merix capabilities ext na 1 09

Merix Corporation Capabilities Cross Compare

San Jose Oregon Volume Production

Class A Controlled Volume Production

Class B Volume Production


Class B

Merix Corporation of 5 Rev:090128

1.0 Material

1.1 Global Material Offerings All Sites Number of Conductive layers Number of Conductive layers Number of Conductive layer Number of Conductive layer

Isola FR406: 2 - 30 32 - 40 2 - 30 32 - 40 Isola 370HR: 2 - 30 32 – 40 2 - 30 32 – 40

ITEQ 180: NO 2 - 40 NO 2 - 40 FR408: 2 - 30 32 – 40 2 - 30 32 – 40

N4000-13 & 13SI: 2 - 30 32 - 40 2 - 30 32 - 40 Rogers 4350/4450: M/L & MIXED Dielectric M/L & MIXED Dielectric M/L & MIXED Dielectric M/L & MIXED Dielectric

1.2 Additional Standard Based Material Standard FR4: 2 - 30 32 – 40 2 - 30 32 – 40

High Tg FR4 (Nelco-29): 2 - 30 32 – 40 2 - 30 32 – 40 High Tg Modified FR-4 (IS415) 2 - 30 32 – 40 2 - 30 32 – 40

1.3 Low Loss E-Glass Materials

High Freq. FR4 (FR408): 2 - 30 32 – 40 2 - 30 32 – 40 High Freq. Modified FR4 (IS620): 2 - 30 32 – 40 2 - 30 32 – 40 Polyclad GETEK & MEM Megtron: NO NO NO NO

Nelco 4000-13& 13SI: 2 - 30 32 – 40 2 - 30 32 – 40 1.4 Lead-Free Qualified Materials

ITEQ 180: NO 2 - 40 NO 2 - 40 High Tg CAF Resistant (370HR): 2 - 30 32 – 40 2 - 30 32 – 40

High Tg FR4 (Nelco-29): 2 - 30 32 – 40 2 - 30 32 – 40 High Tg Modified FR-4 (IS415) 2 - 30 32 – 40 2 - 30 32 – 40

Polyimide: 2 - 30 32 – 40 2 - 30 32 – 40 1.5 Lead-Free Low Loss Materials

High Freq. FR4 (FR408): 2 - 30 32 – 40 2 - 30 32 – 40 High Freq. Modified FR4 (IS620): 2 - 30 32 – 40 2 - 30 32 – 40

Nelco 4000-13EP and EPSI: 2 - 30 32 – 40 2 - 30 32 – 40

1.6 High Temperature Materials Polyimide: 2 - 30 32 – 40 2 - 30 32 – 40

1.7 Commercial RF Materials Roger 3000 Series: YES YES YES YES Roger 4000 Series: YES YES YES YES

Taconic RF Materials: YES YES NO YES 1.8 Advanced RF Materials

Nelco 9000 Series (PTFE): 1 - 2 NO NO NO Roger 6000 Series: 1 – 2 NO NO NO Roger 5000 Series: 1 – 2 NO NO NO

1.9 Asia Material Offering

Isola 400,402, and ED130UV (Tg=125-145C): NO NO NO NO Polyclad 370/ Turbo (Tg=175C): NO NO NO NO

ITEQ IT140(Tg=140C) NO NO NO NO Nanya NP-140 (Tg=140C) NO NO NO NO

SHENGYI S1141 (Tg=135C): NO NO NO NO SHENGYI S1441 (Tg=140C): NO NO NO NO

ITEQ IT158 (Tg=150C): NO NO NO NO SHENGYI S1170 (Tg=170C): NO NO NO NO

ITEQ IT170 (Tg=170C) NO NO NO NO 1.10 Buried Capacitance

Isola FR406– 2mil YES YES YES YES Isola FR408- 2mil YES YES YES YES Isola 370HR-2 mil YES YES YES YES

