Intel® M2M Reference Design for Smart Services Development based on the Intel® Atom™ Processor With a footprint the size of a credit card† the design supports a variety of wireless connectivity and delivers the computing performance required for M2M (machine-to-machine) applications.

SOLUTION BRIEFIntel® M2M Reference Design based on the Intel® Atom™ processorMachine-to-Machine (M2M) Applications

The Connected WorldThe need for M2M connectivity and compute is accepted worldwide by technology leaders who share the vision that most, if not all, electronic devices will be connected to the Internet in the not too distant future. When those devices become connected, new opportunities for services, delivery of content, system optimization and a limitless number of other possibilities will emerge.

Intel and Ericsson* both forecast that tens of billions of devices will communicate over the Internet this decade.1,2 Cellular carriers worldwide believe their networks will serve more machines than people.3 This will create a pervasive Internet that enables more intelligent devices, and Intel is ready to meet the needs of a connected world.

Small Connected Compute PlatformSparing system designers from mastering the complexities of wireless connected computer technology, the Intel® M2M Reference Design, based on the Intel® Atom™ processor, provides a manufacturing-ready platform supporting a variety of wireless connectivity, including 3G/4G wireless broadband, WiFi* and solutions using the IEEE 802.15.4 WPAN technology such as ZigBee*. Now, manufacturers of connected devices can dramatically lower development and product cost with this Intel Atom processor-based platform based on COM Express* form factor architecture. Measuring a mere 84 mm x 55 mm, this “nano” form factor (Figure 1) is ideal for space-constrained, fanless environments. The compute module sits on a carrier board in a case measuring 100 mm x 67 mm, not including antennas or connectors.

Direct Node

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playing a key role in bridging large and small devices. The Intel M2M Reference Design based on the Intel Atom processor can be used to develop M2M devices: indirect nodes, direct nodes and gateways, as described in Figure 2.

M2M Indirect node: “Indirect” interface to the cloud. Attaches to an M2M gateway (part of the gateway’s domain) using a wireless personal area network, such as ZigBee, or a wireless local area network (WLAN), such as WiFi.

Figure 2. Connectivity Example for Gateways and Direct/Indirect Nodes

Figure 1. Reference Design Footprint, Kontron* COM Express* compatible nanoETXexpress-TT

Reference Design ModelThe reference design is comprised of five main components: carrier board, a Kontron* COM Express* compatible nanoETXexpress-TT Computer-On-Module and enclosure, as well as the optional AV Board and Expansion Board. Commercial off-the-shelf (COTS) COM Express modules are available from multiple suppliers.

Benefits for DevelopersThis Intel reference design, featuring support for multiple wireless connections, offers significant advantages for developers:

• Reduced Time-to-Market: Complete, manufacturing-ready system helps reduce development time and project risk.

• Lower Risk: Equipment manufacturers easily implement connected compute technologies without prior wireless experience.

• Diverse Open Source Software: A wide variety of open source software is available, including the Linux* operating system, chipset drivers and protocol stacks.

• Optimal System Form Factor: The low-power, small form factor design satisfies requirements for space-constrained environments (e.g., above ceilings and in equipment closets).

• Broad Range of Solutions: Intel reference designs are supported and enriched by a strong ecosystem of hardware and software providers, including members of the Intel® Embedded Alliance. www.intel.com/go/embeddedalliance

Smart Services Nodes and GatewaysInternet Protocol (IP) networks are the foundation for the connected world, and there are several wireless technologies

M2M Direct node: “Direct” interface to the cloud. Attaches directly to a wireless broadband network using 2.5G, 3G or 4G radios.

M2M Gateway: “Direct” interface to the cloud and indirect nodes. Has a wired or wireless broadband network interface and one or more short haul or WLAN interfaces for connecting to indirect nodes.

