

SIM_VDDSIM_I_O

CTS

TX

AUXOPAUXON

RXD

DTR

RPWRON

TCK

TDO

PCM_TX

PCM_CLK

10. CIRCUIT DIAGRAM

- 90 -

10. CIRCUIT DIAGRAM

F

Drawing

7

Electronics Inc

Designer

1 2 8 9 10

H

Notice NO.

5 6

3

C

Name

12

2 3

4 6

Model

8 9

A

Name

5

Section Date Sign & Name

B

C

Sheet/Sheets

2/6

BASEBAND CHIPSET

10 11

A

LG

12

G

DrawingNo.

H

E

Checked

Approved

D.S.JUNG

N.S.KIM

7

D

Data

100n

11

02.04.11

F

G

4

02.04.11

issue

D

E

1

B

VR2

C223

390RR207

UPR

20PC203

(2012)

C22010u

R281 0R

VBATUPR

270p

C213270p

TP206

0RR280

C211

C227100n

R203

10K

TP

214

FW

E

TM

S

TP221 TP222

C218

100n

nSCS2_TSPEN3G12

niB

OO

TN

1

R205 390R

K6

XD

1_03

_KB

R0

XD

1_04

_KB

R1

M6

P6

XD

1_05

_KB

R2

XD

1_06

_KB

R3

N6

L6X

D1_

07_K

BR

4

X_A

1RX

IR_I

RD

AA

8C

7X

_A4_

TX

IR_I

RD

A

nBH

E_I

_O14

F5

E4

nBLE

_I_O

15

C2

nCS

0_nC

S1_

C3

C1

nCS

2_nC

S3_

D3

nFO

E_X

_A3

E2

E3

nFW

E_X

_A0

D12nRESPWON

E1

VD

D5

VD

DS

_1_1

L14

VD

DS

_1_2

N5

VD

DS

_2A

11

VD

DS

_MIF

0A

4B

6V

DD

S_M

IF1

G1

VD

DS

_MIF

2D

1V

DD

S_M

IF3

VD

DS

_RT

CD

13

VD

D_A

NG

E11

F11

VD

D_P

LL

D14

VD

D_R

TC

N13VDRVDX

P14

VFSRXM13

VS

SO

A14

TSPACT11J13

TSPCLKXJ14

TS

PD

I_I_

O4

H10

TSPDOH11

H13TSPEN0TSPEN1

H12H14

TSPEN2

TX

D_M

CS

I_1_

09L1

0

TX

_IR

DA

C8

B9

TX

_MO

DE

M

N12VCLKRX

VD

D0

A5

B12

VD

D1

VD

D2

N14

VD

D3

P7

M1

VD

D4

TCKB10

A12

TC

XO

EN

TDID10C10

TDO

E9TMS

M12TSPACT00TSPACT01

M14L12

TSPACT02TSPACT03

L13J10

TSPACT04TSPACT05

K11K13

TSPACT06TSPACT07

K12K14

TSPACT08TSPACT09

J11J12

TSPACT10

PW

T_B

UK

7

RF

EN

_NoP

CA

13

RT

S_M

OD

EM

_TO

UT

E8

M10

RX

D_M

CS

I_1_

010

D8

RX

_IR

DA

RX

_MO

DE

MA

9

B2

RnW

_

P9

SC

LK_I

NT

1nS

DI_

SD

AM

9K

8S

DO

_IN

T10

n

SIM_CD_MAS0G11

SIM_CLKF13G13

SIM_IO

F14SIM_PWCTRL_I_O5

G10SIM_RST

F12START_BIT_CLK13M_OUT

KB

C4_

XD

1_02

M5

MCUDIN7M7

MCUDOM8

MCUEN0P8

MCUEN1_I_O8MCUEN2_I_O13

L8

C11

N.C

D11NBSCAN_

B11NEMU0_NEMU1_

E10

NS

CS

0_S

CL

L9 N9

NS

CS

1_X

_A2

ON_OFFF10

C13

OS

C32

K_I

NO

SC

32K

_OU

TB

13L7P

WL_

LTG

ND

8A

10 A7

GN

D9

E12

GN

D_A

NG

GN

D_P

LLE

14

GN

D_R

TC

C14

M2

IDD

Q

INT4n_IT_WAKEUPB14

I_00

1_T

PU

_ID

LEP

3N

3I_

O0_

TP

U_W

AIT

L4I_

O2_

IRQ

4I_

O3_

SIM

_RnW

M4

N2

I_O

7_N

RE

SE

T_O

UT

KB

C0_

NF

IQN

4K

BC

1_N

IRQ

K5

KB

C2_

XD

1_00

L5K

BC

3_X

D1_

01P

5

DATA15B3

D9

DS

R_M

OD

EM

_LP

G

P1EXT_FIQEXT_IRQ

M3

FD

P_n

IAC

KF

4

FS

YN

CH

_MC

SI_

1_01

2K

9

GN

D0

F1

GN

D1

N8

A2

GN

D10

GN

D11

B1

GN

D2

K1

P2

GN

D3

GN

D4

P4

P10

GN

D5

GN

D6

P13

G14

GN

D7

C9

CT

S_M

OD

EM

_XF

B7DATA00

D7DATA01

E7DATA02DATA03

D6A6

DATA04DATA05

C6E6

DATA06DATA07

C5B5

DATA08DATA09

D5E5

DATA10DATA11

B4C4

DATA12DATA13

D4A3

DATA14

K4ADD17ADD18

J5L1

ADD19ADD20

L2

ADD21L3D2

ADD22

AR

MC

LK_B

CLK

RP

11

BC

LKX

_I_O

6N

11

K10BDR

M11BDX

BFSRL11

BFSXP12

C12

CLK

32K

_OU

T

CLK

OU

T_D

SP

_SD

_IR

DA

B8

CLKTCXOE13

N10

CLK

_MC

SI_

1_01

1

F2ADD01ADD02

G5G4

ADD03ADD04

G2G3

ADD05ADD06

H1H3

ADD07ADD08

H2H4

ADD09ADD10

H5J1

ADD11ADD12

J2J3

ADD13ADD14

J4K3

ADD15ADD16

K2

R204 390RU200

CALYPSO

ADD00F3

C229100n

TD

I

C230100n

VR

2B

100nC217

10KR672

R206 390R

VDD_RTC

(1608)

C216 1u

(2012)2.2uC222

0RR2280RR227

120K

R219

TP219

TP

211

VR3

TP

213

0RR231

TC

K

1SS388D200

20KR208

VR2B

GN

D

VR1

C20220P

C226

33n

100n

0RR283

C206

R282 0R

B1VS1VS2

A1

(2012)10u

C219

K3VCC1

D2VCC2

G9VCC3

VCHGE4

H6VCK

VDRK7G6

VDXVFS

G7

VR1BOUTC1

H1VR1OUT

VR2BOUTD1

VR2INE2

E1VR2OUT

D3VR2SEL

H10VR3OUT

F4VREF

K4

TE

N

C8TEST1

B8TEST2

A9TEST3TEST4

B9

TESTRESETZF2

TMSA8

TSCXMB6

TSCYMA6

UDRK6J6

UDX

F5UEN

C3UPR

VAUXA3

J3VBACKUP

VBATE5

H3RESERVED

RESPWRONZF6

A10

RP

WO

N

D7RTC_ALARM

SCLK3C4

B4SCLK5

B2SDIO3

SDIO5D4

SRST3B3

SRST5D5

SVDDA2

SWITCHK2

TCKB7

TDIA7C7

TDO

TD

RJ4

FDBKJ1

K1

GR

ND

1G

RN

D2

C2

G10

GR

ND

3

IBIASG1

E3ICTL

F7INT1INT2

H4

C5LCDSYNC

K9MICBIAS

MICINJ8K8

MICIP

ON_OFFD10

F1

OS

CA

SB

10P

WO

N

RE

FG

ND

F3

G5BFSR

J5BFSX

G4BGTR1

G3BGTR2

G2BGTR3BGTR4

H2J2

BGTR5

C10BULIM

C9BULIP

D9BULQM

D8BULQP

BUZZOPK10

CK

13M

A4

DACF10

EARNH8

EARPH9

E6ADIN3

ADIN4_TSCXPD6

ADIN5_TSCYPC6

F8AFC

AGNDA1J7

F9APC

AUXGNDG8

AUXIH7

AUXONJ10J9

AUXOP

E8BDLIM

E7BDLIP

BDLQME10E9

BDLQP

BDRH5

BDXK5

VR2B

TP216

U201NAUSICA_CS

B5ADIN1

A5ADIN2

RP

WR

ON

VB

AT

1M

VBACKUP

R201220K

UPR

VBACKUP

100nC224

R225

(2012)10uC221

VBAT

100nC228

nBS

CA

N

1nC205

S-817

GND1

IN2

4NC

3OUT

TP205

n.mR221

D2011SS388

U202

n.m

TP

209

TP220

0RR229

VBACKUP

R226

C225100n

C233

1SS388D202

10K

R202

100p

33u/6.3V

V1B

UPR

TP204

A-CASE

C232

VBAT_2

TD

O

R2240R

TP

210

UPR

VDD_RTC

18pC204

TD

O_A

RM

TP

212

VR2B

TP208

1M

R209

VDD_RTC

100n

C231

UPR

10KR220R

222

n.m

220nC215

10K

R22

3

_WR

TP218

(2012)10u

C234

X200MC-146

1

23

4

R21120K

TP217

QNQPINIP

DTRDCD

KEYLIGHT

_WR

PWT

JACK_DETECT

A(0)A(0:22)

