marcello lunardon - alice gluing meeting 010/03/2003 study of glues for the assembly of the alice...
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Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Study of glues for the assembly of the ALICE Silicon Pixel Detectors
Status at 10.03.2003
The PADOVA Gluing Team:
Daniela Fabris2
Marcello Lunardon1,2
Francesca Soramel3,4
1 Dept. of Physics of the University of Padova2 INFN Sezione di Padova
3 Dept. of Physics of the University of Udine 4 INFN Sezione di Trieste-Gruppo collegato di Udine
for the ALICE collaboration
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Assembling the SPD
Test protocol for glue selection
First results
What next
INDEX
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
The Gluing Tasks for the SPD
HALF STAVE
CFSS
TASK 1:
ASSEMBLING THE HALF STAVE
( BARI )
TASK 2:
ASSEMBLING THE HALF STAVES ON THE
CARBON FIBER SECTOR SUPPORT
( PADOVA )
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Assembling the Silicon Pixel Detectors (I)
TOP VIEW
BOTTOM VIEW
GROUNDING FOIL WITH
WINDOWED KAPTON LAYER
BACK SIDE
OF THE CHIP
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Assembling the Silicon Pixel Detectors (II)
Carbon Fiber Sector Support
Cooling Duct
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Assembling the Silicon Pixel Detectors (II)
THERMAL ADHESIVE PADS
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Assembling the Silicon Pixel Detectors (II)
Half Stave
UV GLUE
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Assembling the Silicon Pixel Detectors (II)
Carbon Fiber Clips
UV GLUE
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Assembling the Silicon Pixel Detectors (III)
Main problems to be studied:
• thermal contact
• mechanical stability with UV glue
The two problems are independent in the new
mounting scheme
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
TEST PROTOCOL (I)
TC.a) preliminary adhesion testshow glues look like
TC.b) thermal conductivity measurementsmeasurements for about 0.1 mm adhesive thickness used in working conditions first reduction of candidates
TC.c) glue spreading testsspreading the thermal adhesive on windowed kapton-glass samples fixed above the cooling duct with UV glue and with pressure control glue spreading procedures
TC.d) thermal contact reliability tests w.r.t. thermal cyclestest of thermal contact after many thermal cycles (about 5 – 50 °C ) with best candidates and best glue spreading procedures best candidate(s) selection and definition of the gluing procedure
Thermal compound tests
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
TEST PROTOCOL (II)
UV.a) UV glue basic tests- test the gluing strength with kapton-glass samples to be glued on CFSS- tests of ungluing- tests of clip mounting UV glue quantity and curing time
UV.b) irradiation tests - test the UV glue before and after irradiation
Mechanical assembly with UV glue
TC.e) test of compatibility with Bari glue (ECCOBOND 45)verify the compatibility between the thermal compound and the adhesive used to glue the grounding foil on the bottom side of the half stave
TC.f) irradiation tests with best candidate(s)thermal contact reliability test of best candidate(s) after irradiation final selection of thermal compound
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
Glue Vendor Type Thermal cond.
[W/m°K]
Sample quantity
Comments
Staystik 541 Cookson Electronics
Thermoplastic adhesive film
3.0 M high temperature for curing
Micro Faze K AOS Film 150 micron
1.8 M high pressure
SE 4486 Dow Corning Silicon 1 comp.
1.59 M short workability time
CGL7018 AI Tech. Epoxy 4.1 M ATLAS studySE 4445 Dow Corning Silicon 2
comp.1.26 M ATLAS study
AOS 52032 AOS Non sil. Grease
0.7 S very soft
AOS 52029 AOS Non sil. Grease
1.68 S less soft
AOS 54012 AOS Sil. Grease 2.58 S Migration problems?
AOS 52022 AOS Non sil. Grease
0.7 S less soft
LIST OF THERMAL COMPOUNDS
tested and rejectedtesting
not yet tested
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
FIRST TEST RESULTS
TC.a) Preliminary adhesion tests
test of adhesion for thermoplastic adhesive
easy to handle, but very difficult to get a good contact in working conditions (low pressure, air ). Problems to reach the polymerization temperature rejected
TC.b) Thermal conductivity measurements
Measurement of thermal conductivity of a 0.1 mm thick adhesive layer for glues and greases
see next slides
UV.a) UV glue basic tests
first trial of assebly and unassembly with UV glue
see next slides
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
THERMAL CONDUCTIVITY TESTS (I)
Let be:DISC 1 at T1DISC 2 at T2R dissipating a power Wx the thickness of the glueA the area of the glue
W = k A (T1 -T2) / x
k = x W / (T1 - T2)A
• T from R(PT100) and tables (0.387 / K)• Corrections for power dispersion and thermal resistance between PT100 sensors applied
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
THERMAL CONDUCTIVITY TESTS (II)
Gluek nominal
[W/°Km]Thickness
[micron]k measured
[W/°Km]T/W [°K/W]
Comment
MICRO FAZE K with 0.1 psi pressure
1.8 150 ± 10 0.29 ± 0.02 7need high pressure
SE 4486 1.59 95 ± 9 0.59 ± 0.06 3.4short work
time
SE 4445 1.26 36 ± 6
190 ± 10 0.27 ± 0.06
0.56 ± 0.073.6
ATLAS meas.: 0.5
CGL 7018 460 ± 8
110 ± 11 0.66 ± 0.15
0.74 ± 0.113
ATLAS meas.: 0.6
AOS 52032 0.7 125 ± 13 0.68 ± 0.13 2.9 non sil.
AOS 52029 1.68 130 ± 15
175 ± 15 1.28 ± 0.20
1.26 ± 0.201.6
non sil.
AOS 54012 2.58 130 ± 15 1.44 ± 0.20 1.4 siliconic
expected T/W for 100 micron thickness assuming a chip with 4 x 12.5 = 50 mm2 thermal contact window
tested and rejectedtesting
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
FIRST UV GLUE TESTS (I)
The tooling for UV gluing tests in Padova is almost ready...
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
FIRST UV GLUE TESTS (II)
... meanwhile, some hand-made trial:
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
TC.b) thermal conductivity measurements: completed
TC.c) glue spreading tests: mechanics for tests just completed; starting soon
UV.a) UV glue tests: first assembly and unassembly trials with clips done; mechanics for tests just completed; starting soon more quantitative tests
TC.d) thermal contact reliability tests w.r.t. thermal cycle: mechanical setup and heaters defined, to be realized
TC.e) test of compatibility with Bari glue:setup to be defined
TC.f/UV.b) irradiation tests with best candidate(s): setup for both thermal adhesive and UV glue: to be defined
WHAT NEXT
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
THE END
Marcello Lunardon - ALICE Gluing Meeting 010/03/2003
INVENTARIO
More electronics and mechanics for tests
Glue dispenser I&J Fisnar mod. DD305 arrived and tested
UV glue and UV source
Norland Prod. Inc. mod. Opticure 3
arrived and tested
CF clips INFN PD first version ready
HeatersINFN PD – simple circuit with thin FR4 substrate
design finalized, to be realized
CFSS raw support
INFN PD ready
XY automated movement for glue dispenser
INFN PDready, computer control ready soon
Arm for dispenser
INFN PD ready
Vacuum support for blades
INFN PD almost ready