malaysia melaka conference 2018 ti e 38th international

38th

International Electronics Manufacturing

Technology (IEMT)

Conference

2018 TI E

M

2018

MELAKACONFERENCE

MALAYSIA

Benchmarking on New Packaging Technology Qualification Methodology and Practices

Speaker: Feng Xue (IBM)

Special track – iNEMI session

Melaka, Malaysia

2018-09-05 restricted

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Agenda

Background

Introduction

Survey Outline

Survey Results

Summary & Next Step

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Background

During iNEMI Substrate & Package Technology Workshop 2016 in Singapore, the following was identified as a major gap in packaging industry– Lack of understanding of the assembly processes and application

environments of all potential end-users (vs targeted end-users) to develop the reliability test methodology for new package/materials development

• Test plan only focus on standard test methodology and comply to customer requirements

• Current test standards may not capture the reliability risk in the new package, or may over stress the new package.

• Field failures do not really feedback to test plan

• For new materials/package development, test plan completeness is always questionable.

• Little effort for the industry to come out with new test standard

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Background

Past issues with standard test plan when qualifying new technology– Variability of bondpad structure and strength for qualification of Cu wire

bonding

– New failure mechanism and unique manufacturing controls for embedded IC packages

– Are we sure the standard test plan is able to detect and characterize all weak points in a new technology?


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Introduction

iNEMI officially started the industrial project “Methodology for Qualifying New Packaging Technology” in July 2017, from qualification methodology point of view, to address the gap identified

The purpose of this project is to develop a methodology for defining qualification plan for new packaging technology to address the gaps resulted from:– Lack of understanding of the assembly processes– Lack of understanding of the interactions of the materials and components

within the new package– Lack of understanding of the application environment– Lack of understanding of the use conditions of all potential end-users– Lack of understanding how variations of the manufacturing process could

affect product quality and reliability


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Introduction

Project Member List


Name Company

Project Leader Feng Xue IBM

Project Leader Curt Grosskopt IBM

Project Management Masahiro Tsuriya iNEMI

Member PK Pu Lenovo

Member Richard Coyle Nokia

Member David Locker DoD

Member Sven Thomas Heraeus

Member King Zheng IBM

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Introduction

Project Plan– Task 1 – Collecting current industry standards among project

members - Completed

– Task 2 – Survey within Industry - Completed

– Task 3 – Develop the methodology based on the gap analysis from the interim report – Tgt Oct 2018

– Task 4 – Validate the methodology - Tgt Dec 2018

– Task 5 – Optional: Apply the methodology to selected new technology - TBD

– Task 6 – Final report and Recommendation to the industry -Tgt Jan 2019


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Current Industry Standards Overview


Several commonly used industry standards used to qualify IC packages (qualification plans, tests methods, and requirements) – JESD47 - Stress-Test-Driven Qualification of Integrated Circuits

– JESD94 - Application Specific Qualification Using Knowledge Based Test Methodology

– JEP150 - Stress-Driven Qualification of & Failure Mechanisms Associated with Assembled Solid State Surface-Mount Components

– AEC Q100 - Stress Test Qualification for Integrated Circuits

– IEC - 60749-43 - Guidelines for IC reliability qualification plans

– Mil-Std-883 - Test Method Standard for Microcircuits

– Mil-Std-750 - Test Methods for Semiconductor Devices

However, none of the above industry standard cover the entire process for qualifying a new package; e.g., how to identify best material set, initiate FMEAs, assess all possible customer assembly and field conditions, and other best practices.

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Survey Outline

An industry-wide survey to understand what package qualification methodologies are used today and how users' requirements are obtained to ensure that a robust qualification plan is generated.

7 Sections covering covers the qualification requirements and methodologies used to develop and qualify new package technologies and new materials

– #0: Your Organization

– #1: Methodology to Develop New Packages/Materials

– #2: Types of New Technologies/Materials

– #3: Concerns from Users

– #4: New Test Methods and Test Conditions

– #5: New Application Space

– #6: Issues not identified when qualifying new package technologies/materials

– #7: Qualification Requirement for each industry sectors


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Survey Results - Responses


Survey Responses: 62

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Survey Results – New Technology/Material


New Tech

New Material

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Survey Results – Issues Not Identifiedwhen Qualifying New Tech / Materials


Application failures or issues observed as a result of the use of a new package material / technology

– Process• Matching to the user‘s equipment and manufacturing condition

• Deep probe scrub marks at the edge of the ball allowed corrosion to burrow under the bond