PA_ON

RESET_RF

HOOK_DETECT

13MHZ

CLK

D(0:15)

RPWRON

_WR

TXIR_IRDA

_CS2_CS3

SUB_LED1

HANDSFREE

PCM_RX

RX

SUB_BACKLIGHT

EN

PCM_TX

KB

R(0

)K

BR

(1)

KB

R(2

)K

BR

(3)

KB

R(4

)

RXIR_IRDA

D(14)D(15)

PCM_SYNC

MELODY_INTFOLDER

LCD_RESET

KB

C(0

)K

BC

(1)

KB

C(2

)K

BC

(3)

KB

C(4

)

SPK_EN

D(5)D(6)D(7)D(8)D(9)D(10)D(11)D(12)D(13)

A(20)A(21)A(22)

SD_IRDA

PCM_CLK

D(0)D(1)D(2)D(3)D(4)

A(9)A(10)A(11)A(12)A(13)A(14)A(15)A(16)A(17)A(18)A(19)

ON_OFF

A(1)A(2)A(3)A(4)A(5)A(6)A(7)A(8)

MCLK

END_ON_OFF

AFCPA_LEVEL

VCHGICTL

SIM_VDDSIM_I_OSIM_CLKSIM_RST

MICBIAS

MICIPMICINEARPEARNAUXOPAUXON

_CS1

SUB_LED2SUB_LED3

MELODY_RESET

FDP

_BHE_BLE

_CS0

_RD

TDO

TDITMSTCK

AUXI

KBR(0:4)

KBC(0:4)

BATT_TEMPRADIO_TEMP

XO_ENARF_ENA

CTSRXD

RTSTXD

TX

DATA

- 91 -

10. CIRCUIT DIAGRAM

A

B

C

D

E

F

MEMORY DEVICE

issue Notice NO. Data Name

Section Date Sign & Name

B

6

F

C

D

LGElectronics Inc

Model

A

E

02.04.11

D.S.JUNG

N.S.KIM

1 52

Designer

Checked

Approved

43

02.04.11

DrawingName

DrawingNo.

Sheet/Sheets

3/6

4 5

7 8

1 2 3 6 7 8

R301 n.m

R305

VR2

C304

33n

C300

10K

K7

WE_C5

D4WP_

R300 0R

100n

M2M7

NC13NC14

M8

NC2A7A8

NC3NC4

B1B7

NC5NC6

B8

L1NC7NC8

L2L7

NC9

J2OE_

RESET_D5

RY_BY_C4

VDDJ5

K2VSS0VSS1

H5J6

DQ13DQ14

H6J7

DQ15

DQ2G4K4

DQ3DQ4

K5G5

DQ5DQ6

K6G6

DQ7DQ8

H3J3

DQ9

NC0A1A2

NC1

NC10L8M1

NC11NC12

A2

F4A20A21

E5

A3C2D2

A4A5

F3E3

A6A7

C3D6

A8A9

C6

H7BYTE_

CE_H2

DQ0G3K3

DQ1

DQ10H4J4

DQ11DQ12

TC58FVB641

U302

G2A0A1

F2

E6A10A11

F6D7

A12A13

C7E7

A14A15

F7G7

A16A17

D3E4

A18A19

F5

E2

0RR303

C1

NC5F1

F10NC6

G1NC7

G10NC8NC9

L1

OE_H3

D5RESET_

E5RY_BY_

D4UB_

VCCFJ5J6

VCCS

J9VSS0VSS1

G3

C6WE_

C5WP_

DQ4DQ5

K7G7

DQ6DQ7

J8K3

DQ8DQ9

H4

DUG8

DU_CIOSK6

LB_C4

NC0A1

A10NC1

NC10L10M1

NC11NC12

M10

NC2B1

B10NC3NC4

C7E7

A9

BYTE_H9

CE1S_J2D6

CE2S_

H2CEF_

J3DQ0DQ1

G4

J4DQ10DQ11

K5J7

DQ12H7

DQ13K8

DQ14DQ15

H8

K4DQ2DQ3

H5H6

D8E8

A13A14

F8D9

A15A16

G9F4

A17A18

E4D7

A19

A2E2

A20E6E9

A21

A3D2

A4F3E3

A5A6

D3C3

A7A8

U301

TH50VSF4683

A0G2F2

A1

A10F7C8

A11A12

TP301

VR2

100n

C301

0RR302

VR2

D(5)

_CS2

_CS0

A(4)

A(8)A(9)A(10)A(11)A(12)A(13)A(14)A(15)A(16)A(17)A(18)A(19)A(20)A(21)A(22)

_BHE

A(5)A(6)A(7)A(8)A(9)

A(10)A(11)A(12)A(13)A(14)A(15)A(16)A(17)A(18)A(19)A(20)A(21)

A(1:22)

A(22)

A(1)A(2)A(3)

A(5)A(6)A(7)

D(1)D(2)D(3)D(4)

D(6)D(7)D(8)D(9)D(10)D(11)D(12)D(13)D(14)D(15)

A(1)A(2)A(3)A(4)

_BLE

FDP

_CS1_RD_WR

D(0)D(1)D(2)D(3)D(4)D(5)D(6)D(7)D(8)D(9)

D(10)D(11)D(12)D(13)D(14)D(15)

D(0:15)

D(0)

- 92 -

10. CIRCUIT DIAGRAM

Sign & Name

2 3 5

6

7 8

1 3 4

D

E

Drawing

issue

Receiver

D.S.JUNG

A

N.S.KIM

Data

DrawingNo.

Checked

A0

4/6

Headset jack

2

LG

Speaker

Electronics Inc

Model

02.04.11

7 8

Date

4

_RDIOVDD

C

NC

MT

R

LED

Microphone

6

Name

_CS

Sheet/Sheets

Approved

B

F

C

A

02.04.11

Section

B

Notice NO.

D

E

F

Designer

Name

5

1

AUDIO

HSP405

VR3

HSP404

4.7RR408

100nC408

P0402FC05C

V401

R407

1M

R4197.5K

n.mC403

47pC407

n.mR422

VR3

100n

VCC_EXT

HSP401

VR3

150KR450

C413

10nC419

R4183.3K

R4021.2K

V400

P0402FC05C

C41147p

10K

R417

1nC426

C414

HSP402

C410

4.7RR410

47p

VBAT

9001-8905-040J400

1

2

34

33p

47pC406

C404100n

C427

V403

P0402FC05C

HSP400

47p

100RR420

R41539K

R41682K

R421 0R

2.4K

R401(2012)

C40110u

47p

MIC400

OB-22S40-C33

1KR400

C400

KDS160EMAX4599U404

1

2

3

45 6

3

8SD_

6SENSE_ADJ

4VIN VOUT

5

18K

R404

VR3

D401

U401

SI9182

CNIOSE12

DELAY ERROP_7

GND

-2

1

5

HSP406

47pC402

C42118p

MAX9075U400

3+

4

47pC423

47pC422

C4172.2u

HSP403

C424100n

(2012)

47p

HSP407 1

2

C405

C412

100n

47p

1M

R405

C425

220nC416

47p

C41822n

45

6

HSP4081

2

C415

7V

DD

VR

EF

98V

SS

28WR_

VR2B

VR3

U402MAX4624

+

2

-31

1213

EQ2EQ3

14

2

19

HPOUT-L1011

HPOUT-R

5

PLL

C6

31

29

32

SPOUT11718

SPOUT2

15SPVDDSPVSS

16

30

U403YMU762

-IR

Q3

-RS

T4

CLK

11

27D

0D

126

D2

25

D3

24

D4

23 22D

5D

621 20

D7

EQ1

P0402FC05C

V402

4.7RR409

R41433K

390pC420

C40947p

D(5

)D

(6)

D(7

)

D(0:7)

VIBRATOR

SUB_LED1

JACK_DETECT

HOOK_DETECT

_WR

D(0

)D

(1)

D(2

)D

(3)

D(4

)

ON_OFF

MICBIAS

MICIP

MICIN

AUX_INAUXOP

AUXI

EARNEARN

SPK_EN

REC_P

EARP

JACK_DETECT

MELODY_INTMELODY_RESET

MCLK

_RD

MIDI_CS

SPKNSPKP

A(1)

- 93 -

10. CIRCUIT DIAGRAM

FOLDER SWITCH

E

PROTECTION

Approved

Date

6

B

C

8

1

Data

A

Checked

SUB LCD BACKLIGHT

No.

