"memory innovation for embedded vision systems," a presentation from samsung electronics

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February 22 nd , 2017 l JIN KIM l Samsung Electronics Memory innovation for embedded vision systems

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Page 1: "Memory Innovation for Embedded Vision Systems," a Presentation from Samsung Electronics

February 22nd, 2017 l JIN KIM l Samsung Electronics

Memory innovation for embedded vision systems

Page 2: "Memory Innovation for Embedded Vision Systems," a Presentation from Samsung Electronics

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Disclaimer

This presentation is intended to provide information concerning memory industry. We do our best to make sure that information presented is accurate and fully up-to-date. However, the presentation may be subject to technical inaccuracies, information that is not up-to-date or typographical errors. As a consequence, Samsung does not in any way guarantee the accuracy or completeness of information provided on this presentation. Samsung reserves the right to make improvements, corrections and/or changes to this presentation at any time.

The information in this presentation or accompanying oral statements may include forward-looking

statements. These forward-looking statements include all matters that are not historical facts, statements regarding the Samsung Electronics' intentions, beliefs or current expectations concerning, among other things, market prospects, growth, strategies, and the industry in which Samsung operates. By their nature, forward-looking statements involve risks and uncertainties, because they relate to events and depend on circumstances that may or may not occur in the future. Samsung cautions you that forward looking statements are not guarantees of future performance and that the actual developments of Samsung, the market, or industry in which Samsung operates may differ materially from those made or suggested by the forward-looking statements contained in this presentation or in the accompanying oral statements. In addition, even if the information contained herein or the oral statements are shown to be accurate, those developments may not be indicative developments in future periods.

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Contents

• Vision IoT, divergence

• Embedded vision memory

‒ Auto/VR/Mobile

• Innovative memory solutions

• Summary

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Vision IoT, divergence

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To divergence

DIVERGENCE CONVERGENCE

• Better smartphone UX with vision IoTs

• Need divergence of vision IoT

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Changing role, enriching mobile eco

Service

Intelligent Hub

Data Explosion

6 10 15

22

31

'15 '16 '17 '18 '19 '20

10X

Data Generation

& Distribution Personalization

Cloud

Data Analytics, Deep Learning

Source: Global Mobile Data Traffic, CISCO’16

Active Interaction

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For artificial intelligence, On-device • On-device service expansion

‒ Privacy/security/picture quality On-device A.I.(deep learning)

‒ Energy-efficiency/high-bandwidth/low-latency

Accuracy(# of layers)

Coverage

(10 layers)

(8 layers)

Object detect Medical

Natural Language

Audio

Translation

Self-Drive

Face pay

Number

Recognition

Cloud service

On-device service

Recommend

Super resolution

4-layer 5-layer 6-layer

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Embedded vision memory : Auto/VR/Mobile

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Vision IoT, more memory

Influence level

on memory Imaging

(CIS+memory)

Recognition (SoC+memory)

A.I. (Cloud+memory)

Wearable ★ ★

Automotive ★★ ★★ ★★★★

Camera ADAS ★★ ★★★

IP camera ★★ ★★

Robot/Drone ★ ★★ ★★★

Gateway/Edge ★ ★★

Cellular IoT/M2M ★

Smart Home ★ ★ ★

Retail ★ ★

Automotive

ADAS

Tele-

matics

Info/

Cluster

IP CAM

Smart

Gateway

Robotics

Drone

Smart Home

Thermo

-stat

Appliance Wearable

IoT (50B unit)

100M

C-IoT/

M2M

Retail

• Vision for Imaging Vision for Sensing and A.I.

• Top 10 IoT applications, driving memory consumption

Imaging: improved picture quality/high speed shooting/continuous shooting Recognition: 3D mapping/multi-camera/object/motion/biometrics/face recognition A.I.: autonomous/emotion recognition/disease diagnosis/VR

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Automotive, evolving fast

0

20

40

60

'12 13 '14 15 '16 17

Mobile

Auto

0

2

4

6

8

10

'12 13 '14 15 '16 17

Mobile

Auto

DRAM Bandwidth DRAM Capacity

GB/s GB

Vision

Sensor

D/L Data

Processing

100

50

200

[GB/s]

300

‘21 ‘17 ‘19

OS , Apps

D/L Weight

8x

Number of objects to recognize

40ea(’13) ▶ 1,000ea (’18)

Bandwidth for Compute ADAS

• Autonomous driving adoption, faster than expected

• Compute ADAS drives high B/W (object detection/scene seg./depth extraction)

Source: Samsung

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VR, high-performance & low-power • VR now : FHD 90fps, MTP* latency(~50ms), 2D audio VR sickness

