bedded in a cured cyanate ester resin ma- trix; immersing in a preheated solution comprising an alkali metal salt of an alkox- ide and at least one alcohol, said alkali metal selected from the group consisting of sodium and potassium, said alkoxide hav- ing from one to 12 carbon atoms, said alkali metal salt of an alkoxide present at a concentration ranging from l-50% by weight, said solution having a temperature within the range of 70-120°C; removing the surface from contact with the preheated solution after a period of time ranging from 10 set to 20 min in duration; rinsing with deionized water; and drying by exposing to a stream of nitrogen, said surface thereby prepared to adhere to metal deposited by a subsequent metal plating process, the qual- ity of adhesion ranging from 2 to 5 as measured by ASTM method D 3359B.

Method for Bacterial Reduction of Hexavalent Chromium U.S. Patent 5,569,596. Oct. 29, 1996 E Caccavo, Jr. and M.J. Mclnemey, assignors to The Board of Regents of University of Oklahoma, Norman, Ok/a.

A method of reducing hexavalent chro- mium concentration in a waste stream under

anaerobic conditions, comprising providing a culture of a mutant strain of Shewanella alga having ATCC Accession No. 55627; and treating the waste stream with the mutant strain under anaerobic conditions wherein at least a portion of the hexavalent chromium in the waste stream is reduced by the mutant strain forming a chromium precipitate.

Process for Forming Copper Metallic Wiring U.S. Patent 5,569,627. Oct. 29, 1996 K. Sbinohara ef al., assignors to Sony Corp., Tokyo

A method for forming a copper wiring in a semiconductor device, comprising providing a pattern mask on a copper film; etching exposed portions of the copper film to form a copper wiring; depositing an insulation film over the copper wiring and including on side walls thereof; removing a portion of the in- sulation film to leave an insulation film sub- stantially only on side walls of the copper wiring, which is thinner than before the re- moving; forming a Fit dielectric film be- tween the copper wiring up to a top of the pattern mask but not on top of the pattern mask so as to embed and flatten regions between the copper wiring and pattern mask

so that those regions are substantially level with the top of the pattern mask, and forming a second dielectric layer on the fist dielectric layer so as to provide a flat surface over the copper wiring and pattern mask.

Cathodic Electrocoat U.S. Patent 5369,704. Oct. 29, 1996 M. Yamada and Y Kobata, assignors to Nippon Paint Co. Ltd., Osaka, Japan

A curing agent and a cationic elec- trodeposition coating composition.

Waterborne Polyurethane U.S. Patent 5369,705. Oct. 29, 1996 6. Vogt-Bimbrich et al., assignors to Herbeffs GmbH, Wuppertal, Germany

An aqueous dispersion of polyurethane resins, suitable for use in aqueous coating agents.

Aqueous Polyurea U.S. Patent 5,569,706. 013 29, 1996 FB. Jacobs and KJ? Yonek, assignors lo Bayer Corp., Pittsburgh

An aqueous polyurea dispersion with improved hardness and solvent resistance.

Metal Finishing Questions? People Have Been

Calling Potters Since 1914 For over 80 years,

whenever a question comes up regarding

metal finishing, Potters usually receives the call.

Even today, Potters has an “answemran” standing by with

the benefits of years of research and advice for most questions.

Whether or not you are a current customer, or are using a different

process, Potters invites you to call their answerman. With all the years

of experience, the knowledgeable professionals at Potters are interested

in comparing and sharing their valuable technical expertise.

Become part of the solution. Just pick up the phone and ask for

Ron Schmidt.. the Answerman.

Call the Potters Answerman anytime, no strings attached.

201-438-6462 Putters Industries Inc. m rlMi*rd Th.rQTapor*nn

Southpoint Corporate Headquaners P.O. Box 840 Valley Forge, PA 19482 Potters Technology Center 600 Industrial Rd. Carlstadt. NJ. 07072

Circle 042 on reader information card

N and fishing. Exp8ctmmfrom Exdon-ESR. Exolon-ESK offers a full line of abrasive powders for superior performance and outstanding efficiency in your lapping and grinding applications.

klon bOiC88 - Silicon Carbide (black and green), Aluminum Oxide (brown and white), Boron Carbide, and Cerium Oxide, avail- able in grades from 280 to 1200 including non-standard sizes, for every application from rough finishing to precision lapping

the most sophisticated processes ensure the ultimate in quality and consistency. Certified to meet or exceed FEPA, ANSI, JIS and optical standards.

YOl4 IWbiii - Extensive inven- tones and worldwide distribution gives you the assurance that you have what you need, when you need it. Dedicated Micro Grit Powders division with ceramic engineers provides superior customer service.

1CUKl E. Niagara street ??P.O. Box WI T-. NY 14151-a56c Tel: (NY) i716) 6934550. FAX (716) 693.0151

Circle 020 on reader information card

METAL FINISHING . JULY 1997 69