Sheet/Sheets

4 52

Electronics Inc

A

Model

D

02.04.11

02.04.11

Name

Section

3

E

4

Drawing

7

DOME SWITCH

5/6

1

8

Name

issue

B

VIBRATOR

Notice NO.

LOCKUP

D.S.JUNG

N.S.KIM

Drawing

7

FSign & Name

2

D

5 6

X21

3

C

KEYPAD BACKLIGHT

Designer

MAIN LCD BACKLIGHT

LG

MMI

F

SW518

HSP500

1 2

SW523DOWN

D51

1

SEND

SW5148

SW501MAIL

56p

C502

10K

R50810K

SW5119

C500100n

R513

R519

F3SW519

F1SW508

P0402FC12CV405

V406P0402FC12C

47K

OUT

HS

P51

6

12

P04

02F

C12

CV

404

SW5091

RN1307Q502

GND

IN

SW500A3212

123

D51

4

D52

0

SW5043

D51

9

6

27RR502

100NL502

R517

4.7R

2

D51

5

Q500

IMX9

12

3

4

5

HSP507

VBAT

HS

P51

5

1

R50910K

R505100K

0SW516

V40

7P

0402

FC

12C

SW5032

HSP502

1 2

HSP501

1 2

D50

9

HSMR-C197

D51

8

D51

7

HSP508

10KR512

R5180R

C504100n

6

SW512F2

HSP506

1.5KR520

5SW506 SW507

R51633R

HSP511

1 2

VR2B

VR2B

VBAT

SW517#

6.2KR510

62R

RN1307Q504GND

IN

OUT

Q503RN1307

GND

IN

OUT

END-ON/OFFSW526

HSP504

1 2

R531

C5031u

R50327R

2

3

1

100KR521

VBAT

(1608)C505

Q506

2SC5585TL

4

56

D50

6

100n

D51

2

U502MAX4599

1

2

3

1 2

7SW510

HSP510

SW515

*

LEFTSW520

UPSW522

HSP503

D50

0

ISS302D521

12

3

L500100N

D50

3

D50

2

D50

1

D50

5

D50

4

D50

8

D51

6

SW524CFM

VBAT

100KR501

D51

3

SW502

SIDE_KEY

CO43

VD

1VMVU

2

HSP505

D51

0

R532

VBAT

4SW505

R533 n.m

D50

7

27R

U501CIM-80S7B

7GND

1LEDALEDK

2

RXD45

SD

3TXD

VCC6

SW521RIGHT

1.5KR500

KBR(3)

KBR(2)

HSP509

R504270R

180RR530

SUB_LED1SUB_LED2

I_LED2

I_LED3

I_LED1

VIBRATOR

PWT

KBR(1)

KB

C(4

)

KBR(0:4)

ON_OFF

VCHG

KBC(0:4)

KB

C(0

)

KBR(0)

KB

C(1

)

KB

C(2

)

KB

C(3

)

RXIR_IRDASD_IRDA

TXIR_IRDA

FOLDER

MOTOR

END_ON_OFF

KBR(4)

KEYLIGHT

MAIN_BACKLIGHT

SUB_LED3

LB_HP

B

0

Drawing

8

Model

1

Drawing

HBSW

Name

Sheet/Sheets

issue

Date

D

2

1

C

1

1

A

Data Name

02.04.11

No.LGElectronics Inc

4 5

B

Section

02.04.11

D

3

1

1

86 7

C

0

7

1

LB_LP

5

Designer

0

Sign & NameF

A

Checked

6

E

F

Y.M.CHO

D.H.KIM

Approved

3 4

E

LBSW

RF MAIN

10

TXRXSW

0

0

Notice NO.

HB_LP HB_HP

2

6/6

C681

1KR631

R6100R

R6473.3N

4.7p

C660 3.3p

R6754.7k

1KR629

27p

1nC619

C639n.m

18RR600

C62

0

5.6n(1608)

C600

47p

C673

L609

3.9N

1n

100nC623

R6382.2K(1%)

C66

6

100nC698

C6111.5p

C684n.m

12n(3216)

C6701.2n

C614

C671

51RR608

R6441.5K

330p

n.mC

622

27p

C602

1n

TP610

R633

12p

C601

10nC665

U629

2

3

4

5

SAFSD1G84CB0T00R00

BPF600

1

2

3

4

5

6

C630

SN74HC1GU04DCKR

C62927P n.m

3pC662

C63

3

1.2K

R62

1

R616n.m 51R

R617

100n

C67912p

VBAT

n.mR676

C6457p

(1608)1.2n

C672

12GND3

7

GND4

14

GND5

10GSM_SW

6H_H_PWR

4H_L_PWR

1L_H_PWR

3L_L_PWR

8PWR_SW

11VCC

13VT

120RR622

C609ENFVZ4L07

U600

9DCS_SW

2GND1

5GND2

C643

R601300R

47p

33u/6.3VA-CASE

7p

SW600MHC-173

12

3456

C636

C638 100n

9.76K(1%)R634

C647 100n

100nC641

2.2uC661

(2012)

R637

P-CASE

C6354.7u

R6421K

1K

100nC648

47p

1.2pC613

470u

1KR657

C608

5

6

78

C603

2.2K

R61

5

U607NC7WZ02

1

2

34

4.7p

C63

2

R61

9n.

m34

VCC1

VCC103

VCC238

VCC342

VC

C4

52

VC

C5

63 55V

CC

6

22V

CC

733

VCC8VCC9

15

VR4IN10

VR

EG

149

VREG27

62V

RE

G3

58R

2

R3

60

17R

ES

ET

Z

RX

LON

5354R

XLO

P28

RX

MIX

IN

27R

XM

IXIP

26R

XM

IXQ

NR

XM

IXQ

P25 29

TE

ST

VC

O

TXRX-SW2

59T

XR

XC

P

48VAPC

VB

AT

150

VBAT26

VB

AT

361

GN

DT

XC

P56

GSMLNAN3736

GSMLNAP

1HB-SW

IN20 21

IP

LB-S

W64

MAINCP54

MAINSPUP1

57M

AIN

SP

UP

2

MAINVCO35

51O

MIX

RF

PCSMIXN4140

PCSMIXP

18Q

N19

QP

14AUXCP

AU

XV

CO

N2423

AU

XV

CO

P

32B

AN

DG

AP

BIA

SR

EF

31

11CLK

CRF16

12DATA

44DCSLNANDCSLNAP

43

30D

EC

RX

MIX

DETD4645

DETR

EN13

FILT47

GNDLNAN39

C627

U604

TRF61508APC

9APCEN

100nC663

1n

1KR635

L6323.3N

R6462.2K

n.mC606

BPF601SAFSD942MCL0T00R00

1

2

3

4

5

6

R604 1K

HVC369BD601

2AN

1CAT

LDB32942M05D-429U602

8DCS

1GND1

3GND2

2 GSM4 NC1

6NC2

7OUTN

5OUTP

2.7NL603

R6780R

C66

7

R656 1K

LDC15D190A0007AN600

1

2 3

4

5

67

8

1n

1nC625

(1608)

12nC615

(3216)

680RR674

C6741n

(2012)

100nC683

(2012)

C6872.2u

10pR603

100RR606

ANT600ANT_PAD_LGX

0RL600

L60112n

ADP3330_2V85U605

3-ERR

6-SD G

ND

4

2IN

5NR

1OUT

33R

R62

0

0.5p

C6801n

n.m

L6116.8N

C690

3.3pC658

R623

VBAT

1.2nC691

CA

T

PF08122BU601 9

GN

D1

10G

ND

2

8PIN_DCS

1PIN_GSM

5POUT_DCS

4POUT_GSM

2V

AP

C7

VC

TL

3

VD

D1

6

VD

D2

R6362.7K(1%)

300RR602

HVB387BWKD602

1

A1

2

A2

3

C649

3p

12pC605

100n

R607100R

C675

VBAT

C657

C646 100n

1n

0RR632

1KR625

n.mC612

1MR643

620KR624

L602 2.7N15pC642

100n

C63

4

n.mR640

1n

L60518N

VBAT

R677 0R

C628

2.2uC624

(2012)

n.m R641390R(1%)

