mems packaging 2017 report by yole developpement
TRANSCRIPT
October 2017
From Technologies to Market
Sample
MEMS Packaging Market &
Technology Trends 2017
2
TABLE OF CONTENTS
Part 1/1I
Introduction - 4
What’s new since our last report? - 6
Companies cited in the report – 7
Glossary - 8
Executive summary - 9
Introduction to packaging industry - 38
Introduction to MEMS industry - 42
MEMS packaging market forecast 2016-2022 - 50
o Global units forecast
o Global revenues forecasts
o Revenues forecasts breakdown by
o Wafer-level and thin-film capping
o Interconnections
o Package and substrate
o Assembly
o Tests
MEMS packaging supply chain - 96
Key players
OSAT roadmap
• MEMS packaging focus by device type - 105
o Accelerometer
o Market overview
o Key players – Market shares
o Specific packaging and tests requirements
o Cost structure analysis
o Supply chain
o Packaging roadmap
o Gyroscope
o Magnetometer
o IMU
o Microbolometer
o Micromirror
o Pressure sensor & TPMS
o Gas sensor
o Silicon microphone
o Fingerprint sensor
o RF filter (BAW type)
o Antenna tuner
o Oscillator
©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
3
TABLE OF CONTENTS
Part 1I/1I
Technology challenges & roadmaps - 180
o Interconnections challenges and opportunities
o Wirebond
o Bumps
o TSV
o Hermetic solutions challenges and opportunities
o Ceramic package and metal lids
o Getter solutions
o Wafer-level packaging
o Analysis of specific requirements by markets and emerging package type associated
o Automotive
o Consumers
o Medical
o Telecom and Industrial
o Aerospace and defense
• MEMS testing and calibration - 203
o Focus on MEMS wafer testing
o Focus on MEMS final test & calibration
• Conclusions & Perspectives - 205
• Authors’s biographies - 206
©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
4
Biography & contact
ABOUT THE AUTHORS
Emilie Jolivet
Emilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at YoleDéveloppement the "More than Moore" market research and strategy consulting company. She holds a master’s degree AppliedPhysics specialized in Microelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took theposition of R&D engineer for 7 years in photovoltaic business and co-authored several scientific articles. Strong for thisexperience, she graduated from a master in Business Administration at IAE Lyon and then joined EV Group as a businessdevelopment manager in 3D & Advanced Packaging before joiningYole Développement in 2016.
Contact: [email protected]
©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble. He previously worked at CEA LETI R&D lab inGrenoble, France in marketing dept. Since 1998 he is a cofounder of Yole Développement, a market research company based inFrance. At Yole Développement, Dr. Eric Mounier is in charge of market analysis for MEMS & Sensors, IR imagers and photonics(e.g. Silicon photonics). He has contributed to more than 200 marketing & technological analysis and 100 reports. Eric is also anexpert at the OMNT (“Observatoire des Micro & Nanotechnologies”) for Optics.
Contact: [email protected]
Eric Mounier
5
AAC, Acutronic, Advantest, Afore, AKM, Ametek, Amkor, AMS, AOI Electronics, ASE, Astronics,
Bosch Sensortec, BSE, Cambridge, Carsem, Cavendish, CCMOS, CEA, ChipMOS Technologies,
Cirrus Logic, Corwil, Denso, Discera, Egide, Epson, FemtoTools, FLIR Systems, Form Factor,
Fraunhofer ENAS, Freescale Semiconductors, Gettop Acoustic, GoerTek, Heliotis, Hi-Rel,
Hitachi Metals, Honeywell, i3 Systems, Ideal Aerosmith, Imec, IMT, Infineon Technologies, Integra
Technologies, InvenSense, JCET, King Yuan Electronics, Kaist, Kionix, Kistler, Knowles Electronics,
Kulite, Kyocera, Lingsen Precision, LTX Credence, Materion, mCube, Melexis, MEMSCap,
MEMSensing, Memsic, Micralyne, Microchip, MultiTest, Murata, Nantong Fujitsu Microelectronics,
NCAP, NGK/NTK, Novati Technologies, NXP, Qualcomm, Qorvo, Polytec, Powertech Technology,
Raytheon, Rood Microtec, Safran Colibrys, SAES Getters, Schott, Semiprobe, Sencio, Sensata,
Sensonor, Silex, SMIC, SiTime, Solidus Technologies, Sony, SPEA, SPIL, SST International, STATS
ChipPAC, STMicroelectronics, Systron Donner Inertial, TDK, Teledyne Dalsa, Teradyne, Texas
Instruments, Tianshui Huatian Microelectronics, Tong Hsing, Toyocom, Tronics Microsystems,
TSMC, Tyco, Ulis, Unisem, Unity SC, UTAC, Verigy, Veryst Engineering, Vesper, Wispry, Xcerra,
Xintec, YES, and Yamaha.
©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
COMPANIES CITED IN THE REPORT
6
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
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REPORT METHODOLOGY
Technology analysis methodology Information collection
©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
8©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
REPORT OBJECTIVES
• Offer an understanding of the various MEMS markets’ dynamics
• Provide a forecast in units and value for the different packaging platforms, by MEMS device
• Discuss trends concerning MEMS packaging’s future
• Furnish insights regarding the MEMS packaging supply chain and the roles of IDM vs. OSAT
• Highlight MEMS testing trends
9
INTRODUCTION (1/2)
The MEMS packaging market is driven by lower costs and fusion of several sensors in a package. It is not so much the level ofcomplexity of MEMS device but the need of heterogeneous integration and miniaturization that challenge the packagingdesigners.
MEMS devices are diverse from inertial sensors to RF MEMS, OSATs have to bridge the gap and offer dedicated solutions.
