mems product survey of epson

EPSON? Printing Technology QMEMS Gyro sensor Inertial Sensor Pressure sensor

Product Survey of EPSON

Presented by

MUHAMED SHEREEF PM2 AEI,

ROLL NO:07

EPSON College of Engineering, Trivandrum


Overview

1 EPSON?

2 Printing Technology

3 QMEMS

4 Gyro sensor

5 Inertial Sensor

6 Pressure sensor



EPSON?

EPSON was founded in May 18, 1942(Suwa, Nagano, Japan)

Producers of information-related equipments, Electronic devices,Precision products

It has a paid in capital of 53,204 million yen

It has a net sale of 973,663 million yen (fiscal year ended March 31,2011)



Printing Technology

Long established as one of the world’s leading printer manufacturers, Epsonis dedicated to supporting the diverse needs of its customers worldwide

It offers a wide range of products designed to meet specific needs

Printer Types

Inkjet printers

Laser printers

POS printers

SIDM printers



Epson Micro Piezo TechnologyThe most advanced inkjet print head technology

Epson introduced its first printer that usedpiezoelectric technology for its print heads inOctober 1984: the Epson SQ-2000

In 1990 developed an advanced piezoelectricinkjet head for future generations of Epsonprinters

Micro Piezo print head that was first used in theEpson Stylus 800 which was launched in March1993

Figure: Micro Piezo print head



How does an Epson Micro Piezo print head work?

Stage 1:An electrical pulse is applied to the piezoelectric element behind eachnozzle. This causes the element to bend,creating a negative pressure that drawsink from the main ink chamber into the firing chamber.

Stage 2:The electrical charge is altered, causing the piezoelectric element torapidly push in the opposite direction, propelling the ink droplet out.



Epsons Variable Sized Dot Technology (VSDT)

Epsons Micro Piezo print head technology allowsextremely accurate control over the size of inkdroplets that are ejected from the print head nozzles.

This is done by varying the electrical charge given tothe piezoelectric elements.

This enables Epsons printers to achieve variable sizedink droplets as small as 1.5 picoliters - This is whatEpson calls Variable Size Droplet Technology(VSDT).



By capitalizing on its semiconductor expertise, Epson reengineered itsworld-renowned Micro PiezoTM inkjet print head in 2008, making it capable ofproducing 360 dots per inch

This is the industrys highest density for a print head based on piezoelectrictechnology to date.

Figure: Micro Piezo Head Size Comparison



Electronic device market needs

The market needs electronic devices that offer the same high performanceeven after they are downsized

QMEMS is Seiko Epson’s response to this need



What is QMEMS?

QMEMS is a combination of ’Quartz’, a crystal material with excellentcharacteristics such as high stability and high precision, and ”MEMS”

To a semiconductor MEMS material, we apply precision microprocessingbased on quartz material to create a quartz device that we call ’QMEMS’

It supports a lot of functions such as mechanicals,electronics,optical andchemicals and offers very much adding values in the form of high accuracyand high stability



Tuning-fork crystal unitsSub-miniature tuning-fork crystal units & sub-miniature real-time clock modules

3-D photolithographic processing of crystal chips

Miniaturizing crystal chips witha conventional structure reducesthe area of the electrodes(indicated in red).

Fabricating the chips with anH-groove structure provides alarger electrode area and raiseselectrolytic efficiency

This design enables miniaturizedcrystal with CI values as low asthose on ordinary-sized crystals



The CI value of a crystal fabricated using QMEMS technology remainsconstant,at a level equivalent to that of conventional crystals, even ascrystal size decreases

Applications



Some popular sub-miniature tuning-fork crystal units &sub-miniature real-time clock modules

kHz range crystal units Crystal oscillators

Real time clock modules



HFF crystal unit / HFF crystal oscillator

In order to increase the frequency ofoscillators, it is necessary to makethe chip thinner, but conventionalprocessing methods imposedlimitations on producing thin chips

A high-frequency fundamental wasenabled by photolithographicallyprocessing only the oscillatingportion of the chip so as to form anextremely thin inverted-mesastructure having a thickness of onlyseveral microns.



Advantage of high frequency oscillation at the fundamentalfrequency

High-frequency fundamental oscillation helps stabilize high-speed,high-volume data transmissions because nearby high-frequencycomponents can be suppressed.



Some of most popular HFF crystal units / HFF crystaloscillators

Crystal oscillators 60 MHz or higher



Photo ATCompact AT crystal units and Oscillators using photolithography processing technology

Photolithographic process enables the formation of uniformly shapedcrystal chips, and offer outstanding temperature characteristics



Temperature characteristics

Frequency-temperature coefficient of a 2.0 x 1.6 mm AT crystal unit (26MHz)

Applications

Contribute to smaller mobile devices with greater functionality.



Some of most popular compact AT crystal units andOscillators using photolithography processing technology

MHz range crystal units

Oscillators



Gyro sensor

Vibration gyro sensors sense angular velocity from the Coriolis forceapplied to a vibrating object



There are Five different types of Vibration gyro sensors depending onApplications

XV-8100CB,XV-8000LK,XV-8000CB

For portable GPS applications

XV-3700CB

Motion UI

RC helicopter and hobby with high detection range needs

XV-3500CB

Detection picture stabilization of DVC and DSC

Detection of moving with man machine interface



Features of EPSON Gyrosensors

Low noise level

Stability over temperature

Vibration and shock resistance



SAW Filter

SAW Filters Fundamentals

SAW device consists of two transducers with interdigitaltransducers(IDT) of thin metal electrodes deposited on a piezoelectricsubstrate such as quartz or lithiun tantalite.

One of these acts as the device input and converts signal voltagevariations into mechanical surface acoustic waves.

The other IDT is used as an output receiver to convert mechanicalSAW vibrations back into output voltages.



SAW Filters

FF-32N

Dimension:3.8 × 3.8 × 0.98mm

Frequency range : 300 MHz to 500 MHz

Narrow band for SRD Front-end filters

FF-555

Dimension:4.8 × 5.2 × 1.5mm

Frequency range : 300 MHz to 500 MHz

Excellent shock resistance and environmental capability



Applications

Wireless remote-control

Security(Automotive keyless entry)



Inertial Sensor

Inertial sensor is a sensing device that has mounted 3-axis gyro plus 3-axisaccelerometer

It has two types of Inetial sensors:AH-6120LR and AP-6110LR

Package size 10.0 x 8.0 x 3.8mm



Product summary

3-axis gyro plus 3-axis accelerometer

Factory adjusted accuracy scale factor and bias

Analog output for mixed signaling systems

Low noise and stability over temperature angular rate detection

Low current consumption

Applications

Motion tracking and measurement

Dead reckoning and HealthcareEPSON College of Engineering, Trivandrum


Pressure sensor

Pressure sensor is a sensing device that is used to various kinds of pressuremeasurement for industrial use

Operating Principle

When stress is applied to a twin tuning fork quartz oscillator, itsresonance frequency becomes almost linear

By using this property, the twin tuning fork quartz oscillator in flexurevibration mode (highly sensitive to stress) can be used as a pressure-sensitive device



Product specifications



THANK YOU


mems product survey of epson

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