methods of chemical vapor deposition and powder formation
TRANSCRIPT
relatively low average voltage is preferably used.
M e t h o d of F o r m i n g C o a t i n g
F i lms a n d C o a t e d A r t i c l e
U S . 6 7 9 0 3 2 9 ( N i p p o n P a i n t Co .
L t d . )
S a k a m o t o , H . ; F u i j i i , M . , e t a l .
E l e c t r o c o a t i n g o f p a i n t ( e l e c -
t r o p h o r e t i c ) s u c h a s a u t o m o t i v e
i n n e r o r o u t e r p a n e l s t o g i v e r u s t
p r o t e c t i o n . G r a p h p l o t s t i m e v e r -
s u s . t h i c k n e s s a n d p o t e n t i a l .
Tin P l a t i n g
U.S. Patent 6797142 (Shipley Co. LLC) Crosby, J.N. Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are given, along with methods of electroplating tin and tin-alloys using such composi- tions. These electrolyte composi-
tions are useful for high-speed tin plating.
Apparatus for Plating and Polishing
a Semiconductor Workpiece
US. Patent 6797132 (Nutool Inc.) Talieh, H.; Uzoh, C.E. Mult i -chamber device, with one plat ing and one polishing cham- ber. Plat ing can be brush plating or e lec t rochemica l -mechanica l deposition. Polishing process can be e lect ropol ishing or CMP. Claims to offer improved elec- t ro lyte mass - t r ans f e r and thus allow higher current densities.
Design of Hardware Features to
Facilitate Arc-Spray Coating
Applicat ions and Functions
US. Patent 6797131 (Applied Materials Inc.) Tzou, C.S.; Tsung, J., et al. Apparatus for forming coating on
sputter-coating workpiece; this usually has one or more trenches to define arc-spray coating region.
Methods of Chemical Vapor
Deposition and Powder Formation
US. Patent 6793975 (Micro Coating Technologies Inc.) Hunt, A.T; Hornis, H.G., et al. Powder is formed by CVD or using plasma or flame torch.
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66 Our NeLu
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D£TROIT TUBULAR RIVET, INC, WYANDOTTE, MI
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March 2005 59