6.8NL612

R6090R

C678

R630 1K

27p

C62

1

4.7uP-CASE

3.3NL608

C604

C626

4

R6261K

R64910R

27p

C637

BAT15-099D600

1

2

3

VC-TCXO-208CU606

1CTL

2GND

3OUT

4

VCC

39p

C66

910

0n

12p

TH60122K_NTC

L635 4.7N

2.2KR648

C686

n.m

68RR605

R673270k

C610

C6824.7p

GND211

GND39

GND45

GND53

GND6

1

VC

1

7

VC

2

C685100n

18NL606

SHS-M090BU603

4

AN

T

6 DCS_RX

8 DCS_TX

2 EGSM_RX

10EGSM_TX

13GND1

12

n.mC640

C66

8

3.3NL633

C692 1n

100n2.2uC664

(2012)

n.mR679

1KR645

RADIO_TEMP

VR2B

LBSW

TXRXSWHBSW

VREG3

HBSW

TXRXSW

LBSWVREG3

VR3

RF_ENA

XO_ENA

AFC

RESET_RF

13MHZ

CLKDATA

EN

QNQP

PA_ONPA_LEVEL

INIP

- 94 -

10. CIRCUIT DIAGRAM

10.2 RF Circuit

- 95 -

11. PCB LAYOUT

11.1 TOP

11. PCB LAYOUT

- 96 -

11. PCB LAYOUT

11.2 BOTTOM

- 97 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 Exploded View


M27

M28M31 M32

M29

M25

M2

M34

M35

M5

M6M7

M8

M4

M10

M14

M15

M12 M13

M16

M19

M17

M22

M20

M23M26

M11

M18M21 M24

M9

M30

M3M1

M33

- 98 -

< Parts List Of Exploded View >


No. Location No. Part No. Description QTY Specification Color Sevice RemarkM1 MWAF00 MWAF0005701 WINDOW,LCD(SUB) 1 G7020 G7028 Common use (ALL BRAND) YM2 ACGJ00 ACGJ0016302 COVER ASSY,FOLDER(UPPER) 1 Cobalt Blue Y

ACGJ0016301 COVER ASSY,FOLDER(UPPER) 1 Metal Silver YACGJ0016303 COVER ASSY,FOLDER(UPPER) 1 Red Y

M3 MHFD00 MHFD0002101 HINGE,FOLDER 1 G7000 5 PHI YM4 SVLM00 SVLM0003701 LCD MODULE 1 128*160, 96*64 ,32.05*40.20 ,39.5*58.7*6.4(t), 65K COLOR LCD YM5 SUSY00 SUSY0006001 SPEAKER 1 ASSY ,8 ohm,86 dB,15 mm,G7000 SPEAKER YM6 SACY00 SURY0004501 RECEIVER 1 YM7 SJMY00 SJMY0002801 VIBRATOR,MOTOR 1 3.0 V,80 mA,12*15 ,height 2.7+0.1T YM8 SBCL00 SBCL0001001 BATTERY,CELL,LITHIUM 1 3 V,1.2 mAh,COIN ,ASAHI BATTERY (ML414NB/F9D) YM9 SACY00 SACY0004601 PCB ASSY,FLEXIBLE 1 G7000 Receiver YM10 SACY01 SACY0004501 PCB ASSY,FLEXIBLE 1 G7000 LCD YM11 ACGH00 ACGH0006702 COVER ASSY,FOLDER(LOWER) 1 Cobalt Blue Y

ACGH0006703 COVER ASSY,FOLDER(LOWER) 1 Metal Silver YACGH0006704 COVER ASSY,FOLDER(LOWER) 1 Red Y

M12 GMZZ00 GMZZ0003201 SCREW MACHINE 2 3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7X3.5 DIA3.5 YM13 MCCH00 MCCH0003902 CAP,SCREW 2 Cobal Blue Y

MCCH0003903 CAP,SCREW 2 Metal Silver YMCCH0003904 CAP,SCREW 2 Red Y

M14 MBHY00MBHY0003503 BUMPER 1 LG-510,511,512,common use for METALIC SILVER,diameter=2.4

Cobalt BlueYMetal Silver

MBHY0003505 BUMPER 1 LG-510,511,512,common use, diameter=2.4 Red YM15 MWAC00 MWAC0021401 WINDOW,LCD 1 65K COLOR (LG Brand) YM16 ABGC00 ABGC0000701 BUTTON ASSY,SIDE 1 G7000 YM17 ACGK00 ACGK0014702 COVER ASSY,FRONT 1 Cobalt Blue Y

ACGK0014703 COVER ASSY,FRONT 1 Metal Silver YACGK0014704 COVER ASSY,FRONT 1 Red Y

M18 MDAC00 MDAC0005001 DECO,SIDE 2 G7000 YM19 MCCC00 MCCC0003502 CAP,EARPHONE JACK 1 G7000 Pearl White Color Cobalt Blue Y

MCCC0003501 CAP,EARPHONE JACK 1 Metal Silver YMCCC0003503 CAP,EARPHONE JACK 1 Red Y

M20 ABGA00 ABGA0000901 BUTTON ASSY,DIAL 1 OK key + i (English version) YM21 ADCA00 ADCA0006001 DOME ASSY,METAL 1 G7000 YM22 SAKY00 SAKY0001101 PCB ASSY,SIDEKEY 1 G7000 YM23 SAFY00 SAFY0050102 PCB ASSY,MAIN 1 65K color PCB ASSY MAIN YM24 SUMY00 SUMY0003503 MICROPHONE 1 FPCB,-40 dB,6*1.8,TOLERANCE +-2 YM25 MLEA00 MLEA0003802 LOCKER,BATTERY 1 Cobalt Blue Y

MLEA0003803 LOCKER,BATTERY 1 Metal Silver YMLEA0003804 LOCKER,BATTERY 1 Red Y

M26 MWAZ00 MWAZ0001701 WINDOW 1 G7000 IrDA YM27 ACGM00 ACGM0011902 COVER ASSY,REAR 1 Cobalt Blue Y

ACGM0011903 COVER ASSY,REAR 1 MetalSilver YACGM0011904 COVER ASSY,REAR 1 Red Y

M28 SNGF00 SNGF0000702 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P426C ,G7000 ANTENNA Cobalt Blue YSNGF0000701 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P427 ,G7000 ANTENNA (PANTONE 427C) Metal Silver YSNGF0000702 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P426C ,G7000 ANTENNA Red Y

M29 ACFY00 ACFY0000701 CONTACT ASSY,ANTENNA 1 G7000 YM30 MCCF00 MCCF0002002 CAP,MOBILE SWITCH 1 LG-510,511,512 Cobalt Blue Y

MCCF0002003 CAP,MOBILE SWITCH 1 LG-510,511,512 Metal Silver YMCCF0002005 CAP,MOBILE SWITCH 1 LG-510,511,512 Red Y

M31 GMZZ00 GMZZ0003201 SCREW MACHINE 2 3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7X3.5 DIA3.5 YM32 SBPP00 SBPP0005103 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (CB) Cobalt Blue Y

SBPP0005102 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (SV) Metal Silver YSBPP0005104 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (RD) Red Y

M33 MTAE00 MTAE0004901 TAPE,WINDOW(SUB) 1 G7020 G7028 Common use YM34 MCCZ00 MCCZ0002702 CAP 1 Cobalt Blue Y

MCCZ0002703 CAP 1 Metal Silver YMCCZ0002704 CAP 1 Red Y

M35 ACGG00 ACGG0021702 COVER ASSY,FOLDER 1 Cobalt Blue YACGG0021701 COVER ASSY,FOLDER 1 Metal Silver YACGG0021703 COVER ASSY,FOLDER 1 Red Y

- 99 -


12.2 Accessories

Portable Handsfree Travel Adapter

Cigar Lighter Adapter Data-cable

< Accessories >No. Location No. Part No. Description QTY Specification Color Service Remark2 SGEY00 SGEY0002901 EAR PHONE/EAR MIKE SET 1 EG890B, G5200 3P EAR MIC (EM-412GS) Yes2 SSAD00 SSAD0007806 TRAVEL ADAPTOR,AC-DC 1 100-240V, 50/60 Hz,5.2 V,850 mA,CE (Europe: TA-20G) Yes

SSAD0007807 TRAVEL ADAPTOR,AC-DC 1 100-240V, 50/60 Hz,5.2 V,850 mA,CE (Russian(CIS): TA-20GR) Yes2 SGCC00 SGCC0001802 CIGARETTE LIGHT ADOPTER 1 CLA (CLA-20G) Yes2 SGDY00 SGDY0004401 DATACABLE 1 (DK-20G) Yes

- 100 -


12.3REPLACEMENT PARTS

<Mechanic components>Level Location No. Part No. Description QTY Specification Service Color Remark