• Immersive VR : 160FoV, 8K120fps, MTP(~20ms), 360 audio

Enthusiastic Game

Professional/Industrial

Military/Health Care

Education/Retail

VR Cinema

360 Video Streaming

Casual Game

8K120 streaming, ~51.2GB/s

4GB+

8K120 commercial, ~150GB/s

8GB+

8K120 gaming, 1TB+/s

16GB+

Teth

ere

d

All

In

On

e

Dro

p I

n

4K65 4K75 4K120 8K60 4K90

Display

17 13 9 11 Latency

’16 ’17 ’18 ’19 ’20

ms

TDP

[Watt]

100 300 200

All-in-One

Tethered

LP4/5(~34GB/s)

HBM2/GD6(~500GB/s)

LP5/WIO(~60GB/s)

GP

U [T

FL

OP

S]

8

3

1

Drop-In

fps

Performance

Low

Power

10

<9

*MTP: Motion To Photon

Type & DRAM Requirements VR Ecosystem Readiness

Source: Samsung

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Mobile, overcoming technology barrier

SOC Performance DRAM Performance

0.1

1

10

100

‘10 ‘12 ‘14 ‘16

(log)

‘18

Be

nch

ma

rk S

co

re (

3D

gra

ph

ic)

0

1.6

3.2

4.8

'10 '12 '14 '16 '18

Gbps

Time

‘12 ‘14 ‘16

• Need performance, but can’t increase it

Source: Samsung

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Memory technology trend

Power Efficiency

[mW/GBps]

100%

80%

60%

40%

20%

2020 2016 2018

Performance

[Gbps/pin] 15

12

6

3

LP5

LP4X LP4

2016 2018 2020

DDR4

9

DDR5

GDDR5

LP4

• GDDR6 with over 14Gbps, beyond 10Gbps GDDR5

• LP5, 20% more power-efficient than LP4X

LP5

GDDR6

DDR5

LP4X

GDDR5

DDR4

LP3

DDR3

Source: Hotchips2016, Samsung

GDDR6

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Innovative memory solutions

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High Bandwidth Memory: HBM

PCB

DRAM

Buffer Logic Processor

Si Interposer

HBM

TSV Technology

1,024 I/O Architecture

Benefits

Microbump

8H stacked 20nm 8GB HBM

HBM

GDDR5

X 0.8

Power Efficiency

High Bandwidth 1TB/s

X 2.7

Performance

HBM

GDDR5

Source: Samsung

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3D/2.5D SiP memory PKG • Mobile, small F/F, high-speed, low-power requirement 3D/2.5D SiP PKG

• Close collaboration with SoC

Stacked FBGA

FOPLP

Dual Flip Chip

2.5D Si Interposer

3D SiP

Performance

Form Factor

time

SiP

PoP

Wire Bump FOPLP TSV

Mobile Memory SVR/Gfx Memory

time

TSV

Wire

/FPGA

Wire/FBGA FC/TSV High-IO Interposer

High IO TSV (HBM)

Interposer Based Platform

DDR TSV

FC-CSP

Stacked FBGA

BOC

interposer Performance

Source: Samsung

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A.I. mobile memory

[ source : ISSCC]

DDR Main Memory (DDR4/5)

PCIeGen-Z/CCIX/CAPI

Accelerator (GPU/FPGA/ASIC)

CPU

NPU

HBMs

LPDDR Main Memory (LP4/5)

AMBA/AHB

Accelerator (DSP/VPU/NPU)

AP

A.I . mem

iGPU iGPU

Inference (DSP/NPU/VPU) Training

(GPU/FPGA/ASIC) Trained

model

Output

Energy efficient solution requirement

Dedicated H/W (accelerator + memory)

• Vision IoT requires A.I. specific memory

‒ Deep-learning/parallel/inference processing

Deep-learning on IoT device

Source: Samsung

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Memory-stacked Photography • Require DSLR-level performance (dual camera/pixel and high-speed shooting)

• Chance to processing in stacked memory

‒ Low power, thermal spread, super resolution, real time HDR and slow motion control

Source: ISSCC 2017, Sony

e.g. data rate control, high speed read-out, multi stream output, high speed binning

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PIM for embedded vision IoT • Added value from reduced power consumption

‒ Reduce the unnecessary data transfer and frame rate control

• Possible collaboration with SoC/AP

AP CIS Display

AMBA AHB

Display

CIS AP

Added Value Memory B/W Traffic

VPU

Recognition Distortion FRC Correction

Pre/Post Processing In Memory

Source: Samsung

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Summary

• Smartphone as a Intelligent Hub will continue to enrich mobile ecosystem

‒ Performance never be enough in mobile. The more we have, the better we use

‒ Mobile challenges with power optimization and continued innovation

• High performance, more memory are needed in embedded vision IoT

‒ Automotive ADAS drives high bandwidth memory

‒ Immersive VR requires high-performance and low-power

‒ Mobile memory is getting more power-efficient

• Close collaboration is essential

‒ Keeps innovating technology to correspond to the requirements

‒ Artificial Intelligent memory, CIS stacked memory, Vision processing in memory

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