Nelco-13 and -13Si – 2mil YES YES YES YES Isola IS620 – 2mil YES YES YES YES

Polyimide P96 – 2mil YES YES YES YES Oak-Mitsui Faradflex – BC 24 ( 1 mil) NO NO YES YES

Oak-Mitsui Faradflex – BC12TM (.5 mil) NO NO NO YES

1.11 Panel Sizes and Useable Area





Class B


Multilayer Panel Sizes: 18 X 24 12 X 18

16 X 18

18 X 24 21 X 24 16 x 18

Non Usable Border on Panel: Double Sided Boards: .65 .65 .65 .55

Multilayer Boards: .75 .75 .65 .55 Spacing Between Boards: (Routing Process)

Double Sided and Multilayer Boards: .150 .100 .150 .100

2.0 Stack-ups

2.1 Overall Thickness Range and Tolerances

Overall Board Thickness: ≤ .126 - .240 ≤ .240 ≤ .126 - .240 ≤ .275 Overall Board Thickness Tolerance:

< .020”: +/- 15% +/- 15% +/- 15% +/- 15% .031”: +/- 15% +/- 10% +/- 15% +/- 10% .062”: +/- 10% +/- 8% +/- 10% +/- 8% .093”: +/- 10% +/- 8% +/- 10% +/- 8% .125”: +/- 10% +/- 8% +/- 10% +/- 8% .187”: +/- 10% +/- 8% +/- 10% +/- 8%

2.2 Flatness Spec Flatness: (Warp per Inch) .010 .007 .010 .0075

2.3 Thinnest Dielectric Finished Thin Board Overall Thickness: .017 .013 .017 .015

Thinnest Plated Core: .012 .008 .012 .008

3.0 Mechanical Capabilities

3.1 Machining Drill Capabilities Primary Drilled Hole Location Tolerance to Datum (Hole) Zero

(DTP): 0.007 0.006 0.007 0.006 2nd Drill Hole Location Tolerance to Datum Zero (DTP): 0.014 0.011 0.014 0.011

Minimum Clearance from Copper Conductor to Mechanical Drilled Hole: .0085 .008 .0085 .008 Minimum Clearance from Copper Conductor to a Laser Drilled Hole: .008 .006 .0085 .008

3.2 Plated Through Hole Capabilities

Smallest Plated Thru Hole Size: (Finished Via Size with Finished Hole Size - 1 mil Min Ave Copper Requirement)

Finished Panel Thickness < .020”: .004 .003 .006 .006 Finished Panel Thickness .031”: .004 .004 .006 .006 Finished Panel Thickness.062”: .006 .006 .006 .006 Finished Panel Thickness.093”: .010 .008 .008 .008 Finished Panel Thickness.125”: .012 .008 .008 .008 Finished Panel Thickness.187”: .015 .012 .014 .012

Plated Hole Tolerance: +/-.003 +/-.002 +/- .003 +/- .002 Aspect Ratio (with 10 mil drill): 10:1 12:1 12.5:1 14:1

Plated Hole Spacing Minimum (Drilled hole to hole): .022 .015 .022 .015

3.3 Non Plated Through Holes Smallest Non Plated Hole Size: (Finished) .010 .008 .010 .008

Largest Non-Plated Hole Size Routed: .200 NO LIMIT .200 NO LIMIT Largest Primary Drilled and Tented Non-Plated Hole: .200 .250 .200 .250

Non-plated Routed Hole Tolerance: +/- .005 +/- .003 +/- .005 +/- .003 Minimum NPTH to Edge of Board Spacing: .020 .010 .020 .010

3.4 Micro Via (µVia) Capabilities

Smallest Laser µVia Hole Size: ( Via Size with 0.4 mil Copper Requirement) .004 .004 .004 .004

Largest Drilled Laser Via: .010 .010 .006 > .009 Via Aspect Ratio 0.8:1 .9:1 .75:1 .85:1

Capture Pad Size: µvia + .010 µvia + .006 µvia + .010 µvia + .007 Landing Pad Size: µvia + .010 µvia + .006 µvia + .010 µvia + .007