3 ABGA00 — BUTTON ASSY,DIAL 1 Please refer to the 'Exploded View' Y M203 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Cobalt Blue M353 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Metal Silver3 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Red4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Cobalt Blue M114 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Red5 MBHY00 — BUMPER 2 Please refer to the 'Exploded View' Y M144 MCCH00 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Cobalt Blue M134 MCCH01 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Metal Silver4 MCCH02 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Red5 MCJH00 MCJH0004203 COVER,FOLDER(LOWER) 1 N5 MDAF00 MDAF0000702 DECO,FOLDER(LOWER) 1 N Cobalt Blue5 MDAF00 MDAF0000703 DECO,FOLDER(LOWER) 1 N Metal Silver5 MDAF00 MDAF0000704 DECO,FOLDER(LOWER) 1 N Red5 MDAH01 MDAH0000201 DECO,RECEIVER 1 G7000 N5 MFBB00 MFBB0001901 FILTER,RECEIVER 1 G7000 N5 MPBG00 MPBG0004801 PAD,LCD 1 G7000 N5 MPBJ00 MPBJ0003201 PAD,MOTOR 1 G7000 N5 MTAA00 MTAA0006801 TAPE,DECO 1 G7000 RECEIVER N Pearl White5 MTAA00 MTAA0006501 TAPE,DECO 1 G7000 FOLDER(LOWER) N Metal Silver5 MTAA00 MTAA0006401 TAPE,DECO 1 G7000 FRONT N Red5 MTAA01 MTAA0006501 TAPE,DECO 1 G7000 FOLDER(LOWER) N Pearl White5 MTAA01 MTAA0006801 TAPE,DECO 1 G7000 RECEIVER N Metal Silver5 MTAA01 MTAA0006701 TAPE,DECO 2 G7000 SIDE N Red5 MTAD00 MTAD0010301 TAPE,WINDOW 1 NITTO No.5000NS (t=0.16) N4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Cobalt Blue M24 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Red5 ADBY00 ADBY0001202 DECO ASSY 1 Y Cobalt Blue5 ADBY00 ADBY0001201 DECO ASSY 1 PROJECTION ASSY (RUSSIA) Y Metal Silver5 ADBY00 ADBY0001203 DECO ASSY 1 Y Red6 MDAE00 MDAE0009802 DECO,FOLDER(UPPER) 1 N Cobalt Blue6 MDAE00 MDAE0009801 DECO,FOLDER(UPPER) 1 PROJECTION N Metal Silver6 MDAE00 MDAE0009803 DECO,FOLDER(UPPER) 1 N Red6 MFBC00 MFBC0001901 FILTER,SPEAKER 1 G7010,G7020 COMMON USE N6 MTAA00 MTAA0016601 TAPE,DECO 1 UPPER DECO(LEATHER ASSY) N5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Cobalt Blue M345 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Metal Silver5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Red5 MCJJ00 MCJJ0010202 COVER,FOLDER(UPPER) 1 N Cobalt Blue5 MCJJ00 MCJJ0010201 COVER,FOLDER(UPPER) 1 G7028 (EASTCOM BRAND) N Metal Silver5 MCJJ00 MCJJ0010203 COVER,FOLDER(UPPER) 1 N Red5 MDAE00 MDAE0008403 DECO,FOLDER(UPPER) 1 W7020 LG-COLOR DISPLAY (RUSSIA) N5 MDAY00 MDAY0004201 DECO 1 G7020 G7028 Common use (SUS) N5 MIAA00 MIAA0006701 INDICATOR,LED 1 G7020 G7028 COMMON USE N5 MICA00 MICA0001201 INSERT,FRONT 2 LG-G510,511,512 common use, DIA = 1.7mm+2.3t N5 MMAA00 MMAA0000901 MAGNET,SWITCH 1 G7000 12x2x0.7t N5 MPBQ00 MPBQ0005501 PAD,LCD(SUB) 1 G7010 & G7020 SUB LCD PAD N5 MPBZ00 MPBZ0017401 PAD 1 G7010, G7020 INDICATOR PAD (Common use) N5 MPFD00 MPFD0001001 PLATE,GROUND 1 G7010 N5 MTAA00 MTAA0015501 TAPE,DECO 1 G7020 folder uppper (Electro Forming) ) N5 MTAA01 MTAA0015601 TAPE,DECO 1 G7020 FOLDER UPPER SUS (#615 OR#668) N5 MTAE00 — TAPE,WINDOW(SUB) 1 Please refer to the 'Exploded View' Y M335 MTAZ00 MTAZ0005401 TAPE 1 G7000 MAGNET SWITCH N

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Level Location No. Part No. Description QTY Specification Service Color Remark4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Cobalt Blue M174 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Red5 ABGC00 — BUTTON ASSY,SIDE 1 Please refer to the 'Exploded View' Y M165 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Cobalt Blue M195 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Pearl White5 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Red5 MCJK00 MCJK0006602 COVER,FRONT 1 N Cobalt Blue5 MCJK00 MCJK0006603 COVER,FRONT 1 N Metal Silver5 MCJK00 MCJK0006604 COVER,FRONT 1 N Red5 MDAC00 — DECO,SIDE 2 Please refer to the 'Exploded View' Y M185 MDAG00 MDAG0000902 DECO,FRONT 1 N Cobalt Blue5 MDAG00 MDAG0000903 DECO,FRONT 1 N Metal Silver5 MDAG00 MDAG0000904 DECO,FRONT 1 N Red5 MICA00 MICA0001201 INSERT,FRONT 4 LG-G510,511,512 common use, DIA = 1.7mm+2.3t N5 MPBH00 MPBH0001101 PAD,MIKE 1 G7000 FRONT N5 MTAA00 MTAA0006401 TAPE,DECO 1 G7000 FRONT N5 MTAA01 MTAA0006701 TAPE,DECO 2 G7000 SIDE N4 GMZZ00 — SCREW MACHINE 2 Please refer to the 'Exploded View' Y M124 MGAD00 MGAD0006001 GASKET,SHIELD FORM 2 G7000 10x5x1.5t N 4 MHFD00 — HINGE,FOLDER 1 Please refer to the 'Exploded View' Y M34 MTAB00 MTAB0005101 TAPE,PROTECTION 1 G7000 FOLDER UPPER PROTECTION TAPE Y4 MTAB01 MTAB0005001 TAPE,PROTECTION 1 G7000 MAIN LCD WINDOW PROTECTION TAPE N4 MTAB02 MTAB0005201 TAPE,PROTECTION 1 G7000 sublcd window tape N4 MWAC00 — WINDOW,LCD 1 Please refer to the 'Exploded View' Y M154 MWAF00 — WINDOW,LCD(SUB) 1 Please refer to the 'Exploded View' Y M14 SACY00 — PCB ASSY,FLEXIBLE 1 Please refer to the 'Exploded View' Y M95 SACY00 — RECEIVER 1 Please refer to the 'Exploded View' Y M65 SBCL00 — BATTERY,CELL,LITHIUM 1 Please refer to the 'Exploded View' Y M85 SJMY00 — VIBRATOR,MOTOR 1 Please refer to the 'Exploded View' Y M75 SPCY00 SPCY0007304 PCB,FLEXIBLE 1 POLYI ,0.3 mm,DOUBLE ,G7000 Receiver N5 SUSY00 — SPEAKER 1 Please refer to the 'Exploded View' Y M54 SACY01 — PCB ASSY,FLEXIBLE 1 Please refer to the 'Exploded View' Y M105 ENBY00 ENBY0011001 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (SOCKET) N5 ENBY01 ENBY0010901 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER) N5 SPCY00 SPCY0007202 PCB,FLEXIBLE 1 POLYI ,0.3 mm,DOUBLE ,G7000 LCD N4 SPCY00 SPCY0013401 PCB,FLEXIBLE 1 FR-1 ,0.07 mm,DOUBLE ,GND FPCB N4 SVLM00 — LCD MODULE 1 Please refer to the 'Exploded View' Y M43 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Cobalt Blue M273 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Metal Silver3 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Red4 ACFY00 — CONTACT ASSY,ANTENNA 1 Please refer to the 'Exploded View' Y M295 MBIA00 MBIA0000301 BUSHING,ANTENNA 1 G7000 (KS-D-5101 C3603B ), N3 MCCF00 MCCF0002002 CAP,MOBILE SWITCH 1 Please refer to the 'Exploded View' Y Cobalt Blue M303 MCCF01 MCCF0002003 CAP,MOBILE SWITCH Please refer to the 'Exploded View' Metal Silver3 MCCF02 MCCF0002005 CAP,MOBILE SWITCH Please refer to the 'Exploded View' Red5 MCIA00 MCIA0003701 CONTACT,ANTENNA 1 G7000 N4 MCJN00 MCJN0005402 COVER,REAR 1 N Cobalt Blue4 MCJN00 MCJN0005403 COVER,REAR 1 N Metal Silver4 MCJN00 MCJN0005404 COVER,REAR 1 N Red4 MGAD00 MGAD0011901 GASKET,SHIELD FORM 1 (2.8X7.5X0.3t) N4 MGAD01 MGAD0012001 GASKET,SHIELD FORM 1 (6.0X6.0X3.0t) N4 MIDZ00 MIDZ0008001 INSULATOR 1 G7000 BB INSULATOR N4 MIDZ01 MIDZ0008101 INSULATOR 1 G7000 RF INSULATOR N4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Cobalt Blue M25