• Incomplete soldering of BGAs with SAC105 solder

• Cu wire implementation, last dies in the strip had incomplete post bonding cure

• Incomplete Cu wire bond process development at all quadrants

• Transition from ink to LASER marking occasionally affected heatsink attach process, as less robust pqckage clean procedure is required for LASER marking

– QA• Incomplete qualification

• Solder ball failure and crack in FPGA that was not captured by manufacturer

• Top of package adhesion is typically not verified as part of qualification process

– Reliability• Not understanding the harsh conditions where the product had to perform

• Epoxy aging caused delamination

• Cu wire bonding failing HAST due Cl in mold compound (need low Cl EMC)

• Incomplete qualification due to insufficient understand of possible failure mechanisms

• Conditions were more harsh than project in design phase

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Survey Results – Application SpaceCurrent Application Space where the respondents’ products are being used


whether the application space requirements (use

conditions) for which the products are used exceed

those stated in the corresponding qualification

standard

• Approximately 50% of use condition exceeds those stated in

qual plan in all application spaces

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Survey Results – Application Space

New Application Space– Wearables in outdoor environments

– Undersea applications

– Product which need the high safety security issues.

– IoT applications include outdoor switches for railroads,

– As cold as -55C, as hot as 150C.

– Heavy duty machinery

– Oil well / gas drilling


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Survey Results – Current Qualification Methodology and Practices


Practices being used for qualifying new material and technology

• The industry in general uses qualification methods and practices such as standard test

methods, past acceleration factors, FMEA, computer simulation

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Practices used to determine the duration of each stress test when

qualifying a new packaging technology/material

• The major practices still reside with following standard

qualification document or using past acceleration factors

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Past Qualification Coverage Sufficient Qual Data from Suppliers

• Occasionally, Sometimes

• Varies from supplier to supplier • Industry generally has more focus on final customer

use condition, but do not have good qualification

coverage on the other three areas

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Survey Results – New Test Methods and Test Conditions


Use industry standard test methods, but with

a condition and/or duration not specified in

the method

Use test methods not defined by

industry standards

Among respondents who answered “No” to both

• 36% were aware that the application space requirements of their product

exceeded those stated in the corresponding qualification standard

• 61% saw a need for industry to develop any new test methods to better

address relevant failure mechanisms

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Summary

The survey results confirmed that new technology and new material have been, and will continue to be, introduced in large scale, with emerging new application space

The industry in general uses qualification methods and practices such as standard test methods, past acceleration factors, FMEA, computer simulation, as well as focuses on customer requirement.

However, the industry does recognize the gap in the qualification methods being practiced, especially for new technology, new material or new application requirement; and sees the needs of a methodology for developing qualification plan to address the gap.


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Next Step

A follow-up mini survey to clarify those ambiguous points from the deep-dive analysis of the survey

Publish the iNEMI interim report with deep-dive analysis

Start Task3: Develop the methodology based on the gap analysis

Identify new test methods that could be passed to industry standard groups to develop

If you are interested to join this project, please contact M. Tsuriya ([email protected])


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Backup


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Issues not captured during Cu wire thermosonic ball bonding qualification– Process

• bonding parameters for all bond pads

• Interaction between wafer technology and package technology

• Wire bonder setup

• Process deficiency within the bonding strips (usually last bonding locations)

– QA• Missing requirement for MIL/space qualification

• Performance variation between lots

– Reliability• Reliability in product specific environment

• Environment effects on life cycling

• CTE mismatch with board

• Chlorine induced failures at ppm level

• Long term reliability is not verified

• Board level reliability is lacking

• Broken heel at wedge bond on some samples subjected to sequential stress testing

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Issues not captured during Pb-free SMT soldering process Qualification– Process

• Thin QFPs and BGAs could exhibit excessive package warpage during reflow, which resulted in open solder joints

• Non solder attachments in the same board, e.g. press-fit

• Reflow capability allowed to 245 °C, where some solders need higher peak temperature

– QA• Uniformity of component termination geometry and finish

• Solder joint issues when testing at cold temperature after reflow

– Reliability• Tin whiskers and tin plague

• Brittle under impact

• Degradation synergy between temp. cycle and vibration

• acceleration factors

• Isothermal aging before or during life testing

• Mold compound delamination (JSTD-020 weak in this area)

malaysia melaka conference 2018 ti e 38th international

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