COM Express Carrier BoardThe Intel® M2M Reference Design based on the Intel® Atom™ processor is based on a carrier board that is the same size as its companion Kontron COM Express compatible nanoETXexpress-TT with a Type 1 or Type 10 connector. The design, illustrated in Figure 3, supports two PCI Express* Mini Cards for wireless connectivity: a full-size card for broadband wireless (e.g., 3G/4G) and a half-size card for WiFi, Bluetooth or WiMAX*. The carrier board also has an 802.15.4 radio to support wireless PAN protocols such as ZigBee. Three USB ports are available to support

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Figure 4. The Intel® M2M Reference Design Based on the Intel® Atom™ processor

Small Form-Factor COM Express AdvantagesCOM Express is a Computer-on-Module (COM) mezzanine architecture that places the processor, chipset and memory in a compute module that is seated under the carrier board. This solution makes it possible to swap in different COM Express modules for the right level of performance. The Kontron COM Express compatible nanoETXexpress-TT is an extension of the COM Express architecture to a smaller (84x55mm) form factor that maintains backwards compatibility with the COM Express connector and pin definitions, thus enabling vendors to meet smaller footprints.

Applying the COM Express modular architectural approach, equipment manufacturers can reduce development effort and risk, simplify manufacturing and streamline support processes, compared to fully custom designs.

• Minimize product definition: Instead of expending valuable time writing specs for the computing system, developers can simply evaluate COTS COM Express modules available from various suppliers.

• Reduce design risk: Since proven standard COM Express modules can be acquired at an early stage of the project, it is possible to get a head start on prototyping and software development, which lowers software development risk. The same carrier boards can be used with multiple generations of compute modules.

• Simplify build management: Equipment manufacturers only need to track one line item for a COM Express module instead of more than a hundred parts associated with the computing module, greatly simplifying manufacturing.

Figure 3. Reference Design Carrier Board

additional connectivity or interfaces. There is also an RJ-45 connector with onboard magnetics for connecting to a wired Ethernet LAN. An accelerometer is attached to the I2C bus.

The reference design, illustrated in Figure 4, supports two configurations: one with audio-video (AV) and expansion boards and the other without, making it suitable for headless devices. The AV board has microphone and speaker jacks plus two MicroHDMI connectors for dual independent displays. The expansion board can be used to add other functionality and I/O.

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†Compute card is about the size of a credit card, the carrier board and case are slightly largerINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL MAY MAKE CHANGES TO SPECIFICATIONS, PRODUCT DESCRIPTIONS, AND PLANS AT ANY TIME, WITHOUT NOTICE.Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel’s Web Site at www.intel.com.Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.1 http://www.intel.com/embedded/intelligence/embedded-internet/index.htm 2. http://www.ericsson.com/news/14032313. http://connectedplanetonline.com/3g4g/news/T-Mobile-M2M-connections-outnumber-humans

Copyright © 2011 Intel Corporation. All rights reserved. Intel, Intel Atom, Intel Atom Inside and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the United States or other countries. *Other names and brands may be claimed as the property of others.0711/MS/SD/PDF Please Recycle 324391-009US

Jumpstart Your Connected-Compute Smart Services Design

Simplifying M2M design, the Intel M2M Reference Design based on the Intel® Atom™ processor, provides smart services developers, equipment manufacturers and independent software vendors (ISVs) with a platform that can greatly reduce development time and cost. As the M2M industry evolves, network connectivity will be a check-off requirement for most every device. Satisfying this expectation, the reference design delivers a small, high-performance, low-power solution.

To learn more about Intel’s solutions for wireless connected devices, please visit www.intel.com/go/m2m

For more information about the Kontron M2M platform visit www.kontron.com/M2M

Power-efficient Intel® Atom™ Processors

The reference design’s block diagram, illustrated in Figure 5, meets the needs of a large assortment of performance-intensive, small form factor systems that require low power. An Intel® Atom™ processor E6xx series, paired with the highly integrated Intel® Platform Controller Hub EG20T, has a combined thermal design power (TDP) under 6 watts. The Intel® processor integrates a graphics engine supporting 2D and advanced 3D graphics, high-definition video decode, image processing and LVDS/SDVO display interfaces. This platform’s low power consumption and embedded lifecycle support is ideal for many embedded markets, especially those requiring fanless operation.

Future Expansion

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Figure 5. Reference Design Block Diagram