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Level Location No. Part No. Description QTY Specification Service Color Remark4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Metal Silver4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Red4 MPBH00 MPBH0001201 PAD,MIKE 1 G7000 BACK N4 MSAZ00 MSAZ0007603 SHEET 1 FDK Company(PE72 11.0*11.0*0.25t) N4 MSAZ01 MSAZ0007602 SHEET 1 FDK Company (PE72 4.2*11.8 0.25t) N4 MSDB00 MSDB0001701 SPRING,COIL 1 G7000 N4 MWAZ00 — WINDOW 1 Please refer to the 'Exploded View' Y M263 ADCA00 — DOME ASSY,METAL 1 Please refer to the 'Exploded View' Y M213 GMZZ00 — SCREW MACHINE 4 Please refer to the 'Exploded View' Y M313 MLAK00 MLAK0006301 LABEL,MODEL 1 LG (30.5x21.54-1R) Y3 SAKY00 — PCB ASSY,SIDEKEY 1 Please refer to the 'Exploded View' Y M223 SUMY00 — MICROPHONE 1 Please refer to the 'Exploded View' Y M242 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Cobalt Blue M322 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Metal Silver2 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Red2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Cobalt Blue M282 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Metal Silver2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Red

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Leve Location No. Part No. Description QTY Specification Service Remark3 SAFY00 — PCB ASSY,MAIN 1 Please refer to 'Exploded View' Y M234 SAFA00 SAFA0015702 PCB ASSY,MAIN,AUTO 1 65K color PCB ASSY MAIN AUTO N5 BPF600 SFSY0012301 FILTER,SAW 1 1842.5 MHz,2.0*2.5*1.0 ,SMD ,DCS BAND Y5 BPF601 SFSY0012201 FILTER,SAW 1 942.5 MHz,2.0*2.5*1.0 ,SMD ,GSM BAND Y5 BPF602 SFSY0014101 FILTER,SAW 1 897 MHz,2.0*2.0*1.8 ,SMD , Y5 C100 ECTZ0003901 CAP,TANTAL,CHIP,MAKER 1 10 uF,16V ,M ,STD ,ETC ,R/TP Y5 C101 ECCH0000179 CAP,CERAMIC,CHIP 1 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y5 C103 ECCH0000130 CAP,CERAMIC,CHIP 1 150 pF,50V,J,SL,TC,1005,R/TP Y5 C104 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C105 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C106 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C107 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C108 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C109 ECZH0003902 CAP,CHIP,MAKER 1 0.1 uF,50V ,K ,X7R ,HD ,2012 ,R/TP Y5 C110 ECCH0000276 CAP,CERAMIC,CHIP 1 1 uF,10V,Z,Y5V,HD,1608,R/TP Y5 C118 ECCH0000186 CAP,CERAMIC,CHIP 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y5 C119 ECCH0000186 CAP,CERAMIC,CHIP 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y5 C120 ECCH0000186 CAP,CERAMIC,CHIP 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y5 C124 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 C202 ECCH0000114 CAP,CERAMIC,CHIP 1 20 pF,50V,J,NP0,TC,1005,R/TP Y5 C203 ECCH0000114 CAP,CERAMIC,CHIP 1 20 pF,50V,J,NP0,TC,1005,R/TP Y5 C204 ECCH0000113 CAP,CERAMIC,CHIP 1 18 pF,50V,J,NP0,TC,1005,R/TP Y5 C205 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C206 ECCH0000161 CAP,CERAMIC,CHIP 1 33 nF,16V,K,X7R,HD,1005,R/TP Y5 C211 ECCH0000135 CAP,CERAMIC,CHIP 1 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP Y5 C213 ECCH0000135 CAP,CERAMIC,CHIP 1 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP Y5 C215 ECCH0001811 CAP,CERAMIC,CHIP 1 0.22 uF,50V ,Z ,Y5V ,HD ,1005 ,R/TP Y5 C216 ECCH0000276 CAP,CERAMIC,CHIP 1 1 uF,10V,Z,Y5V,HD,1608,R/TP Y5 C217 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C218 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C219 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C220 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C221 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C222 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C223 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C224 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C225 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C226 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C227 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C228 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C229 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C230 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C231 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C232 ECTZ0003101 CAP,TANTAL,CHIP,MAKER 1 33 uF,10V ,M ,STD ,ETC ,R/TP Y5 C233 ECCH0000128 CAP,CERAMIC,CHIP 1 100 pF,50V,J,NP0,TC,1005,R/TP Y5 C234 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C300 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C301 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C304 ECCH0000161 CAP,CERAMIC,CHIP 1 33 nF,16V,K,X7R,HD,1005,R/TP Y5 C400 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C401 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C402 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C404 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C405 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C406 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C407 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C408 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C409 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C410 ECCH0000189 CAP,CERAMIC,CHIP 1 680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP Y5 C411 ECCH0000189 CAP,CERAMIC,CHIP 1 680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP Y5 C412 ECCH0000189 CAP,CERAMIC,CHIP 1 680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP Y

< Main PCB >

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Leve Location No. Part No. Description QTY Specification Service Remark5 C413 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C414 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C415 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C416 ECCH0001811 CAP,CERAMIC,CHIP 1 0.22 uF,50V ,Z ,Y5V ,HD ,1005 ,R/TP Y5 C417 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C418 ECCH0000179 CAP,CERAMIC,CHIP 1 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y5 C419 ECCH0000155 CAP,CERAMIC,CHIP 1 10 nF,16V,K,X7R,HD,1005,R/TP Y5 C421 ECCH0000113 CAP,CERAMIC,CHIP 1 18 pF,50V,J,NP0,TC,1005,R/TP Y5 C422 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C423 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C424 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C425 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C426 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C427 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C428 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C450 ECCH0003401 CAP,CERAMIC,CHIP 1 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP Y5 C500 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C501 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C502 ECCH0000124 CAP,CERAMIC,CHIP 1 56 pF,50V,J,NP0,TC,1005,R/TP Y5 C503 ECCH0000276 CAP,CERAMIC,CHIP 1 1 uF,10V,Z,Y5V,HD,1608,R/TP Y5 C504 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C505 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C600 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C601 ECCH0000111 CAP,CERAMIC,CHIP 1 12 pF,50V,J,NP0,TC,1005,R/TP Y5 C602 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C603 ECTZ0003801 CAP,TANTAL,CHIP,MAKER 1 470 uF,6.3V ,M ,L_ESR ,ETC ,R/TP Y5 C604 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C605 ECCH0000111 CAP,CERAMIC,CHIP 1 12 pF,50V,J,NP0,TC,1005,R/TP Y5 C608 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C609 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C611 ECCH0000103 CAP,CERAMIC,CHIP 1 1.5 pF,50V,C,NP0,TC,1005,R/TP Y5 C613 ECCH0000701 CAP,CERAMIC,CHIP 1 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C614 ECCH0000137 CAP,CERAMIC,CHIP 1 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP Y5 C615 ECFD0000101 CAP,FILM,MPP 1 8200 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP Y5 C619 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C620 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C621 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C622 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C623 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C624 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C625 ECFD0000601 CAP,FILM,MPP 1 1 nF,16V ,J ,NI ,SMD ,1608 mm,R/TP Y5 C626 ECTZ0003401 CAP,TANTAL,CHIP,MAKER 1 4.7 uF,6.3V ,M ,STD ,2012 ,R/TP Y5 C627 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C628 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C629 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C632 ECCH0000181 CAP,CERAMIC,CHIP 1 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C633 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C634 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C635 ECTZ0003401 CAP,TANTAL,CHIP,MAKER 1 4.7 uF,6.3V ,M ,STD ,2012 ,R/TP Y5 C636 ECTZ0003101 CAP,TANTAL,CHIP,MAKER 1 33 uF,10V ,M ,STD ,ETC ,R/TP Y5 C637 ECCH0000120 CAP,CERAMIC,CHIP 1 39 pF,50V,J,NP0,TC,1005,R/TP Y5 C638 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C641 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C642 ECCH0000112 CAP,CERAMIC,CHIP 1 15 pF,50V,J,NP0,TC,1005,R/TP Y5 C643 ECCH0000108 CAP,CERAMIC,CHIP 1 7 pF,50V,D,NP0,TC,1005,R/TP Y5 C645 ECCH0000108 CAP,CERAMIC,CHIP 1 7 pF,50V,D,NP0,TC,1005,R/TP Y5 C646 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C647 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C648 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C649 ECCH0000104 CAP,CERAMIC,CHIP 1 3 pF,50V,C,NP0,TC,1005,R/TP Y5 C657 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C658 ECCH0000180 CAP,CERAMIC,CHIP 1 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C660 ECCH0000180 CAP,CERAMIC,CHIP 1 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C661 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y