Stacked Via NO 2 NO 3 Type I Capabilities YES YES YES YES

Type II Capabilities YES YES YES YES Type III Capabilities NO NO NO YES

3.5 Control Depth Drill Capabilities

Smallest Control Depth Drill .008 .006 .010 .010 Largest Control Depth Drill .125 .257 .125 .125

Minimum Backside Dielectric Separation .008 .005 .007 .007 Control Depth Drill Depth Tolerance .005 .002 .005 .002

Control Depth Drill Aspect Ratio (with tolerance) .75:1 .85:1 .75:1 .85:1 3.6 Back Drilling Capabilities





Class B


Minimum Back Drill Drilled Diameter .022 .020 .022 .020 Drilled Hole Over Finished Hole Size .012 .010 .012 .010

Drill Depth Tolerance +/- .008 +/- .005 +/-.008 +/-.005 Number of Drilled Depths per Side MULTIPLE MULTIPLE MULTIPLE MULTIPLE

3.7 Scoring Capabilities

Angles: 60° 30° / 45° 30° 30° Offset Tolerance: +/- .010 +/- .005 +/- .003 +/- .002

Optimum Remaining Web Thickness: .018 .012 .015 .012 Remaining Web Tolerance +/- .005 +/- .003 +/- .005 +/-.002 True Position Tolerance: .010 .005 .008 .005

3.8 Edge Connector Bevel Capabilities

Finger Tip Angle: 45° 30° / 20° 49°, 45°, 40° 30°, 20° Bevel Depth Tolerance: +/- .010 +/- .005 +/- .008 +/- .005

3.9 Profile Capabilities Standard Router Bit Diameter: .093 & .125 .062,.039,.031 1.6 mm, 2.4mm, .125 .031, 1mm

Routed Profile Tolerance: (18”X 24” Panel): +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 Routed Cutout Tolerance: (0.50” x 0.50”): +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004

Minimum Internal Rout Radius: > .031 0.016 > .031 0.016 Minimum Routed Slot Width: > .062 .062 - .031 > .062 .062 - .031

4.0 Feature Size Capabilities

4.1 Innerlayer Capabilities Minimum Conductor Width

Internal Starting Copper Weight ½ oz.: .00325 .003 .00325 .003 Internal Starting Copper Weight 1 oz.: .004 .0035 .004 .0035 Internal Starting Copper Weight 2 oz.: .006 .0055 .006 .0055 Internal Starting Copper Weight 3 oz: NO YES NO YES

Minimum Conductor Spacing: (Airgap) Internal Starting Copper Weight ½ oz.: .0035 .00325 .0035 .00325 Internal Starting Copper Weight 1 oz.: .004 .004 .004 .004 Internal Starting Copper Weight 2 oz.: .006 .0055 .006 .0055 Internal Starting Copper Weight 3 oz.: NO YES NO YES

4.2 Outerlayer Capabilities (Finished Cu Thick) Minimum Conductor Width (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating)

External Copper Thickness 1.5 mil: .004 .003 .0035 .003 External Copper Thickness 2.0 mil: .0045 .0035 .004 .0035 External Copper Thickness 2.5 mil: .0055 .005 .0055 .005 External Copper Thickness 3.0 mil: .007 .006 .007 .006

Minimum Conductor Spacing: (Airgap (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) External Copper Thickness 1.5 mil: .004 .003 .004 .0035 External Copper Thickness 2.0 mil: .0045 .0035 .0045 .004 External Copper Thickness 2.5 mil: .005 .004 .006 .0055 External Copper Thickness 3.0 mil: .007 .006 .007 .006

4.3 Pad Diameter to Finished Hole Size

Conventional Drilling: Minimum Pad / Drill / Plated Hole:

(Pad Size for Tangency. Add 2X minimum annular ring as needed.) PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE .062 Thick Board: .020/.010/.006 .018/.008/.004 .020 / .010 / .006 .018 / .008 / .004 .093 Thick Board: .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006