MEMS packaging is only 5% of total packaging revenues split between IDMs and OSATs. So why does it keep OSATs so muchinvolved? Because MEMS are a real opportunity to get on smartphones and automotive business and because price is key, andthat’s why OSATs can promote this business.
The real opportunity of MEMS packaging is carried by RF MEMS devices as the number of units could be multiplied by a factorof five by 2022.
No tremendous change in packaging platform are expected but rather a change in the complexity of the existing platforms torespond to the growing needs of sensor fusions. Combining several inertial or several environmental sensors in a package is nowa reality, the next step will be to combine inertial and environmental sensors in a same package, like LEDs and photodiodes areintegrated today. In the future, the possible packaging are the Fan-Out Wafer-Level Packaging and Embedded Die in laminate forinertial sensors as these plarforms start to deliver specific performance in term of miniaturization.
In this report, Yole analyzed the specifity of the MEMS packaging from back-end to tests including wafer-level packaging as a first-level package which is one dominant trend, as it contributes reducing packaging costs for high-volume.
Functional testing and calibration play an important role in MEMS business as cost contributor. In automotive applications, MEMSoften stand as life-saving components and in this case functional testing and burn-in tests are crucial to detect/anticipate fails incars.
©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
10
INTRODUCTION (2/2)
Due to the diversity of packages and of MEMS,Yole analysed the devices around 5 main families:
Inertial sensors
Environmental sensors
Optical MEMS
Acoustic and ultrasonic sensors
RF MEMS
Yole Développement and System Plus Consulting combined their MEMS and packaging expertise to offer complete and detailedinformation. The MEMS PACKAGING Market and technology trends 2016-2022 comes with a complementary report fromSystem Plus Consulting MEMS packaging review on packaging teardowns analysis on MEMS devices.
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11
BUSINESS MODELS* AROUND MEMS BUSINESS
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THE DIFFERENT MEMS, SENSORS, AND ACTUATORS, AND WHERE THEY CAN COMBINE
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13
MEMS DEVICE FAMILIES
MEMS devicesconsidered in this report
ENVIRONMENTAL SENSORS
Pressure
Gas
Humidity
Combos
OPTICAL MEMS
INERTIAL SENSORS
Accelerometer
Gyroscope
Magnetometer
IMUs
ACOUSTIC & ULTRASONIC
SENSORS
Microphone
Fingerprint sensorsRF MEMS
RF BAW filters
Oscillator
Antenna tuner
Microbolometer
Micromirrors
DOF6
9
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14
MEMS PACKAGING MATRIX (1/4)
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15
TOTAL MEMS PACKAGING MARKET REVENUES
Breakdown by type of device
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16
TELECOMMUNICATION & INDUSTRIAL MARKET
Revenues and units breakdown by devices
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17
MEMS PACKAGING, ASSEMBLY AND TESTS 2016
Revenues and units breakdown by market segments
* A&D stands for Aerospace & Defense
Total of 18,1 billion units in 2016Total of 2,56 billion US$ revenues in 2016
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18
OSATS MEMS PACKAGING & TESTING OPPORTUNITIES
IDMs and OSATs ‘ MEMS packaging activities by MEMS devicefamilies
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19
RELATED REPORTS
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© 2017
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons
21©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS
MEMS & Sensors
Solid State Lighting(LED, OLED, …)
Compound Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices &
Techno.
Advanced
Substrates
Software
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3 BUSINESS MODELS
o Consulting and Analysis
• Market data & research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
M&A with our partner)
www.yole.fr
o Reports
• Market & technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns & reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast
services
• Events: TechDays, forums,…
www.i-Micronews.com
23©2017 | www.yole.fr | About Yole Développement
A GROUP OF COMPANIES
Market, technology
and strategy
consulting
www.yole.fr
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
24©2017 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
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ANALYSIS SERVICES - CONTENT COMPARISON
Multi-
Customers
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and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
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SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plans along the entire
supply chain
Integrators and
end-users
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors,
R&D centers
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SERVING MULTIPLE INDUSTRIAL FIELDS
We workacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
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and
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electronics
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Medical
systems
Industrial
and defense
Energy
management
28©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
o You are looking for:
• An analysis of your product market
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The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 19 years, we worked on more than 2 000 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
REPORTS COLLECTION
www.i-Micronews.com
29©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
OUR 2017 REPORTS PLANNING (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Acoustic MEMS and Audio Solutions 2017
− Integrated Passive Devices Market Status 2017
− 3D Imaging & Sensing 2017
− Status of the MEMS Industry 2017
− Silicon Photonics 2017*
− MEMS & Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017**
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment & Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market & Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Integrated Passive Devices Market Status 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market & Technology Trends 2017*
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced QFN: Market & Technology Trends 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING & OPTOELECTRONICS
− 3D Imaging & Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology & Market Trends 2017*
− Solid State Medical Imaging 2017
− Embedded Software for Machine Vision Systems 2017**
o BATTERY AND ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry*2016 version still available / **To be confirmed
30©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power MOSFET 2017: Market and Technology Trends
− IGBT Market and Technology Trends 2017
− Power Module Packaging: Material Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Integrated Passive Devices Market Status 2017
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− MicroLED IP 2017
− Quantum Dots for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and VCSELs - Technology Applications and Industry Trends 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management Technology and Market Perspectives in Power Electronics
and LEDs 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk
and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− MicroLEDs: Patent Landscape Analysis 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− FLUIDIGM Patent Portfolio Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
*2016 version still available / **To be confirmed
31©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
32©2017 | www.yole.fr | MEMS Packaging Technology and Market Trends | Sample
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
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Contact your sales team according to your location (see the last slide).
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CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
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• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
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