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Leve Location No. Part No. Description QTY Specification Service Remark5 C662 ECCH0000104 CAP,CERAMIC,CHIP 1 3 pF,50V,C,NP0,TC,1005,R/TP Y5 C663 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C664 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C665 ECCH0000155 CAP,CERAMIC,CHIP 1 10 nF,16V,K,X7R,HD,1005,R/TP Y5 C666 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C667 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C669 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C670 ECCH0000144 CAP,CERAMIC,CHIP 1 1.2 nF,50V,K,X7R,HD,1005,R/TP Y5 C671 ECFD0000701 CAP,FILM,MPP 1 12 nF,16V ,J ,NI ,SMD ,3216 mm,R/TP Y5 C672 ECCH0000248 CAP,CERAMIC,CHIP 1 1.2 nF,50V,K,X7R,HD,1608,R/TP Y5 C673 ECCH0000256 CAP,CERAMIC,CHIP 1 5.6 nF,50V,K,X7R,HD,1608,R/TP Y5 C674 ECFD0000601 CAP,FILM,MPP 1 1 nF,16V ,J ,NI ,SMD ,1608 mm,R/TP Y5 C675 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C679 ECCH0000111 CAP,CERAMIC,CHIP 1 12 pF,50V,J,NP0,TC,1005,R/TP Y5 C680 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C681 ECCH0000181 CAP,CERAMIC,CHIP 1 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C682 ECCH0000181 CAP,CERAMIC,CHIP 1 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C683 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C685 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C686 ECCH0000111 CAP,CERAMIC,CHIP 1 12 pF,50V,J,NP0,TC,1005,R/TP Y5 C687 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C690 ECCH0000101 CAP,CERAMIC,CHIP 1 0.5 pF,50V,C,NP0,TC,1005,R/TP Y5 C691 ECCH0000144 CAP,CERAMIC,CHIP 1 1.2 nF,50V,K,X7R,HD,1005,R/TP Y5 C692 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C698 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 D100 EDSY0005201 DIODE,SWITCHING 1 SMD ,30 V,1.5 A,R/TP , Y5 D200 EDSY0010401 DIODE,SWITCHING 1 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky Barrier Type Diode Y5 D201 EDSY0010401 DIODE,SWITCHING 1 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky Barrier Type Diode Y5 D202 EDSY0010401 DIODE,SWITCHING 1 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky Barrier Type Diode Y5 D401 EDSY0009901 DIODE,SWITCHING 1 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t) Y5 D501 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D502 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D503 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D505 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D506 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D507 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D508 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D511 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D512 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D513 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D514 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D517 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D518 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D519 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D520 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D521 EDSY0005301 DIODE,SWITCHING 1 SC-70 ,80 V,0.1 A,R/TP , Y5 D600 EDSY0010301 DIODE,SWITCHING 1 SOT-143 ,4 V,.11 A,R/TP ,Silicon Dual Schottky Diode Y5 D601 EDVY0001201 DIODE,VARIABLE CAP 1 UFP ,4.65 pF,R/TP ,diode capacitance:C1:4.65~5.15pF/C4:1.85~2.15pF Y5 D602 EDVY0001401 DIODE,VARIABLE CAP 1 CMPAK ,4.50 pF,R/TP ,diode capacitance:C1:4.50~5.00pF/C3:1.85~2.80pF Y5 HSP402 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 J100 ENSY0007601 CONN,SOCKET 1 6 PIN,ETC ,SOCKET ,2.54 mm,G7000 SIM CNT (2.4t) Y5 J101 ENRY0000901 CONNECTOR,I/O 1 24 PIN,0.5 mm,ETC , , Y5 J102 ENBY0010901 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER) Y5 J400 ENJE0002301 CONN,JACK/PLUG,EARPHONE 1 3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD Y5 L100 SFBH0007102 FILTER,BEAD,CHIP 1 10 ohm,1005 ,Ferrite Bead Y5 L102 SFBH0007102 FILTER,BEAD,CHIP 1 10 ohm,1005 ,Ferrite Bead Y5 L103 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L104 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L105 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L106 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L107 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L108 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L109 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L110 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y


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Leve Location No. Part No. Description QTY Specification Service Remark5 L111 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L112 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L113 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L114 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L115 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L116 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L117 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L118 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L119 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L120 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L124 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L190 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L500 ELCH0005009 INDUCTOR,CHIP 1 100 nH,J ,1005 ,R/TP , Y5 L502 ELCH0005009 INDUCTOR,CHIP 1 100 nH,J ,1005 ,R/TP , Y5 L600 ECCH0000112 CAP,CERAMIC,CHIP 1 15 pF,50V,J,NP0,TC,1005,R/TP Y5 L601 ELCH0005003 INDUCTOR,CHIP 1 12 nH,J ,1005 ,R/TP , Y5 L602 ELCH0005002 INDUCTOR,CHIP 1 2.7 nH,S ,1005 ,R/TP , Y5 L603 ELCH0005002 INDUCTOR,CHIP 1 2.7 nH,S ,1005 ,R/TP , Y5 L605 ELCH0001402 INDUCTOR,CHIP 1 18 nH,J,1005,R/TP Y5 L606 ELCH0001402 INDUCTOR,CHIP 1 18 nH,J,1005,R/TP Y5 L608 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y5 L609 ELCH0005012 INDUCTOR,CHIP 1 3.9 nH,S ,1005 ,R/TP , Y5 L610 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L611 ELCH0001003 INDUCTOR,CHIP 1 6.8 nH,J,1005,R/TP Y5 L612 ELCH0001003 INDUCTOR,CHIP 1 6.8 nH,J,1005,R/TP Y5 L632 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y5 L633 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y5 L635 ELCH0005013 INDUCTOR,CHIP 1 4.7 nH,S ,1005 ,R/TP , Y5 N600 SCHY0000101 COUPLER,RF HYBRID 1 19.0 dB,0.35 dB,24.0 dB,2.0*1.25*0.95 ,SMD ,DUAL COUPLER Y5 Q100 EQFP0003301 TR,FET,P-CHANNEL 1 SOT-6 ,1.6 W,30 V,2.4 A,R/TP ,use for charge P- CHANNEL FET Y5 Q101 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y5 Q500 EQBN0004801 TR,BJT,NPN 1 SMT6 ,0.2 W,R/TP , Y5 Q502 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y5 Q503 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y5 Q504 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y5 Q506 EQBN0007101 TR,BJT,NPN 1 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY Y5 R100 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y5 R101 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y5 R102 ERHY0000299 RES,CHIP 1 33000 ohm,1/16W ,J ,1005 ,R/TP Y5 R103 ERNR0000403 RES,ARRAY,R 1 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y5 R104 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R105 ERHY0000220 RES,CHIP 1 100 ohm,1/16W,J,1005,R/TP Y5 R106 ERNR0000401 RES,ARRAY,R 1 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y5 R107 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R108 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R109 ERHY0000226 RES,CHIP 1 220 ohm,1/16W,J,1005,R/TP Y5 R110 ERNR0000401 RES,ARRAY,R 1 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y5 R111 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R112 ERNR0000401 RES,ARRAY,R 1 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y5 R114 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y5 R115 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R116 ERHY0001102 RES,CHIP 1 0.2 ohm,1/4W ,F ,2012 ,R/TP Y5 R117 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R118 ERHY0000250 RES,CHIP 1 3.3K ohm,1/16W,J,1005,R/TP Y5 R120 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R121 ERHY0000250 RES,CHIP 1 3.3K ohm,1/16W,J,1005,R/TP Y5 R122 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R123 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R124 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R150 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R151 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R152 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R201 ERHY0000287 RES,CHIP 1 220K ohm,1/16W,J,1005,R/TP Y5 R202 ERHY0000299 RES,CHIP 1 33000 ohm,1/16W ,J ,1005 ,R/TP Y


