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Making the most out of SiCAlexander Streibel, Application Engineer
WBG Power ConferenceDecember 5th, Munich 2017
2 | Danfoss Silicon Power WBG Power Conference, Munich 2017
Content1 Introduction to Danfoss Silicon Power
2
3
Danfoss Technologies
DSP Activities on SiC Packaging
4 Conclusion and Questions
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1990: Kiel
2000: Schleswig
2012: Flensburg
Power Module SpecialistFor more than 25 years
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• ~450 employees
• 4000m2 of clean room area in Flensburg.
• 5000m² of clean room in Utica, USA.In operation beginning of 2018
• >25mio cars equipped with powermodules from DSP
• More than 3GW of solar power withDSP high power 3-level P3L-modules
• >23GW wind turbines installed withDanfoss Silicon Power technology
Flensburg factory – 4000m²
Utica factory, state of New York – 5000m²
Flensburg
Danfoss Silicon Power A Success Story
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Danfoss Silicon PowerPower Modules and Stacks
38%SHARE OF SALES
Automotive (EPS, EV/HEV)
#6 World Wide #3 in Europe
#1 World Wide in MOSFET Power ModulesSource: IHS 2016, DSP analysis
38%SHARE OF SALES
Renewables (Wind, Solar)
24%SHARE OF SALES
Industry (incl. Motor Drives)
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Danfoss Silicon Power is chip independent
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Content1 Introduction to Danfoss Silicon Power
2
3
Danfoss Technologies
DSP Activities on SiC Packaging
4 Conclusion and Questions
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What are the SiC challenges?Electrical: DC stray inductance paralleling of multiple chips parasitic turn-on (high dv/dt) gate oxide reliability
Mechanical: elevated temperatures power cycling capability terminals and connectors
Thermal: lowest Rth lowest pressure drop parallel cooling
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Danfoss Technology for Lifetime Technology induced lifetime increase
technology improvements
Al – wiresoldered die
Al – wiresintered die
Cu – wire on bond buffersintered die
solder degradation and wire lift off
wire lift off
Danfoss DBB®
technology
relia
bilit
y
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DBB® Technology Drives Paradigm Chance: From Current Derating to Full SiC Utilization
Driver for rating
bonding and joining
cooling efficiency
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ShowerPower® Cooling SystemDesign for most efficient coolingShowerPower®3D (SP3D®) principle:
channels in Cu-baseplate guide coolant liquid lowest Rth, at the same time reduced pressure drop homogeneous heat distribution on substrate
0,0000,0200,0400,0600,0800,1000,1200,1400,1600,1800,200
0,00 1,00 2,00 3,00 4,00 5,00 6,00
Rth
[K
/W
]
Flow rate per module [l/min]
Note: 300 mm² IGBT Area, Coolant: 50/50 water glycoleHalf-bridge design optimized for parallel cooling
ShowerPower Design (Gen 2)
ShowerPower 3D (Gen 3, 2017)
200 W/cm²
325 W/cm²
ShowerPower®3D FEM simulation
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Highly advanced packaging technologies from Danfoss are optimal for SiC technology
Danfoss Bond Buffer® Transfer mouldingShowerPower®
• Unmatched reliability • Power density and
cycle capability• Elevated
temperatures• Sintered top- and
bottom side
• More efficient than standard cooling
• Increased thermal transfer
• Minimized lateral temperature gradient
• Low pressure drop
• High reliability & robustness
• Best possible approach for wide-bandgap and other high temperature devices
COST – POWER DENSITY – RELIABILITY – LIFE TIME – EFFICIENCY
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Content1 Introduction to Danfoss Silicon Power
2
3
Danfoss Technologies
DSP Activities on SiC Packaging
4 Conclusion and Questions
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SiC Packaging for Battery Energy Storage Systems: Flexibility for System Integration
Robust 3-level T-Type NPC 1200V phase lag
Customized pin-out available for your application’s need
Bond wire design to decouple control circuit from load current
Integration of individual gate resistors for each chip to allow switching speed adjustment
Advanced substrate material forhighest thermal performance (AlN)
62 mm
45 mm
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1700V 250A Halfbridge for Rail Traction
12 x Rohm Gen2 planar type SiCMOSFETs per logical switch paired with SBD
AlN substrate for lowest Rth
EMI improvements made operation at 25 kHz possible
5 times lower Switch-Off losses
Enabling high efficient inverter
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ThermoFreq (2017 – 2020)
Partners:
Laserwelding
DBB®
Cu-Tape
Sinterlayer
Low-inductiveconductor
Cu-conductor and heat spreader
Isolation Foil
Source: Fraunhofer ILTSi/SiC-Chip
Baseplate
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KomroL – KOOPERATION (2017 – 2019)
Partners:
Targets:
Design a molded power module (Half-Bridge)with internal monolithic RC-Snubbers todecrease the internal commutation loop down to ~5nH
Power rating of each power module is ~175A @ 920 Vdc
Bi-directional DC/DC converter for automotive traction application
Source: Fraunhofer IISB
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Content1 Introduction to Danfoss Silicon Power
2
3
Danfoss Technologies
DSP Activities on SiC Packaging
4 Conclusion and Questions
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Conclusion
SiC enables
highest compactness and efficiency
maximum current and power density
SiC requires
customized cost-effective low-inductive packages
advanced bonding and joining technologies for ∆T=130K ++
dedicated cooling technologies
#One choice in SiC power modulesEngineering Tomorrow – Making the most out of SiC