.125 Thick Board ( .120 for HY only): .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .150 Thick Board: .022 / .012 / .008 .020 / .010 / .005 .022 / .012 / .008 .020 / .010 / .005 .187 Thick Board: .024 / .014 / .010 .022 / .012 / .008 .024 / .014 / .010 .022 / .012 / .008

Micro Drilling: Laser Via Blind Via: .012/.006/.003 .010/.005/.003 .012/.004/.004 .011/.004/.004

Micro Drilling: Mechanical Via Blind Via: .012/.006/.003 .010/.005/.003 .020 / .010 / .006 .019 / .008/ .004

5.0 Solder Mask and Silkscreen

5.1 Solder Mask Minimum Solder Mask Clearance: (LPI)

Pad size larger than NPTH: .010 .006 .010 .006 Over Surface Image (pad relief): .006 .003 .005 .004

Web Between Surface Mount Pads: .004 .003 .003 .002

Solder Mask Thickness Over Metal: IPC SPEC COVERAGE (SPC RANGES .0002 - .003 TYPICAL = .0007 over conductor)

IPC SPEC COVERAGE (SPC RANGES .0002 - .003 TYPICAL = .0007 over conductor)

Solder Mask Colors: GREEN BLUE, RED, BLACK, YELLOW,

WHITE GREEN RED, BLUE, BLACK





Class B


Solder Mask Type: TAIYO-PSR4000 - HFX TAIYO-PSR4000 - HFX Minimum Mask Defined Pad Diameter: .012 .010 .012 .010

Mask Defined Pad Minimum Overlap of Copper: .005 .0025 .005 .0025 5.2 Silkscreen

Minimum Width Silk Screen Image: .007 .005 .006 .005 Nomenclature Colors WHITE BLACK, YELLOW WHITE BLACK, YELLOW

6.0 Via-in-Pad - HDI

6.1 Epoxy Filled – Non Conductive Epoxy Filled Thru Hole Capability: YES YES YES YES Epoxy Filled Thru Hole Minimum: .010 .0072 .010 .008 Epoxy Filled Thru Hole Maximum: .018 .020 .020 .035

Epoxy Filled µVia Process: YES YES YES YES Epoxy Filled µVia Hole Minimum: .0055 .004 .0055 .004

Minimum Board Thickness: .025 .020 .020 .020 Maximum Board Thickness: .125 .180 .120 .180

Via Fill Aspect Ratio: 8:1 12:1 10:1 12:1 Maximum Panel Size for µVia: 12 X 18 18 X 24 18 X 24 21 X 24

Outerlayer Trace Widths/Spacing .004 / .005 .0035 / .0045 .004 / .005 .004 / .0045 with Wrap Spec Class II 6.2 Copper Plated/ Filled

Copper Filled µVia Process: NO NO NO YES Copper Filled µVia Hole Minimum: NO NO NO .004” Copper Filled µVia Hole Maximum: NO NO NO .005”

Via Fill Aspect Ratio: NO NO NO .85:1 Maximum Board Thickness: NO NO NO <.150”

Outerlayer Trace Widths/Spacing: NO NO NO .004”/.004” with LB to Pattern Combined with other fill technologies NO NO NO Must be reviewed

7.0 Military

7.1 Etch Back 2 Pt. Connection YES YES FR406, 370HR, FR408, Nelco-13, IS415, and Polyimide

3 Pt. Connection ( glass etch) YES YES FR406, 370HR and Polyimide

8.0 Cavity Boards - TMS

Through Rout Technology: NO YES YES YES Step Rout Technology: NO YES YES YES

9.0 Thermal Management Technology

9.1 Coin Attached Conductive Adhesive: NO NO YES YES

Solder Adhesive: NO NO NO YES 9.2 Pallet Attached

Conductive Adhesive: NO NO YES YES Embedded Copper Technology(Merix Patent Pending): NO NO YES YES