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Leve Location No. Part No. Description QTY Specification Service Remark5 R203 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R204 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R205 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R206 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R207 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R208 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y5 R209 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y5 R211 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y5 R219 ERHY0000282 RES,CHIP 1 120K ohm,1/16W,J,1005,R/TP Y5 R220 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R222 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R225 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y5 R227 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R228 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R229 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R231 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R250 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R280 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R281 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R282 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R283 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R300 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R302 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R303 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R305 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R400 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R401 ERHY0006701 RES,CHIP 1 2400 ohm,1/16W ,J ,1005 ,R/TP Y5 R402 ERHY0000243 RES,CHIP 1 1.2K ohm,1/16W,J,1005,R/TP Y5 R404 ERHY0000264 RES,CHIP 1 18K ohm,1/16W,J,1005,R/TP Y5 R405 ERHY0000280 RES,CHIP 1 100K ohm,1/16W,J,1005,R/TP Y5 R407 ERHY0000286 RES,CHIP 1 200K ohm,1/16W,J,1005,R/TP Y5 R408 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R409 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R410 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R414 ERHY0000299 RES,CHIP 1 33000 ohm,1/16W ,J ,1005 ,R/TP Y5 R415 ERHY0000271 RES,CHIP 1 39K ohm,1/16W,J,1005,R/TP Y5 R417 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R418 ERHY0000250 RES,CHIP 1 3.3K ohm,1/16W,J,1005,R/TP Y5 R419 ERHY0000258 RES,CHIP 1 7.5K ohm,1/16W,J,1005,R/TP Y5 R420 ERHY0000220 RES,CHIP 1 100 ohm,1/16W,J,1005,R/TP Y5 R421 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R450 ERHY0000287 RES,CHIP 1 220K ohm,1/16W,J,1005,R/TP Y5 R500 ERHY0000244 RES,CHIP 1 1.5K ohm,1/16W,J,1005,R/TP Y5 R501 ERHY0000280 RES,CHIP 1 100K ohm,1/16W,J,1005,R/TP Y5 R502 ERHY0000206 RES,CHIP 1 18 ohm,1/16W,J,1005,R/TP Y5 R503 ERHY0000206 RES,CHIP 1 18 ohm,1/16W,J,1005,R/TP Y5 R504 ERHY0000228 RES,CHIP 1 270 ohm,1/16W,J,1005,R/TP Y5 R505 ERHY0000280 RES,CHIP 1 100K ohm,1/16W,J,1005,R/TP Y5 R508 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R509 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R510 ERHY0006601 RES,CHIP 1 6200 ohm,1/16W ,J ,1005 ,R/TP Y5 R512 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R513 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R516 ERHY0000211 RES,CHIP 1 33 ohm,1/16W,J,1005,R/TP Y5 R517 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R518 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R519 ERHY0000273 RES,CHIP 1 47K ohm,1/16W,J,1005,R/TP Y5 R520 ERHY0000244 RES,CHIP 1 1.5K ohm,1/16W,J,1005,R/TP Y5 R521 ERHY0000280 RES,CHIP 1 100K ohm,1/16W,J,1005,R/TP Y5 R530 ERHY0000224 RES,CHIP 1 180 ohm,1/16W,J,1005,R/TP Y5 R531 ERHY0008202 RES,CHIP 1 62 ohm,1/16W ,J ,1005 ,R/TP Y5 R532 ERHY0000209 RES,CHIP 1 27 ohm,1/16W,J,1005,R/TP Y5 R535 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R600 ERHY0000206 RES,CHIP 1 18 ohm,1/16W,J,1005,R/TP Y


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Leve Location No. Part No. Description QTY Specification Service Remark5 R601 ERHY0000229 RES,CHIP 1 300 ohm,1/16W,J,1005,R/TP Y5 R602 ERHY0000229 RES,CHIP 1 300 ohm,1/16W,J,1005,R/TP Y5 R603 ECCH0000110 CAP,CERAMIC,CHIP 1 10 pF,50V,D,NP0,TC,1005,R/TP Y5 R604 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R606 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R607 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R608 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R609 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R610 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R615 ERHY0000247 RES,CHIP 1 2.2K ohm,1/16W,J,1005,R/TP Y5 R617 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R620 ERHY0000211 RES,CHIP 1 33 ohm,1/16W,J,1005,R/TP Y5 R621 ERHY0000243 RES,CHIP 1 1.2K ohm,1/16W,J,1005,R/TP Y5 R622 ERHY0000222 RES,CHIP 1 120 ohm,1/16W,J,1005,R/TP Y5 R624 ERHY0006602 RES,CHIP 1 620 Kohm,1/16W ,J ,1005 ,R/TP Y5 R625 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R626 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R629 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R630 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R631 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R632 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R634 ERHY0008503 RES,CHIP 1 9.76 Kohm,1/16W ,F ,1005 ,R/TP Y5 R635 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R636 ERHY0008502 RES,CHIP 1 2.7 Kohm,1/16W ,F ,1005 ,R/TP Y5 R637 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R638 ERHY0008501 RES,CHIP 1 2.2 Kohm,1/16W ,F ,1005 ,R/TP Y5 R641 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R642 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R643 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y5 R644 ERHY0000244 RES,CHIP 1 1.5K ohm,1/16W,J,1005,R/TP Y5 R645 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R646 ERHY0000247 RES,CHIP 1 2.2K ohm,1/16W,J,1005,R/TP Y5 R647 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y5 R648 ERHY0000247 RES,CHIP 1 2.2K ohm,1/16W,J,1005,R/TP Y5 R649 ERHY0000203 RES,CHIP 1 10 ohm,1/16W,J,1005,R/TP Y5 R656 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R657 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R672 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R673 ERHY0000289 RES,CHIP 1 270K ohm,1/16W,J,1005,R/TP Y5 R674 ERHY0000237 RES,CHIP 1 680 ohm,1/16W,J,1005,R/TP Y5 R675 ERHY0000254 RES,CHIP 1 4.7K ohm,1/16W,J,1005,R/TP Y5 R677 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R678 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 SPFY00 SPFY0031306 PCB,MAIN 1 FR-4 ,0.8 mm,MULTI-8 ,Ver1.3 N5 SW500 EUSY0129501 IC 1 SC-74A FIT ,3 PIN,R/TP ,HALL EFFECT SWITCH Y5 SW600 ENWY0000101 CONN,RF SWITCH 1 ANGLE ,SMD ,0.5 dB, Y5 TH601 SETY0001201 THERMISTOR 1 NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES Y5 U101 EUSY0077201 IC 1 SOT(DCK) ,5 PIN,R/TP , Y

5 U102 EUSY0111901 IC 1TSSOP ,14 PIN,R/TP ,

YQUAD BUS BUFFER WITH 3_STATE CONTROL INPUTS5 U103 EUSY0100504 IC 1 SC70 ,5 PIN,R/TP ,UHS 2-INPUT OR GATE Y5 U200 EUSY0116401 IC 1 179GHH PBGA ,179 PIN,BK ,DIGITAL BB CHIP N5 U201 EUSY0116501 IC 1 100GGM PBGA ,100 PIN,BK ,ANALOG BB CHIP N5 U202 EUSY0122401 IC 1 SC-82AB ,4 PIN,R/TP ,CMOS LDO 1.8V OUTPUT/ 2.0 X 2.1 Y

5 U301 EUSY0134901 IC 1P-FBGA69 ,69 PIN,R/TP ,

N64M FLASH 32M PSRAM / BOTTOM BOOT5 U302 EUSY0105201 IC 1 P-TFBGA63 ,63 PIN,R/TP ,64 M-bit CMOS FLASH / 70 ns N5 U400 EUSY0077701 IC 1 SC70-5 ,5 PIN,R/TP , Y5 U401 EUSY0077602 IC 1 MSOP-8 ,8 PIN,R/TP , Y

250mA CMOS LDO WIHT ERROR FLAG / 3.3V5 U402 EUSY0077401 IC 1 SOT23-6 ,6 PIN,R/TP ,SPDT ANALOG SWITCH Y5 U403 EUSY0111601 IC 1 32-PIN QFN ,32 PIN,R/TP , Y

MA-3 / 40 TONES / FM + WAVEFORM TABLE5 U404 EUSY0077301 IC 1 SC70-6/SOT23-6 ,6 PIN,R/TP , Y


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Leve Location No. Part No. Description QTY Specification Service Remark

5 U501 EUSY0122301 IC 1SURFACE MOUNT ,7 PIN,R/TP ,

YIRDA DATA 1.3 LOW POWER TRANSCEIVER / 115.2kb/s5 U502 EUSY0077301 IC 1 SC70-6/SOT23-6 ,6 PIN,R/TP , Y

5 U600 EXSC0005101 VCO 11887 MHz, PPM, pF,SMD ,9.8*8.0*1.8 , VCO YQUAD VCO( TX/RX )897/921/1747/1885 QUAD

5 U601 EUSY0100102 IC 1RF-K ,12 PIN,R/TP ,

YRF POWER AMPLIFIER / E-GSM:55%, DCS1800:50%5 U602 STMY0018201 TRANSFORMER,MATCHING 1 8 PIN,SMD ,3.2*2.5*1.5mm DUAL Y

5 U603 SFAY0001201 FILTER,SEPERATOR 1880/960 ,1710/1880 ,1.3 dB,1.5 dB,

Y30 dB,25 dB,ETC ,5.4*4.0*1.8 Antenna switch5 U604 EUSY0116701 IC 1 S-PQFP ,64 PIN,R/TP ,RF TRANSCEIVER Y5 U605 EUSY0076701 IC 1 SOT-23-6 ,6 PIN,R/TP , Y5 U606 EXSK0000801 VCTCXO 1 13.0 MHz, PPM,10 pF,SMD ,5.0*3.2*1.5 , Y5 U607 EUSY0100503 IC 1 8-LEAD US8 ,8 PIN,R/TP ,UHS DUAL 2-INPUT NOR GATE Y5 U629 EUSY0077201 IC 1 SOT(DCK) ,5 PIN,R/TP , Y5 V102 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V400 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V401 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V402 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V403 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V404 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V405 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V406 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V407 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 X200 EXXY0004601 X-TAL 1 0.32768 MHz,20 PPM,12.5 pF,65000 ohm,SMD ,6.9*1.4*1.3 , Y


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