10.0 Surface Finishes Options

10.1 Surface Finishes Selection Hot Air Solder Level: YES YES YES YES

Immersion Silver: Enthone Alpha Star MacDermid Sterling Lead Free OSP : Shikoku F2(LX) Shikoku F2(LX)

Electroless Nickel Immersion Gold: YES YES YES YES Immersion Tin: YES YES NO Yes – thru SJ Full Body Gold: YES YES – 4 mil spacing on .5 oz YES YES Bondable Gold: YES YES – 4 mil spacing on .5 oz NO NO

10.2 Mixed Finishes Immersion Silver with Selective Hard Gold: YES YES YES YES

HASL with Selective Gold: YES YES YES YES Dual Gold Plating: YES YES YES YES

Immersion Gold with OSP: YES YES NO NO Immersion Gold with Selective Hard Gold: NO YES NO YES

Selective Hard Gold with OSP: YES YES YES YES Recessed Fingers: YES YES NO NO

10.3 Lead-Free Surface Finishes Immersion Silver: YES YES YES YES

Lead Free OSP : Enthone 106AX-HT Shikoku F2(LX) Electroless Nickel Immersion Gold: YES YES YES YES

Immersion Tin: YES YES NO YES Full Body Gold: YES YES YES YES

Lead-Free HASL: NO YES – Outside Service NO YES – Outside Service

11.0 Testing Capabilities





Class B


Minimum Test Continuity Resistance: 20 OHMS 10 OHMS 20 OHMS < 20 OHMS Maximum Test Voltage: 100V 200V 100V 250V

Maximum Test Isolated Resistance: 10M OHMS 50M OHMS 10M OHMS 100M OHMS Largest Test Bed Fixtured: 12 X 19.3 16.5 X 22.5 29.6 x 19.2 DD 29.6 x 19.2 DD

Largest Test Bed Flying Probe: 20 X 24 20 X 24 24X27 24X27 Electrical Test Pitch (Fixture Test): 0.019 0.016 .020 .016

Electrical Test Pitch (Flying Probe Test): 0.008 0.004 .010 .005 DC Line Resistance Testing: NO YES NO YES

Prop Delay: NO NO YES YES

12.0 Electrical Performance TDR Test Tolerance (Print and Etch): +/- 10% +/- 7.5% +/- 10% +/- 7.5% TDR Test Tolerance (Plated Copper): +/- 15% +/- 10% +/- 10% +/- 10%

TDR Test Tolerance Differential Measurements: +/- 15% +/- 10% +/- 10% +/- 10% TDR Tolerance Single Ended Tolerance: +/- 10% +/- 7.5% +/- 10% +/- 10%

HiPot Testing (AC & DC): NO YES YES YES

13.0 Data & Documentation

13.1 Tooling Formats Film Data Formats: ODB++ RS-274X ODB++ RS-274X Drill Data Formats: ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER

Route Data Formats: ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER Electrical Test Formats: ODB++ IPC-D-356A ODB++ IPC-D-356A

Netlist Compare Formats: ODB++ IPC-D-356A OR MENTOR NEUTRAL

FILE ODB++ IPC-D-356A OR MENTOR NEUTRAL

FILE 13.2 Tooling Communication

Media Types & Data Transfer: FTP E-mail

ftp.sj.merix.com [email protected]

FTP E-mail

ftp.merix.com [email protected]

Compression Formats: ZIP, TAR, TGZ RAR, ARC ZIP, TAR, TGZ RAR, ARC

Secured Transfer: FTP PGP ENCRYPTION FTP PGP ENCRYPTION Merix – San Jose

355 Turtle Creek Court San Jose, California 95125

Phone: (800) 800-3278 Direct: (408) 280-0422 FTP: ftp.sj.merix.com

Merix – Oregon 1521 Poplar Avenue

Forest Grove, Oregon 97116 Phone: (888) 256-3749 Direct: (503) 359-9300

FTP: ftp.merix.com